Wafer active clamping device

Abstract

The utility model discloses a kind of wafer active clamping devices, including support disc, rotating block and electromagnetic induction block, several electromagnetic induction blocks are fixed on support disc along the circumferential direction of support disc, rotating block is equipped on support disc and located in the side of each electromagnetic induction block, rotating body is equipped on rotating block, eccentricity platform deviating from the axis of rotating body on the top end surface of each rotating body is equipped, the distance of the axis of all eccentricity platforms from the axis of support disc is equal, permanent magnet is equipped on each rotating body, electromagnetic induction block generates magnetic field to make rotating body rotate simultaneously, wafer single piece is clamped by eccentricity platform.Compared with existing active clamping device, the utility model drives rotating body to rotate by the mode of electromagnetic induction block and permanent magnet cooperation, without complex mechanical transmission structure, reduce the complexity and cost of equipment, improve the convenience of operation simultaneously.

Description

Technical Field

[0001] This utility model relates to an active wafer clamping device. Background Technology

[0002] Wafer cleaning is a key process in semiconductor manufacturing. Wafer cleaning equipment uses a specific mechanism (Chuck) to fix the wafer and rotate it with a motor. Different solutions or methods are used to treat the wafer surface to remove oil and particles.

[0003] Currently, wafer fixation methods are mainly divided into three types: clamping, vacuum adsorption, and Bernoulli, each used for different process environments. Clamping can be further divided into active clamping and passive clamping. Active clamping uses an external mechanism to drive the support pin to clamp the wafer, while passive clamping mainly uses the centrifugal force of the support pin to keep the product in place. There are many active clamping drive methods on the market, but most of them have complex structures and insufficient stability. This patent provides a simple and easy-to-operate structure to solve this problem. Summary of the Invention

[0004] This invention provides an active wafer clamping device to solve the problems existing in the prior art.

[0005] The technical solutions adopted in this utility model are as follows:

[0006] An active wafer clamping device includes a support disk, a rotating block, and an electromagnetic induction block. Several electromagnetic induction blocks are fixed on the support disk along the circumference of the support disk. A rotating block is provided on the support disk and on one side of each electromagnetic induction block. A rotating body is provided on the rotating block. An eccentric stage is provided on the top surface of each rotating body, offset from the axis of the rotating body. The axis of all eccentric stages is equidistant from the axis of the support disk. A permanent magnet is provided on each rotating body. The electromagnetic induction block generates a magnetic field that causes the rotating body to rotate simultaneously. The wafer is clamped by the eccentric stage.

[0007] Furthermore, the rotating block includes a permanent magnet, a mounting base, a fixed base, and a support base. The fixed base is fixed on the support plate, the mounting base and the support base are connected as a whole to form a rotating body, the rotating body is rotatably connected to the fixed base, the permanent magnet is fixed on the mounting base, the top surface of the support base is used to support the wafer, and the eccentric stage is located on the top surface of the support base.

[0008] Furthermore, a limiting pin is fixed on the mounting base along the axial direction of the mounting base, and an arc groove is provided on the mounting base. The center of the arc groove is coaxial with the axis of the rotating body, and the limiting pin extends into the arc groove.

[0009] Furthermore, an electric slip ring is provided at the center of the support disk, and the connecting wires of all electromagnetic induction blocks are connected to the electric slip ring.

[0010] Furthermore, the upper surface of the support plate is provided with several wiring grooves and several mounting grooves, and an electromagnetic induction block is installed in each mounting groove, with the wires of the electromagnetic induction block arranged in the corresponding wiring groove.

[0011] This utility model has the following beneficial effects:

[0012] (1) Compared with existing active clamping devices, this utility model uses an electromagnetic induction block and a permanent magnet to drive the rotating body to rotate, which eliminates the need for a complex mechanical transmission structure, reduces the complexity and cost of the equipment, and improves the ease of operation.

[0013] (2) By limiting the rotation angle of the rotating body through the cooperation of the limiting pin and the arc groove, the eccentric stage is able to stably hold the wafer, avoiding wafer loosening or damage caused by excessive rotation of the rotating body, and improving the stability of the cleaning process.

[0014] (3) By using the electromagnetic induction block to generate a magnetic field, the direction of the magnetic field can be changed by controlling the direction of the current, thereby achieving precise control of the rotation of the rotating body. It can adjust the clamping state of the wafer in real time according to different cleaning process requirements, making it more adaptable.

[0015] (4) The electric slip ring installed at the center of the support plate effectively solves the problem of wire entanglement when the support plate rotates, ensuring the continuous and stable operation of the equipment and improving production efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0017] Figure 2 This is a structural diagram showing the connection between the rotating block and the support disk.

[0018] Figure 3 This is a sectional view of the rotated block.

[0019] Figure 4 This is an exploded view of the rotating block.

[0020] Figure 5 This is an exploded view of the rotating block.

[0021] Figure 6 This is a schematic diagram of the principle of the electromagnetic induction block of this utility model. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings.

[0023] like Figures 1 to 4This utility model discloses an active wafer clamping device, including a support disk 1, a rotating block 2, and an electromagnetic induction block 3. Several electromagnetic induction blocks 3 are fixed on the support disk 1 along the circumference of the support disk 1. A rotating block 2 is provided on the support disk 1 and located on one side of each electromagnetic induction block 3. A rotating body is provided on the rotating block 2. An eccentric stage 20 is provided on the top surface of each rotating body, which is offset from the axis of the rotating body. The axis of all eccentric stages 20 is equidistant from the axis of the support disk 1. A permanent magnet 21 is provided on each rotating body. The electromagnetic induction block 3 generates a magnetic field to make the rotating body rotate simultaneously. The wafer 4 is clamped by the eccentric stage 20.

[0024] The rotating block 2 includes a permanent magnet 21, a mounting base 22, a fixed base 23, and a support base 24. The fixed base 23 is fixed on the support plate 1. The mounting base 22 and the support base 24 are assembled together to form a rotating body. The rotating body is rotatably connected to the fixed base 23 through a bearing. The permanent magnet 21 is fixed on the mounting base 22. The top surface of the support base 24 is used to support the wafer. The eccentric stage 20 is located on the top surface of the support base 24.

[0025] To facilitate the rotation angle of the idle rotating body, a limiting pin 25 is fixed on the mounting base 22 along the axial direction of the mounting base 22. An arc groove 231 is provided on the fixed base 23, the center of which is coaxial with the axis of the rotating block 2. The limiting pin 25 extends into the arc groove 231. Through the cooperation of the limiting pin and the arc groove 231, the rotation angle of the rotating body can be limited.

[0026] Combination Figure 5 The mounting base 22 includes an inner base 221 and an outer shell 222. A transverse groove is provided on the bottom surface of the inner base 221, and a permanent magnet 21 is fixed within the groove. A limiting pin 25 is fixed to the inner base 221, and the outer shell 222 is fitted onto the inner base 221. The inner base 221 is rotatably connected to the fixed base 23 via a bearing. A protruding key connection portion is provided on the inner base 221, and a keyway portion is provided on the support base 24. The inner base 221 and the support base 24 are interference-fitted via a key and keyway structure.

[0027] The electromagnetic induction block 3 is made of soft magnetic material and has multiple spiral coils wound around it. To facilitate the installation of the electromagnetic induction block 3, several wiring grooves and several mounting grooves are provided on the upper surface of the support plate 1. One electromagnetic induction block 3 is installed in each mounting groove, and the wires of the electromagnetic induction block 3 are arranged in the corresponding wiring groove.

[0028] Since the support plate 1 is driven to rotate by a motor during use, an electric slip ring is installed at the axis of the support plate 1 to avoid wire winding (the electric slip ring is not directly shown in the figure for ease of drawing). All connecting wires of the electromagnetic induction blocks 3 are connected to the electric slip ring. The electric slip ring is a standard product and will not be described in detail.

[0029] Combination Figure 6 By changing the direction of the current in the spiral coil of the electromagnetic induction block 3 through the control terminal, the electromagnetic induction block 3 will generate a magnetic field in the corresponding direction according to Lenz's law. The permanent magnet 21 is affected by the magnetic field, causing the rotating body to rotate. When the rotating body rotates to a certain angle, the eccentric stage 20 clamps the wafer 4, thus fixing the wafer. During the cleaning process, the support plate 1 drives the entire device to rotate, and at the same time, by controlling the change of the magnetic field of the electromagnetic induction block 3, the rotation angle of the rotating body can be adjusted in real time, thereby ensuring the stable clamping of the wafer 4.

[0030] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements can be made without departing from the principle of the present utility model, and these improvements should also be considered within the protection scope of the present utility model.

Claims

1. A wafer active clamping device, characterized in that: The device includes a support disk (1), a rotating block (2), and an electromagnetic induction block (3). Several electromagnetic induction blocks (3) are fixed on the support disk (1) along the circumference of the support disk (1). A rotating block (2) is provided on the support disk (1) and on one side of each electromagnetic induction block (3). A rotating body is provided on the rotating block (2). An eccentric stage (20) is provided on the top surface of each rotating body, which is offset from the axis of the rotating body. The axis of all eccentric stages (20) is equidistant from the axis of the support disk (1). A permanent magnet (21) is provided on each rotating body. The electromagnetic induction block (3) generates a magnetic field that causes the rotating body to rotate simultaneously. The wafer (4) is clamped by the eccentric stage (20).

2. The active wafer clamping device as described in claim 1, characterized in that: The rotating block (2) includes a permanent magnet (21), a mounting base (22), a fixed base (23), and a support base (24). The fixed base (23) is fixed on the support plate (1). The mounting base (22) and the support base (24) are connected together to form a rotating body. The rotating body is rotatably connected to the fixed base (23). The permanent magnet (21) is fixed on the mounting base (22). The top surface of the support base (24) is used to support the wafer. The eccentric stage (20) is located on the top surface of the support base (24).

3. The active wafer clamping device as described in claim 2, characterized in that: A limiting pin (25) is fixed on the mounting base (22) and along the axial direction of the mounting base (22). An arc groove (231) is provided on the fixed base (23). The center of the arc groove (231) is coaxial with the axis of the rotating block (2). The limiting pin (25) extends into the arc groove (231).

4. The active wafer clamping device as described in claim 1, characterized in that: An electric slip ring is provided at the center of the support plate (1), and the connecting wires of all electromagnetic induction blocks (3) are connected to the electric slip ring.

5. The active wafer clamping device as described in claim 4, characterized in that: The upper surface of the support plate (1) is provided with several wiring grooves and several mounting grooves. An electromagnetic induction block (3) is installed in each mounting groove, and the wires of the electromagnetic induction block (3) are arranged in the corresponding wiring groove.

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