A circuit board recycling and disassembly device

Abstract

This utility model discloses a circuit board recycling and disassembly device, including a housing, inside which are placed a first collection box and a second collection box. Multiple heating wires are fixedly connected inside the housing, and multiple layers of metal mesh are fixedly connected to the inner wall of the housing. A bidirectional threaded rod is movably connected to the inner wall of the housing, and two slides are movably connected to the outer side of the bidirectional threaded rod. A slide rail is fixedly connected to one side of each slide, and a movable frame is movably connected to one side of each slide rail. A connecting frame is fixedly connected to one end of each movable frame, and a second telescopic rod is fixedly connected between the two connecting frames. This utility model not only facilitates the heating and disassembly of electronic components and circuit boards by workers, eliminating the need for workers to hold the circuit boards during disassembly to avoid burns, making it safer to use, but also facilitates the separate collection of heated and disassembled components and circuit boards for centralized processing.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board recycling and disassembly device. Background Technology

[0002] Circuit board recycling and disassembly technology is mainly used to break down waste circuit boards into recyclable resources such as metals and plastics to achieve resource utilization. In the process of recycling old electronic products, the electronic components on the circuit boards are usually disassembled.

[0003] The electronic components are separated from the circuit board by heating the solder joints. However, the heat generated in this process can make the circuit board very hot, increasing the risk of burns to workers when handling it and creating potential safety hazards in the work environment. In order to better address the above problems, promote the development of industry technology, and improve core competitiveness, this application proposes a new composition structure that is different from the existing technology. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a circuit board recycling and disassembly device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A circuit board recycling and dismantling device includes a housing, inside which are placed a first collection box and a second collection box. Multiple heating wires are fixedly connected inside the housing. Multiple layers of metal mesh are fixedly connected to the inner wall of the housing. A bidirectional threaded rod is movably connected to the inner wall of the housing. Two slides are movably connected to the outer side of the bidirectional threaded rod. A slide rail is fixedly connected to one side of each slide. A movable frame is movably connected to one side of each slide rail. A connecting frame is fixedly connected to one end of each movable frame. A second telescopic rod is fixedly connected between the two connecting frames. Two springs are fixedly connected to one side of each movable frame. A clamping block is fixedly connected between the two springs. A support plate is fixedly connected to one side of each clamping block. A protruding rod is fixedly connected to one end of each clamping block. An auxiliary pushing assembly is provided at one end of each slide.

[0007] As a further embodiment of this utility model, the auxiliary pushing component includes a fixed frame, which is fixed to one end of the slide by bolts. A protrusion is fixedly connected to the top of the fixed frame, and an inclined surface is provided on one side of the protrusion, and the protruding rod can contact the inclined surface.

[0008] As a further embodiment of this invention, two guide rods are fixedly connected between the inner walls on both sides of the housing, and the slide slides along the guide rods.

[0009] As a further embodiment of this utility model, two first telescopic rods are fixedly connected to one side of the movable frame, and the extended ends of the first telescopic rods are fixed to the clamping blocks, with springs sleeved on the outside of the first telescopic rods.

[0010] As a further embodiment of this utility model, a plurality of baffles are fixedly connected to the inner wall of the bottom of the housing, and the first collection box and the second collection box can contact the baffles.

[0011] As a further embodiment of this invention, both ends of the bidirectional threaded rod pass through the housing and are fixedly connected to knobs.

[0012] As a further embodiment of this invention, the multi-layer metal mesh is located at the top of the heating wire, and the second collection box is located at the bottom of the heating wire.

[0013] As a further embodiment of this invention, the two side plates of the multi-layer metal mesh are designed to be inclined from top to bottom.

[0014] The beneficial effects of this utility model are as follows:

[0015] 1. This utility model utilizes the combined use of a heating wire and a clamping block. By pushing the second telescopic rod, the solder joints of the electronic components on the inverted circuit board are heated, causing the solder droplets to detach from the electronic components. This facilitates the heating and disassembly of the electronic components and circuit board by the operator, eliminating the need for the operator to hold the circuit board during disassembly, which could lead to burns. This makes the device safer and improves its effectiveness.

[0016] 2. By setting up an auxiliary pushing component, this utility model allows the disassembled circuit board to detach from the support plate and automatically fall into the first collection box for collection, eliminating the need for manual removal by staff and further improving safety during use.

[0017] 3. This utility model uses a second collection box to collect the heated solder droplets and electronic components, and a first collection box to collect the disassembled circuit boards, thereby facilitating the centralized processing of the collected components by the staff.

[0018] 4. This utility model can restrict the position of the first collection box and the second collection box by means of a baffle, thereby blocking the first collection box and the second collection box. This not only makes it easier for staff to quickly place the two collection boxes, but also makes it easier to quickly remove them, thus improving the convenience of the device. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of a circuit board recycling and disassembly device proposed in this utility model;

[0020] Figure 2This is a cross-sectional view of the housing structure of a circuit board recycling and disassembly device proposed in this utility model;

[0021] Figure 3 This is a partially enlarged structural diagram of a circuit board recycling and disassembly device proposed in this utility model.

[0022] In the diagram: 1. Shell; 2. Baffle; 3. Second telescopic rod; 4. Connecting frame; 5. Support plate; 6. Clamping block; 7. Moving frame; 8. Slide rail; 9. Slide carriage; 10. Bidirectional threaded rod; 11. Guide rod; 12. Inclined surface; 13. Fixing frame; 14. First collection box; 15. Second collection box; 16. Multi-layer metal mesh; 17. First telescopic rod; 18. Spring; 19. Protruding rod; 20. Heating wire. Detailed Implementation

[0023] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Therefore, all other embodiments of this application described herein, and all embodiments obtained by those skilled in the art without creative effort based on the embodiments in this application, should fall within the scope of protection of this application.

[0024] Reference Figures 1-3 A circuit board recycling and dismantling device includes a housing 1. Inside the housing 1, a first collection box 14 and a second collection box 15 are placed, and the first collection box 14 and the second collection box 15 are in contact. Multiple heating wires 20 are fixed inside the housing 1 by bolts. The heating wires 20 heat the circuit board, melting the solder joints of the electronic components and the circuit board. A multi-layer metal mesh 16 is fixed to the inner wall of the housing 1 by bolts. The multi-layer metal mesh 16 adopts two layers of 0.5mm mesh with a 30° staggered overlap, which has a higher interception rate. The two side plates of the multi-layer metal mesh 16 are designed to be inclined from top to bottom at 30-45°. The solder droplets are made to slide to the edge and fall downward by gravity, rather than penetrating vertically. This allows the heating wires 20 to heat the air at the top, while the melted solder droplets and the electronic components that have detached from the circuit board can move downward along the slope of the multi-layer metal mesh 16, avoiding falling on the heating wires 20 and affecting the use.

[0025] It should be noted that a bidirectional threaded rod 10 is rotatably connected to the inner wall of the housing 1. Two slides 9 are threadedly connected to the outer side of the bidirectional threaded rod 10. A slide rail 8 is bolted to one side of each slide 9. A movable frame 7 is slidably connected to one side of the slide rail 8. A connecting frame 4 is bolted to one end of the movable frame 7. A second telescopic rod 3 is bolted between the two connecting frames 4. Two springs 18 are welded to one side of the movable frame 7. A clamping block 6 is welded between the two springs 18. A support plate 5 is welded to one side of the clamping block 6. The distance between the two slides 9 can be adjusted according to the length of the circuit board to be disassembled. That is, by rotating the bidirectional threaded rod 10, the slides 9 are moved to the required position in the middle. At the same time, the second telescopic rod 3 is activated. Rod 3 retracts, then the circuit board is placed between the two clamping blocks 6, and the circuit board is positioned on the upper surface of the support plate 5, thereby positioning and clamping the circuit board. Two first telescopic rods 17 are fixed to one side of the moving frame 7 by bolts, and the extended end of the first telescopic rod 17 is fixed to the clamping block 6. The first telescopic rod 17 can guide the clamping block 6. Spring 18 is sleeved on the outside of the first telescopic rod 17. The operator pushes the second telescopic rod 3, so that the connecting frame 4 drives the moving frame 7 to move along the slide rail 8 until the circuit board moves to the upper surface of the multi-layer metal mesh 16. The heating wire 20 heats the bottom of the circuit board, so that the molten solder droplets and electronic components that have fallen off the circuit board move downwards along the slope of the multi-layer metal mesh 16.

[0026] In this utility model, one end of the clamping block 6 is fixed with a protruding rod 19 by bolts, and one end of the slide 9 is provided with an auxiliary pushing assembly. The auxiliary pushing assembly includes a fixing frame 13, which is fixed to one end of the slide 9 by bolts. A protrusion is fixed to the top of the fixing frame 13 by bolts. An inclined surface 12 is provided on one side of the protrusion, and the protruding rod 19 can contact the inclined surface 12. When the operator continues to push the second telescopic rod 3, the clamping block 6 moves the protruding rod 19 until it contacts the inclined surface 12 on the protrusion. When the protruding rod 19 moves, it is resisted by the inclined surface 12, which causes the protruding rod 19 to move the clamping block 6 to both sides. The spring 18 contracts and the first telescopic rod 17 contracts until the circuit board is no longer in contact with the support plate 5. At this time, the disassembled circuit board falls into the first collection box 14 for collection.

[0027] In particular, two guide rods 11 are fixed between the inner walls on both sides of the housing 1 by bolts, and the slide 9 slides along the guide rods 11. The guide rods 11 can guide the slide 9 and prevent the slide 9 from tilting during movement. Multiple baffles 2 are fixed to the inner wall at the bottom of the housing 1 by bolts, and the first collection box 14 and the second collection box 15 can contact the baffles 2. The baffles 2 can restrict the position of the first collection box 14 and the second collection box 15. Both ends of the bidirectional threaded rod 10 pass through the housing 1 and are welded with knobs, which makes it easy for the operator to rotate the bidirectional threaded rod 10. The multi-layer metal mesh 16 is located at the top of the heating wire 20, and the second collection box 15 is located at the bottom of the heating wire 20.

[0028] Working principle: In use, first adjust the distance between the two carriages 9 according to the required length of the circuit board to be disassembled, that is, turn the knob to make the bidirectional threaded rod 10 drive the carriages 9 to move to the required position in the middle, while the second telescopic rod 3 retracts. Then, the circuit board containing electronic components is inverted between the two clamping blocks 6, and the circuit board is placed on the upper surface of the support plate 5, thereby positioning and clamping the circuit board. Then, the operator pushes the second telescopic rod 3, which causes the connecting frame 4 to drive the moving frame 7 to move along the slide rail 8 until the circuit board moves to the upper surface of the multi-layer metal mesh 16. The heating wire 20 is then activated, so that the heating wire 20 heats the circuit board. The circuit board is heated to melt the solder joints between the electronic components and the circuit board, allowing the molten solder droplets and the electronic components that have detached from the circuit board to move down the slope of the multi-layer metal mesh 16. Then, the worker continues to push the second telescopic rod 3, causing the clamping block 6 to move the protruding rod 19 until it contacts the inclined surface 12 on the protruding block. When the protruding rod 19 moves, it is resisted by the inclined surface 12, which causes the protruding rod 19 to move the clamping block 6 to both sides, and the spring 18 contracts, and the first telescopic rod 17 contracts until the circuit board is no longer in contact with the support plate 5. At this time, the disassembled circuit board falls into the first collection box 14 for collection.

[0029] This utility model has been described through the above embodiments. Those skilled in the art will understand that this utility model is not limited to the above embodiments. Many more modifications can be made based on the teachings of this utility model, and all such modifications fall within the scope of protection claimed by this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A circuit board recycling and dismantling device, comprising a housing (1), a first collection box (14) and a second collection box (15) placed inside the housing (1), a plurality of heating wires (20) fixedly connected inside the housing (1), and a multi-layer metal mesh (16) fixedly connected to the inner wall of the housing (1), characterized in that, A bidirectional threaded rod (10) is movably connected to the inner wall of the housing (1). Two slides (9) are movably connected to the outer side of the bidirectional threaded rod (10). A slide rail (8) is fixedly connected to one side of each slide (9). A movable frame (7) is movably connected to one side of the slide rail (8). A connecting frame (4) is fixedly connected to one end of the movable frame (7). A second telescopic rod (3) is fixedly connected between the two connecting frames (4). Two springs (18) are fixedly connected to one side of the movable frame (7). A clamping block (6) is fixedly connected between the two springs (18). A support plate (5) is fixedly connected to one side of the clamping block (6). A protruding rod (19) is fixedly connected to one end of the clamping block (6). An auxiliary pushing component is provided at one end of the slide (9).

2. The circuit board recycling and disassembly equipment according to claim 1, characterized in that, The auxiliary pushing assembly includes a fixed frame (13), which is fixed to one end of the slide (9) by bolts. A protrusion is fixedly connected to the top of the fixed frame (13), and an inclined surface (12) is provided on one side of the protrusion. The protruding rod (19) can contact the inclined surface (12).

3. The circuit board recycling and disassembly equipment according to claim 1, characterized in that, Two guide rods (11) are fixedly connected between the inner walls on both sides of the housing (1), and the slide (9) slides along the guide rods (11).

4. The circuit board recycling and disassembly equipment according to claim 1, characterized in that, Two first telescopic rods (17) are fixedly connected to one side of the mobile frame (7), and the extended end of the first telescopic rod (17) is fixed to the clamp (6), and the spring (18) is sleeved on the outside of the first telescopic rod (17).

5. The circuit board recycling and disassembly equipment according to claim 1, characterized in that, The bottom inner wall of the housing (1) is fixedly connected with multiple baffles (2), and the first collection box (14) and the second collection box (15) can contact the baffles (2).

6. The circuit board recycling and disassembly equipment according to claim 1, characterized in that, Both ends of the bidirectional threaded rod (10) pass through the housing (1) and are fixedly connected to knobs.

7. The circuit board recycling and disassembly equipment according to claim 1, characterized in that, The multi-layer metal mesh (16) is located at the top of the heating wire (20), and the second collection box (15) is located at the bottom of the heating wire (20).

8. A circuit board recycling and disassembly device according to claim 7, characterized in that, The two side plates of the multilayer metal mesh (16) are designed to slope downwards.

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