A small volume power module

Abstract

The utility model relates to a small volume power module, including shell, PCB board, sealant and electronic component, the shell bottom fixed mounting PCB board through sealant, the hollow air chamber is formed between shell and PCB board, the electronic component is installed inside PCB board, and the electronic component is in hollow air chamber, the shell can protect electronic component, and when the electronic component is in secondary reflow soldering, the hollow air chamber provides release space and temperature protection for soldering tin melting, does not exist interference to the soldering tin after melting, will not cause soldering tin peripheral pressure to increase, the soldering tin after melting will not flow along the micropore or electronic component peripheral or bottom gap, will not produce any influence to power module internal electronic component, has reduced the failure rate of power module, improved the stability of product, in addition, the electronic component is electrically connected with external device through the soldering pad of PCB board, realizes the pinless installation, and the practicality is strong, and the installation is more convenient.

Description

Technical Field

[0001] This utility model relates to electronic devices, specifically to a small-volume power supply module. Background Technology

[0002] A power supply module is a power supply unit that can be soldered or mounted on a PCB (printed circuit board). Its key feature is its ability to power application-specific integrated circuits (ASICs), signal processors, microprocessors, memory, field-programmable gate arrays (FPGAs), and other digital or analog loads. Due to its numerous advantages, power modules are widely used in industrial control, communications, the Internet of Things (IoT), smart homes, new energy, automotive electronics, aerospace, and other fields. The production and use of power modules requires installation and soldering processes. Currently, the industry widely uses manual soldering, wave soldering, and reflow soldering processes. However, current power module installation and soldering processes often present the following problems:

[0003] First, power modules are relatively large, occupying significant space during installation and resulting in a larger final product size and increased PCB area, thus increasing costs. Second, power modules are typically soldered manually or in wave soldering, requiring initial component insertion before soldering, leading to low production efficiency. Third, while some power modules can be reflow soldered, the high temperature of 240-260 degrees Celsius during reflow soldering causes the internal solder to melt. As the solder melts and transforms from a solid to a liquid, its volume increases. Since traditional packaging processes lack an air cavity structure, the large volume of molten solder cannot be contained, leading to increased pressure around the solder. This causes the solder to diffuse into surrounding pores or gaps, potentially causing short circuits in the internal electronic components of the power module and resulting in failure. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model aims to optimize the power module structure. To this end, it provides a small-volume power module with advantages such as stable structure, pinless direct mounting, small size, and low cost. The specific technical solution is as follows:

[0005] A small-volume power module includes a housing, a PCB board, sealant, and electronic components. The PCB board is fixedly mounted on the bottom of the housing with sealant, forming an air cavity between the housing and the PCB board. Electronic components are mounted inside the PCB board and are used to provide power. The electronic components are electrically connected to the PCB board. The electronic components are located within the air cavity. During secondary reflow soldering, the air cavity provides release space and temperature protection for the melting solder. The bottom of the PCB board has pads, through which the electronic components are electrically connected to external devices.

[0006] As a preferred embodiment of this utility model, the outer shell is a plastic shell or a metal shell.

[0007] As a preferred embodiment of this utility model, the outer shell has an inverted U-shaped cross-section, and the PCB board is sealed to cover the bottom opening of the outer shell with sealant.

[0008] In a preferred embodiment of this utility model, at least one solder pad is provided.

[0009] As a preferred embodiment of this utility model, the PCB board has small air holes on its side. When the temperature inside the reflow soldering chamber rises, the air inside the air cavity expands due to heat and is discharged through the air holes to relieve pressure. When the temperature inside the reflow soldering chamber decreases, the air inside the air cavity contracts, and external gas enters the air cavity through the air holes to form a local air flow, which can quickly cool the inside of the power module.

[0010] Beneficial effects: The PCB board is fixedly mounted at the bottom of the casing with sealant, forming an air cavity between the casing and the PCB board. Electronic components are mounted inside the PCB board within the air cavity, and the casing protects the electronic components. During secondary reflow soldering, the air cavity provides space and temperature protection for the melting solder, without interfering with the molten solder or causing increased pressure around the solder. The molten solder will not flow along the micropores or the gaps around or at the bottom of the electronic components, and will not affect the internal electronic components of the power module. This reduces the failure rate of the power module and improves the stability of the product. In addition, the electronic components are electrically connected to external devices through the pads on the PCB board, realizing pinless mounting, which is highly practical and easier to install. Attached Figure Description

[0011] Figure 1 This is a perspective view of the present invention;

[0012] Figure 2 This is a structural diagram of the present invention;

[0013] In the diagram: 1-outer shell, 2-PCB board, 3-sealant, 4-electronic components, 5-air cavity, 6-soldering pads. Detailed Implementation

[0014] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings:

[0015] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the position or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0016] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0017] like Figure 1 and 2 As shown, a small-volume power module includes a housing 1, a PCB board 2, sealant 3, and electronic components 4. The PCB board 2 is fixedly mounted on the bottom of the housing 1 by the sealant, and an air cavity 5 is formed between the housing 1 and the PCB board 2. The electronic components 4 are mounted inside the PCB board 2 and are used to provide power. The electronic components 4 are electrically connected to the PCB board 2. The electronic components 4 are located in the air cavity 5. During the secondary reflow soldering, the air cavity 5 provides a release space and temperature protection for the melting solder. The bottom of the PCB board 2 is provided with pads 6. The electronic components 4 are electrically connected to external devices through the pads 6 of the PCB board 2, realizing pinless mounting and reducing material costs, processing costs, and installation costs.

[0018] Specifically, the outer casing 1 is a plastic or metal casing with an inverted U-shaped cross-section. The PCB board 2 seals the bottom opening of the outer casing 1 with sealant 3. The three-sided sealed casing can act as a protective cover to reduce the damage to the internal components of the power module caused by the hot air inside the reflow soldering process.

[0019] Specifically, at least one pad 6 is provided, making full use of one side of the PCB board 2 for the purpose of realizing the power module function, and the other side of the PCB board 2 is provided with pads for connecting the power module to external circuits, thereby reducing the size of the traditional power module and improving the utilization rate of the PCB board 2.

[0020] Specifically, the PCB board 2 has small air holes on its side. When the temperature inside the reflow soldering chamber rises, the air in the central air cavity 5 expands due to heat and is discharged through the air holes to relieve pressure. When the temperature inside the reflow soldering chamber drops, the air in the central air cavity 5 contracts, and external gas enters the central air cavity 5 through the air holes to form local airflow. This can quickly cool the inside of the power module, reduce the time the power module is exposed to high temperatures, and improve product quality.

[0021] In summary, the advantages of this small-volume power module are:

[0022] (1) Electronic components 4 are installed inside the PCB board 2. Electronic components 4 are electrically connected to the PCB board 2. An air cavity 5 is formed between the outer shell 1 and the PCB board 2. Electronic components 4 are inside the air cavity 5. In this way, electronic components 4 and PCB board 2 will not increase the overall size of the product. The size of the outer shell 1 is the size of the power module. The small size makes it convenient for transportation and use.

[0023] (2) Electronic component 4 is in the air cavity 5. During the second reflow soldering, the air cavity 5 provides a release space and temperature protection for the solder melting. It does not interfere with the molten solder, does not cause an increase in the pressure around the solder, and the molten solder will not flow along the micro-holes or the gaps around or at the bottom of the electronic component. It will not have any impact on the electronic components inside the power module.

[0024] (3) The bottom of the PCB board 2 is provided with pads 6. Electronic components 4 are electrically connected to external devices through the pads 6 of the PCB board 2, realizing pinless mounting. The pinless mounting method increases the contact area between the power module and the mounting PCB, significantly improving the thermal conductivity and quickly releasing the heat when the power module is working. The pinless mounting method reduces the distance between the power module and the peripheral circuit, reduces the internal resistance of the line, and can improve the conversion efficiency and electrical performance of the power module application.

[0025] The above description is a further detailed explanation of the present utility model in conjunction with specific preferred embodiments. It should not be considered that the specific implementation of the present utility model is limited to these descriptions. For those skilled in the art, several simple deductions or substitutions can be made without departing from the concept of the present utility model, and all such deductions or substitutions should be considered to fall within the protection scope of the present utility model.

Claims

1. A small-volume power supply module, characterized in that: It includes a housing, a PCB board, sealant, and electronic components. The PCB board is fixedly mounted on the bottom of the housing with sealant, forming an air cavity between the housing and the PCB board. Electronic components are mounted on the inside of the PCB board, providing power and electrically connecting to the PCB board. The electronic components are located within the air cavity, which provides space for the solder to melt and provides temperature protection during secondary reflow soldering. The bottom of the PCB board has pads, through which the electronic components are electrically connected to external devices.

2. The small-volume power module according to claim 1, characterized in that: The outer shell is either a plastic shell or a metal shell.

3. A small-volume power supply module according to claim 1 or 2, characterized in that: The outer casing has an inverted U-shaped cross-section, and the PCB board is sealed to cover the bottom opening of the outer casing with sealant.

4. A small-volume power supply module according to claim 1, characterized in that: The pad has at least one.

5. A small-volume power supply module according to claim 1, characterized in that: The PCB board has small air holes on its side. When the temperature inside the reflow soldering chamber rises, the air inside the air cavity expands due to heat and is discharged through the air holes to relieve pressure. When the temperature inside the reflow soldering chamber drops, the air inside the air cavity contracts, and external gas enters the air cavity through the air holes to form a local air flow, which can quickly cool the inside of the power module.

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