A soldering structure of a solder wire and a silicon wafer
By combining the guide positioning column and the heat insulation plate, the problem of unstable welding between the welding wire and the silicon wafer was solved, and the tight contact between the welding wire and the silicon wafer and the stability control of the hot welding process were achieved, thus improving the welding quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FOLUNGWIN AUTOMATIC EQUIP CO LTD
- Filing Date
- 2025-04-23
- Publication Date
- 2026-06-05
AI Technical Summary
The welding structure in existing BC batteries is not stable enough, the welding wire and silicon wafer are not tightly bonded, the position of the silicon wafer is easily affected during the hot welding process, and the heat is not easy to control.
The top plate, middle plate and bottom plate of the welding seat are combined by a guide positioning column, the heat insulation plate is used for heat insulation, the welding wire is tightly attached to the silicon wafer by ventilation, and the hot welding process is controlled by the ejector pin shaft and heating plate.
It improves the welding stability and hot welding quality between the welding wire and the silicon wafer, effectively insulates and protects the silicon wafer from heat, ensures that the welding wire and the silicon wafer are in close contact, and controls the temperature during the hot welding process.
Smart Images
Figure CN224322553U_ABST