Anti-deformation injection-molded mobile phone back cover

Abstract

This utility model provides a deformation-resistant injection-molded mobile phone back cover, relating to the field of mobile phone back cover technology. It includes a mobile phone back cover body, with a honeycomb grid layer embedded in the inner non-exterior area of ​​the body. Ribs are provided below the honeycomb grid layer, and a reinforcing frame is embedded at the edge of the body. A guide groove is provided on the inner side of the back cover near the screw post. The composite support structure of the honeycomb grid layer and radially gradient ribs is used. The honeycomb structure evenly disperses local stress, and the ribs are distributed along the principal stress line, significantly improving the overall bending stiffness. With only a 5% increase in weight, the deformation resistance is increased by 40%, effectively suppressing warping problems during manufacturing and use. Furthermore, micro-posts interlacedly connect the honeycomb and ribs, further enhancing structural stability and avoiding localized deformation caused by stress concentration.

Description

Technical Field

[0001] This utility model relates to the field of mobile phone back cover technology, and in particular to a deformation-resistant injection molded mobile phone back cover. Background Technology

[0002] With the widespread adoption of 5G communication technology and the trend towards thinner and lighter smartphones, the materials used for phone back covers are gradually shifting from metal to plastic composites. Injection molding, due to its advantages such as low cost, high efficiency, and great design freedom, has become the mainstream production method. In 2023, the global market size for injection-molded phone back covers reached $4.5 billion, with an annual growth rate of approximately 8%.

[0003] To reduce weight, traditional mobile phone back covers often employ a thin-walled design. However, this design easily leads to localized stress or thermal deformation during manufacturing, causing warping and affecting the phone's aesthetics and structural integrity. Secondly, the edges of traditional mobile phone back covers are relatively weak, making them prone to deformation when the phone is dropped or subjected to pressure. This deformation not only affects the seal between the back cover and the frame but also causes assembly problems and even impacts the overall appearance of the phone. Finally, in extreme cases, temperature changes or sudden impacts may cause the back cover to randomly crack, generating dangerous fragments. These fragments can not only injure the user but also damage internal components, increasing the risk of injury. Therefore, we propose a deformation-resistant injection-molded mobile phone back cover. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies. Traditional mobile phone back covers often employ a thin-walled design to reduce weight. However, this design easily leads to localized stress or thermal deformation during manufacturing, causing warping and affecting the phone's aesthetics and structural integrity. Secondly, the edges of traditional mobile phone back covers are relatively weak, making them prone to deformation when the phone is dropped or subjected to pressure. This deformation not only affects the seal between the back cover and the frame but also causes assembly problems and even impacts the overall appearance of the phone. Finally, in extreme cases, temperature changes or sudden impacts may cause the back cover to randomly crack, generating dangerous fragments. These fragments can not only injure the user but also damage internal components, increasing the risk of injury.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A deformation-resistant injection-molded mobile phone back cover includes a mobile phone back cover body. A honeycomb grid layer is embedded in the inner non-exterior area of ​​the mobile phone back cover body. A rib is provided below the honeycomb grid layer. A reinforcing frame is embedded in the edge of the mobile phone back cover body. A guide groove is provided on the inner side of the mobile phone back cover body near the screw post.

[0007] Furthermore, several micro-pillars are interleaved between the honeycomb grid layer and the rib plate, and the honeycomb grid layer is flush with the inner wall of the main body of the phone back cover.

[0008] Furthermore, the rib has a radially gradient structure, with a thickness of 0.2 mm and a height that gradually varies from 1 mm to 2 mm. The rib is distributed along the principal stress line of the rear cover.

[0009] Furthermore, the reinforcing frame is made of TPU material and forms a closed ring structure. The top two sides of the reinforcing frame are provided with wedge-shaped self-locking teeth, which fit into the grooves on the middle frame.

[0010] Furthermore, the outer side of the reinforcing frame is provided with wavy buffer ribs.

[0011] Furthermore, the guide groove has a Y-shaped branch structure, the end of the guide groove points to the screw fixing point, and a flexible transition zone is arranged around the guide groove.

[0012] Furthermore, the toughness transition zone adopts a gradient mesh design, and the mesh becomes denser and sparser from the guide groove outwards.

[0013] Furthermore, the guide groove has a width of 0.1 mm and a depth of 0.2 mm, and a central hole is provided at the bottom of the guide groove.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. The composite support structure adopts a honeycomb grid layer and radially gradient ribs. The honeycomb structure evenly disperses local stress, and the ribs are distributed along the principal stress line, which significantly improves the overall bending stiffness. With only a 5% increase in weight, the deformation resistance is increased by 40%, effectively suppressing warping problems during manufacturing and use. In addition, the micro-columns interlacedly connect the honeycomb and ribs, further enhancing the structural stability and avoiding local deformation caused by stress concentration.

[0016] 2. The back cover of the phone is embedded with a TPU elastic reinforcing frame. Combined with the interference fit between the wedge-shaped self-locking teeth and the groove of the middle frame, it provides a progressive locking effect when dropped or squeezed, which improves the edge's resistance to deformation. The wave-shaped buffer rib design absorbs energy through elastic deformation when subjected to external impact, reducing the risk of edge deformation, while maintaining a good feel for disassembly and assembly. Attached Figure Description

[0017] Figure 1 A schematic diagram of the overall structure of an anti-deformation injection molded mobile phone back cover provided by this utility model;

[0018] Figure 2 A schematic diagram of a honeycomb grid layer and rib structure for a deformation-resistant injection-molded mobile phone back cover provided by this utility model;

[0019] Figure 3 A schematic diagram of a reinforcing frame structure for an anti-deformation injection-molded mobile phone back cover provided by this utility model;

[0020] Figure 4 A schematic diagram of a guide groove structure for an anti-deformation injection molded mobile phone back cover provided by this utility model.

[0021] Illustration: 1. Main body of mobile phone back cover; 101. Honeycomb mesh layer; 102. Rib plate; 103. Reinforcing frame; 104. Guide groove; 105. Miniature column; 106. Wedge-shaped self-locking tooth; 107. Wave-shaped buffer rib; 108. Tough transition zone. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0023] To facilitate understanding of this utility model, a more comprehensive description of this utility model will be provided below with reference to relevant embodiments, and several embodiments of this utility model will be given. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of this utility model more thorough and complete.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items. Example

[0026] like Figure 1-4 As shown, this utility model provides a technical solution: a deformation-resistant injection-molded mobile phone back cover, including a mobile phone back cover body 1. A honeycomb grid layer 101 is embedded in the inner non-exterior area of ​​the mobile phone back cover body 1. A rib plate 102 is provided below the honeycomb grid layer 101. The honeycomb grid layer 101 disperses local stress, and the rib plate 102 inhibits overall warping. A reinforcing frame 103 is embedded in the edge of the mobile phone back cover body 1. The reinforcing frame 103 focuses on protecting the vulnerable edge. A guide groove 104 is opened on the inner side of the back cover body 1 near the screw post. The guide groove 104 allows the fracture energy to be released along a predetermined path, and the fragment size is controlled within a safe range, while ensuring the structural integrity during normal use. Example

[0027] like Figure 1-4 As shown, several micro-pillars 105 are interleaved between the honeycomb grid layer 101 and the rib plate 102. The micro-pillars 105 interleave between the honeycomb grid layer 101 and the rib plate 102 to further enhance the structural stability and avoid local deformation caused by stress concentration. The honeycomb grid layer 101 is flush with the inner wall of the main body 1 of the mobile phone back cover. The rib plate 102 has a radial gradient structure with a thickness of 0.2 mm and a height that gradually changes from 1 mm to 2 mm. The rib plate 102 is distributed along the principal stress line of the back cover, which significantly improves the overall bending stiffness.

[0028] The reinforcing frame 103 is made of TPU material and forms a closed ring structure. The top of both sides of the reinforcing frame 103 are provided with wedge-shaped self-locking teeth 106. The wedge-shaped self-locking teeth 106 fit into the groove on the middle frame. When subjected to external force, the wedge-shaped self-locking teeth 106 and the groove produce a progressive locking effect. The outer side of the reinforcing frame 103 is provided with wave-shaped buffer ribs 107, which absorb impact energy through elastic deformation when falling.

[0029] The guide groove 104 has a Y-shaped branch structure, with its end pointing towards the screw fixing point. A toughness transition zone 108 is arranged around the guide groove 104. The toughness transition zone 108 adopts a gradient grid design, with the grid becoming denser and sparser from the guide groove 104 outwards. The toughness transition zone 108 allows the fracture energy to be released smoothly, ensuring both daily use strength and improving failure safety. The guide groove 104 has a width of 0.1 mm and a depth of 0.2 mm. A concentration hole is provided at the bottom of the guide groove 104. The concentration hole can precisely control the crack initiation point. The guide groove 104, together with the stress concentration hole at the bottom, ensures that the crack extends along a predetermined path under extreme stress, avoiding random fracture and the generation of dangerous fragments.

[0030] The workflow of this utility model: When using a deformation-resistant injection-molded mobile phone back cover, there are firstly concentrated situations:

[0031] 1) When the back cover of the phone is subjected to external pressure or thermal stress:

[0032] The honeycomb grid layer 101 plays its role first, and its uniformly distributed honeycomb cells disperse and transmit local stress. The radially tapered ribs 102 provide support along the principal stress line to suppress overall warping deformation. The micro-columns 105 form a three-dimensional support network between the honeycomb grid layer 101 and the ribs 102 to prevent stress concentration.

[0033] 2) When the phone is dropped or its edges are squeezed:

[0034] The reinforcing frame 103 made of TPU material first undergoes elastic deformation. The wedge-shaped self-locking teeth 106 gradually engage with the groove of the middle frame to form a self-locking protection mechanism. The wave-shaped buffer ribs 107 absorb impact energy through waveform deformation and reduce peak stress.

[0035] 3) When subjected to impacts exceeding design limits or sudden temperature changes:

[0036] The stress is first concentrated at the concentration hole at the bottom of the guide groove 104, and the crack extends directionally along the guide groove 104 with the Y-shaped branch structure. The gradient grid design of the ductile transition zone 108 controls the crack propagation rate, and finally the fracture energy is safely released along the predetermined path.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A deformation-resistant injection-molded mobile phone back cover, comprising a mobile phone back cover body (1), characterized in that: A honeycomb mesh layer (101) is embedded in the non-exterior area of ​​the back cover body (1) of the mobile phone. A rib plate (102) is provided below the honeycomb mesh layer (101). A reinforcing frame (103) is embedded in the edge of the back cover body (1). A guide groove (104) is provided on the inner side of the back cover body (1) near the screw post.

2. The anti-deformation injection molded mobile phone back cover according to claim 1, characterized in that: Several micro-pillars (105) are interleaved between the honeycomb grid layer (101) and the rib plate (102), and the honeycomb grid layer (101) is flush with the inner wall of the mobile phone back cover body (1).

3. The anti-deformation injection molded mobile phone back cover according to claim 1, characterized in that: The rib (102) has a radially gradient structure. The thickness of the rib (102) is 0.2 mm, and the height gradually changes from 1 mm to 2 mm. The rib (102) is distributed along the main stress line of the back cover.

4. The anti-deformation injection molded mobile phone back cover according to claim 1, characterized in that: The reinforcing frame (103) is made of TPU material and forms a closed ring structure. The top two sides of the reinforcing frame (103) are provided with wedge-shaped self-locking teeth (106), which fit into the grooves on the middle frame.

5. The anti-deformation injection molded mobile phone back cover according to claim 1, characterized in that: The outer side of the reinforcing frame (103) is provided with a wavy buffer rib (107).

6. The anti-deformation injection molded mobile phone back cover according to claim 1, characterized in that: The guide groove (104) has a Y-shaped branch structure, the end of the guide groove (104) points to the screw fixing point, and a flexible transition zone (108) is arranged around the guide groove (104).

7. The anti-deformation injection molded mobile phone back cover according to claim 6, characterized in that: The toughness transition zone (108) adopts a gradient grid design, and the grid becomes denser and sparser from the guide groove (104) outwards.

8. The anti-deformation injection molded mobile phone back cover according to claim 1, characterized in that: The guide groove (104) has a width of 0.1 mm and a depth of 0.2 mm, and a central hole is provided at the bottom of the guide groove (104).

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