A chip package sealing detection device

Abstract

The utility model relates to chip package detection technical field, concretely is a kind of chip package body leakproofness detection device, and sealing detection subassembly includes support, support is symmetrically set in box top, sliding slot is opened in support inboard, support top is equipped with cross bar, vacuum pump is equipped at cross bar top, drive cylinder is equipped at cross bar bottom, drive cylinder output is equipped with sealing detection box, sealing detection box both ends are equipped with sliding block, sealing detection box is slidably connected with support sliding slot by sliding block, the utility model is closely matched by sealing detection box and groove through sealing strip, the action of combining vacuum pump and vacuum pipe, can form good sealing detection environment, improve the precision and efficiency of leakproofness detection.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging testing technology, specifically a chip package sealing testing device. Technical Background

[0002] The sealing of the chip package is one of the key factors to ensure the normal operation of the chip and extend its service life. If the chip package is not well sealed, impurities such as moisture and dust in the air will enter the package, leading to a decrease in chip performance or even damage. In the prior art, the device with patent number CN202311023410.3 first conducts an airtight test and then a watertight test. This can ensure that the chip package test will not damage the internal chip, and the test accuracy and effect can be improved by conducting two tests. It can ensure the airtightness of the package while testing the waterproofness of the package.

[0003] However, the device has some shortcomings in use. For example, when clamping the chip package, the device often does not clamp it securely enough, which can easily cause the chip package to shift during the testing process and affect the accuracy of the test results. At the same time, the device lacks an effective buffer structure, which may damage the chip package due to external impact during the testing process. In addition, the sealed testing structure of the device is not designed reasonably, and the testing efficiency and accuracy need to be improved.

[0004] Therefore, a new type of chip package sealing performance testing device is needed to solve the above problems. Utility Model Content

[0005] The present invention aims to solve the problems of unstable clamping, lack of buffer structure that easily damages the chip, and low detection efficiency and accuracy of existing chip package sealing detection devices.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a chip package sealing performance testing device, comprising a support component, a clamping component, a buffer component, and a sealing detection component.

[0007] The clamping assembly is located above the bearing assembly. The clamping assembly includes a placement plate with a rectangular groove at the top. The placement plate has a sliding groove inside and a drive motor at one end. The output end of the drive motor is connected to a bidirectional threaded rod through a bearing. The drive motor drives the bidirectional threaded rod to rotate. The bidirectional threaded rod is located inside the sliding groove of the placement plate.

[0008] The clamping assembly also includes a clamping plate and a movable block. The movable block is symmetrically arranged above the bidirectional threaded rod and is threadedly connected to the bidirectional threaded rod. The top of the movable block is fixedly connected to the clamping plate by bolts.

[0009] The load-bearing components include a housing and support legs, with the support legs evenly and symmetrically arranged at the bottom of the housing using bolts.

[0010] The buffer assembly is located at the top of the box. The buffer assembly includes a sleeve, the bottom end of which is fixedly connected to the top of the box. A connecting rod is movably provided inside the sleeve, the top end of which is fixedly connected to the bottom end of the placement plate. A buffer spring is provided at the bottom end of the connecting rod, the top end of which is fixedly connected to the bottom end of the connecting rod, and the bottom end of the buffer spring is fixedly connected to the inner wall of the sleeve.

[0011] The sealing test assembly includes a bracket symmetrically arranged at the top of the housing. A sliding groove is provided on the inner side of the bracket. A crossbar is provided at the top of the bracket. A vacuum pump is provided at the top of the crossbar. A drive cylinder is provided at the bottom of the crossbar. A sealing test box is provided at the output end of the drive cylinder. A slider is provided at both ends of the sealing test box. The sealing test box is slidably connected to the sliding groove of the bracket through the slider.

[0012] The sealing test assembly also includes a vacuum tube, a sealing layer, and a sealing strip; the vacuum pump output end and the vacuum tube are sealed together, the other end of the vacuum tube extends through and reaches the top of the sealing test box, the sealing layer is set inside the sealing test box, the sealing layer has evenly distributed ventilation holes, and the sealing strip is set at the bottom of the sealing test box, the sealing strip is adapted to the groove.

[0013] Each side of the clamp is equipped with a rubber pad, and the surface of the rubber pad has anti-slip texture.

[0014] The present invention has the following advantages: 1. By setting up a clamping component, the present invention drives the motor to rotate the bidirectional threaded rod, so that the movable block drives the clamping plate to clamp the chip package, which can stably clamp chip packages of different sizes, prevent them from shifting during the testing process, and improve the accuracy of the testing results.

[0015] 2. This utility model, through the setting of the buffer component, can play an effective buffering role during the testing process. Through the cooperation of the sleeve, connecting rod and buffer spring, it can reduce the impact of external force on the chip package, avoid damage to the chip package due to impact, and protect the integrity of the chip package.

[0016] 3. This utility model, through the tight fit between the sealing test box and the groove via a sealing strip, combined with the function of a vacuum pump and a vacuum tube, can form a good sealing test environment, thereby improving the accuracy and efficiency of sealing performance testing. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the overall structure of the clamping assembly of this utility model;

[0019] Figure 3This is a schematic diagram of the overall structure of the buffer component of this utility model;

[0020] Figure 4 This is a schematic diagram of the overall structure of the sealing detection component of this utility model.

[0021] The attached figures are labeled as follows:

[0022] 1. Load-bearing component; 11. Housing; 12. Support leg; 2. Clamping component; 21. Placement plate; 22. Groove; 23. Drive motor; 24. Bidirectional threaded rod; 25. Clamping plate; 26. Movable block; 3. Buffer component; 31. Sleeve; 32. Connecting rod; 33. Buffer spring; 4. Sealing detection component; 41. Bracket; 42. Crossbar; 43. Vacuum pump; 44. Vacuum tube; 45. Drive cylinder; 46. Sealing detection box; 47. Sealing layer; 48. Sealing strip. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] As attached Figure 1 To be continued Figure 4The aforementioned chip package sealing test device includes a support component 1, a clamping component 2, a buffer component 3, and a sealing test component 4.

[0027] Example 1

[0028] Specifically, the clamping assembly 2 is positioned above the bearing assembly. The clamping assembly 2 includes a placement plate 21 with a rectangular groove 22 at its top. The placement plate 21 has a sliding groove inside, and a drive motor 23 is located at one end of the placement plate 21. The output end of the drive motor 23 is connected to a bidirectional threaded rod 24 via a bearing. The drive motor 23 drives the bidirectional threaded rod 24 to rotate. The bidirectional threaded rod 24 is positioned inside the sliding groove of the placement plate 21. The drive motor 23 and the bidirectional threaded rod 24 are connected via a bearing, which can stably transmit the power of the drive motor 23 to the bidirectional threaded rod 24, allowing the bidirectional threaded rod 24 to rotate smoothly within the sliding groove of the placement plate 21, thus providing a power source for subsequent clamping actions.

[0029] The clamping assembly 2 also includes a clamping plate 25 and a movable block 26. The movable block 26 is symmetrically arranged above the bidirectional threaded rod 24 and is threadedly connected to the bidirectional threaded rod 24. The top of the movable block 26 is fixedly connected to the clamping plate 25 by bolts. The movable block 26 and the bidirectional threaded rod 24 can convert the rotational motion of the bidirectional threaded rod 24 into the linear motion of the movable block 26. The movable block 26 and the clamping plate 25 are fixed by bolts, which can drive the clamping plate 25 to move synchronously, thereby realizing the clamping function of the chip package.

[0030] Specifically, the load-bearing component 1 includes a housing 11 and support feet 12. The support feet 12 are evenly and symmetrically arranged at the bottom of the housing 11 by bolts, which can provide stable support for the housing 11, lift the housing 11 off the ground, avoid the housing 11 from direct contact with the ground and be worn, and at the same time ensure the stability of the overall placement of the device.

[0031] Specifically, the buffer assembly 3 is located at the top of the housing 11. The buffer assembly 3 includes a sleeve 31, the bottom end of which is fixedly connected to the top end of the housing 11. A connecting rod 32 is movably provided inside the sleeve 31, the top end of which is fixedly connected to the bottom end of the placement plate 21. A buffer spring 33 is provided at the bottom end of the connecting rod 32, the top end of which is fixedly connected to the bottom end of the connecting rod 32, and the bottom end of the buffer spring 33 is fixedly connected to the inner wall of the sleeve 31. The sleeve 31 is fixed to the housing 11, providing an installation base for the entire buffer assembly. The connecting rod 32 connects the placement plate 21 and the buffer spring 33, and can transfer the force on the placement plate 21 to the buffer spring 33. The buffer spring 33 is located between the connecting rod 32 and the sleeve 31, and can absorb the impact force through its own elastic deformation, playing a buffering and protective role, and preventing the chip package on the placement plate 21 from being damaged by impact.

[0032] Example 2

[0033] Based on Example 1, in order to further realize the sealing test of the chip package, a sealing test component is set on the top of the box.

[0034] Specifically, the sealing detection assembly 4 includes a bracket 41, which is symmetrically arranged at the top of the housing 11. A sliding groove is provided on the inner side of the bracket 41. A crossbar 42 is provided at the top of the bracket 41, and a vacuum pump 43 is provided at the top of the crossbar 42. A drive cylinder 45 is provided at the bottom of the crossbar 42, and a sealing detection box 46 is provided at the output end of the drive cylinder 45. The sealing detection box 46 has sliders at both ends, and the sealing detection box 46 is slidably connected to the sliding groove of the bracket 41 via the sliders. The bracket 41 is connected to the housing 11, providing support for the crossbar 42. The crossbar 42 is equipped with the vacuum pump 43 and the drive cylinder 45 respectively, achieving a reasonable layout of the components. The drive cylinder 45 is connected to the sealing detection box 46, which can drive the sealing detection box 46 to move up and down. The sealing detection box 46, through the cooperation of the slider and the sliding groove of the bracket 41, ensures the stability of the sealing detection box 46 during movement, enabling precise alignment of the sealing detection box 46.

[0035] The sealing detection assembly 4 also includes a vacuum tube 44, a sealing layer 47, and a sealing strip 48. The output end of the vacuum pump 43 is sealed to the vacuum tube 44, and the other end of the vacuum tube 44 extends through the top of the sealing detection box 46. The sealing layer 47 is located inside the sealing detection box 46, and vent holes are evenly distributed on the sealing layer 47. The sealing strip 48 is located at the bottom of the sealing detection box 46 and is adapted to the groove 22. The vacuum pump 43 is connected to the sealing detection box 46 through the vacuum tube 44, which can extract the air inside the sealing detection box 46 to form a sealed detection environment. The vent holes on the sealing layer 47 can make the air pressure inside the sealing detection box 46 evenly distributed, ensuring the accuracy of the detection. The sealing strip 48 cooperates with the groove 22 to enhance the sealing between the sealing detection box 46 and the placement plate 21, ensuring the airtightness of the detection environment.

[0036] Each side of the clamping plate 25 is equipped with a rubber pad with anti-slip texture. The rubber pad is located on one side of the clamping plate 25 to avoid direct rigid contact between the clamping plate 25 and the chip package, thus preventing the chip package from being damaged. The anti-slip texture on the surface of the rubber pad can increase the friction between the clamping plate and the chip package, improve the stability of the clamping, and prevent the chip package from sliding during the testing process.

[0037] In practical use, firstly, the chip package to be tested is placed in the groove 22 of the placement plate 21, and the drive motor 23 of the clamping assembly 2 is started. The drive motor 23 drives the bidirectional threaded rod 24 to rotate in the slide groove of the placement plate 21. Since the movable block 26 is threadedly connected to the bidirectional threaded rod 24, the rotation of the bidirectional threaded rod 24 will cause the two movable blocks 26 to move relative to each other along the slide groove, thereby driving the clamping plate 25 at the top to move synchronously until the clamping plate 25 firmly clamps the chip package. The rubber pad and anti-slip texture can enhance the stability of the clamping and prevent the chip package from shifting during the testing process.

[0038] Next, the drive cylinder 45 of the sealing test assembly 4 is activated, and the drive cylinder 45 pushes the sealing test box 46 downward. The sliders at both ends of the sealing test box 46 slide smoothly along the sliding grooves on the inner side of the bracket 41 to ensure that the sealing test box 46 moves down accurately. When the sealing strip 48 at the bottom of the sealing test box 46 is completely in contact with the groove 22 of the placement plate 21, the drive cylinder 45 is stopped. At this time, the sealing test box 46 and the groove 22 form a closed test space, which encloses the chip package.

[0039] Subsequently, the vacuum pump 43 is started. The vacuum pump 43 evacuates the closed detection space through the vacuum tube 44, creating a negative pressure environment in the detection space. The sealing layer 47 inside the sealed detection box 46 and the vent holes on it can ensure that the air pressure in the detection space is evenly distributed, thus ensuring the consistency of the detection conditions.

[0040] During the testing process, if the chip package has good sealing performance, the negative pressure in the testing space will remain stable; if the chip package has sealing defects, outside air will seep into the testing space through the defects, causing changes in negative pressure. By monitoring the changes in air pressure in the testing space, it can be determined whether the sealing performance of the chip package is qualified.

[0041] Meanwhile, the buffer component 3 plays a role throughout the testing process. When the device is subjected to an external impact, the placement plate 21 will drive the connecting rod 32 to move downward. The connecting rod 32 compresses the buffer spring 33. The elastic deformation of the buffer spring 33 will absorb the impact force, reduce the impact on the chip package, and play a role in protecting the chip package. After the test is completed, the vacuum pump 43 and the drive cylinder 45 are turned off, the sealed test box 46 moves upward and resets, the drive motor 23 reverses, the clamping plate 25 is released, and the tested chip package can be taken out.

[0042] It should also be understood that vacuum pump 43 is common knowledge in the field. It is only used and not modified, so the control method and circuit connection will not be described in detail.

[0043] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific implementation of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0044] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A chip package sealing performance testing device, characterized in that, Includes: a load-bearing assembly (1), a clamping assembly (2), a buffer assembly (3), and a seal detection assembly (4); The clamping assembly (2) is positioned above the bearing assembly (1). The clamping assembly (2) includes a placement plate (21). A groove (22) is provided at the top of the placement plate (21). The groove (22) is rectangular. A sliding groove is provided inside the placement plate (21). A drive motor (23) is provided at one end of the placement plate (21). The output end of the drive motor (23) is connected to a bidirectional threaded rod (24) through a bearing. The drive motor (23) drives the bidirectional threaded rod (24) to rotate. The bidirectional threaded rod (24) is located inside the sliding groove of the placement plate (21).

2. The chip package sealing performance testing device according to claim 1, characterized in that: The clamping assembly (2) also includes a clamping plate (25) and a movable block (26). The movable block (26) is symmetrically arranged above the bidirectional threaded rod (24). The movable block (26) is threadedly connected to the bidirectional threaded rod (24). The top of the movable block (26) is fixedly connected to the clamping plate (25) by bolts.

3. The chip package sealing performance testing device according to claim 2, characterized in that: The load-bearing component (1) includes a housing (11) and support feet (12), which are evenly and symmetrically arranged at the bottom of the housing (11) by bolts.

4. The chip package sealing performance testing device according to claim 3, characterized in that: The buffer assembly (3) is located at the top of the box (11). The buffer assembly (3) includes a sleeve (31). The bottom end of the sleeve (31) is fixedly connected to the top end of the box (11). A connecting rod (32) is movably provided inside the sleeve (31). The top end of the connecting rod (32) is fixedly connected to the bottom end of the placement plate (21). A buffer spring (33) is provided at the bottom end of the connecting rod (32). The top end of the buffer spring (33) is fixedly connected to the bottom end of the connecting rod (32). The bottom end of the buffer spring (33) is fixedly connected to the inner wall of the sleeve (31).

5. The chip package sealing performance testing device according to claim 4, characterized in that: The sealing test assembly (4) includes a bracket (41), which is symmetrically arranged at the top of the box (11). A sliding groove is provided on the inner side of the bracket (41). A crossbar (42) is provided at the top of the bracket (41). A vacuum pump (43) is provided at the top of the crossbar (42). A drive cylinder (45) is provided at the bottom of the crossbar (42). A sealing test box (46) is provided at the output end of the drive cylinder (45). A slider is provided at both ends of the sealing test box (46). The sealing test box (46) is slidably connected to the sliding groove of the bracket (41) through the slider.

6. The chip package sealing performance testing device according to claim 5, characterized in that: The sealing detection assembly (4) also includes a vacuum tube (44), a sealing layer (47), and a sealing strip (48); The output end of the vacuum pump (43) is sealed to the vacuum tube (44). The other end of the vacuum tube (44) passes through the top of the extended sealing test box (46). The sealing layer (47) is set inside the sealing test box (46). Ventilation holes are evenly opened on the sealing layer (47). The sealing strip (48) is set at the bottom of the sealing test box (46). The sealing strip (48) is adapted to the groove (22).

7. The chip package sealing performance testing device according to claim 6, characterized in that: Rubber pads are provided on one side of the clamp (25), and the surface of the rubber pads is provided with anti-slip texture.

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