Gluing device

Abstract

The utility model provides a kind of gluing device, including the platform for supporting semiconductor substrate, glue knife on semiconductor substrate is glued, the first gluing moving mechanism that can be translated and move up and down relative to platform and the first driving part for driving first gluing moving mechanism uniform speed translation, wherein, glue knife is installed on first gluing moving mechanism and slit type glue outlet of glue knife is parallelly arranged with platform, first driving part drives first gluing moving mechanism uniform speed translation at set speed and direction to link glue knife uniform speed translation relative to platform, in turn make the glue outlet at gluing height position is evenly glued on semiconductor substrate, improve the yield of semiconductor substrate.

Description

Technical Field

[0001] This utility model belongs to the field of adhesive application technology and relates to an adhesive application device. Background Technology

[0002] The adhesive application device includes a coating blade with a slit-type adhesive outlet and a platform for placing a semiconductor substrate. The adhesive outlet is used to apply adhesive to the semiconductor substrate during translation relative to the platform.

[0003] In the existing technology, the coating blade is manually driven to move horizontally. During the horizontal movement, the blade moves at an uneven speed, which can easily cause the adhesive applied to the semiconductor substrate to be uneven, resulting in a low yield.

[0004] For the reasons mentioned above, there is an urgent need for a glue application device that can solve the above problems. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a coating device that can move at a constant speed relative to a semiconductor substrate, thereby improving the yield of semiconductor substrates.

[0006] This utility model is implemented as follows: an adhesive application device, comprising:

[0007] Platform used to mount semiconductor substrates;

[0008] A coating knife with a slit-type adhesive outlet for applying adhesive to semiconductor substrates;

[0009] The first adhesive application moving mechanism is capable of translational and vertical movement relative to the platform, and the coating blade is mounted on the first adhesive application moving mechanism and is limited to being parallel to the platform.

[0010] The first driving unit is used to drive the first coating moving mechanism to move at a uniform speed and direction according to a set speed and direction, thereby linking the coating blade to move at a uniform speed relative to the platform, so that the adhesive outlet located at the coating height position can uniformly coat the semiconductor substrate with adhesive.

[0011] Furthermore, the adhesive application device also includes:

[0012] A translation sensor is used to detect the current translation speed of the coating blade and output the translation speed signal.

[0013] The drive controller stores preset standard translation speed information. When the detected current translation speed deviates from the standard translation speed, the drive controller changes the magnitude of the current supplied to the first drive unit to make the coating knife translate at the standard translation speed.

[0014] Furthermore, the adhesive application device also includes:

[0015] Two first slide rails are arranged parallel to each other on the platform and located on both sides of the semiconductor substrate, for guiding the translational coating knife.

[0016] Furthermore, the first adhesive application moving mechanism also includes a lifting assembly, which comprises:

[0017] Two bases are respectively slidably mounted on the corresponding two first slide rails;

[0018] Two second drive units are respectively disposed on the two bases, and the two ends of the coating knife are directly or indirectly connected to the two second drive units respectively, and are arranged parallel to the platform.

[0019] Furthermore, the first adhesive application moving mechanism includes:

[0020] Two guide components are provided, with the two ends of the coating knife sliding directly or indirectly on the two guide components for vertical guidance of the coating knife. Each set of guide components includes two vertically spaced second slide rails.

[0021] Furthermore, the adhesive application device also includes:

[0022] The first position sensor is set at the starting position of the adhesive application and is used to detect whether the applicator is in the starting position. When the applicator is in the starting position, it outputs a starting position signal.

[0023] The drive controller outputs a first control signal to the two second drive units according to the received start position signal. The second drive units rotate according to the received first control signal and according to a set first number of revolutions and a first direction to drive the coating blade to move to the coating height position, which is the height position of the coating blade for coating.

[0024] Furthermore, the adhesive application device also includes:

[0025] The second position sensor is set at the end position of the adhesive application and is used to detect whether the applicator is at the end position of the adhesive application. When the applicator is at the end position, it outputs an end position signal.

[0026] The drive controller outputs a second control signal to the two second drive units according to the received termination position signal. The second drive units rotate according to the received second control signal and according to a set second number of revolutions and a second direction to drive the coating blade to move to a predetermined height position, which is higher than the coating height position.

[0027] Furthermore, the adhesive applicator also includes a buffer that limits the stroke of the applicator blade.

[0028] Furthermore, the adhesive applicator also includes a baffle for protecting the adhesive outlet of the applicator blade, the bottom surface of the baffle being at the same height as the adhesive outlet.

[0029] Furthermore, the adhesive application device also includes a second adhesive application moving mechanism capable of translating and moving up and down relative to the platform, wherein the first adhesive application moving mechanism and the second adhesive application moving mechanism are respectively disposed at both ends of the platform, and the adhesive application thickness of the second adhesive application moving mechanism is different from that of the first adhesive application moving mechanism.

[0030] This utility model provides a coating device, including a platform for placing a semiconductor substrate, a coating blade for coating the semiconductor substrate, a first coating moving mechanism capable of translating and moving up and down relative to the platform, and a first driving unit for driving the first coating moving mechanism to translate at a uniform speed. The coating blade is mounted on the first coating moving mechanism and the slit-type adhesive outlet of the coating blade is arranged parallel to the platform. The first driving unit drives the first coating moving mechanism to translate at a uniform speed according to a set speed and direction, thereby coordinating the uniform translation of the coating blade relative to the platform. This allows the adhesive outlet located at the coating height position to uniformly coat the semiconductor substrate, improving the yield of the semiconductor substrate. Attached Figure Description

[0031] To more clearly illustrate the technical solution of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a structural diagram of the adhesive application device provided in an embodiment of the present invention.

[0033] Figure 2 This is a structural diagram of the first adhesive application moving mechanism in the adhesive application device provided in this embodiment of the utility model.

[0034] Figure 3 yes Figure 2 Enlarged view of point A in the middle.

[0035] Figure 4 This is a block diagram of the drive controller driving the first drive unit and the second drive unit in the glue coating device provided in this embodiment of the utility model.

[0036] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0037] The reference numerals in the attached figures are explained as follows:

[0038] Platform 100;

[0039] Semiconductor substrate 10;

[0040] 200 applicator blade, 210 glue outlet, 220 tip, 230 buffer, 240 baffle;

[0041] The first adhesive application moving mechanism 300, the lifting component 310, the two bases (311, 311'), the two second drive units (312, 312'), the guide component 320, the second slide rails (321, 321'), and the first adhesive application moving mechanism 300'.

[0042] First drive unit 400;

[0043] Translation sensor 500;

[0044] Drive controller 600;

[0045] Two first slide rails (700, 700');

[0046] First position sensor 800;

[0047] Second position sensor 900;

[0048] Altitude sensor 910. Detailed Implementation

[0049] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or state relationship based on the orientation or state relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0050] Furthermore, in addition to indicating location or state relationships, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in certain situations to indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0051] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0052] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts, which may be the same or different in type and construction, and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0053] To clarify the directional relationships in the diagram, a coordinate system with the vertical direction as the Z-direction and the horizontal plane as the XY-plane is appropriately labeled.

[0054] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0055] like Figures 1-4 As shown, an embodiment of this utility model provides an adhesive application device, comprising:

[0056] Platform 100 is used to mount semiconductor substrate 10. Platform 100 is preferably a marble platform with high parallelism (e.g., ∥1μm) to ensure the parallelism of semiconductor substrate 10. Semiconductor substrate 10 may include, but is not limited to: glass substrates for liquid crystal display devices, glass substrates for PDP, glass substrates for photomasks, substrates for color filters, substrates for recording disks, substrates for solar cells, substrates for electronic paper and other precision electronic device substrates, rectangular glass substrates, flexible substrates for thin-film liquid crystals, substrates for organic EL and other substrates. In this embodiment, a glass substrate is preferred.

[0057] The coating blade 200 has a slit-type adhesive outlet 210 for applying adhesive to the semiconductor substrate 10. The adhesive outlet 210 is located on the tip 220 protruding from the coating blade 200. Because the coating blade 200 has a large external size and is close to the platform 100 during the adhesive application process, the phenomenon of the coating blade 200 colliding with the platform 100 after tilting is avoided.

[0058] The first adhesive application moving mechanism 300 is capable of translation relative to the platform 100 (see reference). Figure 1 (in the X direction) and vertical movement (refer to) Figure 1 (in the Z direction), the applicator 200 is mounted on the first adhesive application moving mechanism 300 and is limited to be parallel to the platform 100;

[0059] The first driving unit 400 is used to drive the first adhesive application moving mechanism 300 to move at a uniform speed and direction according to a set speed and direction, thereby linking the coating blade 200 to move at a uniform speed relative to the platform 100, so that the adhesive outlet 210 located at the adhesive application height position can uniformly apply adhesive to the semiconductor substrate 10, which significantly improves the yield of the semiconductor substrate 10. The first driving unit 400 is a magnetic linear motor, a lead screw motor or a telescopic motor, all of which can drive the first adhesive application moving mechanism 300 to move. In this embodiment, the first driving unit 400 is preferably a magnetic linear motor with high precision and long moving distance.

[0060] Furthermore, the adhesive application device also includes:

[0061] Translation sensor 500 is used to detect the current translation speed of the coating knife 200 and output the translation speed signal to the outside.

[0062] The drive controller 600 stores preset standard translation speed information. When the detected current translation speed deviates from the standard translation speed, the drive controller 600 changes the magnitude of the current supplied to the first drive unit 400 so that the coating knife 200 moves at the standard translation speed, further ensuring that the adhesive outlet 210 applies adhesive evenly to the semiconductor substrate 10.

[0063] Furthermore, the adhesive application device also includes:

[0064] Two first slide rails (700, 700') are arranged parallel to each other on the platform 100 and located on both sides of the semiconductor substrate 10. They are used to guide the translational coating blade 200 so that the coating blade 200 can accurately apply adhesive at the set position on the semiconductor substrate 10.

[0065] Furthermore, the first adhesive application moving mechanism 300 also includes a lifting assembly 310, which includes:

[0066] The two bases (311, 311') are respectively slidably mounted on the corresponding two first slide rails (700, 700');

[0067] Two second drive units (312, 312') are respectively mounted on two bases (311, 311'). The two ends of the coating blade 200 are directly or indirectly connected to the two second drive units (312, 312'). The two second drive units (312, 312') rotate according to a set number of turns and direction to precisely adjust the height position of the coating blade 200.

[0068] The two second drive units (312, 312') include, but are not limited to, telescopic motors, lead screw motors, or telescopic cylinders. In this embodiment, the two second drive units (312, 312') are preferably lead screw motors. The distance that the coating knife 200 moves up and down can be obtained by the product of the lead screw pitch and the number of rotations.

[0069] Furthermore, the first adhesive application moving mechanism 300 also includes:

[0070] Two guide components 320 are provided, and the two ends of the applicator 200 are directly or indirectly slidably mounted on the two guide components 320 for vertically guiding the applicator 200. The first set of guide components 320 includes two vertically spaced second slide rails 321, and the second set of guide components 320 includes two vertically spaced second slide rails 321'.

[0071] Furthermore, the adhesive application device also includes:

[0072] The first position sensor 800 is set at the starting position of the applicator 200 to detect whether the applicator 200 is in the starting position. When the applicator 200 is in the starting position, the first position sensor 800 outputs a starting position signal.

[0073] The drive controller 600 outputs a first control signal to the two second drive units (312, 312') according to the received start position signal. The second drive units (312, 312') rotate according to the received first control signal and according to a set first number of revolutions and a first direction to drive the applicator 200 to move to the glue application height position, which is the height position at which the applicator 200 applies glue.

[0074] Furthermore, the adhesive application device also includes:

[0075] The second position sensor 900 is set at the end position of the adhesive application of the applicator 200. It is used to detect whether the applicator 200 is at the end position of adhesive application. When the applicator 200 is at the end position, it outputs an end position signal.

[0076] The drive controller 600 outputs a second control signal to the two second drive units (312, 312') according to the received termination position signal. The second drive units (312, 312') rotate according to the received second control signal and according to a set second number of revolutions and a second direction to drive the applicator 200 to move to a predetermined height position. This predetermined height position is higher than the adhesive application height position to avoid the applicator 200 scratching the applied adhesive layer during the resetting process.

[0077] Furthermore, the adhesive applicator also includes a buffer 230 that limits the stroke of the applicator 200. The buffer 230 can effectively prevent the first adhesive applicator moving mechanism 300 from exceeding its stroke and colliding with or being damaged by other components.

[0078] Furthermore, the adhesive applicator also includes a baffle 240 for protecting the adhesive outlet 210 of the applicator 200. The baffle 240 is fixed to the side of the applicator 200 and is arranged parallel to the adhesive outlet 210. The bottom surface 241 of the baffle 240 is at the same height as the adhesive outlet 210. The baffle 240 can effectively prevent the applicator 200 from being damaged by collision with solids attached to the platform within its movement range.

[0079] In addition, during the application of adhesive, the height sensor 910, which is electrically connected to the drive controller 600, can measure the distance between the adhesive outlet 210 and the semiconductor substrate 10. The drive controller 600 controls the two second drive units (312, 312') to rotate simultaneously according to the set number of revolutions and direction based on the signal fed by the height sensor 910, so as to adjust the adhesive outlet 210 to the required height (such as the adhesive application height or the cleaning height).

[0080] Furthermore, the adhesive application device also includes a second adhesive application moving mechanism 300' that moves horizontally and vertically relative to the platform 100. The first and second adhesive application moving mechanisms 300 and 300' are respectively located at opposite ends of the platform 100, and their structures are identical, so they will not be described in detail here. The difference lies in the adhesive application thickness of the second adhesive application moving mechanism 300', which differs from that of the first adhesive application moving mechanism 300. For example, the adhesive application thickness of the first adhesive application moving mechanism 300 may be less than or greater than that of the second adhesive application moving mechanism 300'. In this embodiment, the adhesive application thickness of the first adhesive application moving mechanism 300 is less than that of the second adhesive application moving mechanism 300', so that the first and second adhesive application moving mechanisms 300 and 300' can alternately or separately apply adhesive to the same platform 100. This saves on the number of platforms 100, reduces costs, saves internal space in the adhesive application device, facilitates product miniaturization, shortens the adhesive application interval, and achieves a high degree of automation.

[0081] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications are also considered to be within the protection scope of this utility model.

Claims

1. A glue-applying device, characterized in that, include: Platform used to mount semiconductor substrates; A coating knife with a slit-type adhesive outlet for applying adhesive to semiconductor substrates; The first adhesive application moving mechanism is capable of translational and vertical movement relative to the platform, and the application blade is mounted on the first adhesive application moving mechanism and configured to be parallel to the platform. The first driving unit is used to drive the first coating moving mechanism to move at a uniform speed and direction according to a set speed and direction, thereby linking the coating blade to move at a uniform speed relative to the platform, so that the adhesive outlet located at the coating height position can uniformly coat the semiconductor substrate with adhesive.

2. The adhesive applicator according to claim 1, characterized in that, include: A translation sensor is used to detect the current translation speed of the coating blade and output the translation speed signal. The drive controller stores preset standard translation speed information. When the detected current translation speed deviates from the standard translation speed, the drive controller changes the magnitude of the current supplied to the first drive unit to make the coating knife translate at the standard translation speed.

3. The adhesive applicator according to claim 2, characterized in that, include: Two first slide rails are arranged parallel to each other on the platform and on both sides of the semiconductor substrate to guide the translational coating knife.

4. The adhesive applicator according to claim 3, characterized in that, The first adhesive application moving mechanism includes a lifting assembly, which includes: Two bases are respectively slidably mounted on the corresponding two first slide rails; Two second drive units are respectively disposed on the two bases, and the two ends of the coating blade are directly or indirectly connected to the two second drive units, so that the coating blade is arranged parallel to the platform.

5. The adhesive applicator according to claim 4, characterized in that, The first adhesive application moving mechanism further includes: Two guide components are provided, with the two ends of the coating knife sliding directly or indirectly on the two guide components for vertical guidance of the coating knife. Each set of guide components includes two vertically spaced second slide rails.

6. The adhesive applicator according to claim 4, characterized in that, include: The first position sensor is set at the starting position of the coating knife to detect whether the coating knife is in the starting position. When the coating knife is in the starting position, it outputs a starting position signal. The drive controller outputs a first control signal to both second drive units simultaneously based on the received start position signal. The two second drive units rotate according to the received first control signal and according to a set first number of revolutions and a first direction to drive the coating blade to move to the coating height position, which is the height position at which the coating blade applies adhesive.

7. The adhesive applicator according to claim 4 or 6, characterized in that, include: The second position sensor is used to detect whether the applicator is at the end position of the adhesive application. When the applicator is at the end position, it outputs an end position signal. The drive controller outputs a second control signal to the two second drive units according to the received termination position signal. The two second drive units rotate according to the received second control signal and according to a set second number of revolutions and a second direction to drive the coating blade to move to a predetermined height position, which is higher than the coating height position.

8. The adhesive applicator according to claim 1, characterized in that, Includes a buffer that limits the travel of the coating knife.

9. The adhesive applicator according to claim 1, characterized in that, Includes a baffle for protecting the dispensing port of the applicator, the bottom surface of the baffle being at the same height as the dispensing port.

10. The adhesive applicator according to claim 1, characterized in that, include: The second adhesive application moving mechanism is capable of translating and moving up and down relative to the platform. The first and second adhesive application moving mechanisms are symmetrically arranged at both ends of the platform to apply adhesive of different thicknesses.

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