A silicon wafer carrying mechanism of a BC battery string welding machine

Abstract

The utility model discloses a silicon wafer carrying mechanism of BC battery string welding machine, including half piece carrying support, carry translation module and blow dry heating cavity, and the carrying support flat plate is fixed on half piece carrying support, and the carrying fixed suction hole is distributed on the carrying support flat plate along with the front -back direction, and the drive end of carry translation module is installed with the carrying jacking motor, and the drive end of carrying jacking motor is connected with the carrying jacking cam, and the carrying jacking module is arranged below the carrying support platform, and the upper end of carrying jacking module is connected with the carrying batten, and the carrying batten is in the middle part of carrying support flat plate, and the carrying jacking cam controls the up and down movement of carrying batten, and the blow dry heating cavity is installed above the carrying support flat plate. The silicon wafer carrying mechanism of BC battery string welding machine is through carrying batten and is inserted into the half piece cutting machine in front, and the double half piece of laser cutting is carried to the blow dry heating area, and the double half piece is jacked up and is handled to blow dry heating by depending on the cam, and it is convenient for the combination of subsequent conveying, adhesive tape and welding wire.

Description

Technical Field

[0001] This utility model relates to the technical field of silicon wafer string bonding, and in particular to a silicon wafer handling mechanism for a BC battery string bonding machine. Background Technology

[0002] Photovoltaic silicon wafers are the core and most valuable component of a solar power system. Their function is to convert solar energy into electrical energy, which is then stored in batteries or used directly as a power source. Currently, customers using BC cells (back-contact cells, which can be combined with various circuits) require the stringing of several half-wafers with welding wires. Therefore, a suitable facility is needed to dry and heat-treat the laser-cut double halves to meet the requirements of subsequent production processes. Utility Model Content

[0003] One objective of this invention is to provide a silicon wafer transport mechanism for a BC battery string bonding machine, which connects to the double half-wafers of a half-wafer cutting machine, performs edge heating treatment after lifting, and dries the laser-cut parts, thus facilitating subsequent transport and processing.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] A silicon wafer transport mechanism for a BC battery string bonding machine includes a half-wafer transport bracket, a transport translation module, and a drying and heating chamber. A transport support plate is fixed on the half-wafer transport bracket. Transport fixing suction holes are distributed along the front-back direction on the transport support plate. A transport lifting motor is installed on the drive end of the transport translation module. A transport lifting cam is connected to the drive end of the transport lifting motor. A transport lifting module is arranged below the transport support plate. A transport strip is connected to the upper end of the transport lifting module. The transport strip is located in the middle of the transport support plate. The transport lifting cam controls the up-and-down movement of the transport strip. The drying and heating chamber is installed above the transport support plate.

[0006] As a preferred technical solution, the transport translation module includes a transport translation motor and a transport translation slide rail. The drive end of the transport translation motor and one end of the half-piece transport bracket are both connected to transport translation synchronous pulleys. A transport translation synchronous belt is connected between the two transport translation synchronous pulleys. A transport translation support is fixedly connected to the transport translation synchronous belt. The transport translation support is slidably connected along the transport translation slide rail. The transport lifting motor is fixed on the transport translation support.

[0007] As a preferred technical solution, both sides of the half-piece transport bracket are provided with transport lifting guide plates, the upper end of the transport lifting guide plates is connected to the transport strip, and both sides of the transport translation support are fixed with transport lifting slide rails, and the transport lifting guide plates slide vertically on the transport lifting slide rails.

[0008] As a preferred technical solution, the transport and lifting module is provided with a cam movable hole, and the transport and lifting cam moves within the cam movable hole.

[0009] As a preferred technical solution, the side of the transport support plate is provided with a transport air pipe connector, which is connected to the transport fixing suction hole.

[0010] As a preferred technical solution, the two sides of the drying and heating chamber are fixed in the middle of the transport support plate, a drying and heating rod is installed inside the drying and heating chamber, a vent plate is provided above the drying and heating rod, and a drying and heating cooling fan is installed above the drying and heating chamber.

[0011] As a preferred technical solution, a reflector is provided above the rear end of the half-piece transport bracket, and a transport signal sensor is provided below the rear end of the half-piece transport bracket.

[0012] The beneficial effects of this utility model are as follows: It provides a silicon wafer transport mechanism for a BC battery string bonding machine. The silicon wafer transport mechanism of the BC battery string bonding machine extends into the front half-wafer cutting machine through the transport plate to transport the laser-cut double half-wafers to the drying and heating area. The double half-wafers are lifted by the cam for drying and heating treatment, which facilitates subsequent conveying, bonding of adhesive strips and welding wires. Attached Figure Description

[0013] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0014] Figure 1 This is a schematic diagram of the first overall structure of the silicon wafer handling mechanism of a BC battery string bonding machine as described in the embodiment;

[0015] Figure 2 This is a schematic diagram of the second overall structure of the silicon wafer handling mechanism of a BC battery string bonding machine as described in the embodiment;

[0016] Figure 3 This is a diagram showing the internal structure of the drying heating chamber described in the embodiment.

[0017] Figures 1 to 3 middle:

[0018] 1. Half-piece transport bracket; 2. Transport and translation module; 3. Drying and heating chamber; 4. Transport support plate; 5. Transport and lifting motor; 6. Transport and lifting cam; 7. Transport and lifting module; 8. Transport strip; 9. Transport and translation motor; 10. Transport and translation slide rail; 11. Transport and translation synchronous pulley; 12. Transport and translation support; 13. Transport and lifting guide plate; 14. Transport and lifting slide rail; 15. Transport air pipe connector; 16. Drying and heating rod; 17. Ventilation plate; 18. Drying and heating cooling fan; 19. Reflector. Detailed Implementation

[0019] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0020] like Figures 1 to 3 As shown in this embodiment, a silicon wafer transport mechanism for a BC battery string bonding machine includes a half-wafer transport bracket 1, a transport translation module 2, and a drying and heating chamber 3. A transport support plate 4 is fixed on the half-wafer transport bracket 1. Transport fixing suction holes are distributed along the front-back direction on the transport support plate 4. A transport lifting motor 5 is installed on the drive end of the transport translation module 2. A transport lifting cam 6 is connected to the drive end of the transport lifting motor 5. A transport lifting module 7 is arranged below the transport support plate. A transport strip 8 is connected to the upper end of the transport lifting module 7. The transport strip 8 is located in the middle of the transport support plate 4. The transport lifting cam 6 controls the up-and-down movement of the transport strip 8. The drying and heating chamber 3 is installed above the transport support plate 4.

[0021] Driven by the transport translation module 2, the transport strip 8 extends into the half-piece cutting machine to pull out the laser-cut double half-pieces. The transport lifting motor 5 controls the rise and fall of the transport strip 8 through the transport lifting cam 6, so that the double half-pieces change their front, middle and rear positions on the half-piece transport bracket 1. When in the middle position, the upper drying and heating chamber 3 dries and heats the laser-cut position between the double half-pieces. Then, when the transport strip 8 rises and moves backward, it moves to the rear of the transport support plate 4 to wait for subsequent transport.

[0022] The transport translation module 2 includes a transport translation motor 9 and a transport translation slide rail 10. The drive end of the transport translation motor 9 and one end of the half transport bracket 1 are both connected to a transport translation synchronous wheel 11. A transport translation synchronous belt is connected between the two transport translation synchronous wheels 11. A transport translation support 12 is fixedly connected to the transport translation synchronous belt. The transport translation support 12 is slidably connected along the transport translation slide rail 10. The transport lifting motor 5 is fixed on the transport translation support 12.

[0023] When the half-wafer is moving, the transport lifting motor 5 controls the transport slats 8 to rise via the transport lifting cam 6, causing the half-wafer to leave the transport support plate 4. Then, the transport translation motor 9 drives the transport translation support 12 to move backward along the transport translation slide rail 10 via the rotating transport translation synchronous wheel 11 and the transport translation synchronous belt. When the half-wafer moves to below the drying heating chamber 3, the transport translation motor 9 stops, and the transport lifting motor 5 controls the transport slats 8 to descend, causing the half-wafer to fall onto the transport support plate 4. At this time, the transport fixing suction hole will adsorb and fix the half-wafer. After the drying and heating are completed, the transport fixing suction hole will release the half-wafer, and the transport slats 8 will rise again and move backward. Then, the transport slats 8 will move down to below the transport support plate 4 and then return to the front, repeating the above operation.

[0024] Both sides of the half-piece transport bracket 1 are provided with transport lifting guide plates 13. The upper end of the transport lifting guide plate 13 is connected to the transport plate 8. Both sides of the transport translation support 12 are fixed with transport lifting slide rails 14. The transport lifting guide plate 13 slides vertically on the transport lifting slide rail 14. When the transport plate 8 moves up and down, the transport lifting guide plate 13 moves up and down along the transport lifting slide rail 14 to form a guiding function.

[0025] The transport and lifting module 7 is equipped with a cam movable hole. The transport and lifting cam 6 moves within the cam movable hole. During the lifting process, when the cam moves within the cam movable hole, it drives the transport strip 8 to move up and down.

[0026] The side of the transport support plate 4 is provided with a transport air pipe connector 15, which is connected to the transport fixing suction hole. The transport air pipe connector 15 is responsible for air supply and release, and controls the transport fixing suction hole to suck and release the current half silicon wafer.

[0027] The drying and heating chamber 3 is fixed on both sides in the middle of the transport support plate 4. A drying and heating rod 16 is installed inside the drying and heating chamber 3. A vent plate 17 is set above the drying and heating rod 16. A drying and heating cooling fan 18 is installed above the drying and heating chamber 3. The drying and heating rod 16 dries the laser-segmented area on the double half plate below the drying and heating chamber 3, and the high-temperature gas is blown out by the drying and heating cooling fan 18 above.

[0028] A reflector 19 is provided above the rear end of the half-wafer transport bracket 1, and a transport signal sensor is provided below the rear end of the half-wafer transport bracket 1. When the two half-wafers that have finished drying move above the transport signal sensor, they will block the reflector 19, and the subsequent mechanism will receive a signal that the half-wafer can be moved away.

[0029] All modules involved in this application are linear modules.

[0030] It should be stated that the above-described specific embodiments are merely preferred embodiments of this utility model and the technical principles applied thereto. Within the scope of the technology disclosed in this utility model, any variations or substitutions that are easily conceived by those skilled in the art should be covered within the protection scope of this utility model.

Claims

1. A silicon wafer transport mechanism for a BC battery string bonding machine, characterized in that, The device includes a half-piece transport bracket, a transport translation module, and a drying and heating chamber. A transport support plate is fixed on the half-piece transport bracket. The transport support plate has transport fixing suction holes distributed along the front-back direction. A transport lifting motor is installed on the drive end of the transport translation module. The drive end of the transport lifting motor is connected to a transport lifting cam. A transport lifting module is arranged below the transport support plate. A transport strip is connected to the upper end of the transport lifting module. The transport strip is located in the middle of the transport support plate. The transport lifting cam controls the up-and-down movement of the transport strip. The drying and heating chamber is installed above the transport support plate.

2. The silicon wafer handling mechanism of a BC battery string bonding machine according to claim 1, characterized in that, The transport and translation module includes a transport and translation motor and a transport and translation slide rail. The drive end of the transport and translation motor is connected to one end of the half transport bracket, and a transport and translation synchronous pulley is connected between the two transport and translation synchronous pulleys. A transport and translation synchronous belt is fixedly connected to the transport and translation synchronous belt. The transport and translation support is slidably connected along the transport and translation slide rail. The transport and lifting motor is fixed on the transport and translation support.

3. The silicon wafer handling mechanism of a BC battery string bonding machine according to claim 2, characterized in that, Both sides of the half-piece transport bracket are provided with transport lifting guide plates. The upper end of the transport lifting guide plate is connected to the transport plate strip. Both sides of the transport translation support are fixed with transport lifting slide rails. The transport lifting guide plate slides vertically on the transport lifting slide rails.

4. The silicon wafer handling mechanism of a BC battery string bonding machine according to claim 2, characterized in that, The transport and lifting module is provided with a cam movable hole, and the transport and lifting cam moves within the cam movable hole.

5. The silicon wafer handling mechanism of a BC battery string bonding machine according to claim 1, characterized in that, The transport support plate is provided with a transport air pipe connector on its side, and the transport air pipe connector is connected to the transport fixing suction hole.

6. The silicon wafer handling mechanism of a BC battery string bonding machine according to claim 1, characterized in that, The two sides of the drying and heating chamber are fixed in the middle of the transport support plate. A drying and heating rod is installed inside the drying and heating chamber. A vent plate is provided above the drying and heating rod. A drying and heating cooling fan is installed above the drying and heating chamber.

7. The silicon wafer handling mechanism of a BC battery string bonding machine according to claim 1, characterized in that, A reflector is provided above the rear end of the half-piece transport bracket, and a transport signal sensor is provided below the rear end of the half-piece transport bracket.

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