A metallizing fixture for thin film capacitor cores
By designing a gold-plating fixture with limiting clips, groove positioning, and elastic components, the problem of film capacitor cores falling off during the gold plating process was solved, achieving stable clamping of the cores and stability of the gold plating process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUNAN AIYUANDA CAPACITOR CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-06-05
AI Technical Summary
Thin-film capacitor cores are prone to falling off during the gold plating process and cannot be stably fixed, causing problems during the gold plating process.
A gold-spraying fixture for thin-film capacitor cores was designed, which uses limiting strips, groove positioning partitions and frames, combined with elastic components and extrusion components to ensure that the cores are firmly clamped during the gold spraying process.
It effectively prevents the core from falling off during the gold spraying process, ensuring the stability and reliability of the gold spraying process.
Smart Images

Figure CN224321650U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a production equipment for thin-film capacitors, and more particularly to a gold-plating fixture for thin-film capacitor cores. Background Technology
[0002] Because the metal film on the core of a film capacitor is very thin, electrodes cannot be directly soldered out. Therefore, it needs to undergo a gold plating process, which involves spraying metal onto both ends of the core to form a gold plating layer, allowing the leads to be soldered onto this layer. Due to the impact on the core during the gold plating process, the core of the film capacitor needs to be continuously pressurized during the process, and the capacitor must not fall off. Utility Model Content
[0003] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a gold spraying fixture for thin film capacitor cores.
[0004] To solve the above-mentioned technical problems, the technical solution proposed by this utility model is as follows: a gold-plating fixture for thin-film capacitor cores, comprising a main frame and a partition, wherein the partition is disposed on the main frame, and the cores are arranged in rows on the base or partition of the main frame, with multiple rows of cores; adjacent rows of cores are separated by partitions; the partitions cover the cores so that both ends of the cores are exposed; a pressure plate is disposed on the upper part of the main frame, and the pressure plate presses down on the partitions and cores below.
[0005] Preferably, in the above-mentioned gold-plating fixture for the thin-film capacitor core, the main frame includes a base, a frame, and a top plate; the base and the top plate are arranged opposite to each other, and the two ends of the frame are respectively connected to the top plate and the base; a limiting strip is provided on the inner side of the frame, and the two ends of the partition are provided with grooves corresponding to the limiting strips; the partition is limited on the limiting strips by the grooves at both ends.
[0006] Preferably, in the above-mentioned gold-plating fixture for the thin-film capacitor core, an extrusion assembly is provided on the top plate of the main frame. The extrusion assembly includes a pull rod and an elastic component. One end of the pull rod is connected to the pressure plate, and the other end passes through a limiting hole in the top plate of the main frame. At least one elastic component is provided at both ends of the pressure plate. One end of the elastic component is connected to the pressure plate, and the other end is connected to the top plate of the main frame.
[0007] Preferably, in the above-mentioned gold-plating fixture for the thin-film capacitor core, the elastic component includes a limiting cylinder, a spring, and a central rod; a limiting plate is provided inside the limiting cylinder, and a connecting hole is provided on the limiting plate; one end of the central rod is connected to the pressure plate, and the other end passes through the connecting hole of the limiting cylinder; the spring is pressed between the pressure plate and the limiting plate of the limiting cylinder.
[0008] Compared with the prior art, the advantages of this utility model are as follows: In this utility model, the spacer plate of each row of capacitors is positioned by limiting strips and grooves between the spacer plate and the frame, so as to ensure that the core is firmly pressed into the frame during the gold spraying process, and thus the core will not fall off during the gold spraying process. Attached Figure Description
[0009] Figure 1 This is a schematic diagram of the gold-plating fixture for the thin-film capacitor core in Example 1.
[0010] Figure 2 for Figure 1 A magnified structural diagram of point A in the middle.
[0011] Figure 3 This is a schematic diagram of the structure in Example 1 where the partition covers the core.
[0012] Figure 4 This is a schematic diagram of the extrusion assembly in Example 1.
[0013] Legend
[0014] 1. Main frame; 11. Base; 12. Frame; 121. Limiting strip; 13. Top plate; 2. Partition; 21. Groove; 3. Core; 4. Pressure plate; 5. Extrusion assembly; 51. Pull rod; 52. Elastic assembly; 521. Limiting cylinder; 522. Spring; 523. Center rod; 524. Limiting plate; 6. Connecting ear; 7. Power component. Detailed Implementation
[0015] To facilitate understanding of this utility model, it will be described more comprehensively and in detail below with reference to the accompanying drawings and preferred embodiments. However, the scope of protection of this utility model is not limited to the following specific embodiments.
[0016] It should be noted that when a component is described as being "fixed to, attached to, connected to or connected to" another component, it can be directly fixed to, attached to, connected to or connected to the other component, or it can be indirectly fixed to, attached to, connected to or connected to the other component through other intermediate connectors.
[0017] Unless otherwise defined, all technical terms used herein have the same meaning as commonly understood by those skilled in the art. The technical terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the scope of protection of this invention. Example 1
[0018] like Figure 1 and Figure 2The gold-plating fixture for a thin-film capacitor core 3 shown includes a main frame 1 and a partition 2. The partition 2 is disposed on the main frame 1. The cores 3 are arranged in rows on the base 11 of the main frame 1 or on the partition 2. There are multiple rows of cores 3. Adjacent rows of cores 3 are separated by the partition 2. The partition 2 covers the cores 3 so that both ends of the cores 3 are exposed. A pressure plate 4 is disposed on the upper part of the main frame 1. The pressure plate 4 presses down on the partition 2 and the cores 3 below.
[0019] In this embodiment, the main frame 1 includes a base 11, a side frame 12, and a top plate 13. The base 11 and the top plate 13 are arranged opposite to each other, and the two ends of the side frame 12 are respectively connected to the top plate 13 and the base 11. A limiting strip 121 is provided on the inner side of the side frame 12, and the two ends of the partition 2 are provided with grooves 21 corresponding to the limiting strip 121. The partition 2 is limited on the limiting strip 121 by the grooves 21 at both ends. The partition 2 between each row of capacitors is positioned between the partition 2 and the side frame 12 by the limiting strip 121 and the grooves 21, ensuring that the core 3 is firmly pressed into the frame during the gold spraying process, so that the core 3 will not fall off during the gold spraying process.
[0020] like Figure 1 As shown, in this embodiment, the cores 3 are arranged in rows, with the bottom row arranged on the base 11, and then covered with a partition 2; then a row of cores 3 is installed on the partition 2, and another partition 2 is covered on the cores 3; this process is repeated until the position of the top partition 2 reaches the bottom end where the extrusion assembly 5 can function.
[0021] When loading the core 3, first place the gold-plating fixture of this embodiment against the back plate, with one side of the main frame 1 resting against the back plate; the back plate can be inclined or vertical, and when the back plate is inclined, the inclination angle is generally greater than or equal to 45°. When loading the core 3, the core 3 is placed on the partition 2, ensuring that both ends of the core 3 do not protrude from the partition 2; Figure 3 As shown, after the core package is placed on the partition 2, the partition 2 completely covers the core 3 from both the top and bottom. The angle of inclination of the back plate is generally greater than or equal to 45° to ensure that the core 3 will not slide on the partition 2 when it is placed on the partition 2.
[0022] Because a certain pressure needs to be continuously applied to the core 3 during the gold spraying process to prevent the core 3 from falling off, the position of the uppermost partition 2 needs to reach the lowest point where the extrusion assembly 5 can function after the core 3 is fed.
[0023] In this embodiment, as Figure 4As shown, the extrusion assembly 5 is installed on the top plate 13 of the main frame 1. The extrusion assembly 5 includes a pull rod 51 and an elastic assembly 52. One end of the pull rod 51 is connected to the pressure plate 4, and the other end passes through the limiting hole of the top plate 13 of the main frame 1. At least one elastic assembly 52 is provided at both ends of the pressure plate 4. One end of the elastic assembly 52 is connected to the pressure plate 4, and the other end is connected to the top plate 13 of the main frame 1.
[0024] In this embodiment, the elastic component includes a limiting cylinder 521, a spring 522, and a central rod 523; a limiting plate 524 is provided inside the limiting cylinder 521, and a connecting hole is provided on the limiting plate 524; one end of the central rod 523 is connected to the pressure plate 4, and the other end passes through the connecting hole of the limiting cylinder 521; the spring 522 is pressed between the pressure plate 4 and the limiting plate 524 of the limiting cylinder 521.
[0025] In this embodiment, a connecting lug 6 is provided on the top plate 13 of the main frame 1. When the core 3 is being fed, the connecting lug 6 is fixed to the external bracket (not shown in the figure). Then, after the power component 7 connects to the pull rod 51, the power component 7 pulls the pull rod 51 upward, causing the pressure plate 4 connected to the pull rod 51 to press the spring 522 upward, thus making room for the core 3. At the same time, after the core 3 is fed, the power component 7 releases the pull rod 51, and under the action of the spring 522, the pressure plate 4 presses the core 3 downward. In this embodiment, the spring 522 can apply a pressure of more than 3000N to the core 3. The power component 7 can be a cylinder or a hydraulic cylinder.
Claims
1. A gold-plating fixture for a thin-film capacitor core, characterized in that: It includes a main frame and partitions. The partitions are set on the main frame. The cores are arranged in rows on the base or partitions of the main frame. There are multiple rows of cores. Adjacent rows of cores are separated by partitions. The partitions cover the cores so that the two ends of the cores are exposed. A pressure plate is set on the upper part of the main frame. The pressure plate presses down on the partitions and cores below.
2. The gold-plating fixture for the thin-film capacitor core according to claim 1, characterized in that: The main frame includes a base, a frame, and a top plate; the base and the top plate are arranged opposite to each other, and the two ends of the frame are respectively connected to the top plate and the base; a limit strip is provided on the inner side of the frame, and the two ends of the partition are provided with grooves corresponding to the limit strip; the partition is limited on the limit strip by the grooves at both ends.
3. The gold-plating fixture for the thin-film capacitor core according to claim 1 or 2, characterized in that: The top plate of the main frame is provided with a pressing assembly, which includes a pull rod and an elastic component. One end of the pull rod is connected to the pressure plate and the other end passes through a limiting hole in the top plate of the main frame. At least one elastic component is provided at both ends of the pressure plate. One end of the elastic component is connected to the pressure plate and the other end is connected to the top plate of the main frame.
4. The gold-plating fixture for the thin-film capacitor core according to claim 3, characterized in that: The elastic component includes a limiting cylinder, a spring, and a central rod; a limiting plate is provided inside the limiting cylinder, and a connecting hole is provided on the limiting plate; one end of the central rod is connected to the pressure plate, and the other end passes through the connecting hole of the limiting cylinder; the spring is pressed between the pressure plate and the limiting plate of the limiting cylinder.