A 3M adhesive type heat-conducting silica gel sheet convenient to attach

Abstract

This utility model relates to the field of thermally conductive silicone pad technology, specifically to a 3M adhesive-type thermally conductive silicone pad that is easy to apply. It includes an adhesive body containing a thermally conductive silicone pad. Both the upper and lower surfaces of the thermally conductive silicone pad are coated with 3M adhesive. Z-shaped pieces are adhered and fixed to both sides of the lower surface of the thermally conductive silicone pad. A lower release paper is adhered and fixed to the center of the lower surface of the thermally conductive silicone pad, and an upper release paper is adhered and fixed to the upper part of the thermally conductive silicone pad. In this utility model, the 3M adhesive enhances the adhesion between the thermally conductive silicone pad and the chip / heat sink. The Z-shaped pieces allow for easy bonding by first removing the lower release paper, holding and flipping the Z-shaped pieces, and using the Z-shaped pieces for support and positioning. The thermally conductive silicone pad is gradually lowered, first bonding the center, and then gradually bonding outwards. The rigidity and support positioning of the Z-shaped pieces improve the bonding accuracy and flatness, thereby enhancing the thermal conductivity.

Description

Technical Field

[0001] This utility model relates to the field of thermally conductive silicone pad technology, specifically to a 3M adhesive-type thermally conductive silicone pad that is easy to apply. Background Technology

[0002] Thermally conductive silicone pads are flexible thermally conductive interface materials made of silicone as the base material and with added thermally conductive fillers such as metal oxides. They are mainly used for heat transfer between heat-generating components and heat sinks in electronic devices. Thermally conductive silicone pads increase the contact area by filling the tiny gaps between the heat-generating and heat-dissipating surfaces, and transfer heat using the thermal conductivity of the internal metal oxides (such as aluminum oxide and boron nitride) or non-metallic fillers.

[0003] Thermal conductive silicone pads are typically placed in the gaps between CPUs, GPUs, and heat sinks to conduct heat. Conventional manual placement requires a high level of skill from the operator because the adhesive layer on the bottom is sticky. If the position is not well controlled, the thermal conductive silicone pad may extend beyond the surface of the chip or the surface may become wrinkled, affecting the heat conduction effect. Utility Model Content

[0004] The purpose of this invention is to provide a 3M adhesive-type thermal conductive silicone sheet that is easy to apply, as conventional manual application requires high operator skill and the adhesive layer on the bottom is sticky and poor position control can cause the thermal conductive silicone sheet to extend beyond the surface of the chip or cause surface wrinkles that affect the thermal conductivity.

[0005] The objective of this utility model can be achieved through the following technical solutions:

[0006] A 3M adhesive-type thermally conductive silicone pad that is easy to apply includes an adhesive body, the adhesive body including a thermally conductive silicone pad, the upper and lower surfaces of the thermally conductive silicone pad are coated with 3M adhesive, Z-shaped pieces are adhered and fixed to both sides of the lower surface of the thermally conductive silicone pad, a lower release paper is adhered and fixed to the middle of the lower surface of the thermally conductive silicone pad, and an upper release paper is adhered and fixed to the upper part of the thermally conductive silicone pad.

[0007] As a further embodiment of this utility model: the lower part of the Z-shaped sheet has a bending notch printed in the middle.

[0008] As a further embodiment of this utility model: the Z-shaped piece has bending grooves cut at both ends of the bending notch.

[0009] As a further embodiment of this invention: the surface of the Z-shaped sheet that contacts the thermally conductive silicone sheet is coated with silicone oil.

[0010] As a further embodiment of this utility model: the colloid is also equipped with a positioning frame, and the inner wall of the positioning frame is fixed with limit protrusions.

[0011] As a further embodiment of this utility model: the bottom of both sides of the positioning frame is fixed with limiting plates to facilitate the contact of the Z-shaped pieces.

[0012] The beneficial effects of this utility model are:

[0013] 1. By applying 3M adhesive to both the upper and lower surfaces of the thermally conductive silicone pad, Z-shaped pieces are adhered and fixed to both sides of the lower surface of the thermally conductive silicone pad. Silicone oil is applied to the surfaces of the Z-shaped pieces that contact the thermally conductive silicone pad. The silicone oil reduces the adhesion between the Z-shaped pieces and the thermally conductive silicone pad. A lower release paper is adhered and fixed to the middle of the lower surface of the thermally conductive silicone pad, and an upper release paper is adhered and fixed to the upper part of the thermally conductive silicone pad. The 3M adhesive is used to improve the adhesion between the thermally conductive silicone pad and the chip and heat sink. When bonding the Z-shaped pieces, the lower release paper can be removed first. Hold the Z-shaped pieces and flip them over. Use the Z-shaped pieces for support and positioning. Gradually lower the thermally conductive silicone pad, first bonding the middle part, and then gradually bonding outwards. The rigidity and support positioning of the Z-shaped pieces improve the bonding accuracy and flatness, and improve the thermal conductivity.

[0014] 2. By using a positioning frame with the colloid, and fixing limiting protrusions on the inner wall of the positioning frame, the positioning frame and the outer frame of the chip are positioned. Then, limiting plates are fixed on both sides of the bottom of the positioning frame to facilitate the contact of the Z-shaped pieces. In use, first peel off the lower release paper and use the two Z-shaped pieces to contact the limiting plates respectively. Then, apply force inward to make the Z-shaped pieces bend at the bending notch, gradually reducing the height of the thermal conductive silicone sheet and the chip and bonding them together. Then, spread it from the center to both sides, remove the Z-shaped pieces and peel off the upper release paper to bond with the heat sink. The positioning frame further improves the convenience and accuracy of the application. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings.

[0016] Figure 1 This is a schematic diagram of the structure of the colloid and positioning frame of this utility model;

[0017] Figure 2 This is an exploded diagram of the colloid in this utility model;

[0018] Figure 3 This is a schematic diagram of the limiting plate in this utility model;

[0019] Figure 4 This is a schematic diagram of the Z-shaped piece in this utility model.

[0020] In the diagram: 100, colloid; 110, lower release paper; 120, thermally conductive silicone sheet; 130, Z-shaped sheet; 131, bending groove; 132, bending notch; 140, upper release paper; 200, positioning frame; 210, limiting plate; 220, limiting protrusion. Detailed Implementation

[0021] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0022] Please see Figure 1 , 2 As shown in Figure 4, in this embodiment, a 3M adhesive-type thermally conductive silicone pad that is easy to attach includes an adhesive body 100, which includes a thermally conductive silicone pad 120. Both the upper and lower surfaces of the thermally conductive silicone pad 120 are coated with 3M adhesive. Z-shaped pieces 130 are adhered and fixed to both sides of the lower surface of the thermally conductive silicone pad 120. The surfaces of the Z-shaped pieces 130 that contact the thermally conductive silicone pad 120 are coated with silicone oil. By using silicone oil, the adhesion between the Z-shaped pieces 130 and the thermally conductive silicone pad 120 is reduced. The lower surface of the thermally conductive silicone pad 120 is adhered to the center. A lower release paper 110 is fixed, and an upper release paper 140 is adhered and fixed to the upper part of the thermally conductive silicone sheet 120. The adhesion between the thermally conductive silicone sheet 120 and the chip and heat sink is improved by using 3M adhesive. When bonding, the lower release paper 110 can be removed first, the Z-shaped sheet 130 can be held and flipped, and the Z-shaped sheet 130 can be used for support and positioning. The thermally conductive silicone sheet 120 is gradually lowered so that the middle part is bonded first, and then gradually bonded to the outside. The rigidity and support positioning of the Z-shaped sheet 130 are used to improve the bonding accuracy and flatness.

[0023] Please see Figure 4 As shown in this embodiment, the lower part of the Z-shaped sheet 130 has a bending notch 132 printed in the middle. By setting the bending notch 132, bending can be performed within a limited space to ensure accuracy.

[0024] The Z-shaped piece 130 has bending grooves 131 cut at both ends of the bending notch 132 to further improve bending accuracy.

[0025] Please see Figure 1 , 3As shown, in this embodiment, the colloid 100 is also equipped with a positioning frame 200. The inner wall of the positioning frame 200 is fixed with limiting protrusions 230. The positioning protrusions 230 ensure the position between the positioning frame 200 and the outer frame of the chip. The bottom of both sides of the positioning frame 200 is fixed with limiting plates 210 to facilitate the contact of the Z-shaped pieces 130. In this way, when in use, the lower release paper 110 is first removed so that the two Z-shaped pieces 130 can contact the limiting plates 210 respectively. Then, force is applied inward so that the Z-shaped pieces 130 bend about the bending notch 132, gradually reducing the height of the thermally conductive silicone sheet 120 and the chip and bonding them together. Then, it is spread from the center to both sides. Then, the Z-shaped pieces 130 are removed and the upper release paper 140 is peeled off and bonded to the heat sink.

[0026] In this specification, the terms "an embodiment," "example," "specific example," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0027] The above description is merely an example and illustration of the present utility model. Those skilled in the art can make various modifications or additions to the specific embodiments described or use similar methods to replace them, as long as they do not deviate from the utility model or exceed the scope defined in the claims, they should all fall within the protection scope of the present utility model.

Claims

1. A 3M adhesive-type thermally conductive silicone sheet that is easy to apply, characterized in that, The material includes a colloid (100), which includes a thermally conductive silicone sheet (120). The upper and lower surfaces of the thermally conductive silicone sheet (120) are coated with 3M adhesive. Z-shaped sheets (130) are adhered and fixed on both sides of the lower surface of the thermally conductive silicone sheet (120). A lower release paper (110) is adhered and fixed in the middle of the lower surface of the thermally conductive silicone sheet (120). An upper release paper (140) is adhered and fixed in the upper part of the thermally conductive silicone sheet (120).

2. The 3M adhesive-type thermally conductive silicone sheet according to claim 1, characterized in that, The lower part of the Z-shaped piece (130) has a bend notch (132) printed in the middle.

3. The easily attachable 3M adhesive thermally conductive silicone sheet according to claim 2, characterized in that, The Z-shaped piece (130) has bending grooves (131) cut at both ends of the bending notch (132).

4. The 3M adhesive-type thermally conductive silicone sheet according to claim 1, characterized in that, The surface of the Z-shaped sheet (130) that contacts the thermally conductive silicone sheet (120) is coated with silicone oil.

5. The 3M adhesive-type thermally conductive silicone sheet according to claim 1, characterized in that, The colloid (100) is also equipped with a positioning frame (200), and the inner wall of the positioning frame (200) is fixed with a limiting protrusion (230).

6. The 3M adhesive-type thermally conductive silicone sheet according to claim 5, characterized in that, The bottom sides of the positioning frame (200) are fixed with limiting plates (210) to facilitate contact between the Z-shaped piece (130).

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