Chuck and wafer handling device

Abstract

The application relates to the technical field of photovoltaic automation equipment, and discloses a suction disc and a silicon wafer carrying device, wherein the suction disc comprises a suction disc plate, an air pipe and a suction disc body, the suction disc plate is provided with a first surface, and the first surface is provided with an air pipe groove; the air pipe is communicated with the suction disc body, and the air pipe is arranged in the air pipe groove; the suction disc body is arranged on the suction disc plate; wherein the air pipe groove is provided with a slot penetrating through the first surface, and the width of the slot is smaller than the diameter of the air pipe. In the application, the air pipe is fixed through the air pipe groove, so that the air pipe can be prevented from being bent and protruding from the suction disc to a large extent, contacting the adjacent silicon wafer and causing the appearance of the silicon wafer to be poor, thereby affecting the quality of the silicon wafer.

Description

Technical Field

[0001] This application relates to the field of photovoltaic automation equipment technology, and in particular to a suction cup and silicon wafer handling device. Background Technology

[0002] Silicon wafers are a crucial core material in semiconductor manufacturing, solar cell manufacturing, and optoelectronic device manufacturing.

[0003] In the silicon wafer production process, robots drive multiple suction cups to move together, transferring the silicon wafers from various mechanisms to graphite boats, or vice versa. The suction cups are the main structure for gripping the silicon wafers. They are arranged at intervals along the same direction, and each suction cup is equipped with a nozzle to grip the silicon wafer.

[0004] Although the air tubes of each suction cup are embedded in the suction cup plate, the air tubes may still bend during the movement of the suction cup after it grabs the silicon wafer. This can cause the air tubes to come into contact with adjacent silicon wafers, resulting in poor appearance of the silicon wafers and affecting their quality. Utility Model Content

[0005] This application discloses a suction cup that accommodates and fixes an air tube through an air tube groove, which can prevent the air tube from bending and protruding significantly from the suction cup, contacting adjacent silicon wafers, causing poor appearance of the silicon wafers, and affecting the quality of the silicon wafers.

[0006] To achieve the above objectives, according to a first aspect disclosed in this application, a suction cup is provided, comprising: a suction cup plate having a first surface, the first surface being provided with an air tube groove;

[0007] A trachea, wherein the trachea is disposed in the trachea groove;

[0008] A suction cup body, wherein the suction cup body is disposed on the suction cup plate;

[0009] The air tube groove has a slot that penetrates the first surface, and the width of the slot is smaller than the diameter of the air tube.

[0010] As an optional implementation, the suction cup plate has a second surface disposed opposite to the first surface, and the width of the air tube groove gradually increases along the direction from the first surface to the second surface.

[0011] As an optional implementation, the tracheal groove is a dovetail groove.

[0012] As an optional implementation, the inner wall of the tracheal groove is cylindrical, and the directrix of the cylindrical surface is a superior arc curve.

[0013] As an optional implementation, the tracheal channel has a first sidewall and a second sidewall disposed opposite to each other along its width direction;

[0014] The first sidewall is provided with a first limiting protrusion, and the distance from the first limiting protrusion to the second sidewall is less than the diameter of the trachea; or,

[0015] The second sidewall is provided with a second limiting protrusion, and the distance from the second limiting protrusion to the first sidewall is less than the diameter of the trachea; or,

[0016] The first sidewall has the first limiting protrusion, and the second sidewall has the second limiting protrusion. The first limiting protrusion and the second limiting protrusion are arranged opposite to each other along the width direction of the tracheal groove, and the distance between the first limiting protrusion and the second limiting protrusion is less than the diameter of the trachea.

[0017] As an optional implementation, the suction cup is provided with a plurality of weight-reducing holes, which penetrate the suction cup along the first direction, and a portion of the weight-reducing holes are spaced apart on the extension path of the air tube groove.

[0018] As an optional implementation, the number of suction cup bodies is multiple, and the suction cup bodies are used to adsorb silicon wafers;

[0019] The number of air tubes is multiple, and each air tube is provided in a one-to-one correspondence with the suction cup body and is connected to the corresponding suction cup body;

[0020] The airway groove and the airway are arranged in a one-to-one correspondence, and each airway is set in the corresponding airway groove.

[0021] As an optional implementation, the suction cup body includes:

[0022] The suction cup body includes:

[0023] Suction cup base;

[0024] An air pipe connector is provided on the top of the suction cup body. The air pipe connector is connected to the air pipe, and the axis of the air pipe connector is collinear with the axis of the air pipe.

[0025] A suction nozzle is mounted on the suction cup base and is used to grip materials.

[0026] Multiple hook springs are arranged around the suction cup base, with one end of each hook spring connected to the suction cup base and the other end connected to the suction cup plate.

[0027] As an optional implementation, the suction cup further includes:

[0028] Multiple air passage connectors are provided on the suction cup plate. Each air passage connector is corresponding to each air pipe. One end of each air passage connector is connected to the corresponding air pipe, and the other end is used to connect to an external pipeline.

[0029] The axis of the air passage connector is collinear with the axis of the air pipe.

[0030] According to an embodiment of the second aspect of this application, a silicon wafer handling device is provided, comprising: a plurality of the aforementioned suction cups;

[0031] The suction cups are arranged at intervals along their thickness direction, the adsorption surface of the suction cup body is opposite to the first surface, and in every two adjacent suction cups, the first surface of one suction cup is facing the adsorption surface of the suction cup body on the other suction cup.

[0032] Compared with the prior art, the beneficial effects of this application are:

[0033] The suction cup provided in this embodiment has an air tube groove on the suction cup plate. The width of the groove opening through the first surface is smaller than the diameter of the air tube. The air tube is accommodated by the air tube groove, and the groove opening limits the air tube. This prevents the air tube from protruding from the groove opening and from directly protruding from the first surface of the suction cup and contacting the silicon wafer adjacent to the first surface of the suction cup plate. It also prevents the air tube from bending and protruding and contacting the adjacent silicon wafer, which would cause poor appearance of the silicon wafer and affect the quality of the silicon wafer. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the structure of the first surface of the suction cup plate disclosed in the embodiments of this application;

[0036] Figure 2 The embodiments disclosed in this application Figure 1 Schematic diagram of the cross-sectional structure at point AA;

[0037] Figure 3 The embodiments disclosed in this application Figure 1 Another cross-sectional structural diagram at point AA;

[0038] Figure 4 The embodiments disclosed in this applicationFigure 1 Another cross-sectional structural diagram at point AA;

[0039] Figure 5 This is a schematic diagram of the structure of the second surface of the suction cup plate disclosed in the embodiments of this application;

[0040] Figure 6 This is a schematic diagram of the structure of the multiple suction cups disclosed in the embodiments of this application;

[0041] Figure 7 The embodiments disclosed in this application Figure 6 Enlarged structural diagram at point B;

[0042] Figure 8 This is a schematic diagram of the structure of the multiple suction cups disclosed in the embodiments of this application from another perspective;

[0043] Figure 9 This is a schematic diagram of the silicon wafer handling device disclosed in the embodiments of this application.

[0044] Explanation of reference numerals in the attached figures:

[0045] 100-Suction cup; 11-Suction cup plate; 111-First surface; 112-Second surface; 12-Air tube groove; 121-First sidewall; 122-Second sidewall; 123-First limiting protrusion; 124-Second limiting protrusion; 125-Cylindrical surface; 13-Weight reduction hole; 200-Suction cup body; 21-Suction cup base; 22-Air tube connector; 23-Suction nozzle; 24-Hook spring; 300-Air tube; 400-Air circuit connector; 500-Robot; a-First direction; b-Second direction. Detailed Implementation

[0046] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0047] In this application, the terms "upper," "lower," "top," "bottom," "inner," "vertical," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0048] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0049] Furthermore, the terms "set up," "equipped with," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0050] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0051] Silicon wafers are a crucial core material in semiconductor manufacturing, solar cell manufacturing, and optoelectronic device manufacturing. In the field of solar photovoltaics, solar cells primarily operate based on the photoelectric effect of silicon. When sunlight shines on a silicon wafer, photon energy excites electrons in silicon atoms, causing them to escape the nucleus and form electron-hole pairs. Under the influence of an electric field, the electrons and holes move in opposite directions, generating an electric current. By connecting multiple silicon wafers in series or parallel, solar cells can be assembled into solar panels, providing clean solar power to people.

[0052] In the silicon wafer production process, such as during the coating process, automated loading and unloading equipment is needed to automatically load and unload silicon wafers from baskets into graphite boats, and vice versa. During this process, a robot is needed to move multiple suction cups together. The robot can be a six-axis robot, and multiple suction cups can be set on the robot. Each suction cup can pick up one silicon wafer at a time, and multiple suction cups can pick up multiple silicon wafers at a time, transferring multiple silicon wafers simultaneously, thus improving handling efficiency.

[0053] Multiple suction cups can be arranged at intervals along their thickness direction. Each suction cup is equipped with a suction cup body, which adsorbs and grasps silicon wafers. The number of suction cups can correspond to the number of silicon wafers loaded in a graphite boat. Each suction cup corresponds to one silicon wafer, and each suction cup can grasp the corresponding silicon wafer. In one grasping and handling operation, all the silicon wafers on a graphite boat can be moved, which can improve the transfer efficiency.

[0054] Each suction cup corresponds to a silicon wafer on a graphite boat, resulting in a small gap between the suction cups. When installing the air tubes of the suction cups, the air tubes can be embedded in the suction cups to avoid the air tubes occupying the space between the suction cups. Specifically, a rectangular groove can be set on the suction cup and the air tubes can be placed in the rectangular groove.

[0055] However, due to excessive length or twisting during installation, the air tube may still bend during the movement of the suction cup after it picks up the silicon wafer. The bent air tube protrudes from the rectangular groove, causing it to protrude from the surface of the suction cup plate and come into contact with the adjacent silicon wafer, resulting in poor appearance of the silicon wafer and affecting its quality.

[0056] Based on this, this application provides a suction cup, which includes a suction cup plate. An air tube groove is formed on the suction cup plate, and an air tube is placed in the air tube groove. The width of the groove opening is smaller than the diameter of the air tube. By accommodating and fixing the air tube in the air tube groove, it is possible to prevent the air tube from bending and protruding significantly from the suction cup, contacting adjacent silicon wafers, causing poor appearance of the silicon wafers, and affecting the quality of the silicon wafers.

[0057] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0058] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of the first surface of the suction cup plate disclosed in an embodiment of this application. This application discloses a suction cup 100, including: a suction cup plate 11, an air tube 300, and a suction cup body 200. The suction cup plate 11 has a first surface 111, and an air tube groove 12 is provided on the first surface 111; the air tube 300 is disposed in the air tube groove 12; the suction cup body 200 is disposed on the suction cup plate 11; wherein, the air tube groove 12 has a slot penetrating the first surface 111, and the width of the slot is smaller than the diameter of the air tube 300.

[0059] Specifically, the suction cup plate 11 can be a cuboid with a small thickness, allowing it to extend between silicon wafers. This enables the suction cup plate 11 to move the suction cup body 200 between two adjacent silicon wafers, and the suction cup body 200 to grip one of the silicon wafers. The first direction 'a' is the thickness direction of the suction cup plate 11.

[0060] One end of the air tube 300 is connected to the suction cup body 200, and the other end is connected to an external pipeline. It can provide negative pressure to the suction cup body 200. The air tube 300 is set in the air tube groove 12, which can accommodate the air tube 300. This prevents the air tube 300 from swinging around and can prevent the air tube 300 from bending and deforming to a certain extent. This ensures the connectivity between the air tube 300 and the suction cup body 200 and guarantees the normal adsorption function of the suction cup body 200 on the silicon wafer.

[0061] The air tube groove 12 is disposed on the first surface 111, so that the air tube groove 12 has at least a groove that penetrates the first surface 111. The width of the groove is smaller than the diameter of the air tube 300, which can restrict the radial displacement of the air tube 300 in the groove, that is, the air tube 300 cannot come out of the groove, further enhancing the stability of the air tube 300 on the suction cup 100 and improving the stability of the entire suction cup 100 structure.

[0062] It is understandable that during the installation of the trachea 300 into the trachea groove 12, the trachea 300 can be inserted through the groove along its extension direction of the trachea groove 12, but it is not limited to this one installation method.

[0063] According to the suction cup 100 of this utility model embodiment, an air tube groove 12 is provided on the suction cup 100, and the width of the groove opening of the air tube groove 12 penetrating the first surface 111 is smaller than the diameter of the air tube 300. The air tube 300 is accommodated by the air tube groove 12, and the air tube 300 is limited by the groove opening. This can prevent the air tube 300 from protruding from the groove opening to the outside of the air tube groove 12, and prevent the air tube 300 from directly protruding from the first surface 111 of the suction cup 100 and contacting the silicon wafer adjacent to the air tube 300. It can also prevent the air tube 300 from bending and protruding and contacting the adjacent silicon wafer, which would cause poor appearance of the silicon wafer and affect the quality of the silicon wafer.

[0064] Combination Figure 2 and Figure 7 , Figure 2 The embodiments disclosed in this application Figure 1 A schematic diagram of the cross-sectional structure at point A. Figure 7 The embodiments disclosed in this application Figure 6 An enlarged structural schematic diagram at point B. In some embodiments, the width of the tracheal groove 12 gradually increases along the direction from the first surface 111 to the second surface 112.

[0065] Specifically, the tracheal groove 12 is a groove with length, depth, and width, such as Figure 1 and Figure 6 As shown, Figure 6This is a schematic diagram of the structure of multiple suction cups disclosed in the embodiments of this application. The length of the air duct groove 12 is the distance along its extension direction; the depth is the distance from the bottom of the air duct groove 12 to the first surface 111 along the first direction a; and the width is the length of the air duct groove 12 along the second direction b. The second direction b is perpendicular to the extension direction of the air duct groove 12 and parallel to the first surface 111. The width of the air duct groove 12 can gradually increase from the first surface 111 to the second surface 112 in a gradual manner. That is, the two sidewalls of the air duct groove 12 can be inclined, making the air duct groove 12 wider inside and narrower outside. This allows the air duct groove 12 to accommodate the air tube 300 while also limiting the air tube 300, preventing it from bending and protruding into adjacent silicon wafers, which would cause poor appearance of the silicon wafers and affect their quality.

[0066] Combination Figure 2 In some embodiments, the tracheal groove 12 is a dovetail groove.

[0067] Specifically, the air tube groove 12 can be a dovetail groove, which has a relatively narrow opening and a wide bottom. The narrow opening is located on the first surface 111. A sealing plate can be set in the narrow opening of the dovetail groove. The sealing plate can be slidably connected to the suction cup 100. After the air tube 300 is accommodated in the dovetail groove, the sealing plate is slidably installed in the narrow opening of the dovetail groove to further limit the internal air tube 300, preventing the air tube 300 from protruding directly from the first surface 111 of the suction cup 100 and contacting the silicon wafer adjacent to the first surface 111 of the suction cup 100. This also prevents the air tube 300 from bending and protruding and contacting the adjacent silicon wafer, which would cause poor appearance of the silicon wafer and affect the quality of the silicon wafer.

[0068] Combination Figure 3 , Figure 3 The embodiments disclosed in this application Figure 1 Another cross-sectional structural diagram at point AA. In some embodiments, the inner wall of the tracheal channel 12 is a cylindrical surface 125, and the directrix of the cylindrical surface 125 is a superior arc curve.

[0069] Specifically, cylindrical surface 125 is a curved surface formed by a straight line moving along a fixed curve. The straight line is called the generatrix of cylindrical surface 125, and the fixed curve is called the directrix of cylindrical surface 125. For the directrix, the part between any two points on a circle is called an arc. The arc smaller than a semicircle is called a minor arc, and the arc larger than a semicircle is called a major arc. In the embodiment of this application, the inner wall of the air tube groove 12 can be cylindrical surface 125 with the major arc curve as the directrix. This allows the air tube 300 to be accommodated in the air tube groove 12, while the inner wall of the cylindrical surface 125 of the air tube groove 12 provides a limit for the air tube 300, preventing the air tube 300 from protruding directly from the first surface 111 of the suction cup plate 11 and contacting the silicon wafer adjacent to the air tube 300. This also prevents the air tube 300 from bending and protruding and contacting the adjacent silicon wafer, which would cause poor appearance of the silicon wafer and affect the quality of the silicon wafer. The diameter of the superior arc curve can be adapted to the diameter of the trachea 300, or slightly larger than the diameter of the trachea 300, so that the trachea 300 can be adapted to the trachea groove 12, so that the trachea 300 is fixed in the trachea groove 12 and the trachea 300 is prevented from moving.

[0070] Combination Figure 4 , Figure 4 The embodiments disclosed in this application Figure 1 Another cross-sectional structural schematic diagram at point AA. In some embodiments, the tracheal channel 12 has a first sidewall 121 and a second sidewall 122 disposed opposite to each other along its width direction;

[0071] The first sidewall 121 is provided with a first limiting protrusion 123, and the distance from the first limiting protrusion 123 to the second sidewall 122 is less than the diameter of the trachea 300; or,

[0072] The second sidewall 122 is provided with a second limiting protrusion 124, the distance from the second limiting protrusion 124 to the first sidewall 121 being less than the diameter of the trachea 300; or,

[0073] The first sidewall 121 has a first limiting protrusion 123, and the second sidewall 122 has a second limiting protrusion 124. The first limiting protrusion 123 and the second limiting protrusion 124 are arranged opposite to each other along the width direction of the tracheal groove 12, and the distance between the first limiting protrusion 123 and the second limiting protrusion 124 is less than the diameter of the trachea 300.

[0074] Specifically, the air tube groove 12 has a limiting protrusion on the first side wall 121, and the distance from the first limiting protrusion 123 to the second side wall 122 is less than the diameter of the air tube 300. Alternatively, a second limiting protrusion 124 is provided on the second side wall 122, and the distance from the second limiting protrusion 124 to the first side wall 121 is less than the diameter of the air tube 300. Or, a first limiting protrusion 123 is provided on the first side wall 121, and a second limiting protrusion 124 is provided on the second side wall 122, and the distance between the first limiting protrusion 123 and the second limiting protrusion 124 is less than the diameter of the air tube 300. This can limit the air tube 300 contained in the air tube groove 12, preventing the air tube 300 from protruding directly from the first surface 111 of the suction cup plate 11 and contacting the silicon wafer adjacent to the air tube 300. This also prevents the air tube 300 from bending and protruding and contacting the adjacent silicon wafer, which would cause poor appearance of the silicon wafer and affect its quality.

[0075] In some embodiments, a first limiting protrusion 123 may be provided on the first sidewall 121, and a second limiting protrusion 124 may be provided on the second sidewall 122. The distance between the first limiting protrusion 123 and the second sidewall 122 is such that the trachea 300 can pass through it, and the distance between the second limiting protrusion 124 and the first sidewall 121 is such that the trachea 300 can pass through it. The first limiting protrusion 123 and the second limiting protrusion 124 are staggered, and the first limiting protrusion 123 may be positioned adjacent to the slot of the trachea groove 12 that penetrates the first surface 111. The 300 is accommodated between the second limiting protrusion 124 and the bottom of the groove, so that the staggered first limiting protrusion 123 and second limiting protrusion 124 can prevent the air tube 300 from directly protruding from the first surface 111 in the air tube groove 12. It can also facilitate the installation of the air tube 300. When installing the air tube 300, the installer can directly move the air tube 300 from the gap between the first limiting protrusion 123 and the second side wall 122 to the gap between the second limiting protrusion 124 and the first side wall 121, and finally move it between the second limiting protrusion 124 and the bottom of the groove.

[0076] Combination Figure 1 In some embodiments, the suction cup 100 is provided with a plurality of weight-reducing holes 13, which penetrate the suction cup 100 along the first direction a, and a portion of the weight-reducing holes 13 are spaced apart on the extension path of the air tube groove 12.

[0077] Specifically, the weight reduction hole 13 can be a rectangular hole or a circular hole, and there is no restriction. There can be multiple weight reduction holes 13. As many as possible can be set without affecting the strength of the suction cup plate 11, so as to reduce the weight of each suction cup plate 11. The weight reduction holes 13 on the extension path of the air tube groove 12 can facilitate the installation of the air tube 300.

[0078] Combination Figure 5 , Figure 5This is a schematic diagram of the structure of the second surface of the suction cup plate disclosed in an embodiment of this application. In some embodiments, there are multiple suction cup bodies 200, which are used to adsorb silicon wafers;

[0079] There are multiple air tubes 300, and each air tube 300 is set in a one-to-one correspondence with the suction cup body 200 and is connected to the corresponding suction cup body 200.

[0080] The tracheal slots 12 and trachea 300 are set one-to-one, and each trachea 300 is set in the corresponding tracheal slot 12.

[0081] Specifically, the air tube 300 can provide negative pressure to the suction cup body 200. The suction cup body 200 grips the silicon wafer through negative pressure. By gripping the silicon wafer through the suction cup body 200, it is possible to avoid contamination and scratches on the silicon wafer at the same time. The air tubes 300 are set one-to-one with each suction cup body 200, and each air tube 300 is set in a corresponding air tube groove 12.

[0082] Combination Figure 5 In some embodiments, the suction cup body 200 includes: a suction cup base 21, an air pipe connector 22, a suction nozzle 23, and a plurality of hook springs 24. The air pipe connector 22 is disposed on the top of the suction cup body 200, and the air pipe connector 22 is connected to the air pipe 300, and the axis of the air pipe connector 22 is collinear with the axis of the air pipe 300. The suction nozzle 23 is disposed on the suction cup base 21 and is used to grip materials. The plurality of hook springs 24 are arranged around the suction cup base 21, and one end of each hook spring 24 is connected to the suction cup base 21, and the other end is connected to the suction cup plate 11.

[0083] Specifically, a suction cup groove can be provided on the suction cup plate 11 for mounting the suction cup base 21. The suction cup base 21 is engaged with the inner wall of the suction cup groove by multiple hook springs 24. There can be four hook springs 24, which can be evenly arranged around the suction cup base 21. By mounting the suction cup base 21 through the hook springs 24, and then mounting the suction nozzle 23 on the suction cup base 21, a certain buffer can be provided for the suction nozzle 23. When the suction nozzle 23 grips the silicon wafer, it can make close contact with the silicon wafer, while avoiding excessive pressure from the suction nozzle 23 on the silicon wafer, which could damage the silicon wafer.

[0084] Combination Figure 5 In some embodiments, the silicon wafer handling device further includes: a plurality of air passage connectors 400, all of which are disposed on the suction cup plate 11. Each air passage connector 400 is correspondingly disposed to each air pipe 300. One end of the air passage connector 400 is connected to the corresponding air pipe 300 and is fixedly connected to the air pipe 300, and the other end is used to connect to an external pipeline.

[0085] The axis of the air connection 400 is collinear with the axis of the air pipe 300.

[0086] Specifically, the air path connector 400 can be fixed to the suction cup 100 by bolts or clips, and the air tube 300 can be fixedly connected to the air path connector 400 by screws. An external pipeline can be connected to the air tube 300 through the air path connector 400. An external air source can be connected to the air path connector 400 through an external pipeline, then to the air tube 300, and finally to the suction nozzle 23. The external air source can provide negative pressure to the suction nozzle 23. The axis of the air path connector 400 and the air tube 300... The axis of 00 and the axis of the air pipe connector 22 are collinear, which allows the air pipe 300 to extend in a straight line. This ensures smooth connection between the air pipe 300 and the air circuit connector 400, as well as between the air pipe 300 and the air pipe connector 22. It also prevents the connection from being crooked, which could cause the air pipe 300 to have poor airflow or to protrude out of the air pipe groove 12 and come into contact with the silicon wafer adjacent to the air pipe 300. This also prevents the air pipe 300 from bending and protruding and coming into contact with the adjacent silicon wafer, which could cause poor appearance of the silicon wafer and affect its quality.

[0087] Please see Figure 8 and Figure 9 , Figure 8 This is a schematic diagram of the structure of the multiple suction cups disclosed in the embodiments of this application from another perspective. Figure 9 This is a schematic diagram of the silicon wafer handling device disclosed in an embodiment of this application. The embodiment of this application discloses a silicon wafer handling device, including: a plurality of the aforementioned suction cups 100; wherein the plurality of suction cups 100 are arranged at intervals along a first direction a, the adsorption surface of the suction cup body 200 is disposed opposite to the first surface 111, and in every two adjacent suction cups 100, the first surface 111 of one suction cup 100 is disposed facing the adsorption surface of the suction cup body 200 on the other suction cup 100.

[0088] Specifically, photovoltaic automation equipment may include a silicon wafer handling device. This device can handle silicon wafers, saving manpower and improving production efficiency. The silicon wafer handling device may include multiple suction cups 100 and a robot 500. The robot 500 may be a six-axis robot. The multiple suction cups 100 are arranged at intervals along a first direction a to form a suction cup group. The distance between each suction cup 100 can correspond to the material to be grasped. That is, when the silicon wafers to be grasped and transported are placed in a graphite boat or basket, they are all arranged at intervals along the first direction a, with each suction cup 100 corresponding to a silicon wafer. The six-axis robot 500 drives each suction cup 100 to move and extend into the gaps between the silicon wafers, which can grasp multiple silicon wafers at once. It can grasp a group of silicon wafers in a graphite boat or basket together and transport the grasped silicon wafers, which can greatly improve the handling effect.

[0089] The first surface 111 of one suction cup plate 11 and the second surface 112 of another suction cup plate 11 can be set facing each other, that is, the orientation of each suction cup 100 is the same, that is, the first surface 111 of each suction cup 11 faces one side, or the direction from the first surface 111 to the second surface 112 of each suction cup plate 11 points to the same side. After all the suction cups 100 are set in the same direction, the air tube 300 is limited by the air tube groove 12. This can prevent the air tube 300 from protruding from the air tube groove 12 and contacting the silicon wafer gripped by the other suction cup 100, that is, the silicon wafer adjacent to the first surface 111 of the suction cup plate 11. This can prevent the air tube 300 from bending and protruding and contacting the adjacent silicon wafer, which would cause poor appearance of the silicon wafer and affect the quality of the silicon wafer.

[0090] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A suction cup, characterized in that, include: A suction cup plate (11) has a first surface (111) and an air tube groove (12) is provided on the first surface (111); A suction cup body (200) is disposed on the suction cup plate (11); An air tube (300) is connected to the suction cup body (200) and is disposed in the air tube groove (12); The airway groove (12) has a slot that penetrates the first surface (111), and the width of the slot is smaller than the diameter of the airway (300).

2. The suction cup according to claim 1, characterized in that, The suction cup plate (11) has a second surface (112) disposed opposite to the first surface (111) along a first direction (a), and the width of the air tube groove (12) gradually increases along the direction from the first surface (111) to the second surface (112).

3. The suction cup according to claim 2, characterized in that, The tracheal groove (12) is a dovetail groove.

4. The suction cup according to claim 1, characterized in that, The inner wall of the tracheal groove (12) is a cylindrical surface (125), and the directrix of the cylindrical surface (125) is a superior arc curve.

5. The suction cup according to claim 1, characterized in that, The tracheal tube (12) has a first sidewall (121) and a second sidewall (122) disposed opposite to each other along its width direction; The first sidewall (121) is provided with a first limiting protrusion (123), and the distance from the first limiting protrusion (123) to the second sidewall (122) is less than the diameter of the trachea (300); or, The second sidewall (122) is provided with a second limiting protrusion (124), the distance from the second limiting protrusion (124) to the first sidewall (121) being less than the diameter of the trachea (300); or, The first sidewall (121) has the first limiting protrusion (123), and the second sidewall (122) has the second limiting protrusion (124). The first limiting protrusion (123) and the second limiting protrusion (124) are arranged opposite to each other along the width direction of the tracheal groove (12). The distance between the first limiting protrusion (123) and the second limiting protrusion (124) is less than the diameter of the trachea (300).

6. The suction cup according to claim 2, characterized in that, The suction cup plate (11) is provided with a plurality of weight-reducing holes (13), which penetrate the suction cup plate (11) along the first direction (a), and a portion of the weight-reducing holes (13) are spaced apart on the extension path of the air duct groove (12).

7. The suction cup according to claim 1, characterized in that, The number of suction cup bodies (200) is multiple, and the suction cup bodies (200) are used to adsorb silicon wafers; There are multiple air tubes (300), and each air tube (300) is provided in a one-to-one correspondence with the suction cup body (200) and is connected to the corresponding suction cup body (200); The airway groove (12) is provided in a one-to-one correspondence with the airway (300), and each airway (300) is provided in the corresponding airway groove (12).

8. The suction cup according to claim 1, characterized in that, The suction cup body (200) includes: Suction cup base (21); An air pipe connector (22) is provided on the top of the suction cup body (200). The air pipe connector (22) is connected to the air pipe (300), and the axis of the air pipe connector (22) is collinear with the axis of the air pipe (300). A suction nozzle (23) is disposed on the suction cup base (21) and is used to grip materials; Multiple hook springs (24) are arranged around the suction cup base (21), with one end of each hook spring (24) connected to the suction cup base (21) and the other end connected to the suction cup plate (11).

9. The suction cup according to claim 1, characterized in that, The suction cup also includes: Multiple air passage connectors (400) are provided on the suction cup plate (11). Each air passage connector (400) is provided in correspondence with each air pipe (300). One end of each air passage connector (400) is connected to the corresponding air pipe (300) and is fixedly connected to the air pipe (300). The other end is used to connect to an external pipeline. The axis of the air passage connector (400) is collinear with the axis of the air pipe (300).

10. A silicon wafer handling device, characterized in that, include: Multiple suction cups (100) as described in any one of claims 1-9; The plurality of suction cups (100) are arranged at intervals along their thickness direction, the adsorption surface of the suction cup body (200) is opposite to the first surface (111), and in every two adjacent suction cups (100), the first surface (111) of one suction cup (100) is facing the adsorption surface of the suction cup body (200) on the other suction cup (100).

Images