A tin ball mold

Abstract

The utility model discloses a kind of solder ball moulds, including mould body: the side of mould body is provided with ejection groove, the other side of mould body is provided with forming groove, forming groove is provided with atomization face.The edge profile of the ejection groove in the utility model is cambered surface, so that the needle end has certain gap between mould when being worn, push the needle makes solder ball stripping when needle does not collide with mould, and then effectively solve the problem of needle fracture;The outer contour of forming groove is formed atomization face by materialization processing, so that the surface of the formed solder ball has ground-in quality, can effectively improve the welding reliability of solder ball, mechanical strength and process adaptability.

Description

Technical Field

[0001] This utility model relates to the field of mold technology, specifically to a solder ball mold. Background Technology

[0002] Solder balls are spherical components made primarily of tin. They are formed by melting molten tin at high temperatures and then cooling it in a specially designed mold. Common materials include tin-lead alloys and lead-free tin-silver-copper alloys. Solder balls possess excellent electrical and thermal conductivity and solderability, and are widely used in electronics manufacturing, semiconductor packaging, and precision industries. In the solder ball production process, tin is heated to a high temperature and melted into a liquid state before being injected into a corresponding mold. The molded material then cools and solidifies to form solder balls of the required specifications.

[0003] In actual production, after the molten solder gradually cools and solidifies into solder balls in the mold cavity, ejector pins are needed to push the finished product out of the mold to complete the demolding process. When ejecting the solder balls, the ejector pins may experience rigid impacts with the mold due to factors such as the surface roughness of the mold and insufficient draft angle. This can easily lead to ejector pin breakage, requiring frequent replacement of ejector pins, which affects production continuity and results in higher production costs. Utility Model Content

[0004] The purpose of this utility model is to provide a solder ball mold in order to solve the above problems.

[0005] To achieve the above objectives, this utility model specifically adopts the following technical solution, including a mold body:

[0006] The mold body has an ejector groove on one side, which is used to insert ejector pins.

[0007] A forming groove is provided on the other side of the mold body, and the forming groove is provided with an atomizing surface, which is used to process the surface of the solder ball.

[0008] As a further description of the above technical solution, the forming groove is hemispherical.

[0009] As a further description of the above technical solution, the outer contour of the forming groove is formed into an atomized surface through atomization treatment.

[0010] An abutment groove is provided on the outside of the forming groove, and the abutment groove is used to abut against the mold body.

[0011] As a further description of the above technical solution, the diameter of the abutment groove is twice that of the forming groove.

[0012] As a further description of the above technical solution, a guide groove is provided on the outside of the abutment groove, and the guide groove is used to guide the liquid material.

[0013] As a further description of the above technical solution, the guide groove edge contour is an arc surface.

[0014] As a further description of the above technical solution, the mold body has an ejection cavity inside, and the two ends of the ejection cavity are connected to the forming groove and the arc groove.

[0015] As a further description of the above technical solution, the edge contour of the ejector groove is an arc surface.

[0016] As a further description of the above technical solution, a fixing groove is provided on one side of the outer side of the mold body, and the fixing groove is used to fix the mold body.

[0017] The beneficial effects of this utility model are as follows:

[0018] 1. In this utility model, an ejector groove is provided on one side of the mold body, and the edge contour of the ejector groove is an arc surface, so that there is a certain gap between the end of the ejector pin and the mold when it is inserted, so that the ejector pin will not collide with the mold when the solder ball is pushed to demold, thereby effectively solving the problem of ejector pin breakage.

[0019] 2. In this utility model, the mold body is provided with a forming groove, and the outer contour of the forming groove is formed into a mist surface through atomization treatment, so that the surface of the formed solder ball has a frosted texture, which can effectively improve the soldering reliability, mechanical strength and process adaptability of the solder ball.

[0020] To more clearly illustrate the structural features and functions of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the solder ball mold of this utility model;

[0022] Figure 2 This is the front view of the solder ball mold of this utility model;

[0023] Figure 3 This is the front view of the solder ball mold of this utility model;

[0024] Figure 4 This is a top view of the solder ball mold of this utility model.

[0025] Figure label:

[0026] 1. Mold body; 2. Forming groove; 3. Atomizing surface; 4. Ejection groove; 5. Abutment groove; 6. Guide groove; 7. Ejection cavity; 8. Fixing groove. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0028] like Figures 1-4 As shown, in one embodiment, a solder ball mold includes a mold body: an ejector groove 4 is provided on one side of the mold body 1 for inserting ejector pins; specifically, the edge contour of the ejector groove 4 is an arc surface. It can be understood that the ejector groove 4 creates a certain gap between the ejector pin end and the mold during insertion, preventing the ejector pin from colliding with the mold when pushing the ejector pin to demold the solder ball, thus avoiding rigid contact between the ejector pin and the mold, and effectively solving the problem of ejector pin breakage.

[0029] Correspondingly, a forming groove 2 is provided on the other side of the mold body 1, and the forming groove 2 is hemispherical. Specifically, the outer contour of the forming groove 2 is formed into an atomized surface 3 through physical and chemical treatment. This atomized surface 3 is composed of countless micron-level concave and convex structures, which are used to process the surface of the solder ball. It can be understood that when high-temperature molten solder is injected into the forming groove 2, the microstructure of the atomized surface 3 will, through the "morphology replication" effect, give the surface of the formed solder ball a naturally frosted texture, which can effectively improve the soldering reliability, mechanical strength and process adaptability of the solder ball.

[0030] Furthermore, an abutment groove 5 is provided on the outer side of the forming groove 2. The abutment groove 5 is used to abut against the mold body 1. When it cooperates with the external mounting structure (corresponding to the mold with the other half of the forming cavity), it can form a tight mechanical connection and avoid mold loosening due to friction wear, thus ensuring stability during the production process. Specifically, the diameter of the abutment groove 5 is twice that of the forming groove 2.

[0031] Correspondingly, a guide groove 6 is provided on the outer side of the abutment groove 5 to guide the molten solder, allowing the high-temperature molten solder to flow smoothly into the forming tank 2 in a laminar flow state, further improving the uniformity of the molten solder filling. Specifically, the guide groove 6 has an arc-shaped edge profile.

[0032] Furthermore, the mold body 1 has an ejection cavity 7 inside, and the two ends of the ejection cavity 7 are connected to the forming groove 2 and the arc groove. During the ejection process, the ejector pins are guided by the straight line of the ejection cavity 7, which can evenly transmit the demolding force to the bottom of the solder ball, avoiding the breakage of the solder ball due to uneven force.

[0033] In addition, a fixing groove 8 is provided on one side of the mold body 1 to achieve quick positioning and fixing of the mold body 1, ensuring that the mold remains stable during high-speed production.

[0034] Working principle: First, the mold is securely installed at the corresponding station of the production equipment by tightly fitting the external clamp with the fixing groove 8 on the outside of the mold body 1. Then, the high-temperature molten solder is transported to the guide groove 6 on the outside of the mold body 1 through the guide device, and the solder flows slowly into the hemispherical forming groove 2 in a laminar flow state. During the process of the solder cooling and solidifying, the surface of the formed solder ball is made to have a frosted texture through the atomization surface 3. After the solder ball is completely formed, the ejector pin moves along the internal ejection cavity 7 to make the solder ball detach smoothly.

[0035] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A solder ball mold, comprising a mold body (1), characterized in that: The mold body (1) has an ejector groove (4) on one side, and the ejector groove (4) is used to insert ejector pins; The mold body (1) has a forming groove (2) on the other side, and the forming groove (2) is provided with an atomizing surface (3), which is used to process the surface of the solder ball.

2. The solder ball mold according to claim 1, characterized in that, The forming groove (2) is hemispherical.

3. The solder ball mold according to claim 2, characterized in that, The outer contour of the forming groove (2) is formed into an atomized surface (3) through physical and chemical treatment.

4. The solder ball mold according to claim 2, characterized in that, The outer side of the forming groove (2) is provided with an abutment groove (5), which is used to abut against the mold body (1).

5. The solder ball mold according to claim 4, characterized in that, The diameter of the abutment groove (5) is twice that of the forming groove (2).

6. The solder ball mold according to claim 4, characterized in that, A guide groove (6) is provided on the outside of the abutment groove (5), and the guide groove (6) is used to guide the liquid.

7. The solder ball mold according to claim 6, characterized in that, The guide groove (6) has an arc-shaped edge profile.

8. The solder ball mold according to claim 1, characterized in that, The mold body (1) has an ejection cavity (7) inside, and the two ends of the ejection cavity (7) are connected to the forming groove (2) and the arc groove.

9. The solder ball mold according to claim 1, characterized in that, The edge contour of the top groove (4) is an arc surface.

10. The solder ball mold according to claim 1, characterized in that, A fixing groove (8) is provided on one side of the outside of the mold body (1), and the fixing groove (8) is used to fix the mold body (1).

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