A PTC heating assembly and a PTC heating bag
By adding a pressure strip around the electrode sheet and cooperating with the slot of the packaging frame, the problem of electrode sheet displacement was solved, the processing difficulty and cost were reduced, and the product quality and reliability were improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 四川赛特制冷设备有限公司
- Filing Date
- 2025-07-09
- Publication Date
- 2026-06-09
AI Technical Summary
Existing PTC heating packs are prone to electrode displacement before heating and curing, resulting in high product defect rates, increased costs, and greater processing difficulties.
A pressure strip is added around the electrode sheet. The movement of the electrode sheet is restricted by the cooperation between the pressure strip and the slot and clearance slot of the packaging frame, so as to avoid displacement and falling off. The electrode sheet is fixed by riveting.
It reduces processing difficulty, improves product quality and pass rate, avoids the risk of electrode displacement and breakdown, and enhances structural reliability.
Smart Images

Figure CN224343400U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of electrothermal electrodes in electrical engineering, specifically relating to a PTC heating component and a PTC heating pack. Background Technology
[0002] PTC heating packs are a new type of electric heater with advantages such as high heat exchange efficiency, safety and reliability, rapid heating, and small size. Referring to Chinese patent CN210112304U, which discloses a PTC heating component and a PTC heating pack, existing PTC heating packs mainly include a heating pack shell and a PTC heating component. The heating pack shell is mainly used to house the PTC heating component, providing support, fixation, and protection. The PTC heating component mainly includes a packaging frame, a ceramic plate, electrode plates, and an insulating film. The ceramic plate is located inside the packaging frame, and two electrode plates are respectively located on both sides of the ceramic plate. Positioning holes are provided through the leads of the electrode plates. Positioning posts that fit the positioning holes are formed on both sides of the packaging frame protruding towards the electrode plates. The insulating film is located on the outside of the electrode plates. To ensure good electrical contact and thermal conductivity between the electrode plates and the ceramic plate, electrode adhesive is usually filled into the gap between the electrode plates and the ceramic plate. During manufacturing, pressure is applied to the electrode plates towards the ceramic plates and heated. The electrode adhesive cures, forming a single unit from the packaging frame, ceramic plate, and electrode plates.
[0003] Before heat curing, the electrode sheet is positioned and limited mainly through the cooperation of positioning holes and positioning posts. To prevent the positioning posts from protruding beyond the electrode sheet through the positioning holes, causing interference with or puncturing of the insulating film, the protrusion height of the positioning posts is usually limited to a small range, generally 0.3mm-0.45mm. To optimize production line turnaround time, the electrode adhesive curing process and the dry-firing process after assembling the PTC heating component with the heating pack housing are generally combined. During the process of transferring and inserting the assembled encapsulation frame, ceramic sheet, and electrode sheet into the heating pack housing and performing heat curing, due to the limited protrusion height of the positioning posts, the electrode sheet is prone to detach from the positioning posts due to displacement in the thickness direction, causing the electrode sheet to fail in positioning and... Electrode displacement can lead to a large number of defective and scrapped products. Currently, the method to prevent electrode displacement or falling off involves assembling one electrode with a packaging frame via insert injection molding, applying electrode adhesive to the other side of the electrode, inserting a ceramic sheet, applying electrode adhesive to one side of another electrode and covering the ceramic sheet, and then placing it into a heating pack housing for heating and curing. However, the need for insert injection molding increases the complexity of component processing and can lead to defects such as deformation and breakage of the electrode, increasing costs. Furthermore, because the parts are not on the same plane after insert injection molding, it is difficult to apply adhesive to the electrode surface, resulting in inconsistent adhesive quality and potentially lower product yield and increased processing time. Therefore, it is necessary to design a PTC heating assembly that prevents electrode displacement before heating and curing to reduce processing difficulty and improve product quality. Summary of the Invention
[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of this utility model is to provide a PTC heating component and a PTC heating pack to solve the technical problem that the electrode sheet is prone to displacement before heating and curing, thereby reducing the processing difficulty and improving product quality.
[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:
[0006] A PTC heating assembly includes a package frame, a ceramic sheet, and two electrode sheets with the same thickness direction. The ceramic sheet is located inside the package frame, and the two electrode sheets are respectively disposed on both sides of the ceramic sheet in the thickness direction. The peripheral protrusions of the electrode sheets form multiple pressure strips, and at least two pressure strips are respectively located on both sides of the electrode sheet in the length direction or on both sides in the width direction. The free ends of the pressure strips are bent toward the ceramic sheet and abut against the outer surface of the package frame to restrict the movement of the electrode sheets relative to the package frame.
[0007] Furthermore, along the length of the electrode sheet, the pressure strips on the same side of the two electrode sheets are distributed at intervals along the width of the electrode sheet; along the width of the electrode sheet, the pressure strips on the same side of the two electrode sheets are distributed at intervals along the length of the electrode sheet.
[0008] Furthermore, in the thickness direction of the electrode sheet, the distance between the free end face of the pressure strip on the electrode sheet and the other electrode sheet is greater than 2 mm.
[0009] Furthermore, multiple slots are provided on the outer side of the packaging frame, and the multiple slots correspond one-to-one with the multiple pressure strips. The slots extend through the packaging frame along the thickness direction, and the depth of the slots is greater than the thickness of the pressure strips. The free end of the pressure strip is located in the corresponding slot and abuts against the bottom surface of the slot to prevent the pressure strip from protruding from the outer side of the packaging frame.
[0010] Furthermore, the bottom surface of the card slot is sloping and faces away from the electrode plate where the corresponding pressure strip is located.
[0011] Furthermore, the electrode sheet is located inside the packaging frame and its size is matched. Multiple clearance grooves are respectively opened on both sides of the packaging frame in the thickness direction. The multiple clearance grooves correspond one-to-one with the multiple card slots. The extension direction of the clearance groove is perpendicular to the extension direction of the corresponding card slot. The two ends of the clearance groove are respectively connected to the corresponding card slot and the inside of the packaging frame. In the thickness direction of the packaging frame, the clearance groove and the electrode sheet where the corresponding pressure strip is located are located on the same side. The depth of the clearance groove matches the thickness of the pressure strip. The root of the pressure strip is located in the corresponding clearance groove.
[0012] Furthermore, the bottom surface of the relief groove is smoothly connected to the bottom surface of the corresponding card slot through a curved surface transition.
[0013] Furthermore, a pin is formed by a protrusion on the periphery of the electrode sheet, and the pins on the two electrode sheets are located on the same side in the length or width direction of the electrode sheet; a positioning groove corresponding to the pin is opened on the side of the package frame in the thickness direction, the depth of the positioning groove matches the thickness of the pin, the pin is located in the positioning groove and extends out of the package frame through the positioning groove; a positioning post is formed by a protrusion on the bottom surface of the positioning groove, the protrusion height of the positioning post is less than the depth of the positioning groove, and a positioning hole corresponding to the positioning post is provided through the pin, the positioning post is located in the positioning hole.
[0014] Furthermore, there are multiple ceramic sheets arranged in a matrix inside the encapsulation frame, and the side of the electrode sheet away from the ceramic sheet is covered with an insulating film.
[0015] This utility model also includes a PTC heating pack, which includes a heating pack shell, a U-shaped clamp, and a PTC heating component as described above. The heating pack shell has a receiving groove, the U-shaped clamp is placed in the receiving groove with the U-shaped opening facing upward, and the PTC heating component is inserted inside the U-shaped clamp with the leads of the electrode plate facing upward.
[0016] Compared with the prior art, the present invention has the following beneficial effects:
[0017] 1. The PTC heating assembly of this utility model only adds pressure strips on two opposite sides of the electrode sheet in the circumferential direction, which can be formed by punching the electrode sheet. This does not increase the processing steps of the electrode sheet or increase the cost. During assembly, the electrode sheet is fixed to the packaging frame by riveting the pressure strips. This can prevent the electrode sheet from shifting or falling off during the process of transferring and inserting the assembled packaging frame, ceramic sheet and electrode sheet into the heating package shell and heating and curing. This can effectively solve the problem of electrode sheet easy shifting before heating and curing, which is conducive to reducing the processing difficulty of PTC heating assembly and improving product quality.
[0018] 2. In the PTC heating assembly described in this utility model, the pressure strips on the two electrode plates located on the same side are spaced apart, which avoids the situation where the two electrode plates bypass the ceramic plate and directly form an electric circuit due to the overlap, contact or proximity of the free ends of the pressure strips. Furthermore, in the thickness direction of the electrode plates, the distance between the free end face of the pressure strip on the electrode plate and the other electrode plate is greater than 2mm, which avoids the risk of the electrode plate breaking down with the other electrode plate through the pressure strip, thereby improving the reliability and practicality of the PTC heating assembly structure.
[0019] 3. In the PTC heating assembly described in this utility model, a slot and a clearance groove are provided on the encapsulation frame to accommodate the pressure strip, so as to avoid the pressure strip protruding from the encapsulation frame and affecting subsequent assembly. In addition, the bottom surface of the slot is set as an inclined surface. When the pressure strip abuts against the inclined surface, the inclination angle of the pressure strip and the inclined surface matches. Even if the pressure strip does not abut tightly against the inclined surface, the electrode sheet can still be restricted from leaving the encapsulation frame along the thickness direction by relying on the cooperation between the pressure strip and the inclined surface. This is beneficial to further improve the reliability of restricting the movement of the electrode sheet relative to the encapsulation frame by the pressure strip. Attached Figure Description
[0020] Figure 1 This is a perspective view of the PTC heating assembly described in the embodiment;
[0021] Figure 2 for Figure 1 The structure shown is a 3D view with the insulating film hidden.
[0022] Figure 3 for Figure 2 An exploded view of the structure shown.
[0023] Figure 4 for Figure 2 The structure shown is a 3D view with the electrode plates hidden.
[0024] Figure 5 This is a perspective view of the electrode sheet described in the embodiment;
[0025] Figure 6 This is the front view of the encapsulation frame described in the embodiment;
[0026] Figure 7This is a perspective view of the packaging frame described in the embodiment;
[0027] Figure 8 This is a perspective view of the PTC heating pack described in this embodiment;
[0028] Figure 9 for Figure 8 The structure shown is a 3D view of the heating pack housing, which is omitted.
[0029] The components include: 1. Encapsulation frame; 2. Ceramic sheet; 3. Electrode sheet; 4. Pressure strip; 5. Slot; 6. Inclined surface; 7. Relief groove; 8. Arc surface; 9. Pin; 10. Positioning groove; 11. Positioning post; 12. Positioning hole; 13. Insulating film; 14. Heating pack housing; 15. U-shaped clamp; 16. Receiving groove; 17. Stepped surface. Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.
[0031] Example:
[0032] Please see Figure 2 , Figure 3 and Figure 5 A PTC heating assembly includes a packaging frame 1 with consistent thickness, a ceramic sheet 2, and two electrode sheets 3. The packaging frame 1 has a rectangular frame structure. The ceramic sheet 2 is located inside the packaging frame 1. The two electrode sheets 3 are respectively disposed on both sides of the ceramic sheet 2 in the thickness direction. Multiple pressure strips 4 are formed on the peripheral protrusions of the electrode sheets 3, and at least two pressure strips 4 are respectively located on both sides of the length direction or both sides of the width direction of the electrode sheets 3. The free ends of the pressure strips 4 are bent toward the ceramic sheet 2 and abut against the outer surface of the packaging frame 1. In this embodiment, each electrode sheet 3 has two pressure strips 4 and are respectively located on both sides of the length direction of the electrode sheet 3.
[0033] In the PTC heating assembly of this invention, during assembly, after placing the two electrode plates 3 on both sides of the ceramic plate 2 in the thickness direction, pressure is applied to the pressure strip 4, causing the free ends of the pressure strip 4 to bend towards the direction of the ceramic plate 2, and causing the side of the pressure strip 4 facing the inside of the encapsulation frame 1 to abut against the outer side of the encapsulation frame 1 in the length or width direction. The electrode plates 3 are clamped and fixed to the encapsulation frame 1 by the pressure strip 4, thereby restricting relative movement between the electrode plates 3 and the encapsulation frame 1. In the PTC heating assembly of this invention, pressure strips are only added to two opposite sides of the plate-shaped electrode plates 3 in the circumferential direction. 4. The pressure strip 4 is formed by punching along with the electrode sheet 3, which does not increase the processing steps of the electrode sheet 3 or increase the cost. During assembly, after filling the space between the electrode sheet 3 and the ceramic sheet 2 with electrode glue, the electrode sheet 3 is fixed to the encapsulation frame 1 by riveting the pressure strip 4. This can prevent the electrode sheet 3 from shifting or falling off during the process of transferring and inserting the assembled encapsulation frame 1, ceramic sheet 2 and electrode sheet 3 into the heating package housing 14 and heating and curing. It can effectively solve the problem that the electrode sheet 3 is easy to shift before heating and curing, which is conducive to reducing the processing difficulty of PTC heating components and improving product quality.
[0034] Please see Figure 2 , Figure 3 and Figure 5 Along the length of the electrode sheet 3, the pressure strips 4 on the same side of the two electrode sheets 3 are spaced apart along the width of the electrode sheet 3; along the width of the electrode sheet 3, the pressure strips 4 on the same side of the two electrode sheets 3 are spaced apart along the length of the electrode sheet 3. In this way, the pressure strips 4 on the same side of the two electrode sheets 3 are spaced apart, which can avoid the situation where the two electrode sheets 3 bypass the ceramic sheet 2 and directly form a power circuit due to the overlap, contact or proximity of the free ends of the pressure strips 4. This is beneficial to improving the reliability and practicality of the PTC heating component structure.
[0035] In this embodiment, in order to save materials and reduce the difficulty of fixing the electrode sheet 3 to the packaging frame 1 by riveting the pressure strips 4, each electrode sheet 3 is provided with only two pressure strips 4, which are located on both sides of the length direction of the electrode sheet 3. The two pressure strips 4 on each electrode sheet 3 are diagonally distributed. The two pressure strips 4 on the same side of the length direction on the two electrode sheets 3 are close to the two sides of the width direction of the electrode sheet 3. The four pressure strips 4 on the two electrode sheets 3 are rectangularly distributed.
[0036] In this embodiment, based on the spacing of the pressure strips 4 on the same side of the two electrode sheets 3, in order to avoid the risk of the electrode sheet 3 breaking through the pressure strip 4 to the other electrode sheet 3, the distance between the free end face of the pressure strip 4 on the electrode sheet 3 and the other electrode sheet 3 is further limited to more than 2mm in the thickness direction of the electrode sheet 3, thereby ensuring the reliability and practicality of the PTC heating component structure.
[0037] Please seeFigure 1 , Figure 6 and Figure 8 Multiple slots 5 are provided on the outer surface of the encapsulation frame 1. Each slot 5 corresponds to a single pressure strip 4. The slots 5 extend through the encapsulation frame 1 along its thickness direction. The depth of the slots 5 is greater than the thickness of the pressure strips 4. The free end of the pressure strip 4 is located in the corresponding slot 5 and abuts against the bottom surface of the slot 5. In this way, the encapsulation frame 1 accommodates the pressure strip 4 through the slots 5 and abuts against the pressure strip 4 through the bottom surface of the slots 5. This not only allows the pressure strip 4 to be recessed into the outer surface of the encapsulation frame 1 without changing the overall size of the assembled encapsulation frame 1, ceramic sheet 2, and electrode sheet 3, but also avoids affecting the subsequent installation of the insulating film 13 and the insertion of the electrode sheet 3 into the receiving groove 16 on the heating pack housing 14 via the U-shaped clip 15. Furthermore, the slots 5 can restrict the movement of the electrode sheet 3 in the width direction through the pressure strips 4, which is beneficial to further improve the reliability of restricting the movement of the electrode sheet 3 relative to the encapsulation frame 1 through the pressure strips 4.
[0038] Please see Figure 3 , Figure 6 and Figure 7 The bottom surface of the slot 5 is an inclined surface 6 and faces away from the electrode sheet 3 where the corresponding pressure strip 4 is located. That is, the depth of the side of the bottom surface of the slot 5 closest to the electrode sheet 3 where the corresponding pressure strip 4 is located is less than the depth of the other side. In this way, when the pressure strip 4 abuts against the inclined surface 6, the inclination angle of the pressure strip 4 and the inclined surface 6 are matched. Even if the pressure strip 4 does not abut against the inclined surface 6 tightly, the electrode sheet 3 can still be restricted from leaving the packaging frame 1 along the thickness direction by the cooperation of the pressure strip 4 and the inclined surface 6. This is conducive to further improving the reliability of restricting the movement of the electrode sheet 3 relative to the packaging frame 1 by the pressure strip 4.
[0039] Please see Figure 2 , Figure 3 and Figure 6 The electrode sheet 3 is located inside the encapsulation frame 1 and its size is matched. Multiple clearance grooves 7 are respectively opened on both sides of the encapsulation frame 1 in the thickness direction. The multiple clearance grooves 7 correspond one-to-one with the multiple slots 5. The extension direction of the clearance groove 7 is perpendicular to the extension direction of the corresponding slot 5. The two ends of the clearance groove 7 are respectively connected to the corresponding slot 5 and the inside of the encapsulation frame 1. In the thickness direction of the encapsulation frame 1, the clearance groove 7 and the electrode sheet 3 where the corresponding pressure strip 4 is located are located on the same side. The depth of the clearance groove 7 matches the thickness of the pressure strip 4. The root of the pressure strip 4 is located in the corresponding clearance groove 7. In this way, the electrode sheet 3 is also set inside the encapsulation frame 1 to restrict the movement of the electrode sheet 3 in the length and width directions. Based on the electrode sheet 3 being located inside the encapsulation frame 1, the clearance groove 7 is set to accommodate the root of the pressure strip 4, preventing the pressure strip 4 from protruding from the electrode sheet 3 itself in the thickness direction, and avoiding affecting the subsequent setting of the insulating film 13 and the insertion into the receiving groove 16 on the heating pack housing 14 by the U-shaped clip 15.
[0040] Please see Figure 4, Figure 5 and Figure 6 The bottom surface of the positioning groove 7 and the bottom surface of the corresponding slot 5 are smoothly connected by the arc surface 8; in this way, when riveting the pressure strip 4, the root of the pressure strip 4 and the free end are connected by the arc surface, which helps to reduce the riveting difficulty, avoid the pressure strip 4 from breaking due to the large bending range, and improve the reliability and practicality of the PTC heating component structure.
[0041] Please see Figure 1 , Figure 2 and Figure 5 A pin 9 is formed by a protrusion on the periphery of the electrode sheet 3. The pins 9 on the two electrode sheets 3 are located on the same side in the length or width direction of the electrode sheet 3. A positioning groove 10 corresponding to the pin 9 is formed on the side of the encapsulation frame 1 in the thickness direction. The depth of the positioning groove 10 matches the thickness of the pin 9. The pin 9 is located in the positioning groove 10 and extends out of the encapsulation frame 1 through the positioning groove 10. A positioning post 11 is formed by a protrusion on the bottom surface of the positioning groove 10. The protrusion height of the positioning post 11 is less than the depth of the positioning groove 10. A positioning post 11 corresponding to the positioning post 11 is passed through the pin 9. Positioning hole 12, positioning post 11 is located inside positioning hole 12; in this way, the packaging frame 1 makes way for pin 9 through positioning groove 10, so that pin 9 extends out of the packaging frame 1 without protruding from the electrode plate 3 itself, so that the electrode plate 3 can be wired. Positioning groove 10, through the cooperation of positioning post 11 and positioning hole 12, further realizes the installation positioning and limit of electrode plate 3, which helps to reduce installation difficulty and improve installation accuracy. Positioning post 11 is lower than the opening of positioning hole 12, which can effectively avoid interference between positioning post 11 and insulating film 13 or puncture of insulating film 13.
[0042] In this embodiment, the pressure strip 4, the pin 9, and the electrode sheet 3 are an integral structure. The thickness of the pin 9 and the pressure strip 4 is the same as the thickness of the electrode sheet 3. Stepped surfaces 17 are formed between the two sides and the inner sides of the encapsulation frame 1 in the thickness direction. Each stepped surface 17 on the same side forms a ring of mounting grooves. The mounting grooves, clearance grooves 7, and positioning grooves 10 have the same depth. In this way, when the electrode sheet 3 is installed into the encapsulation frame 1, it can be positioned by the stepped surfaces 17 and its movement in the length and width directions can be restricted. It also restricts the distance between the electrode sheet 3 and the ceramic sheet 2, which can prevent the ceramic sheet 2 from cracking due to excessive or unstable pressure during the pressure heating and curing process.
[0043] Please see Figure 1 , Figure 3 and Figure 4There are multiple ceramic sheets 2 arranged in a matrix inside the encapsulation frame 1. The side of the electrode sheet 3 away from the ceramic sheet 2 is covered with an insulating film 13. In this way, the ceramic sheet 2 between two electrode sheets 3 is usually a whole piece, which is easy to break during the process of pressure heating and curing. Changing the ceramic sheet 2 from a whole to multiple pieces and dispersing them increases the strength of the ceramic sheet 2 without affecting the performance and can avoid the phenomenon of ceramic heating sheet breakage.
[0044] Please see Figure 8 and Figure 9 After a U-shaped clip 15 is installed on the outside of the PTC heating assembly, it can be inserted into the receiving groove 16 of the heating pack housing 14 to obtain the PTC heating pack.
[0045] In summary, the PTC heating assembly of this utility model only adds pressure strips 4, which can be formed by punching the electrode sheet 3, to two opposite sides of the electrode sheet 3 in the circumferential direction. This does not increase the processing steps of the electrode sheet 3, and the manufacturing process is simpler than injection molding, resulting in lower product manufacturing costs. During assembly, the electrode sheet 3 is fixed to the encapsulation frame 1 by riveting the pressure strips 4, which can prevent the electrode sheet 3 from shifting or falling off during the process of transferring and inserting the assembled encapsulation frame 1, ceramic sheet 2 and electrode sheet 3 into the heating package housing 14 and heating and curing. This reduces the processing difficulty and increases the product qualification rate from 70% to 99%. It can effectively solve the problem of the electrode sheet 3 easily shifting before heating and curing, which is conducive to reducing the processing difficulty of PTC heating assemblies and improving product quality.
[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and not to limit the technical solutions. Those skilled in the art should understand that any modifications or equivalent substitutions to the technical solutions of this utility model that do not depart from the spirit and scope of this technical solution should be covered within the scope of the claims of this utility model.
Claims
1. A PTC heating assembly, comprising a casing frame, a ceramic sheet, and two electrode sheets of uniform thickness direction, wherein the ceramic sheet is located inside the casing frame, and the two electrode sheets are respectively disposed on both sides of the ceramic sheet in the thickness direction, characterized in that: The electrode sheet has multiple pressure strips formed on its peripheral protrusions, and at least two pressure strips are located on both sides of the electrode sheet in the length direction or on both sides in the width direction. The free ends of the pressure strips are bent toward the ceramic sheet and abut against the outer side of the encapsulation frame to restrict the movement of the electrode sheet relative to the encapsulation frame.
2. The PTC heating assembly according to claim 1, characterized in that: Along the length of the electrode sheet, the pressure strips on the same side of the two electrode sheets are distributed at intervals along the width of the electrode sheet; along the width of the electrode sheet, the pressure strips on the same side of the two electrode sheets are distributed at intervals along the length of the electrode sheet.
3. The PTC heating assembly according to claim 2, characterized in that: In the thickness direction of the electrode sheet, the distance between the free end face of the pressure strip on the electrode sheet and the other electrode sheet is greater than 2mm.
4. The PTC heating assembly according to claim 2, characterized in that: Multiple slots are provided on the outer side of the packaging frame, and the multiple slots correspond one-to-one with the multiple pressure strips. The slots extend through the packaging frame along the thickness direction, and the depth of the slots is greater than the thickness of the pressure strips. The free end of the pressure strip is located in the corresponding slot and abuts against the bottom surface of the slot to prevent the pressure strip from protruding from the outer side of the packaging frame.
5. The PTC heating assembly according to claim 4, characterized in that: The bottom surface of the card slot is sloping and faces away from the electrode plate where the corresponding pressure strip is located.
6. The PTC heating assembly according to claim 4, characterized in that: The electrode sheet is located inside the packaging frame and is sized to match. Multiple clearance grooves are respectively opened on both sides of the packaging frame in the thickness direction. The multiple clearance grooves correspond one-to-one with the multiple card slots. The extension direction of the clearance groove is perpendicular to the extension direction of the corresponding card slot. The two ends of the clearance groove are respectively connected to the corresponding card slot and the inside of the packaging frame. In the thickness direction of the packaging frame, the clearance groove and the electrode sheet where the corresponding pressure strip is located are located on the same side. The depth of the clearance groove matches the thickness of the pressure strip. The root of the pressure strip is located in the corresponding clearance groove.
7. A PTC heating assembly according to claim 6, characterized in that: The bottom surface of the clearance groove is smoothly connected to the bottom surface of the corresponding card slot through a curved surface.
8. The PTC heating assembly according to claim 7, characterized in that: A pin is formed by a protrusion on the periphery of the electrode sheet, and the pins on the two electrode sheets are located on the same side in the length or width direction of the electrode sheet; a positioning groove corresponding to the pin is opened on the side of the package frame in the thickness direction, the depth of the positioning groove matches the thickness of the pin, the pin is located in the positioning groove and extends out of the package frame through the positioning groove; a positioning post is formed by a protrusion on the bottom surface of the positioning groove, the protrusion height of the positioning post is less than the depth of the positioning groove, and a positioning hole corresponding to the positioning post is provided through the pin, the positioning post is located in the positioning hole.
9. A PTC heating assembly according to claim 8, characterized in that: There are multiple ceramic sheets arranged in a matrix inside the encapsulation frame, and the side of the electrode sheet away from the ceramic sheet is covered with an insulating film.
10. A PTC heating pack, characterized in that: The device includes a heating pack housing, a U-shaped clamp, and a PTC heating assembly as described in any one of claims 6-9. The heating pack housing has a receiving groove, the U-shaped clamp is placed in the receiving groove with the U-shaped opening facing upward, and the PTC heating assembly is inserted inside the U-shaped clamp with the leads of the electrode plates facing upward.