A multi-head rotary mounting device
By designing a multi-head rotary placement device, the problems of large structural size and low cycle time of mini LED placement machines are solved, achieving a compact structure and efficient placement process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 中科光智(重庆)科技有限公司
- Filing Date
- 2025-06-03
- Publication Date
- 2026-06-02
AI Technical Summary
Existing mini LED mounting machines have a large overall mounting device size and a low mounting cycle time.
A multi-head rotary placement device is adopted, including a mounting frame, a placement head assembly, a placement head position adjustment assembly, and a first vertical adjustment assembly. Through the coordinated action of the placement head position adjustment assembly and the first vertical adjustment assembly, the placement head rotates in the horizontal direction and moves in the vertical direction, realizing the synchronous pick-up and placement of chips.
This design achieves a compact mounting device structure, significantly reducing the overall size and improving the mounting cycle time.
Smart Images
Figure CN224319844U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of manufacturing equipment for electrical components and assemblies, and specifically to a multi-head rotary mounting device. Background Technology
[0002] A placement machine is a widely used manufacturing equipment for electrical components and assemblies. A placement machine generally includes a substrate motion module, a wafer stage module, a ejector module, and a placement device. The substrate motion module holds the substrate to be processed; the wafer stage module holds the chips to be placed; during chip placement, the ejector module lifts the chip from the wafer stage module to the placement device; and the placement device then further places the chip onto the substrate. In the mini LED placement machine market, because the chip size is typically small, generally within 1x1mm, the overall placement cycle time is required to be high.
[0003] In the existing technology, the mounting devices for mini LED mounting machines mainly have the following two structural forms:
[0004] The first type of placement machine uses a swing-arm type placement device. This type of placement device removes the chip from the wafer stage and places it onto the corresponding position on the substrate by rotating the swing arm. The overall size of the placement machine with this type of placement device is relatively large.
[0005] The second type of placement machine uses a turret-type placement device. This type of turret-type placement device drives the placement device to move by rotating the turret, thereby achieving the purpose of transferring the chip from the wafer stage to the substrate. The overall size of the placement machine with this type of turret-type placement device is also larger, and due to the larger size, the overall moment of inertia is also greater, and the cost of the drive motor to achieve the rotation is also higher.
[0006] Therefore, the two existing mini LED mounting machines employ mounting devices that result in significant issues with the overall size of the mounting machine. Furthermore, both mounting devices require the chip to be picked up from the wafer stage before being moved to the substrate for mounting, which leads to a low overall mounting cycle time. Utility Model Content
[0007] In view of the above-mentioned shortcomings of the existing technology, the technical problem to be solved by this utility model is: how to provide a multi-head rotary placement device with a relatively compact overall structure and which can effectively improve the placement cycle of the entire equipment.
[0008] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:
[0009] A multi-head rotary placement device includes a mounting frame, a placement head assembly, a placement head position adjustment assembly, and a first vertical adjustment assembly. Both the placement head position adjustment assembly and the first vertical adjustment assembly are connected to the mounting frame. The placement head assembly includes multiple placement heads arranged circumferentially. The placement head assembly is connected to the power output end of the placement head position adjustment assembly, so that the placement head position adjustment assembly can drive each placement head in the placement head assembly to rotate to different positions. The power output end of the first vertical adjustment assembly has a limiting protrusion at a position passing through the placement head position adjustment assembly. The limiting protrusion abuts against the placement head assembly, and the first vertical adjustment assembly can drive two placement heads in the same radial direction to move simultaneously in the vertical direction via the limiting protrusion.
[0010] The working principle of this utility model is as follows: When the placement device of this utility model is used on a placement machine, the placement head position adjustment component drives the placement head assembly to rotate, so that one of the two placement heads in the same radial direction corresponds to the position of the ejector pin module of the placement machine, and the other corresponds to the position of the substrate motion module of the placement machine. Then, the ejector pin module on the placement machine lifts the chip on the wafer stage module. At the same time, the first vertical adjustment component drives the two placement heads in the same radial direction to move vertically simultaneously. The placement head closer to the ejector pin module moves vertically and picks up the chip lifted by the ejector pin module, while the placement head closer to the substrate motion module moves vertically and picks up the chip. The placement head also moves towards the substrate. Initially, the placement head closer to the substrate motion module does not pick up any chips. However, as the placement head position adjustment component drives the placement head assembly to rotate continuously, different placement heads rotate sequentially to the positions corresponding to the ejector pin module. This allows different placement heads to pick up chips sequentially. When the placement head closer to the substrate motion module picks up a chip, the first vertical adjustment component drives the placement head to move vertically. This achieves the purpose of the placement head closer to the ejector pin module picking up the chip, while the placement head closer to the substrate motion module moves vertically to place the chip onto the substrate.
[0011] In summary, this invention designs the placement device as a horizontally rotating structure, and the power output end of the first vertical adjustment component is designed to pass through the placement head station adjustment component. This makes the entire placement device more compact, thus significantly reducing the overall size of the placement machine. Furthermore, through ingenious design, this solution achieves simultaneous chip pickup and placement, thereby greatly improving the placement cycle time of the device.
[0012] Preferably, the limiting protrusion includes multiple limiting protrusions, each corresponding to a placement head. Each limiting protrusion includes a limiting groove and a protrusion. The placement head has a first position abutting against the limiting groove and a second position abutting against the protrusion. When the placement head position adjustment assembly drives the placement head to rotate, the placement head is located in the first position. When the power output end of the first vertical adjustment assembly drives the protrusion to rotate and abuts against the placement head, the protrusion drives the placement head to move vertically, and the placement head is located in the second position.
[0013] In this way, a limiting protrusion is set at the position of the first vertical adjustment component's power output end, passing through the placement head station adjustment component, and the limiting protrusion on the limiting protrusion corresponds one-to-one with the placement head. When the placement head is in the first position abutting against the limiting groove, the placement head station adjustment component drives the placement head to rotate, and the first vertical adjustment component drives the limiting protrusion to rotate synchronously. When the placement head station adjustment component drives the placement head to rotate to the set station, which is the position corresponding to the ejector pin module, the first vertical adjustment component continues to drive the limiting protrusion to rotate. The protrusion rotates and abuts against the placement head. Under the action of the protrusion, the placement head moves in the vertical direction and is in the second position. One of the two placement heads in the same radial direction picks up the chip from the ejector pin module, and the other places the chip on the substrate. After the chip is picked up and placed, the first vertical adjustment component drives the limiting protrusion to rotate in the opposite direction, so that the placement head is located in the limiting groove. At this time, the placement head position adjustment component drives the placement head to rotate to the next placement head to reach the set position, and the chip is picked up and placed again.
[0014] Preferably, the mounting head station adjustment assembly includes a first rotary drive component, the power output end of the first rotary drive component is connected to the mounting head assembly so as to drive the mounting head assembly to rotate through the first rotary drive component, and the first rotary drive component is a hollow structure. The power output end of the first vertical adjustment assembly passes through the hollow structure of the first rotary drive component and is connected to the limiting protrusion.
[0015] In this way, the first rotary drive component is designed as a hollow structure, and the power output end of the first vertical adjustment component passes through the hollow structure of the first rotary drive component. This makes full use of the hollow structure of the first rotary drive component, making the structure of the entire placement head module more compact, which can further reduce the size of the entire placement machine.
[0016] Preferably, the mounting head assembly further includes a mounting base, which is connected to the power output end of the first rotary drive member. Each mounting head is slidably connected to the mounting base in the radial direction, so that the mounting head can slide in the radial direction of the mounting base. An elastic element is provided at a position corresponding to each mounting head. One end of the elastic element is connected to the mounting base, and the other end of the elastic element is connected to the mounting head. When the mounting head is in the second position, the elastic element is in a compressed state.
[0017] In this way, by setting up an elastic element, when the first vertical adjustment component drives the limiting protrusion to rotate in the opposite direction, the mounting head moves from the protrusion at the second position to the limiting groove at the first position. At this time, under the action of the elastic element, the mounting head automatically resets vertically.
[0018] Preferably, the first vertical adjustment component includes a second rotary drive component, the shaft of the second rotary drive component is provided with an angular contact ball bearing, one end of the shaft of the second rotary drive component passes through the hollow structure of the first rotary drive component and is connected to the limiting protrusion, the other end is connected to the rotating end of the pneumatic slip ring through an elastic coupling, and the fixed end of the pneumatic slip ring is connected to the air supply component.
[0019] By employing angular contact ball bearings, along with a rear-mounted structure for the limiting protrusions and their driving mechanism (i.e., the second rotary drive component), the overall size of the placement head module can be further reduced. Simultaneously, the flexible coupling design absorbs disturbances and prevents over-positioning of the second rotary drive component, while the pneumatic slip ring enables gas transfer between the rotating and stationary components, achieving the goal of vacuum pick-up of chips by the placement head.
[0020] Preferably, both the first rotary drive and the second rotary drive are direct-drive rotary motors.
[0021] Preferably, the elastic element is a spring. Attached Figure Description
[0022] Appendix Figure 1 This is a schematic diagram of the overall structure of a mounting machine equipped with the multi-head rotary mounting device of this utility model;
[0023] Appendix Figure 2 A front view of a mounting machine equipped with the multi-head rotary mounting device of this utility model;
[0024] Appendix Figure 3 This is a schematic diagram of the structure of the multi-head rotary mounting device of this utility model;
[0025] Appendix Figure 4 This is a front view of the multi-head rotary mounting device of this utility model;
[0026] Appendix Figure 5For the appendix Figure 4 AA section view in the image.
[0027] Explanation of reference numerals in the attached drawings: 1. Main body; 2. Substrate motion module; 3. Dual-optical-path vision positioning module; 4. Wafer stage module; 5. Ejector pin module; 6. Mounting device; 601. Mounting bracket; 602. First rotary drive component; 603. Mounting base; 604. Mounting head; 605. Limiting protrusion; 606. Elastic component; 607. Second rotary drive component; 608. Elastic coupling; 609. Pneumatic slip ring; 610. Angular contact ball bearing. Detailed Implementation
[0028] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.
[0029] As attached Figure 1 and attached Figure 2 The figures shown are a schematic diagram and a front view of a mounting machine equipped with the multi-head rotary mounting device of this solution. The mounting machine includes a body 1, on which a substrate motion module 2, a dual-optical-path vision positioning module 3, a wafer stage module 4, and a ejector pin module 5 are arranged sequentially along the vertical direction. The mounting device 6 of this solution is located between the substrate motion module 2 and the wafer stage module 4. The substrate to be processed is placed on the substrate motion module 2. The chip to be mounted is placed on the wafer stage module 4. The ejector pin module 5 is used to lift the chip to the mounting device 6. The mounting device 6 is used to mount the chip onto the substrate.
[0030] The structure of the mounting device in this solution will be described in detail below:
[0031] In this specific embodiment, as shown in the appendix Figure 3 To the attached Figure 5The diagram shows the specific structure of the mounting device 6. The mounting device 6 includes a mounting frame 601, a mounting head assembly, a mounting head position adjustment assembly, and a first vertical adjustment assembly. The mounting frame 601 is connected to the body 1. The mounting head position adjustment assembly and the first vertical adjustment assembly are both connected to the mounting frame 601. The mounting head assembly includes multiple mounting heads 604. The mounting head position adjustment assembly is used to drive the mounting heads 604 to rotate to different positions. The power output end of the first vertical adjustment assembly passes through the mounting head position adjustment assembly and abuts against the mounting head 604 assembly. The first vertical adjustment assembly can drive two mounting heads 604 in the same radial direction to move simultaneously in the vertical direction, so that one of the two mounting heads in the same radial direction abuts against the ejector pin module 5 to obtain the chip, and the other abuts against the substrate and mounts the chip onto the substrate.
[0032] Specifically, a limiting protrusion 605 is provided at the position where the power output end of the first vertical adjustment component passes through the placement head station adjustment component. The limiting protrusion 605 includes multiple limiting protrusions, each corresponding to a placement head 604. Each limiting protrusion includes a limiting groove and a protrusion. The placement head 604 has a first position abutting against the limiting groove and a second position abutting against the protrusion. When the placement head station adjustment component drives the placement head 604 to rotate, the placement head 604 is located in the first position. When the power output end of the first vertical adjustment component drives the protrusion to rotate and abuts against the placement head 604, the protrusion drives the placement head 604 to move vertically, and the placement head is located in the second position. In this way, by setting the limiting protrusion 605 at the position where the power output end of the first vertical adjustment component passes through the placement head station adjustment component, and ensuring that the limiting protrusions on the limiting protrusion 605 correspond one-to-one with the placement head 604, the placement head achieves a good balance. When the placement head 604 is in the first position abutting against the limiting groove, the placement head position adjustment component drives the placement head 604 to rotate, and the first vertical adjustment component drives the limiting protrusion 605 to rotate synchronously. When the placement head position adjustment component drives the placement head 604 to rotate to the set position, which is the position where the placement head 604 rotates to the position corresponding to the ejector module 5, the first vertical adjustment component continues to drive the limiting protrusion 605 to rotate. The protrusion rotates and abuts against the placement head 604. Under the action of the protrusion, the placement head 604 moves in the vertical direction and is in the second position. One of the two placement heads 604 in the same radial direction picks up the chip from the ejector module 5, and the other places the chip on the substrate. After the chip is picked up and placed, the first vertical adjustment component drives the limiting protrusion 605 to rotate in the opposite direction, so that the placement head is located in the limiting groove. At this time, the placement head station adjustment component drives the placement head and the limiting protrusion 605 to rotate synchronously to the next placement head to reach the set station, and the chip is picked up and placed again.
[0033] Specifically, the placement head station adjustment assembly includes a first rotary drive 602. The first rotary drive 602 can be a hollow DDR motor (i.e., a direct-drive rotary motor). The power output end of the first rotary drive 602 is connected to the placement head assembly to drive its rotation. The first rotary drive 602 has a hollow structure, and the power output end of the first vertical adjustment assembly passes through the hollow structure of the first rotary drive 602 and connects to the limiting protrusion 605. Thus, by designing the first rotary drive 602 as a hollow structure, and having the power output end of the first vertical adjustment assembly pass through the hollow structure of the first rotary drive 602, the hollow structure of the first rotary drive 602 can be fully utilized, making the entire placement head module 6 more compact and further reducing the overall size of the placement machine.
[0034] Specifically, the mounting head assembly also includes a mounting base 603, which is connected to the power output end of the first rotary drive 602. Each mounting head 604 is slidably connected to the mounting base 603 in the radial direction, allowing the mounting head 604 to slide along the radial direction of the mounting base 603. An elastic element 606 is provided at a corresponding position of each mounting head 604. In this specific embodiment, the elastic element 606 can be a spring. One end of the elastic element 606 is connected to the mounting base 603, and the other end is connected to the mounting head 604. When the mounting head 604 is in the second position, the elastic element 606 is in a compressed state. Thus, by providing the elastic element 606, when the first vertical adjustment component drives the limiting protrusion 605 to rotate in the opposite direction, the mounting head 604 moves from the protrusion at the second position to the limiting groove at the first position. At this time, under the action of the elastic element 606, the mounting head 604 automatically resets vertically.
[0035] Specifically, the first vertical adjustment component includes a second rotary drive 607. In this specific embodiment, the second rotary drive 607 can also be a direct-drive rotary motor. An angular contact ball bearing 610 is provided on the shaft of the second rotary drive 607. One end of the shaft passes through the hollow structure of the first rotary drive 602 and connects to the limiting protrusion 605. The other end is connected to the rotating end of a pneumatic slip ring 609 via a flexible coupling 608, and the fixed end of the pneumatic slip ring is connected to the air supply component. Thus, by using the angular contact ball bearing 610, in conjunction with the limiting protrusion 605 and the rear-mounted structure of the second rotary drive 607 (which drives the limiting protrusion 605), the overall size of the placement head module 6 can be further reduced. Simultaneously, the design of the flexible coupling 608 can absorb disturbances and prevent over-positioning of the second rotary drive 607. The pneumatic slip ring 609 can realize gas transmission between the rotating and stationary components, thereby achieving the purpose of vacuum pick-up of the chip by the placement head 604.
[0036] The working principle of this utility model is as follows: When the mounting machine equipped with the mounting device of this utility model is in use, the substrate is placed on the substrate motion module 2, and the chip is placed on the wafer stage module 4. The mounting head position adjustment component drives the mounting head assembly to rotate, so that one of the two mounting heads 604 in the same radial direction corresponds to the position of the ejector module 5, and the other corresponds to the position of the substrate motion module 2. Then, the ejector module 5 lifts the chip on the wafer stage module. At the same time, the first vertical adjustment component drives the two mounting heads 604 in the same radial direction to move vertically simultaneously. The mounting head 604 closer to the ejector module 5 moves vertically and picks up the chip lifted by the ejector module 5, and moves closer to the substrate motion module 2. The placement head 604 in the direction of the substrate will also move towards the substrate. Initially, the placement head 604 in the direction of the substrate motion module 2 does not pick up any chips. However, as the placement head position adjustment component drives the placement head assembly to rotate continuously, different placement heads 604 rotate sequentially to the positions corresponding to the ejector pin module 5. This allows different placement heads 604 to pick up chips sequentially. When a chip is picked up on the placement head 604 in the direction of the substrate motion module 2, the first vertical adjustment component can drive the placement head 604 to move vertically, so that the placement head 604 near the ejector pin module 5 can pick up the chip, while the placement head near the substrate motion module 2 moves vertically to place the chip on the substrate.
[0037] In summary, this invention designs the placement device as a horizontally rotating structure, and the power output end of the first vertical adjustment component is designed to pass through the placement head station adjustment component. This makes the entire placement device more compact, significantly reducing the overall size of the placement machine. Furthermore, through ingenious design, this solution achieves simultaneous chip pickup and placement, thereby greatly improving the placement cycle time of the device.
[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and not to limit the technical solutions. Those skilled in the art should understand that any modifications or equivalent substitutions to the technical solutions of this utility model that do not depart from the spirit and scope of this technical solution should be covered within the scope of the claims of this utility model.
Claims
1. A multi-head rotary mounting device, characterized in that, The device includes a mounting bracket, a placement head assembly, a placement head position adjustment assembly, and a first vertical adjustment assembly. Both the placement head position adjustment assembly and the first vertical adjustment assembly are connected to the mounting bracket. The placement head assembly includes multiple placement heads arranged circumferentially. The placement head assembly is connected to the power output end of the placement head position adjustment assembly, allowing the placement head position adjustment assembly to rotate each placement head in the assembly to different positions. A limiting protrusion is provided at the position where the power output end of the first vertical adjustment assembly passes through the placement head position adjustment assembly. The limiting protrusion abuts against the placement head assembly, and the first vertical adjustment assembly can drive two placement heads in the same radial direction to move simultaneously in the vertical direction via the limiting protrusion.
2. The multi-head rotary placement apparatus of claim 1, wherein The limiting protrusion includes multiple limiting protrusions, each corresponding to a placement head. Each limiting protrusion includes a limiting groove and a protrusion. The placement head has a first position abutting against the limiting groove and a second position abutting against the protrusion. When the placement head position adjustment assembly drives the placement head to rotate, the placement head is located in the first position. When the power output end of the first vertical adjustment assembly drives the protrusion to rotate and abuts against the placement head, the protrusion drives the placement head to move vertically, and the placement head is located in the second position.
3. The multi-head rotary mounting device according to claim 2, characterized in that, The mounting head station adjustment assembly includes a first rotary drive component. The power output end of the first rotary drive component is connected to the mounting head assembly so as to drive the mounting head assembly to rotate. The first rotary drive component is a hollow structure. The power output end of the first vertical adjustment component passes through the hollow structure of the first rotary drive component and is connected to the limiting protrusion.
4. The multi-head rotary mounting device according to claim 3, characterized in that, The mounting head assembly further includes a mounting base, which is connected to the power output end of the first rotary drive member. Each mounting head is slidably connected to the mounting base in the radial direction, so that the mounting head can slide in the radial direction of the mounting base. An elastic element is provided at a position corresponding to each mounting head. One end of the elastic element is connected to the mounting base, and the other end of the elastic element is connected to the mounting head. When the mounting head is in the second position, the elastic element is in a compressed state.
5. The multi-head rotary mounting device according to claim 4, characterized in that, The first vertical adjustment component includes a second rotary drive component. The shaft of the second rotary drive component is provided with an angular contact ball bearing. One end of the shaft of the second rotary drive component passes through the hollow structure of the first rotary drive component and is connected to the limiting protrusion. The other end is connected to the rotating end of the pneumatic slip ring through an elastic coupling. The fixed end of the pneumatic slip ring is connected to the air supply component.
6. The multi-head rotary mounting device according to claim 5, characterized in that, Both the first rotary drive and the second rotary drive are direct-drive rotary motors.
7. The multi-head rotary mounting device according to claim 6, characterized in that, The elastic element is a spring.