High-precision wafer brushing machine for sapphire wafer brushing

Abstract

A kind of high-precision wafer brushing machine for sapphire wafer brushing, it is related to wafer brushing machine technical field, solve the problem that existing technology mainly relies on single rotation to brush, it is difficult to completely clean wafer surface.The base is connected with wafer bearing table, the top of wafer bearing table is provided with rotating brush head assembly, the upper portion of base is connected with support frame, high-precision lead screw positioning mechanism is connected on support frame, high-precision lead screw positioning mechanism includes base, lead screw, nut seat and servo motor, nut seat is slidably connected on base, nut seat is threadedly connected with lead screw, nut seat is connected with rotating brush head assembly, servo motor is used to drive lead screw to rotate, water vapor two-fluid nozzle is connected on nut seat corresponding to rotating brush head assembly.The beneficial effect is: the pollutants on the surface of wafer can be removed by water vapor two-fluid, and the crystal can be cleaned in all directions.

Description

Technical Field

[0001] This utility model relates to the field of wafer brushing machine technology, specifically a high-precision wafer brushing machine for sapphire wafer brushing. Background Technology

[0002] Sapphire crystal possesses extremely high hardness, second only to diamond, enabling sapphire wafers to withstand harsh working environments and physical friction. Simultaneously, sapphire crystal exhibits excellent optical transmittance. Therefore, in modern electronics technology, sapphire wafers are widely used in many key areas due to their superior optical performance and mechanical strength. During wafer processing, various contaminants adhere to their surface, such as metal particles, organic residues, and abrasive debris. If these contaminants are not thoroughly removed, they will severely affect subsequent wafer processing. Therefore, the brushing process has become a crucial step in the sapphire wafer manufacturing process.

[0003] Current wafer brushing machines generally have a structure similar to that described in patent application CN202420096599.2, which discloses a wafer brushing machine using a planetary brush structure. This includes: a base with support rods fixedly mounted at each of its four ends; a top cover fixedly mounted above the support rods; a motor fixedly mounted below the base; a turntable rotatably mounted above the motor; and placement discs evenly mounted above the turntable; and an adjustment mechanism located inside the top cover, including a connecting shaft. This invention's brushing mechanism consists of multiple polishing discs fixed below a cylinder. During brushing, the cylinder rotates, and simultaneously, a secondary gear drives the polishing discs to rotate, thus achieving planetary motion. However, this brushing method relies primarily on single rotation, making it difficult to penetrate the gaps between contaminants and the wafer surface, failing to remove stubborn stains, and hindering thorough cleaning of the wafer surface.

[0004] Therefore, this invention proposes a high-precision sapphire wafer brushing machine to solve the above-mentioned problems. Utility Model Content

[0005] The purpose of this invention is to provide a high-precision sapphire wafer cleaning machine to solve the problem that existing technologies mainly rely on single rotation for cleaning, which makes it difficult to thoroughly clean the wafer surface.

[0006] The technical solution adopted by this utility model to solve its technical problem is:

[0007] A high-precision sapphire wafer cleaning machine includes a base, a wafer carrier platform connected to the base, the wafer carrier platform being rotatably connected to the base, a vacuum adsorption device connected inside the wafer carrier platform, and adsorption holes corresponding to the vacuum adsorption device on the wafer carrier platform; a rotating brush head assembly is disposed on the top of the wafer carrier platform, a support frame is connected above the base, and a high-precision lead screw positioning mechanism is connected to the support frame; the high-precision lead screw positioning mechanism includes a base, a lead screw, a nut seat, and a servo motor, the lead screw being positioned relative to the base. The base is rotatably connected, the nut seat is slidably connected to the base, the nut seat is threadedly connected to the lead screw, the nut seat is connected to the rotating brush head assembly, and the servo motor is used to drive the lead screw to rotate; a water-vapor two-fluid nozzle is connected to the nut seat corresponding to the rotating brush head assembly, the water-vapor two-fluid nozzle is connected to a water-vapor two-fluid supply assembly, and the water-vapor two-fluid supply assembly is connected to the base; a material drop trough is provided on the top of the base, a collection box is provided inside the base corresponding to the material drop trough, and a side door is provided on the side wall of the base.

[0008] By adopting the above technical solution, water vapor and two fluids can be sprayed onto the wafer surface through a nozzle to help remove contaminants from the wafer surface, enhance the cleaning effect, and achieve comprehensive cleaning of the crystal.

[0009] Furthermore, the rotating brush head assembly includes a brush head, a drive motor, and an adjustment device. The drive motor drives the brush head to rotate, and the brush head is connected to the nut seat through the adjustment device. The adjustment device includes a lifting adjustment mechanism and an angle adjustment mechanism.

[0010] By adopting the above technical solutions, the lifting adjustment mechanism and the angle adjustment mechanism can flexibly adjust the position and angle of the brush head according to the requirements of the sapphire wafer, so that the brush head can better fit the wafer surface and improve the cleaning effect.

[0011] Furthermore, a protective door is connected to the periphery of the support frame, and a light curtain sensor is connected to the opening of the protective door. An emergency stop button is also connected to the support frame, and both the light curtain sensor and the emergency stop button are electrically connected to the drive motor.

[0012] By adopting the above technical solutions, the protective door can prevent pollutants from splashing out and avoid polluting the surrounding environment; the light curtain sensor can send a signal to stop the drive motor when a person or object enters the work area, thus preventing safety accidents; the emergency stop button can stop the drive motor immediately, ensuring work safety.

[0013] Furthermore, the water-vapor two-fluid supply assembly includes a water supply pipe, an air supply pipe, and a water-vapor mixing device. The water supply pipe and the air supply pipe are connected to the water-vapor mixing device, and the water-vapor mixing device is connected to the water-vapor two-fluid nozzle.

[0014] By adopting the above technical solution, the cleaning agent and gas can be mixed into a uniform water vapor two-fluid mixture, providing a suitable cleaning medium for efficient scrubbing.

[0015] Furthermore, the water-vapor dual-fluid supply assembly also includes a filter and a heater, and both the water supply pipe and the gas supply pipe are connected to the water-vapor mixing device through the heater and the filter.

[0016] By adopting the above technical solutions, the filter can remove impurities from the cleaning agent and gas, preventing impurities from causing secondary pollution to the wafer surface; the heater can heat the cleaning agent, increase the cleaning temperature, enhance the activity of the cleaning agent, and further improve the brushing effect.

[0017] Furthermore, a recycling pipe is connected between the water supply pipe and the collection tank, and a filter device and a circulation pump are connected to the recycling pipe.

[0018] By adopting the above technical solution, the cleaning solution after scrubbing can be recovered, impurities can be removed by a filtration device, and then it can be pumped back to the water supply pipe for reuse, thereby realizing the recycling of the cleaning solution and reducing production costs.

[0019] Furthermore, the high-precision lead screw positioning mechanism also includes a guide rail and a slider. The guide rail is fixedly mounted on the base, and the slider is fixedly connected to the nut seat and can slide along the guide rail. The guide rail is a linear rolling guide rail and is made of ceramic material.

[0020] By adopting the above technical solution, the guide rail and slider can provide stable guidance for the movement of the nut seat, ensuring the smoothness of the nut seat movement, and thus ensuring the movement accuracy of the rotating brush head assembly; the guide rail is a linear rolling guide rail and is made of ceramic material, which has a low coefficient of friction and high wear resistance, making the nut seat move more smoothly and further improving the positioning accuracy.

[0021] In summary, compared with the prior art, the beneficial effects of this utility model are as follows:

[0022] This invention utilizes a water-vapor dual-fluid system, which, when sprayed onto the wafer surface through a nozzle, generates a strong impact force. This force penetrates deep into the gaps between contaminants and the wafer surface, loosening and flushing away stubborn dirt from these gaps. This aids in removing contaminants from the wafer surface, enhancing the cleaning effect. Furthermore, the brush head's action achieves comprehensive cleaning of the crystal. Simultaneously, the water-vapor dual-fluid system also acts as a lubricant and coolant, effectively removing contaminants while preventing scratches on the sapphire wafer. Attached Figure Description

[0023] Figure 1 This is a three-dimensional schematic diagram of the present invention;

[0024] Figure 2 This is the front view of the present invention;

[0025] Figure 3 This is a partial cross-sectional view of the main view of this utility model;

[0026] Figure 4 This is the right view of the present invention;

[0027] Figure 5 This is a partial cross-sectional view of the right side of this utility model;

[0028] In the diagram: 1. Base; 2. Wafer carrier; 5. Support frame; 6. Side door; 7. Protective door; 8. Material drop chute; 9. Collection box; 10. Light curtain sensor; 11. Base; 12. Lead screw; 13. Nut seat; 14. Servo motor; 15. Guide rail; 16. Slider; 17. Brush head; 18. Drive motor; 19. Lifting adjustment mechanism; 20. Angle adjustment mechanism; 21. Water supply pipe; 22. Air supply pipe; 23. Water-vapor mixing device; 24. Filter; 25. Heater; 26. Filtration device; 27. Circulation pump; 28. Recovery pipe; 29. ​​Emergency stop button. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0030] In this application, the terms "upper," "inner," "outer," "middle," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0031] like Figure 1-5 As shown, a high-precision sapphire wafer cleaning machine includes a base 1, a wafer carrier stage 2 connected to the base 1, the wafer carrier stage 2 being rotatably connected to the base 1, a vacuum adsorption device 3 connected inside the wafer carrier stage 2, and adsorption holes 4 corresponding to the vacuum adsorption device 3 on the wafer carrier stage 2; thus, the adsorption holes 4 can firmly adsorb the sapphire wafer, preventing the wafer from shifting due to the force of the brush head 17 during the cleaning process, ensuring the accuracy of the cleaning position, and guaranteeing the cleaning quality.

[0032] A rotating brush head assembly is installed on the top of the wafer carrier stage 2. A support frame 5 is connected above the base 1. A high-precision lead screw positioning mechanism is connected to the support frame 5. The high-precision lead screw positioning mechanism includes a base 11, a lead screw 12, a nut seat 13, and a servo motor 14. The lead screw 12 is rotatably connected to the base 11, and the nut seat 13 is slidably connected to the base 11. The nut seat 13 is threadedly connected to the lead screw 12 and is connected to the rotating brush head assembly. The servo motor 14 is used to drive the lead screw 12 to rotate. The high-precision lead screw positioning mechanism also includes a guide rail 15 and a slider 16. The guide rail 15 is fixedly installed on the base 11, and the slider 16 is fixedly connected to the nut seat 13 and can slide along the guide rail 15. The guide rail 15 is a linear rolling guide rail and is made of ceramic material.

[0033] The rotating brush head assembly includes a brush head 17, a drive motor 18, and an adjustment device. The drive motor 18 drives the brush head 17 to rotate. The brush head 17 is connected to the nut seat 13 through the adjustment device. The adjustment device includes a lifting adjustment mechanism 19 and an angle adjustment mechanism 20.

[0034] A water-vapor two-fluid nozzle is connected to the rotating brush head assembly on the nut seat 13. The water-vapor two-fluid nozzle is connected to a water-vapor two-fluid supply assembly, which is connected to the base 1. A material drop trough 8 is provided on the top of the base 1, and a collection box 9 is provided inside the base 1 corresponding to the material drop trough 8. A side door 6 is provided on the side wall of the base 1. The water-vapor two-fluid supply assembly includes a water supply pipe 21, an air supply pipe 22, and a water-vapor mixing device 23. The water supply pipe 21 and the air supply pipe 22 are connected to the water-vapor mixing device 23, which is connected to the water-vapor two-fluid nozzle. The water-vapor two-fluid supply assembly also includes a filter 24 and a heater 25. The water supply pipe 21 and the air supply pipe 22 are both connected to the water-vapor mixing device 23 through the heater 25 and the filter 24. A recovery pipe 28 is connected between the water supply pipe 21 and the collection box 9. A filter device 26 and a circulation pump 27 are connected to the recovery pipe 28.

[0035] A protective door 7 is connected to the periphery of the support frame 5. A light curtain sensor 10 is connected to the opening of the protective door 7. An emergency stop button 29 is also connected to the support frame 5. Both the light curtain sensor 10 and the emergency stop button 29 are electrically connected to the drive motor 18.

[0036] The working process of this utility model is as follows:

[0037] First, open the protective door 7 and place the sapphire wafer to be cleaned on the wafer support platform 2. Activate the vacuum adsorption device 3, which firmly adsorbs the wafer through the adsorption holes 4 on the wafer support platform 2. Then, using the lifting adjustment mechanism 19 and the angle adjustment mechanism 20, adjust the brush head 17 to the appropriate height and angle according to the wafer's cleaning requirements. Next, activate the servo motor 14, causing the lead screw 12 to rotate and move the nut seat 13. This, in turn, rotates the brush head assembly, which, with the assistance of the guide rail 15 and the slider 16, moves to the starting position for cleaning the sapphire wafer. Finally, activate the drive motor 18, causing the brush head 17 to rotate at high speed to clean the wafer surface. Simultaneously, the water-vapor two-fluid supply component is activated. The cleaning agent in the water supply pipe 21 and the gas in the air supply pipe 22 are filtered by the filter 24 and heated by the heater 25, respectively. They are then mixed in the water-vapor mixing device 23 to form a water-vapor two-fluid. This mixture is then sprayed onto the wafer surface through the water-vapor two-fluid nozzle. The impurities and debris generated during the cleaning process fall into the collection box 9 along with the cleaning agent through the drop chute 8 at the top of the base 1. The cleaning agent in the collection box 9 then enters the recovery pipe 28. The cleaning agent is then filtered by the filter device 26 to remove impurities and is then powered by the circulation pump 27 to return to the water supply pipe 21.

[0038] After the sapphire wafer is cleaned, turn off the drive motor 18 of the rotating brush head assembly, the brush head 17 stops rotating, then turn off the water and steam fluid supply assembly to stop the supply of water and steam fluid, finally turn off the vacuum adsorption device 3, open the protective door 7, and take out the cleaned wafer.

Claims

1. A high-precision wafer brushing machine for sapphire wafer cleaning, comprising a base (1), characterized in that, A wafer carrier stage (2) is connected to the base (1). The wafer carrier stage (2) is rotatably connected to the base (1). A vacuum adsorption device is connected inside the wafer carrier stage (2). An adsorption hole is opened on the wafer carrier stage (2) corresponding to the vacuum adsorption device. A rotating brush head assembly is provided on the top of the wafer carrier stage (2). A support frame (5) is connected above the base (1). A high-precision lead screw positioning mechanism is connected on the support frame (5). The high-precision lead screw positioning mechanism includes a base (11), a lead screw (12), a nut seat (13), and a servo motor (14). The lead screw (12) is rotatably connected to the base (11). The nut seat (13) is slidably connected to the base (11). The nut seat (13) is threadedly connected to the lead screw (12). The nut seat (13) is connected to the rotating brush head assembly. The servo motor (14) is used to drive the lead screw (12) to rotate. A water-vapor two-fluid nozzle is connected to the nut seat (13) corresponding to the rotating brush head assembly. The water-vapor two-fluid nozzle is connected to the water-vapor two-fluid supply assembly, which is connected to the base (1). A material drop trough (8) is provided on the top of the base (1). A collection box (9) is provided inside the base (1) corresponding to the material drop trough (8). A side door (6) is provided on the side wall of the base (1).

2. The high-precision wafer brushing machine for sapphire wafer cleaning according to claim 1, characterized in that, The rotating brush head assembly includes a brush head (17), a drive motor (18), and an adjustment device. The drive motor (18) drives the brush head (17) to rotate. The brush head (17) is connected to the nut seat (13) through the adjustment device. The adjustment device includes a lifting adjustment mechanism (19) and an angle adjustment mechanism (20).

3. A high-precision wafer brushing machine for sapphire wafer cleaning according to claim 2, characterized in that, The support frame (5) is connected to a protective door (7) on its periphery. A light curtain sensor (10) is connected to the opening of the protective door (7). An emergency stop button (29) is also connected to the support frame (5). The light curtain sensor (10) and the emergency stop button (29) are both electrically connected to the drive motor (18).

4. A high-precision wafer brushing machine for sapphire wafer cleaning according to claim 1, characterized in that, The water-vapor two-fluid supply assembly includes a water supply pipe (21), an air supply pipe (22), and a water-vapor mixing device (23). The water supply pipe (21) and the air supply pipe (22) are connected to the water-vapor mixing device (23), and the water-vapor mixing device (23) is connected to the water-vapor two-fluid nozzle.

5. A high-precision wafer brushing machine for sapphire wafer cleaning according to claim 4, characterized in that, The water-vapor two-fluid supply assembly also includes a filter (24) and a heater (25), and the water supply pipe (21) and the air supply pipe (22) are both connected to the water-vapor mixing device (23) through the heater (25) and the filter (24).

6. A high-precision wafer brushing machine for sapphire wafer cleaning according to claim 5, characterized in that, A recycling pipe (28) is connected between the water supply pipe (21) and the collection box (9), and a filter device (26) and a circulation pump (27) are connected to the recycling pipe (28).

7. A high-precision wafer brushing machine for sapphire wafer cleaning according to claim 1, characterized in that, The high-precision lead screw positioning mechanism also includes a guide rail (15) and a slider (16). The guide rail (15) is fixedly installed on the base (11), and the slider (16) is fixedly connected to the nut seat (13) and can slide along the guide rail (15). The guide rail (15) is a linear rolling guide rail and is made of ceramic material.

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