A module junction box for improving flowability of two-component glue

Abstract

The utility model discloses a module junction box of improving the flow of two -component glue, including box body and with box body clamping fixed face cover, be provided with accommodation cavity in the box body, and the recessed plastic package body groove is arranged in accommodation cavity bottom, and the both sides of plastic package body groove are provided with the support part, and the outside of support part is provided with the locating column, and the module diode is installed on the locating column, the side of box body is provided with first identification part, and the first box body below first identification part is provided with the cable groove, and the cable groove is installed with the cable of module diode connection, and the cable below is connected in the cable groove through the wire pressing block clamping, the utility model discloses the box body bottom busbar hole place trepanning, simple structure, injection moulding technology is few, and the flow of two -component glue is improved, and the heat dissipation effect of the whole junction box is improved.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic junction box technology, and in particular to a module junction box that improves the flowability of two-component adhesive. Background Technology

[0002] A photovoltaic junction box is a connecting device between a solar cell array composed of solar cell modules and a solar charging control device. Its main function is to connect and protect the solar photovoltaic modules, connect the power generated by the solar cells to external lines, and conduct the current generated by the photovoltaic modules.

[0003] Existing junction boxes are prone to air entrapment due to their complex bottom structure. During the potting process, the air entrapment at the busbars prevents the glue from flowing properly, resulting in voids that affect product quality and appearance. In addition, the voids created during potting can also cause the diode temperature to rise. Utility Model Content

[0004] To address the aforementioned technical problems, a module junction box that improves the flowability of two-component adhesives is provided.

[0005] To achieve the above objectives, this utility model discloses a modular junction box for improving the flowability of two-component adhesive, including a box body and a cover that is snapped and fixed to the box body. The box body is provided with a receiving cavity, and a recessed encapsulation groove is provided at the bottom of the receiving cavity. Support parts are provided on both sides of the encapsulation groove, and positioning posts are provided on the outer side of the support parts. A modular diode is installed on the positioning posts. A first marking part is provided on the side of the box body, and a cable groove is provided below the first marking part on the box body. A cable connected to the modular diode is installed in the cable groove, and the cable is snapped into the cable groove by a wire clamping block.

[0006] Furthermore, the support includes a first platform with a manifold hole at the top, the side of the first platform being inclined and connected to the bottom of the accommodating cavity, and a second platform located at the notch of the first platform on the side of the manifold hole.

[0007] Furthermore, the positioning post is provided with a trapezoidal block that connects to the bottom of the accommodating cavity. The height of the trapezoidal block is the same as the height of the support. At least four sets of positioning posts are provided and distributed in an array within the accommodating cavity.

[0008] Furthermore, the module diode includes two opposing electrode plates and a plastic encapsulation body disposed at the connection between the electrode plates, with a solder block mounted on the front side of the electrode plates.

[0009] Furthermore, the electrode plate is provided with a bending head within the plastic encapsulation. The bending head includes a first bending section and a second bending section, and a conductive sheet is provided on the outer side of the bending head.

[0010] Furthermore, the electrode plate is provided with a bending head within the plastic encapsulation. The bending head includes a first bending section, and stamping grooves are formed on both sides of the bending head and the electrode plate. A conductive sheet is provided on the outer side of the bending head.

[0011] Furthermore, a rectangular soldered copper sheet is provided below the module diode in the cable.

[0012] The beneficial effects of this utility model compared with the prior art are as follows:

[0013] 1. The bottom of the box has openings at the manifold holes to allow for better flow of the two-component adhesive; there are no voids at the bottom.

[0014] 2. Simple structure, fewer injection molding processes;

[0015] 3. The connector jacket is protected by an outer shell, increasing strength and connection stability;

[0016] 4. Improve the heat dissipation effect of the junction box. Attached Figure Description

[0017] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0018] Figure 1 This is a schematic diagram of the structure of the box body of this utility model.

[0019] Figure 2 This is a schematic diagram of the bottom of the box body of this utility model.

[0020] Figure 3 This is a structural diagram of the diode module in the housing of this utility model.

[0021] Figure 4 This is a structural diagram of the electrode plate in Embodiment 1 of this utility model.

[0022] Figure 5 This is a structural diagram of the electrode plate in Embodiment 2 of this utility model.

[0023] Figure 6 This is a structural diagram of Embodiment 3 of the present invention.

[0024] In the diagram: 10 is the housing; 11 is the molding compound groove; 12 is the first platform; 13 is the second platform; 14 is the positioning post; 141 is the trapezoidal block; 15 is the first identification part; 16 is the busbar hole; 17 is the faceplate; 20 is the module diode; 21 is the electrode plate; 211 is the first bending section; 212 is the second bending section; 213 is the conductive sheet; 22 is the molding compound; 23 is the solder block; 30 is the cable; 31 is the soldering copper sheet; 40 is the wire clamping block. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Embodiment 1 of this utility model, as follows: Figure 1 and Figure 2 As shown, the box 10 has a receiving cavity inside. The top of the box 10 has a buckle that is fixed to the cover 17. The bottom of the receiving cavity has a recessed molding groove 11. Support parts are provided on both sides of the molding groove 11. Positioning posts 14 are provided on the outside of the support parts. A module diode 20 is installed on the positioning post 14. The electrode plate 21 of the module diode 20 has a foolproof notch. The molding 22 has a direction mark to avoid incorrect installation direction. The side of the box 10 has a first marking part 15. The box 10 below the first marking part 15 has a cable groove. The cable 30 connected to the module diode 20 is installed in the cable groove. The cable groove has a large notch on the side. Adhesive flows to this point to seal the cable. The cable 30 is clamped in the cable groove by a wire clamping block 40. The first marking part 15 is marked with "+". The box is used as a positive terminal box.

[0027] like Figure 3 As shown, the support includes a first platform 12 with a busbar hole 16 at the top. Different housings are connected by busbars between the busbar holes. The side of the first platform 12 is inclined and connected to the bottom of the accommodating cavity. A second platform 13 is provided on the side of the busbar hole 16 at the notch of the first platform 12. The inclined surface of the support near the molding compound groove 11 fits against the molding compound 22 to fix the module diode 20. The first platform 12 and the second platform 13 provide support for the module diode 20 while reducing the contact area with the module diode 20, thus improving the heat dissipation effect.

[0028] The positioning post 14 is provided with a trapezoidal block 141 connected to the bottom of the accommodating cavity. The height of the trapezoidal block 141 is the same as the height of the support part. At least four sets of positioning posts 14 are provided and distributed in an array in the accommodating cavity. The positioning post 14 is used for the rapid positioning of the module diode 20. After the module diode 20 is positioned, the trapezoidal block 141 together with the support part provides support.

[0029] like Figure 4As shown, the module diode 20 includes two opposing electrode plates 21 and a plastic encapsulation 22 disposed at the connection of the electrode plates 21. A solder block 23 is mounted on the front of the electrode plate 21 for heat dissipation. A bending head is disposed inside the plastic encapsulation 22 on the electrode plate 21. The bending head includes a first bending section 211 and a second bending section 212. A conductive sheet 213 is disposed on the outside of the bending head. The bending forming process has a lower processing cost compared to the traditional cold heading forming process.

[0030] A rectangular welding copper sheet 31 is provided below the module diode 20 for the cable 30. The cable 30 and the module diode 20 are connected and fixed by resistance welding. A rectangular notch is provided in the housing 10 at this location to allow for resistance welding processing.

[0031] The difference between Embodiment 2 and Embodiment 1 of this utility model is that, as shown in the following... Figure 5 As shown, the electrode plate nail head type in the module diode 20 is different. In this embodiment, the electrode plate 21 is provided with a bending nail head in the plastic encapsulation body 22. The bending nail head has only one bending. The two sides of the bending nail head and the electrode plate 21 are provided with stamping grooves. A conductive sheet 213 is provided on the outside of the bending nail head. Compared with the two-stage bending in the first embodiment, the large R angle is eliminated, reducing one bending process.

[0032] The difference between Embodiment 3 and Embodiment 1 of this utility model is that, as shown in the following... Figure 6 As shown, the first marking is marked with "-", and the box is used as a negative terminal box.

[0033] Several points need to be clarified: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly, and can refer to mechanical or electrical connections, or internal connections between two components, or direct connections. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships, and the relative positional relationships may change when the absolute position of the described objects changes. Second, in this document, relational terms such as "first" and "second" are only used to distinguish one entity from another entity, and do not necessarily require or imply any such actual relationship or order between these entities.

[0034] The above examples are merely illustrative of this utility model and do not constitute a limitation on the scope of protection of this utility model. All designs that are the same as or similar to this utility model are within the scope of protection of this utility model.

Claims

1. A modular junction box for improving the flowability of two-component adhesive, comprising a box body (10) and a cover (17) snapped and fixed to the box body (10), characterized in that, The box (10) has a receiving cavity, and a recessed encapsulation groove (11) is provided at the bottom of the receiving cavity. Support parts are provided on both sides of the encapsulation groove (11), and positioning posts (14) are provided on the outside of the support parts. A module diode (20) is installed on the positioning post (14). A first marking part (15) is provided on the side of the box (10). A cable groove is provided at the box (10) below the first marking part (15). A cable (30) connected to the module diode (20) is installed in the cable groove. The cable (30) is clamped in the cable groove by a wire clamping block (40).

2. A module junction box for improving the flowability of two-component adhesive according to claim 1, characterized in that, The support includes a first platform (12) with a manifold hole (16) at the top, the side of the first platform (12) is inclined and connected to the bottom of the accommodating cavity, and a second platform (13) is provided on the side of the manifold hole (16) at the notch of the first platform (12).

3. A module junction box for improving the flowability of two-component adhesive according to claim 1, characterized in that, The positioning post (14) is provided with a trapezoidal block (141) connected to the bottom of the accommodating cavity. The height of the trapezoidal block (141) is the same as the height of the support part. The positioning post (14) is provided with at least four sets and is distributed in an array in the accommodating cavity.

4. A module junction box for improving the flowability of two-component adhesive according to claim 1, characterized in that, The module diode (20) includes two opposing electrode plates (21) and a plastic encapsulator (22) disposed at the connection of the electrode plates (21). A solder block (23) is mounted on the front side of the electrode plates (21).

5. A module junction box for improving the flowability of two-component adhesive according to claim 4, characterized in that, The electrode plate (21) has a bending head inside the encapsulation body (22). The bending head includes a first bending section (211) and a second bending section (212). A conductive sheet (213) is provided on the outside of the bending head.

6. A module junction box for improving the flowability of two-component adhesive according to claim 4, characterized in that, The electrode plate (21) has a bending head inside the encapsulation body (22). The bending head includes a first bending section (211). The two sides of the bending head and the electrode plate (21) are provided with stamping grooves. A conductive sheet (213) is provided on the outside of the bending head.

7. A module junction box for improving the flowability of two-component adhesive according to claim 1, characterized in that, The cable (30) has a rectangular welded copper sheet (31) below the module diode (20).

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