Low stress thermally and electrically conductive connection structure
By introducing a support layer and a hollow structure into the thermally conductive structure, combined with thermally and electrically conductive components, the problem of decreased thermal conductivity caused by high stress is solved, achieving efficient thermal and electrical conduction and improving product reliability and heat dissipation efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN HONGYI ELECTRONICS CO LTD
- Filing Date
- 2025-05-27
- Publication Date
- 2026-06-16
AI Technical Summary
Existing thermal conductive structures suffer from reduced thermal conductivity due to high stress, affecting product reliability and service life.
It adopts a low-stress thermal and electrical conductive connection structure, including a support body and thermal and electrical conductive components. The support layer has a hollow structure. Combined with the thermal and conductive layers, materials such as metal thin film are used to form a cylindrical, elliptical cylindrical, arc or folded support layer, so as to achieve ultra-low installation stress and improve thermal conductivity.
It improves thermal conductivity and electrical conductivity, thereby enhancing product reliability and heat dissipation efficiency.
Smart Images
Figure CN224366561U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of thermally and electrically conductive structures, and specifically to a low-stress thermally and electrically conductive connection structure. Background Technology
[0002] As electronic products become increasingly intelligent and compact, their power consumption density is also constantly increasing, leading to more and more serious heat dissipation problems. For products requiring circumferential heat dissipation, the usual method is to add external heat dissipation components, often neglecting the internal environment. This is especially true for plug-and-play products, where internal heat dissipation space cannot be effectively utilized, resulting in a single heat dissipation method and high unidirectional heat dissipation pressure. To address these issues, CN202021216700.1 discloses a novel thermally conductive structure, including a high thermal conductivity layer, an adhesive layer, a wear-resistant layer, and a heat source. The adhesive layer is disposed on the outer surface of the high thermal conductivity layer, and the wear-resistant layer is disposed on the side of the adhesive layer away from the high thermal conductivity layer, with the wear-resistant layer in contact with the heat source. A new material is obtained by combining a pluggable material with a high thermal conductivity material. This material provides the function of circumferential contact heat transfer and effectively conducts heat out of the system through the high thermal conductivity material to reduce the internal temperature. The new material can adapt to various pluggable scenarios and can meet the contact heat conduction requirements in various pluggable scenarios, effectively utilizing the heat dissipation space inside the equipment.
[0003] However, the existing heat-conducting structure still has the following problems: the existing heat-conducting structure requires filler to ensure that the entire heat-conducting structure maintains a large stress. The large stress leads to poor heat conduction, which affects the heat conduction performance of the heat-conducting structure and the reliability and service life of products that use the heat-conducting structure. Utility Model Content
[0004] This utility model addresses the shortcomings of current technology by providing a low-stress thermal and electrical conductive connection structure, aiming to solve the technical problem that high stress leads to reduced thermal conductivity in existing technologies.
[0005] The technical solution adopted by this utility model to achieve the above objectives is as follows:
[0006] A low-stress thermally and electrically conductive connection structure includes a support body and a thermally and electrically conductive component. The thermally and electrically conductive component is wrapped around the outside of the support body and is used to provide thermal and electrical conductivity. The support body includes a support layer with a hollow structure, which is used to achieve ultra-low installation stress.
[0007] As a further improvement, the thermally and electrically conductive component is a metal thin film with electrical and thermal conductivity functions, and the metal thin film is disposed on the outside of the support layer.
[0008] As a further improvement, the thermally and electrically conductive component includes a thermally conductive layer and a conductive layer. The thermally conductive layer is disposed outside the support layer, and the conductive layer is disposed outside the thermally conductive layer. The thermally conductive layer is used for heat conduction, and the conductive layer is used for electrical conduction.
[0009] As a further improvement, the thermally conductive layer is one of copper foil, aluminum foil, graphite film, graphene film or boron nitride film, and each end of the thermally conductive layer is provided with an encapsulation structure for sealing the end.
[0010] As a further improvement, the support layer is wound into a cylindrical structure.
[0011] As a further improvement, the support layer is wound into an elliptical cylindrical structure.
[0012] As a further improvement, the support layer is wound into an arc-shaped structure.
[0013] As a further improvement, the support layer is wound to form a folded structure.
[0014] As a further improvement, the support layer is wound to form a cylindrical structure.
[0015] As a further improvement, the support layer is one of PI film, PET film, PE film, and PC sheet.
[0016] Compared with the prior art, the above-mentioned technical solutions in the low-stress thermally and electrically conductive connection structure provided by the embodiments of this utility model have at least one of the following technical effects:
[0017] This invention achieves ultra-low installation stress by setting a support layer with supporting force and a hollow structure within the support layer, while simultaneously providing thermal conductivity by setting a thermally conductive layer to ensure smooth heat conduction, thereby improving the thermal conductivity effect. By setting a low-stress thermally and electrically conductive connection structure, the low-stress thermally and electrically conductive connection structure has high thermal and electrical conductivity performance and effect, improving the reliability of subsequent products. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of the overall structure of the low-stress thermally and electrically conductive connection structure in this embodiment;
[0020] Figure 2This is another schematic diagram of the low-stress thermally and electrically conductive connection structure in this embodiment;
[0021] Figure 3 This is a schematic diagram of the stress-conducting and electrical-conducting connection structure of the cylindrical structure in this embodiment;
[0022] Figure 4 This is a schematic diagram of the stress-conducting and electrical-conducting connection structure of the elliptical cylindrical structure in this embodiment;
[0023] Figure 5 This is a schematic diagram of the stress-conducting and electrical-conducting connection structure of the arc-shaped structure in this embodiment;
[0024] Figure 6 This is a schematic diagram of the stress-conducting and electrical-conducting connection structure of the folded structure in this embodiment;
[0025] Figure 7 This is a schematic diagram of the stress-conducting, thermally conductive, and electrically conductive connection structure of the cylindrical structure in this embodiment. Detailed Implementation
[0026] The following description is only a preferred embodiment of the present invention and does not limit the scope of protection of the present invention.
[0027] For examples, see the appendix. Figure 1 A low-stress thermally and electrically conductive connection structure 1 includes a supporting body 2 and a thermally and electrically conductive component 3. The thermally and electrically conductive component 3 is wrapped around the outside of the supporting body 2 and is used to provide thermal and electrical conductivity. The supporting body 2 includes a supporting layer 20, which has a hollow structure 21. The hollow structure 21 is used to achieve ultra-low installation stress, thereby improving the thermal and electrical conductivity effect and improving the reliability of the product. One end of the stress-thermally and electrically conductive connection structure 1 is attached to the heating element with adhesive, and the heat of the heating element is transferred to the other end face through the stress-thermally and electrically conductive connection structure 1 to achieve the thermal conductivity effect.
[0028] In one embodiment, the thermally conductive component 3 is a metal thin film with electrical and thermal conductivity functions, and the metal thin film is disposed outside the support layer 20; preferably, the metal thin film can be one of copper foil, aluminum foil or alloy foil. Using a metal thin film with electrical and thermal conductivity functions can ensure the electrical and thermal conductivity performance of the low-stress thermally conductive connection structure 1 while reducing the overall thickness of the low-stress thermally conductive connection structure 1.
[0029] Another embodiment is shown in the appendix. Figure 2 The thermally and electrically conductive component 3 includes a thermally conductive layer 30 and a conductive layer 31. The thermally conductive layer 30 is disposed outside the support layer 20, and the conductive layer 31 is disposed outside the thermally conductive layer 30. The thermally conductive layer 30 is used for heat conduction, and the conductive layer 31 is used for electrical conduction.
[0030] The thermal conductive layer 30 is one of copper foil, aluminum foil, graphite film, graphene film or boron nitride film. Each end of the thermal conductive layer 30 is provided with an encapsulation structure, which is used to seal the end, thereby preventing the filler in the thermal conductive layer 30 from falling out due to the cut.
[0031] One embodiment is shown in the appendix. Figure 3 The support layer 20 is wound to form a cylindrical structure.
[0032] Another embodiment is shown in the appendix. Figure 4 The support layer 20 is wound to form an elliptical cylindrical structure.
[0033] Another embodiment is shown in the appendix. Figure 5 The support layer 20 is wound to form an arc-shaped structure, preferably a C-shaped structure.
[0034] Another embodiment is shown in the appendix. Figure 6 The support layer 20 is wound to form a folded structure, preferably a Z-shaped structure.
[0035] Another embodiment is shown in the appendix. Figure 7 The support layer 20 is wound to form a columnar structure, and the hollow structure 21 is disposed inside the columnar structure.
[0036] The support layer 20 is one of PI film, PET film, PE film, and PC sheet, and the support layer 20 is used to provide structural support.
[0037] The working principle of this utility model is as follows: According to the usage requirements, one or multiple low-stress thermally and electrically conductive connection structure arrays are constructed by splicing. After arraying, a linear one-dimensional array or a planar two-dimensional array is formed and attached to the device to realize the connection between the cooling surface and the heating surface, thereby achieving efficient thermal and electrical conduction. In addition, the array method is used to increase the heat dissipation area, which improves the heat transfer efficiency to the environment and greatly improves the heat dissipation efficiency of the device.
[0038] This invention achieves ultra-low installation stress by setting a support layer with supporting force and a hollow structure within the support layer, while simultaneously providing thermal conductivity by setting a thermally conductive layer to ensure smooth heat conduction, thereby improving the thermal conductivity effect. By setting a low-stress thermally and electrically conductive connection structure, the low-stress thermally and electrically conductive connection structure has high thermal and electrical conductivity performance and effect, improving the reliability of subsequent products.
[0039] This utility model is not limited to the above-described embodiments. Other low-stress thermal and electrical conductive connection structures obtained by using the same or similar structures or devices as the above-described embodiments of this utility model are all within the protection scope of this utility model.
Claims
1. A low-stress thermally and electrically conductive connection structure, characterized in that: The low-stress thermally and electrically conductive connection structure includes a support body and a thermally and electrically conductive component. The thermally and electrically conductive component is wrapped around the outside of the support body and is used to provide thermal and electrical conductivity. The support body includes a support layer with a hollow structure, which is used to achieve ultra-low installation stress.
2. The low-stress thermally and electrically conductive connection structure according to claim 1, characterized in that: The thermally and electrically conductive component is a thin metal film with electrical and thermal conductivity functions, and the thin metal film is disposed on the outside of the support layer.
3. The low-stress thermally and electrically conductive connection structure according to claim 1, characterized in that: The thermally and electrically conductive component includes a thermally conductive layer and a conductive layer. The thermally conductive layer is disposed outside the support layer, and the conductive layer is disposed outside the thermally conductive layer. The thermally conductive layer is used to provide thermal conductivity, and the conductive layer is used to conduct electricity.
4. The low-stress thermally and electrically conductive connection structure according to claim 3, characterized in that: The thermally conductive layer is one of copper foil, aluminum foil, graphite film, graphene film or boron nitride film, and each end of the thermally conductive layer is provided with an encapsulation structure for sealing the end.
5. The low-stress thermally and electrically conductive connection structure according to claim 3 or 4, characterized in that: The support layer is wound to form a cylindrical structure.
6. The low-stress thermally and electrically conductive connection structure according to claim 3 or 4, characterized in that: The support layer is wound to form an elliptical cylindrical structure.
7. The low-stress thermally and electrically conductive connection structure according to claim 3 or 4, characterized in that: The support layer is wound to form an arc-shaped structure.
8. The low-stress thermally and electrically conductive connection structure according to claim 3 or 4, characterized in that: The support layer is wound to form a folded structure.
9. The low-stress thermally and electrically conductive connection structure according to claim 3 or 4, characterized in that: The support layer is wound to form a cylindrical structure.
10. The low-stress thermally and electrically conductive connection structure according to claim 1, characterized in that: The support layer is one of PI film, PET film, PE film, or PC sheet.