A double-fin double-air-duct microcomputer heat pipe radiator with staggered arrangement

Abstract

The utility model relates to a kind of double-finned double-air duct microcomputer heat pipe radiator of staggered layout, be equipped in CPU chip on mini PC, including heat dissipation blower and the heat dissipation device that is attached on the heat dissipation blower, the heat dissipation device includes heat dissipation copper sheet group, heat pipe group, fin group and chip radiator baseplate.The chip radiator baseplate is attached on CPU chip, and the heat generated by CPU chip is quickly conducted to the heat pipe group, the heat dissipation copper sheet group and the fin group, realizes the quick conduction of heat, and the heat dissipation blower is provided with double air duct, and the air outlet of each air duct is provided with fin, and the design of double fin increases the heat dissipation area of the radiator, reduces the wind speed flowing through the fin under the condition that the total air volume of the heat dissipation blower is unchanged, reduces the noise of the heat dissipation blower, and ensures the heat dissipation effect of equipment.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structure technology, specifically to a microcomputer heat pipe radiator with staggered double fins and double airflow channels. Background Technology

[0002] A mini PC (microcomputer host) is a small, portable computer device commonly used in home entertainment, business offices, and technology fields. Unlike the bulky traditional computer host, a mini PC has a relatively compact microcomputer host. The size of the microcomputer host is not limited by the screen size, making it extremely portable. Mini smart computers can easily switch between display devices such as LCD monitors, televisions, and projectors anytime, anywhere.

[0003] Thermal Design Power (TDP) refers to the maximum amount of heat generated by a processor when operating at full load, measured in watts. TDP is a core reference indicator for thermal system design. To meet the cooling requirements of devices, sufficient fan airflow (CFM) is needed; however, high-speed airflow over fins generates significant noise. Due to the small size of mini PCs and limited space within the chassis, the compact structure of various components places even higher demands on heat dissipation and noise control in models with TDPs of 45W, 65W, or even higher. Utility Model Content

[0004] In view of this, it is necessary to provide a microcomputer heat pipe radiator with a staggered arrangement of dual fins and dual airflow channels that increases heat dissipation area and reduces noise.

[0005] A staggered dual-fin, dual-airflow heat pipe radiator for microcomputers is installed on the CPU chip within a mini PC. It includes a cooling blower and a heat dissipation device attached to the blower. The heat dissipation device comprises a copper heat sink assembly, a heat pipe assembly, a fin assembly, and a chip heat sink substrate. The chip heat sink substrate is attached to the heat pipe assembly. The heat pipe assembly and the cooling blower are respectively attached to both sides of the copper heat sink assembly. The cooling blower includes multiple airflow channels. Each fin in the fin assembly is located at the outlet of each airflow channel and is attached to the copper heat sink assembly to achieve rapid heat dissipation of the CPU chip.

[0006] Preferably, the heat dissipation copper fin assembly includes a first heat dissipation copper fin and a second heat dissipation copper fin, the first heat dissipation copper fin and the second heat dissipation copper fin are attached to the outside of the air duct of the heat dissipation blower; at the same time, the first heat dissipation copper fin and the second heat dissipation copper fin are spliced ​​together to form the mounting bracket of the heat dissipation blower.

[0007] Preferably, the heat pipe assembly includes a first U-shaped heat pipe and a second U-shaped heat pipe, which are interleaved and connected alternately. The two side arms of the first U-shaped heat pipe and the second U-shaped heat pipe are respectively welded to the first heat dissipation copper sheet and the second heat dissipation copper sheet.

[0008] Preferably, the chip heat sink substrate is disposed on the side arm of the first U-shaped heat pipe and the second U-shaped heat pipe, and thermally conductive gel is disposed above the chip heat sink substrate.

[0009] Preferably, the thermally conductive gel is filled between the CPU chip and the chip heat sink substrate, and the thermally conductive gel is used to transfer the heat generated by the CPU to the chip heat sink substrate.

[0010] Preferably, the fin assembly includes a first fin and a second fin, the first fin and the second fin having a predetermined angle between them, and the first fin and the second fin being respectively attached to the first heat dissipation copper sheet and the second heat dissipation copper sheet.

[0011] Preferably, the cooling blower includes a blower impeller and a volute. The volute has two air ducts, each with an air outlet. The two air ducts are at a predetermined angle so that the two air outlets face different directions. The first fin and the second fin are respectively located at the air outlets of the two air ducts.

[0012] Preferably, the edges of the heat pipe assembly and the fin assembly are provided with shock-absorbing foam, which abuts against the inner side of the equipment housing to reduce the noise of the blower during operation.

[0013] Preferably, the heat dissipation copper fin assembly is further provided with a thermally conductive silicone pad, which is used to fill the gap between the electronic components and the heat dissipation copper fin assembly.

[0014] In the aforementioned staggered dual-fin, dual-airflow microcomputer heat pipe radiator, the chip heat sink substrate is attached to the CPU chip, rapidly transferring the heat generated by the CPU chip to the heat pipe assembly, the copper heat sink assembly, and the fin assembly, achieving rapid heat transfer. Simultaneously, the cooling blower is equipped with dual airflow channels, each with fins at its outlet. This dual-fin design increases the heat dissipation area of ​​the radiator. While maintaining the same total airflow from the cooling blower, it reduces the air velocity flowing through the fins, lowering the blower's noise and ensuring effective heat dissipation. This invention has a simple structure, is easy to implement, has low cost, and is readily applicable. Attached Figure Description

[0015] Figure 1This is a schematic diagram of the structure of a microcomputer heat pipe radiator with staggered double fins and double air ducts according to an embodiment of this utility model.

[0016] Figure 2 This is a schematic diagram of the heat dissipation device of a microcomputer heat pipe radiator with staggered double fins and double air ducts according to an embodiment of this utility model.

[0017] Figure 3 This is a schematic diagram of the heat dissipation blower of a microcomputer heat pipe radiator with staggered double fins and double air ducts according to an embodiment of this utility model (with the volute cover removed). Detailed Implementation

[0018] The present invention will now be described in detail with reference to specific embodiments and accompanying drawings.

[0019] Please see Figures 1 to 3 This paper illustrates a staggered dual-fin, dual-airflow microcomputer heat pipe radiator 100, mounted on a CPU chip within a mini PC. It includes a cooling blower 10 and a heat dissipation device 20 attached to the blower 10. The heat dissipation device 20 comprises a copper heat sink assembly, a heat pipe assembly, a fin assembly, and a chip heat sink substrate 27. The chip heat sink substrate 27 is attached to the heat pipe assembly. The heat pipe assembly and the blower 10 are respectively attached to both sides of the copper heat sink assembly. The blower 10 includes multiple airflow channels. Each fin in the fin assembly is located at the outlet of each airflow channel and is attached to the copper heat sink assembly to achieve rapid heat dissipation of the CPU chip.

[0020] Preferably, the heat dissipation copper fin assembly includes a first heat dissipation copper fin 21 and a second heat dissipation copper fin 22, the first heat dissipation copper fin 21 and the second heat dissipation copper fin 22 are attached to the outside of the air duct of the heat dissipation blower 10; at the same time, the first heat dissipation copper fin 21 and the second heat dissipation copper fin 22 are spliced ​​together to form the mounting bracket of the heat dissipation blower 10.

[0021] Specifically, the first heat dissipation copper plate 21 and the second heat dissipation copper plate 22 can be used to transfer the heat generated by the equipment, and can also be used for the fixed installation of the heat dissipation blower 10, which simplifies the internal structure of the equipment and improves the space utilization rate inside the equipment.

[0022] Preferably, the heat pipe assembly includes a first U-shaped heat pipe 23 and a second U-shaped heat pipe 24, which are staggered and interlocked. The two side arms of the first U-shaped heat pipe 23 and the second U-shaped heat pipe 24 are respectively welded to the first heat dissipation copper sheet 21 and the second heat dissipation copper sheet 22.

[0023] Specifically, in this embodiment, both the first U-shaped heat pipe 23 and the second U-shaped heat pipe 24 are flattened copper heat pipes with a diameter of 8mm. The first U-shaped heat pipe 23 and the second U-shaped heat pipe 24 are preferably copper tube heat conduction components produced by sintering process. The thermal conductivity of copper itself exceeds 400W / (m·K), while the thermal conductivity of sintered copper tubes can reach 22000~25000W / (m·K), resulting in faster heat conduction speed.

[0024] Preferably, the chip heat sink substrate 27 is disposed on the side arm of the first U-shaped heat pipe 23 and the second U-shaped heat pipe 24, and thermally conductive gel is disposed above the chip heat sink substrate 27.

[0025] Preferably, the thermally conductive gel is filled between the CPU chip and the chip heat sink substrate 27, and the thermally conductive gel is used to transfer the heat generated by the CPU to the chip heat sink substrate 27.

[0026] Specifically, the thermally conductive gel is a paste-like gap-filling material made of silicone resin as the matrix and ceramic / metal oxide fillers. It cures to form a highly thermally conductive elastomer, combining the structural adaptability of thermal pads with the low thermal resistance of silicone grease. The thermally conductive gel has advantages such as ultra-thin filling, permanent wetting, automatic adaptation, and insulation and weather resistance. In this embodiment, the thermal conductivity of the thermally conductive gel is 6-9W. The thermally conductive gel fills the space between the CPU chip and the chip heatsink substrate 27, rapidly transferring the heat generated by the CPU to the chip heatsink substrate 27, and then conducting it through the chip heatsink substrate 27 to the heat pipe assembly and the copper heat sink assembly.

[0027] Preferably, the fin assembly includes a first fin 25 and a second fin 26, with a predetermined angle between the first fin 25 and the second fin 26, and the first fin 25 and the second fin 26 are respectively attached to the first heat dissipation copper sheet 21 and the second heat dissipation copper sheet 22.

[0028] Preferably, the cooling blower 10 includes a blower impeller and a volute. The volute has two air ducts, each with an air outlet. The two air ducts are at a predetermined angle so that the two air outlets face different directions. The first fin 25 and the second fin 26 are respectively located at the air outlets of the two air ducts.

[0029] Specifically, in this embodiment, the two air ducts include a first air duct 11 and a second air duct 12. The air outlets of the two air ducts are at a 90-degree angle, so that the first fin 25 and the second fin 26 are also at a 90-degree angle. The vertically arranged first fin 25 and second fin 26 can increase the heat dissipation area, reduce the space occupied, and improve the heat dissipation efficiency.

[0030] Specifically, the air volume in each air duct of the cooling blower 10 is positively correlated with the size of the first fin 25 and the second fin 26, and the axial sides of the fan impeller of the cooling blower 10 are unobstructed, and the air inlet of the fan impeller is far away from other equipment, so that the air duct of the fan impeller is unobstructed.

[0031] Preferably, the edges of the heat pipe assembly and the fin assembly are provided with shock-absorbing foam, which abuts against the inner side of the equipment housing to reduce the noise of the blower during operation.

[0032] Preferably, the heat dissipation copper fin assembly is further provided with a thermally conductive silicone pad, which is used to fill the gap between the electronic components and the heat dissipation copper fin assembly.

[0033] Specifically, in this embodiment, a thermally conductive silicone pad with a thermal conductivity of 3W is used to fill the gap between the electronic components and the heat sink. The thermally conductive silicone pad is used to establish a heat conduction channel and also plays a role in electrical insulation and shock absorption.

[0034] In the aforementioned staggered dual-fin, dual-airflow microcomputer heat pipe radiator 100, the chip heat sink substrate 27 is attached to the CPU chip, rapidly transferring the heat generated by the CPU chip to the heat pipe assembly, the heat dissipation copper fin assembly, and the fin assembly, achieving rapid heat transfer. Simultaneously, the cooling blower 10 is equipped with dual airflow channels, each with fins at its outlet. This dual-fin design increases the heat dissipation area of ​​the radiator. While maintaining the same total airflow from the cooling blower 10, it reduces the air velocity flowing through the fins, lowering the noise level of the cooling blower 10 and ensuring effective heat dissipation. This invention has a simple structure, is easy to implement, has low cost, and is readily applicable.

[0035] It should be noted that this utility model is not limited to the above-described embodiments. Based on the inventive spirit of this utility model, those skilled in the art can make other changes, and these changes made based on the inventive spirit of this utility model should be included within the scope of protection claimed by this utility model.

Claims

1. A staggered dual-fin, dual-airflow heat pipe radiator for a microcomputer, mounted on the CPU chip within a mini PC, characterized in that, The device includes a cooling blower and a cooling device attached to the cooling blower. The cooling device includes a copper heat sink assembly, a heat pipe assembly, a fin assembly, and a chip heat sink substrate. The chip heat sink substrate is attached to the heat pipe assembly. The heat pipe assembly and the cooling blower are respectively attached to both sides of the copper heat sink assembly. The cooling blower includes multiple air ducts. Each fin in the fin assembly is located at the air outlet of each air duct and is attached to the copper heat sink assembly to achieve rapid heat dissipation of the CPU chip.

2. The microcomputer heat pipe radiator with staggered dual-fin dual-airflow design as described in claim 1, characterized in that, The heat dissipation copper fin assembly includes a first heat dissipation copper fin and a second heat dissipation copper fin, which are attached to the outside of the air duct of the heat dissipation blower; at the same time, the first heat dissipation copper fin and the second heat dissipation copper fin are spliced ​​together to form the mounting bracket of the heat dissipation blower.

3. The microcomputer heat pipe radiator with staggered dual-fin dual-airflow design as described in claim 2, characterized in that, The heat pipe assembly includes a first U-shaped heat pipe and a second U-shaped heat pipe, which are interleaved and connected. The two side arms of the first U-shaped heat pipe and the second U-shaped heat pipe are respectively welded to the first heat dissipation copper sheet and the second heat dissipation copper sheet.

4. The microcomputer heat pipe radiator with staggered dual-fin dual-airflow design as described in claim 3, characterized in that, The chip heat sink substrate is disposed on the side arms of the first U-shaped heat pipe and the second U-shaped heat pipe, and thermally conductive gel is disposed on the top of the chip heat sink substrate.

5. The microcomputer heat pipe radiator with staggered dual-fin dual-airflow design as described in claim 4, characterized in that, The thermally conductive gel is filled between the CPU chip and the chip heat sink substrate, and the thermally conductive gel is used to transfer the heat generated by the CPU to the chip heat sink substrate.

6. The microcomputer heat pipe radiator with staggered dual-fin dual-airflow design as described in claim 2, characterized in that, The fin assembly includes a first fin and a second fin, with a predetermined angle between the first fin and the second fin, and the first fin and the second fin are respectively attached to the first heat dissipation copper plate and the second heat dissipation copper plate.

7. The microcomputer heat pipe radiator with staggered dual-fin dual-airflow design as described in claim 6, characterized in that, The cooling blower includes a blower impeller and a volute. The volute has two air ducts, each with an air outlet. The two air ducts are at a predetermined angle so that the two air outlets face different directions. The first fin and the second fin are respectively located at the air outlets of the two air ducts.

8. The microcomputer heat pipe radiator with staggered dual-fin dual-airflow design as described in claim 1, characterized in that, The edges of the heat pipe assembly and the fin assembly are provided with shock-absorbing foam, which abuts against the inside of the equipment housing to reduce the noise of the blower during operation.

9. The microcomputer heat pipe radiator with staggered dual-fin dual-airflow design as described in claim 1, characterized in that, The heat dissipation copper fin assembly is also provided with a thermally conductive silicone pad, which is used to fill the gap between the electronic components and the heat dissipation copper fin assembly.

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