A film removing device for semiconductor refrigeration sheet production
By designing a film removal device for semiconductor cooling wafers, a cylinder-driven slide rail and slider system is used to move the cooling wafer, solving the problem that the developer solution has difficulty covering uneven structures, improving the quality and efficiency of film removal, and adapting to cooling wafers of different sizes.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HUAXIN ZHONGYUAN TECHNOLOGY CO LTD
- Filing Date
- 2025-06-24
- Publication Date
- 2026-06-16
AI Technical Summary
In the prior art, the uneven surface structure and corner areas of the semiconductor cooling chip make it difficult for the developer to cover the film evenly, resulting in poor film removal quality.
A film removal device was designed. A cylinder drives a slide rail and slider system to move the cooling chip placement rack up and down in the film removal tank. The cooling chip is shaken by the cooperation of a push rod and a push block, which promotes the flow of developer on the surface. At the same time, an adjustment mechanism is used to adapt to cooling chips of different sizes to ensure that the developer is in full contact with the chip.
It improves the contact between the developer and the surface of the semiconductor cooling chip, enhances the film removal effect and efficiency, adapts to cooling chips of different sizes and specifications, and improves the versatility of production.
Smart Images

Figure CN224366303U_ABST