A moisture-proof protective housing for an electronic chip

Abstract

The utility model discloses a kind of moisture-proof protective shell for electronic chip, is related to the moisture-proof protective shell field in electronic chip.A kind of moisture-proof protective shell for electronic chip, including protective shell, the top of the protective shell is provided with top cover, the bottom of the inner chamber of the protective shell is sequentially vertically installed with baffle from left to right, the outer surface of the protective shell is provided with pressure resistance layer, the side of the pressure resistance layer away from protective shell is provided with protective outer layer.The utility model provides a kind of moisture-proof protective shell for electronic chip, can promote the overall structural rigidity and strength of protective shell by reinforcing rib, avoid deformation due to external force or deadweight, especially when protective shell bears larger pressure or load, reinforcing rib can effectively prevent protective shell from breaking and damaging, by the setting of handle slot, it is convenient to protective shell played the role of convenient handling, by the setting of top cover, it played the role of sealing and protection to protective shell.

Description

Technical Field

[0001] This utility model relates to the field of moisture-proof protective shells for electronic chips, and more particularly to a moisture-proof protective shell for electronic chips. Background Technology

[0002] Electronic chips, commonly known as radio frequency identification (RFID) technology, are silicon wafers inscribed with digital codes. They are encapsulated using biocompatible glass to ensure security and stability in specific applications. As an advanced identification technology, electronic chips play a vital role in multiple fields, providing convenient and efficient solutions for tracking and managing goods and animals. After production, electronic chips require a moisture-proof protective casing for easy transport later.

[0003] Current moisture-proof protective shells for electronic chips have poor pressure resistance and cannot effectively protect the electronic chips from damage. The low strength of the protective shell can cause it to break, thus failing to protect the electronic chips.

[0004] Therefore, it is necessary to provide a moisture-proof protective casing for electronic chips to solve the above-mentioned technical problems. Utility Model Content

[0005] This utility model provides a moisture-proof protective shell for electronic chips, which solves the technical problems of existing moisture-proof protective shells for electronic chips having poor pressure resistance, failing to effectively protect electronic chips from damage, and being prone to damage due to low strength, thus failing to protect electronic chips.

[0006] To solve the above-mentioned technical problems, this utility model provides a moisture-proof protective shell for electronic chips, including a protective shell, a top cover on the top of the protective shell, baffles vertically installed from left to right at the bottom of the inner cavity of the protective shell, a pressure-resistant layer on the outer surface of the protective shell, and a protective outer layer on the side of the pressure-resistant layer away from the protective shell.

[0007] The pressure-resistant layer includes an HDPE plastic layer, the surface of which is provided with an ultra-high molecular weight polyethylene layer, and the outer surface of which is provided with a carbon fiber reinforced plastic layer.

[0008] The protective outer layer includes a polyamide layer, and a PSU plastic layer is disposed on the surface of the polyamide layer.

[0009] Preferably, the top cover and the baffle are made of the same material as the protective shell.

[0010] Preferably, a base pad is installed around the lower end of the protective shell, and a positioning groove is provided around the upper end of the top cover to cooperate with the base pad.

[0011] Preferably, the top of both sides of the protective shell is provided with handle grooves, and the front and back of the protective shell are provided with reinforcing ribs.

[0012] Preferably, the surface of the HDPE plastic layer is bonded to the inner surface of the ultra-high molecular weight polyethylene layer, and the surface of the ultra-high molecular weight polyethylene layer is bonded to the inner surface of the carbon fiber reinforced plastic layer.

[0013] Preferably, the surface of the polyamide layer is adhered to the inner surface of the PSU plastic layer.

[0014] Compared with related technologies, the moisture-proof protective shell for electronic chips provided by this utility model has the following beneficial effects:

[0015] This utility model provides a moisture-proof protective shell for electronic chips. The reinforcing ribs can improve the overall structural rigidity and strength of the protective shell, and prevent deformation caused by external force or its own weight. Especially when the protective shell is subjected to large pressure or load, the reinforcing ribs can effectively prevent the protective shell from cracking and being damaged. The handle groove makes it easy to move the protective shell. The top cover provides a sealing and protection function for the protective shell.

[0016] This utility model provides a moisture-proof protective shell for electronic chips. The baffle facilitates the classification and storage of electronic chips. The base pad and positioning groove allow the protective shells to be stacked, providing excellent stability during stacking. Attached Figure Description

[0017] Figure 1 A schematic diagram of a preferred embodiment of the moisture-proof protective shell for electronic chips provided by this utility model;

[0018] Figure 2 This is a top view of the rear of the protective shell and baffle structure of this utility model;

[0019] Figure 3 This is a partial cross-sectional view of the protective shell, pressure-resistant layer, and protective outer layer structure of this utility model;

[0020] Figure 4 This is a partial cross-sectional view of the pressure-resistant layer structure of this utility model;

[0021] Figure 5 This is a partial cross-sectional view of the protective outer layer structure of this utility model.

[0022] The following are labeled in the diagram: 1. Protective outer shell; 2. Top cover; 3. Baffle; 4. Pressure-resistant layer; 41. HDPE plastic layer; 42. Ultra-high molecular weight polyethylene layer; 43. Carbon fiber reinforced plastic layer; 5. Protective outer layer; 51. Polyamide layer; 52. PSU plastic layer; 6. Bottom pad; 7. Positioning groove; 8. Handle groove. Detailed Implementation

[0023] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0024] Example 1:

[0025] Please see Figure 1-5 This utility model provides a technical solution: a moisture-proof protective shell for electronic chips, including a protective shell 1, a top cover 2 on the top of the protective shell 1, baffles 3 vertically installed from left to right at the bottom of the inner cavity of the protective shell 1, a pressure-resistant layer 4 on the outer surface of the protective shell 1, and a protective outer layer 5 on the side of the pressure-resistant layer 4 away from the protective shell 1.

[0026] The pressure-resistant layer 4 includes an HDPE plastic layer 41, an ultra-high molecular weight polyethylene layer 42 is disposed on the surface of the HDPE plastic layer 41, and a carbon fiber reinforced plastic layer 43 is disposed on the outer surface of the ultra-high molecular weight polyethylene layer 42.

[0027] The protective outer layer 5 includes a polyamide layer 51, and a PSU plastic layer 52 is disposed on the surface of the polyamide layer 51.

[0028] In this embodiment, the HDPE plastic layer 41 provides excellent toughness and moisture resistance. HDPE plays a significant role in the packaging industry for storage and transportation, increasing the strength of the protective shell 1. The polyamide layer 51 provides high hardness, wear resistance, and impact resistance, playing a role in protecting the protective shell 1 during use. It also has excellent flexibility, pressure resistance, corrosion resistance, and heat insulation properties, extending the service life of the protective shell 1. The ultra-high molecular weight polyethylene layer 42 further enhances the impact resistance. It has a low elongation at break but a strong energy absorption capacity, exhibiting outstanding impact resistance and cut resistance, thus increasing the impact resistance of the protective shell 1.

[0029] Example 2:

[0030] Please see Figure 1-5As shown, based on Embodiment 1, this utility model provides a technical solution: the top cover 2 and the baffle 3 are made of the same material as the protective shell 1. The lower end of the protective shell 1 is equipped with a bottom pad 6 around its perimeter. The upper end of the top cover 2 is provided with a positioning groove 7 that works with the bottom pad 6 around its perimeter. The top of both sides of the front of the protective shell 1 is provided with a handle groove 8. The front and back of the protective shell 1 are provided with reinforcing ribs. The surface of the HDPE plastic layer 41 is bonded to the inner surface of the ultra-high molecular weight polyethylene layer 42. The surface of the ultra-high molecular weight polyethylene layer 42 is bonded to the inner surface of the carbon fiber reinforced plastic layer 43. The surface of the polyamide layer 51 is bonded to the inner surface of the PSU plastic layer 52.

[0031] In this embodiment, the main functions of the carbon fiber reinforced plastic layer 43 include improving the mechanical strength, friction resistance, and wear resistance of the material, as well as improving the overall performance of the material, thereby increasing the wear resistance and service strength of the protective shell 1. The PSU plastic layer 52 provides excellent heat resistance, chemical corrosion resistance, and mechanical strength, thereby increasing the service strength and corrosion resistance of the protective shell 1 and extending its service life.

[0032] The working principle of the moisture-proof protective shell for electronic chips provided by this utility model is as follows:

[0033] Implementation steps for the first innovation point:

[0034] Step 1: The HDPE plastic layer 41 provides excellent toughness and moisture resistance. HDPE has a place in the packaging industry for storage and transportation, increasing the strength of the protective shell 1.

[0035] Step 2: The polyamide layer 51 has high hardness, wear resistance and impact resistance, which plays an impact-resistant role in the use of the protective shell 1. It also has excellent flexibility, pressure resistance, corrosion resistance and heat insulation properties, which extend the service life of the protective shell 1.

[0036] Step 3: By setting the ultra-high molecular weight polyethylene layer 42, the impact resistance is better. It has a low elongation at break but a strong ability to absorb energy, and has outstanding impact resistance and cut resistance, which increases the impact resistance of the protective shell 1.

[0037] Implementation steps for the second innovation point:

[0038] Step 1: The main functions of the carbon fiber reinforced plastic layer 43 include improving the mechanical strength, friction resistance and wear resistance of the material, as well as improving the overall performance of the material, thereby increasing the wear resistance and service strength of the protective shell 1;

[0039] Step 2: The PSU plastic layer 52 provides excellent heat resistance, chemical corrosion resistance and mechanical strength, which increases the strength and corrosion resistance of the protective shell 1 and extends its service life.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A moisture-proof protective casing for electronic chips, comprising a protective casing (1), characterized in that: The protective shell (1) is provided with a top cover (2) at the top, and a baffle (3) is installed vertically from left to right at the bottom of the inner cavity of the protective shell (1). The outer surface of the protective shell (1) is provided with a pressure-resistant layer (4), and a protective outer layer (5) is provided on the side of the pressure-resistant layer (4) away from the protective shell (1). The pressure-resistant layer (4) includes an HDPE plastic layer (41), the surface of which is provided with an ultra-high molecular weight polyethylene layer (42), and the outer surface of which is provided with a carbon fiber reinforced plastic layer (43). The protective outer layer (5) includes a polyamide layer (51), and a PSU plastic layer (52) is disposed on the surface of the polyamide layer (51).

2. The moisture-proof protective casing for electronic chips according to claim 1, characterized in that, The top cover (2) and the baffle (3) are made of the same material as the protective shell (1).

3. The moisture-proof protective casing for electronic chips according to claim 1, characterized in that, The protective shell (1) has a base pad (6) installed around its lower end, and the top cover (2) has a positioning groove (7) around its upper end that works in conjunction with the base pad (6).

4. The moisture-proof protective shell for electronic chips according to claim 1, characterized in that, The protective shell (1) has handle grooves (8) on the top of both sides of the front, and the protective shell (1) has reinforcing ribs on the front and back.

5. A moisture-proof protective casing for electronic chips according to claim 1, characterized in that, The surface of the HDPE plastic layer (41) is bonded to the inner surface of the ultra-high molecular weight polyethylene layer (42), and the surface of the ultra-high molecular weight polyethylene layer (42) is bonded to the inner surface of the carbon fiber reinforced plastic layer (43).

6. A moisture-proof protective casing for electronic chips according to claim 1, characterized in that, The surface of the polyamide layer (51) is bonded to the inner surface of the PSU plastic layer (52).

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