A bendable thermoelectric separation copper substrate

Abstract

The utility model relates to a kind of bendable thermoelectric separation copper substrate, to solve the current substrate each layer is fixedly attached together, thus in bending, it can cause heat dissipation channel to be oppressed and reduce, it can also cause partial position deformation due to bending, thereby the technical problem of affecting the heat dissipation effect and service life of copper substrate, including flexible connecting layer, the top center of flexible connecting layer is fixedly connected with the bottom center of thermoelectric separation layer, the top two sides of flexible connecting layer are equipped with several sliding slots, the inner side of sliding slot is slidably connected with slider The utility model separates the two ends of the topmost thermoelectric separation layer from fixed, and sets sliding slot and slider to limit it, when bending, the two ends of thermoelectric separation layer will slide relative to flexible connecting layer, guarantee the unobstructed heat dissipation channel, as far as possible reduce the situation of partial position deformation due to bending, guarantee the normal service life of copper substrate.

Description

Technical Field

[0001] This utility model relates to the field of copper substrate technology, specifically a bendable thermoelectrically separable copper substrate. Background Technology

[0002] In 3D interconnect circuit board design requirements, flexible layout and connection in three-dimensional space are necessary. Bendable thermoelectrically separable copper substrates, through their flexible connection layers, can be bent and folded within a certain range, thereby adapting to complex 3D spatial structures and achieving tight connection and efficient layout of electronic components. This flexibility is unmatched by traditional rigid circuit boards. Bendable thermoelectrically separable copper substrates are an innovative electronic packaging material that combines thermoelectric separation technology and bendability, providing electronic devices with greater flexibility and adaptability. While maintaining excellent heat dissipation and electrical performance, this substrate material can also be bent and folded as needed to meet the packaging requirements of complex electronic devices.

[0003] In 3D interconnect design, heat dissipation performance is particularly important because the compact spatial layout may lead to heat accumulation. Traditional bendable thermoelectrically separated copper substrates have layers that are tightly fixed together. Therefore, when bending, the heat dissipation channels may be compressed and shrink or collapse. Bending may also cause deformation in some areas, thus affecting the heat dissipation effect and service life of the copper substrate.

[0004] For example, in some applications of rotating circuit boards, the fixed heat dissipation layer may develop micro-wrinkles and deformations in the bending area, which may lead to a reduction in the heat dissipation channel area between layers or even local collapse. At the same time, the bending area may undergo plastic deformation due to stress concentration, which may lead to the propagation of micro-cracks in the conductive layer, ultimately causing thermal runaway or electrical connection failure. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the existing technology, adapt to practical needs, and provide a bendable thermoelectric separation copper substrate to solve the technical problem that the current substrates are all tightly fixed together, so when bent, the heat dissipation channels may be compressed and shrink or collapse, and some parts may be deformed due to bending, thus affecting the heat dissipation effect and service life of the copper substrate.

[0006] To achieve the purpose of this utility model, the technical solution adopted by this utility model is as follows: a bendable thermoelectric separation copper substrate is designed, including a flexible connecting layer. The top center of the flexible connecting layer is fixedly connected to the bottom center of the thermoelectric separation layer. Several sliding grooves are opened on both sides of the top of the flexible connecting layer. A slider is slidably connected to the inner side of the sliding groove. The slider is used to limit the thermoelectric separation layer above. The slider is fixedly connected to the bottom of the thermoelectric separation layer. The bottom of the thermoelectric separation layer is attached to the top of the flexible connecting layer.

[0007] In this solution, the two ends of the top thermoelectric separation layer are detached from the fixed layer, and a sliding groove and a slider are set to limit its movement. When bending, the two ends of the thermoelectric separation layer will slide relative to the flexible connection layer, exposing the lower heat dissipation port. This ensures unobstructed heat dissipation channels while minimizing deformation in some areas due to bending, thus ensuring the normal service life of the copper substrate.

[0008] Preferably, the bottom of the slide groove is provided with a lower heat dissipation port, which penetrates the flexible connecting layer and is located below the slider.

[0009] In practical applications, the lower heat dissipation vent is used to supplement the heat dissipation channel. When bending, the slider moves away, and the lower heat dissipation vent is exposed, thereby supplementing the total heat dissipation channel area and ensuring normal heat dissipation capacity.

[0010] Preferably, a rectangular opening is provided on the top surface of the thermoelectric separation layer above the chute, and an upper heat dissipation opening is provided at the bottom inner part of the rectangular opening, the upper heat dissipation opening penetrating the thermoelectric separation layer.

[0011] In practical applications, the upper and lower heat dissipation vents work together to create a new heat dissipation channel, which connects with the outside when the structure is bent, thereby improving the efficiency of heat dissipation.

[0012] Preferably, an expansion groove is provided on the inner wall of one side of the rectangular opening, and the inner wall of the other side of the rectangular opening is fixedly connected to one end of the spring piece. The movable end of the spring piece is located inside the expansion groove, and one end of the spring piece is slidably connected inside the expansion groove.

[0013] In practical applications, when the device is bent, the spring slides, thereby exposing one side of the rectangular opening to ensure unobstructed heat dissipation. The more it is bent, the larger the exposed area becomes.

[0014] Preferably, the flexible connecting layer has constraint plates at both ends, and the thermoelectric separation layer has limit plates fixedly connected to both ends. The limit plates are in contact with the constraint plates, and the bottom of the limit plates is in contact with the surface of the flexible connecting layer.

[0015] In practical applications, the constraint sheet protects both ends of the thermoelectric separation layer and ensures stability during the sliding process.

[0016] Preferably, the flexible connecting layer is fixedly connected to the top of the substrate body, and the cross-sectional area of ​​the groove of the flexible connecting layer is the same as the cross-sectional area of ​​the slider.

[0017] In practical applications, the slider can maintain stability during sliding because the cross-sectional size is consistent when it slides in the groove.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0019] 1. This utility model detaches the two ends of the top thermoelectric separation layer from the fixed layer and sets a sliding groove and a slider to limit it. When bending, the two ends of the thermoelectric separation layer will slide relative to the flexible connecting layer, exposing the lower heat dissipation port. This ensures that the heat dissipation channel is unobstructed and the heat dissipation effect is good, while minimizing the occurrence of deformation in some parts due to bending, thus ensuring the normal service life of the copper substrate.

[0020] 2. This utility model has several rectangular openings on both sides of the top of the thermoelectric separation layer. The inner wall of the rectangular opening is provided with a spring piece. When bent, the spring piece slides in the expansion groove of the inner wall of the rectangular opening. During the sliding process, it gradually disengages from the rectangular opening and exposes the rectangular opening, thereby connecting the heat dissipation channel formed by the lower heat dissipation port and the upper heat dissipation port, ensuring the smooth flow of the heat dissipation channel and improving the heat dissipation efficiency. Attached Figure Description

[0021] Figure 1 This is an overall view of the present invention;

[0022] Figure 2 This is a front cross-sectional view of the present invention;

[0023] Figure 3 This is a side cross-sectional view of the present invention;

[0024] Figure 4 This is a schematic diagram of the structure at point A of this utility model;

[0025] In the figure: 1. Substrate body; 2. Flexible connection layer; 201. Constraint piece; 3. Thermoelectric separation layer; 301. Limiting piece; 4. Slide groove; 5. Slider; 6. Lower heat dissipation port; 7. Rectangular opening; 701. Telescopic groove; 8. Spring piece; 9. Upper heat dissipation port. Detailed Implementation

[0026] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0027] Example 1: A bendable thermoelectrically decoupled copper substrate, see [link to example]. Figures 1 to 4The system includes a flexible connecting layer 2, which is fixedly connected to the top of the substrate body 1. The center of the top of the flexible connecting layer 2 is fixedly connected to the center of the bottom of the thermoelectric separation layer 3. The bottom of the thermoelectric separation layer 3 is attached to the top of the flexible connecting layer 2. Several sliding grooves 4 are provided on both sides of the top of the flexible connecting layer 2. Sliding sliders 5 are slidably connected to the inner side of the sliding grooves 4. The two ends of the thermoelectric separation layer 3 are not fixed to the flexible connecting layer 2 below. Therefore, when bending, the two ends slide relative to the flexible connecting layer 2, allowing the lower heat dissipation port 6 to be exposed. This ensures unobstructed heat dissipation channels while minimizing deformation in some areas due to bending, thus ensuring the normal service life of the copper substrate.

[0028] It should be noted that the flexible connection layer 2 is mainly for achieving the bendability of the substrate, allowing the substrate to be flexibly bent at different angles without damaging the internal structure. Its material is usually a flexible polymer, such as polyimide, polyethylene terephthalate, or other high-performance flexible materials. These materials have good flexibility and plasticity, and can withstand frequent bending and folding without breaking or being damaged. The thermoelectric separation layer 3 mainly realizes the thermoelectric separation function, that is, effectively conducts the heat generated by the thermoelectric element away, while ensuring the normal flow of current. It usually includes two functions: thermal conduction and electrical conduction. The thermal conduction part is responsible for conducting heat to the heat dissipation device, and the electrical conduction part is responsible for the transmission of current. Its material may use a material with a high thermal conductivity (such as thermally conductive silicone, thermally conductive ceramic, etc.) to ensure that the heat can be conducted away quickly, while the electrical conduction part uses a metal with good electrical conductivity (such as copper, silver, etc.) or other conductive materials to ensure stable current transmission.

[0029] Specifically, such as Figure 3 and Figure 4 As shown, the cross-section of the groove 4 of the flexible connecting layer 2 is the same as the cross-sectional size of the slider 5. The slider 5 is used to limit the upper thermoelectric separation layer 3. The slider 5 is fixedly connected to the bottom of the thermoelectric separation layer 3, and the slider 5 is made of a material with a certain elasticity, such as a silicone block, so that it can slide normally when the groove 4 is bent. The groove 4 plays a limiting role in the slider 5, thereby ensuring the stability of the upper thermoelectric separation layer 3.

[0030] Specifically, such as Figure 4As shown, a lower heat dissipation vent 6 is provided at the bottom inner side of the slide groove 4. The lower heat dissipation vent 6 penetrates the flexible connecting layer 2 and is located below the slider 5. A rectangular opening 7 is provided on the top surface of the thermoelectric separation layer 3 above the slide groove 4. An upper heat dissipation vent 9 is provided at the bottom inner side of the rectangular opening 7 and penetrates the thermoelectric separation layer 3. The lower heat dissipation vent 6 is normally located below the slider 5. When bending occurs, the slider 5 slides, and the lower heat dissipation vent 6 will be exposed. At this time, the upper heat dissipation vent 9 will also be exposed due to the sliding of the spring piece 8, thus connecting with the lower heat dissipation vent 6, ensuring the smooth flow of the heat dissipation channel and improving the heat dissipation efficiency.

[0031] Furthermore, such as Figure 4 As shown, a telescopic groove 701 is provided on the inner wall of one side of the rectangular opening 7. The inner wall of the other side of the rectangular opening 7 is fixedly connected to one end of the spring piece 8. The movable end of the spring piece 8 is located inside the telescopic groove 701, and one end of the spring piece 8 is slidably connected inside the telescopic groove 701. The spring piece 8 is normally located in the telescopic groove 701. When bending, the spring piece 8 will slide upward along the telescopic groove 701. During the sliding process, the edge of the rectangular opening 7 is exposed, thereby forming a heat dissipation channel, which facilitates the normal heat dissipation effect when bending. The telescopic groove 701 here plays the role of limiting and reducing friction. The inner wall of the telescopic groove 701 is very smooth.

[0032] It is worth mentioning that the spring 8 here needs to have the characteristics of bending and resetting. At the same time, some composite materials can be used, such as PET material, which has good flexibility and elasticity, can easily be bent and deformed, and is also an excellent insulating material with high resistivity and breakdown voltage.

[0033] It should be noted that the two ends of the thermoelectric separation layer 3 are not fixedly connected and have the ability to slide. The rectangular opening 7 and the spring 8 are located in the heat-conducting area of ​​the thermoelectric separation layer 3, while the central area of ​​the thermoelectric separation layer 3 is the conductive area. Since it is fixedly connected to the flexible connecting layer 2 below, electronic components can be set in the conductive area to support the normal operation of the circuit.

[0034] It is worth noting that, such as Figure 1 and Figure 2 As shown, the flexible connecting layer 2 has constraint plates 201 at both ends, and the thermoelectric separation layer 3 has limit plates 301 fixedly connected to both ends. The limit plates 301 are in contact with the constraint plates 201, and the bottom of the limit plates 301 is attached to the surface of the flexible connecting layer 2. The limit plates 301 slide laterally inside the constraint plates 201. During the sliding process, the limit plates 301 play a protective role for both ends and ensure the stability of both ends during the sliding process.

[0035] In addition, all components designed in this utility model are general standard parts or components known to those skilled in the art. Their structure and principle can be learned by those skilled in the art through technical manuals or conventional experimental methods. Those skilled in the art can fully implement them, so there is no need to elaborate. The content protected by this utility model does not involve improvements to the internal structure and method.

[0036] The embodiments disclosed herein are preferred embodiments, but are not limited thereto. Those skilled in the art can readily grasp the spirit of this utility model based on the above embodiments and make different extensions and variations. However, as long as they do not depart from the spirit of this utility model, they are all within the protection scope of this utility model.

Claims

1. A bendable thermoelectrically separated copper substrate, comprising a flexible connecting layer (2), characterized in that, The top center of the flexible connecting layer (2) is fixedly connected to the bottom center of the thermoelectric separation layer (3). Several sliding grooves (4) are provided on both sides of the top of the flexible connecting layer (2). A slider (5) is slidably connected to the inner side of the sliding groove (4). The slider (5) is used to limit the thermoelectric separation layer (3) above. The slider (5) is fixedly connected to the bottom of the thermoelectric separation layer (3). The bottom of the thermoelectric separation layer (3) is attached to the top of the flexible connecting layer (2).

2. The bendable thermoelectrically separated copper substrate as described in claim 1, characterized in that, The bottom of the slide (4) is provided with a lower heat dissipation port (6), which penetrates the flexible connecting layer (2) and is located below the slider (5).

3. The bendable thermoelectrically separated copper substrate as described in claim 1, characterized in that, A rectangular opening (7) is provided on the top surface of the thermoelectric separation layer (3) above the slide (4), and an upper heat dissipation opening (9) is provided at the bottom inside the rectangular opening (7), and the upper heat dissipation opening (9) penetrates the thermoelectric separation layer (3).

4. The bendable thermoelectrically separated copper substrate as described in claim 3, characterized in that, The inner wall of one side of the rectangular opening (7) is provided with a telescopic groove (701), and the inner wall of the other side of the rectangular opening (7) is fixedly connected to one end of the spring piece (8). The movable end of the spring piece (8) is located inside the telescopic groove (701), and one end of the spring piece (8) is slidably connected inside the telescopic groove (701).

5. The bendable thermoelectrically separated copper substrate as described in claim 1, characterized in that, The flexible connecting layer (2) has constraint pieces (201) at both ends, and the thermoelectric separation layer (3) has limit pieces (301) fixedly connected at both ends. The limit pieces (301) are in contact with the constraint pieces (201), and the bottom of the limit pieces (301) is in contact with the surface of the flexible connecting layer (2).

6. The bendable thermoelectrically separated copper substrate as described in claim 1, characterized in that, The flexible connecting layer (2) is fixedly connected to the top of the substrate body (1), and the cross-section of the groove (4) of the flexible connecting layer (2) is consistent with the cross-sectional dimensions of the slider (5).

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