Intermediate structure for manufacturing a package structure and a package structure with a cavity

Abstract

The application discloses an intermediate structure for manufacturing a packaging structure and a packaging structure with a cavity. The intermediate structure for manufacturing the packaging structure comprises a carrier, a cover, a plurality of first metal columns arranged on the surface of the carrier, a plurality of second metal columns arranged on the surface of the cover, and a dissolvable protective layer. Each of the plurality of first metal columns is arranged opposite to each of the plurality of second metal columns, and a cavity is defined. The dissolvable protective layer is filled in the cavity. The packaging structure with the cavity can be manufactured in a more cost-saving manner.

Description

Technical Field

[0001] This application relates to the field of electromechanical technology, and in particular to an intermediate structure for manufacturing a packaging structure and a packaging structure with a cavity. Background Technology

[0002] Cavity packaging is mainly used in microelectromechanical systems. Existing methods for manufacturing cavity packaging structures involve the removal of protective layers. However, traditional techniques for removing protective layers are quite complex and do not easily reduce manufacturing costs. Utility Model Content

[0003] Therefore, it is necessary to provide an intermediate structure for manufacturing packaging structures. The intermediate structure for manufacturing packaging structures in this application has low cost and a simple manufacturing process.

[0004] One embodiment of this application provides an intermediate structure for manufacturing a packaging structure.

[0005] An intermediate structure for manufacturing a packaging structure, comprising:

[0006] carrier;

[0007] Cover;

[0008] A plurality of first metal pillars are disposed on the surface of the carrier;

[0009] A plurality of second metal pillars are disposed on the surface of the cover; and

[0010] Soluble protective layer;

[0011] In this configuration, a plurality of the first metal pillars are each disposed opposite to a plurality of the second metal pillars, defining a cavity, and the soluble protective layer is filled in the cavity.

[0012] In some embodiments, the soluble protective layer comprises an alkali-soluble protective layer formed by coating or pouring a resin composition between the first metal column and the second metal column.

[0013] In some embodiments, the ratio of the total thickness of the soluble protective layer to the sum of the thicknesses of the first metal pillar and the second metal pillar is between 0.9 and 1.3.

[0014] In some implementations, the ratio is between 0.9 and 1.1.

[0015] In some embodiments, the thickness of the first metal column is between 0.1 mm and 1 mm.

[0016] In some embodiments, the thickness of the second metal column is between 0.1 mm and 1 mm.

[0017] In some embodiments, the carrier comprises a semiconductor element.

[0018] In some embodiments, the carrier and the cover each independently comprise a single layered structure or a composite layer composed of multiple sublayers made of different materials.

[0019] In some embodiments, the carrier and the cover each independently include a silicon substrate having an oxide layer.

[0020] In some embodiments, the oxide layer comprises a silicon dioxide layer.

[0021] One embodiment of this application provides a cavity-based encapsulation structure.

[0022] A cavity-based encapsulation structure is obtained by dissolving the soluble protective layer in the intermediate structure used to manufacture the encapsulation structure as described in any of the above embodiments.

[0023] A cavity-based encapsulation structure comprising:

[0024] carrier;

[0025] Cover;

[0026] A plurality of first metal pillars are disposed on the surface of the carrier;

[0027] A plurality of second metal pillars are disposed on the surface of the cover; and

[0028] In this configuration, a plurality of the first metal pillars are each disposed opposite to a plurality of the second metal pillars, defining cavities that can be used to fill the soluble protective layer.

[0029] This application utilizes a soluble protective layer, such as an alkali-soluble resin composition, as a protective layer, and combines it with a specially customized process to provide a simple and cost-effective intermediate structure for manufacturing packaging structures, which can be used in microelectromechanical systems (MEMS). Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings. In the following description, the same reference numerals denote the same parts.

[0032] Figure 1 , Figure 2 , Figure 3 , Figure 4 as well as Figure 5 A flowchart illustrating a method for manufacturing a cavity-based packaging structure according to an embodiment of this application;

[0033] Figure 6 This is a schematic diagram showing the positional relationship between the soluble protective layer and the first metal pillar in one embodiment of this application;

[0034] Figure 7 This is a schematic diagram showing the positional relationship between the soluble protective layer and the second metal pillar in one embodiment of this application.

[0035] Explanation of reference numerals in the attached figures

[0036] 10. Carrier; 11. First metal pillar; 16. Soluble protective layer; 20. Cap; 21. Second metal pillar; 13, 23, 213, 223. Soluble protective layer. Detailed Implementation

[0037] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0038] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0040] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0041] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0042] In this document, "optionally," "optionally," and "optional" mean that something is optional, that is, it is selected from either "with" or "without." If multiple "options" appear in a technical solution, unless otherwise specified and there are no contradictions or mutual constraints, each "option" is independent. In this application, descriptions such as "optionally contains" and "optionally includes" indicate "contains or does not contain."

[0043] In this application, unless otherwise stated, the sum of the parts of each component in the composition may be 100 parts by weight. Unless otherwise specified, the percentages (including weight percentages) in this application are based on the total weight of the composition, and "wt%" in this document means mass percentage.

[0044] In this document, unless otherwise stated, the reaction steps may be performed in the order described herein or not. For example, other steps may be included between reaction steps, and the order of reaction steps may be appropriately interchanged. This is something that those skilled in the art can determine based on conventional knowledge and experience. Preferably, the reaction methods described herein are performed sequentially.

[0045] In this application, when numerical intervals (i.e., numerical ranges) are mentioned, unless otherwise specified, the distribution of selectable numerical values ​​within the numerical interval is considered continuous, and includes the two endpoints of the numerical interval (i.e., the minimum and maximum values), as well as every numerical value between these two endpoints. Unless otherwise specified, when a numerical interval refers only to integers within that numerical interval, it includes the two endpoint integers of the numerical range, as well as every integer between the two endpoints, which is equivalent to directly listing every integer. When multiple numerical ranges are provided to describe features or characteristics, these numerical ranges can be merged. In other words, unless otherwise specified, the numerical ranges disclosed in this application should be understood to include any and all subranges included therein. The "numerical value" in the numerical interval can be any quantitative value, such as a number, percentage, ratio, etc. The term "numerical interval" can be broadly included to include percentage intervals, ratio intervals, proportion intervals, etc.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0047] One embodiment of this application provides an intermediate structure for manufacturing a packaging structure, prepared by the method described below for manufacturing a cavity-based packaging structure. This solves the problem that in conventional methods for manufacturing cavity-based packaging structures suitable for microelectromechanical systems, the protective layer removal step is complex, cumbersome, and costly. The method for manufacturing a cavity-based packaging structure will be described below with reference to the accompanying drawings.

[0048] This application provides a method for manufacturing a cavity-based packaging structure according to one embodiment. For an example, please refer to [link to relevant documentation]. Figure 1 As shown, Figures 1-5 This is a schematic flowchart illustrating a method for manufacturing a cavity-based packaging structure according to an embodiment of this application. The method for manufacturing a cavity-based packaging structure according to this application can be used to manufacture cavity-based packaging structures.

[0049] For example, please refer to Figure 1As shown, a method for manufacturing a cavity-based packaging structure includes the steps of providing a carrier 10 and a cover 20. The carrier 10 may be a semiconductor device. The cover 20 may be silicon or a metal (e.g., copper). In some embodiments, the carrier 10 and the cover 20 may be made of the same or different materials. The carrier 10 and the cover 20 may each be a single-layer structure or a composite layer of multiple sublayers made of different materials. In some embodiments, both the carrier 10 and the cover 20 are composite layers with silicon as the bottom layer and an oxide layer, such as a silicon dioxide layer, on top.

[0050] Please see Figure 2 As shown, a method for manufacturing a cavity-shaped encapsulation structure includes forming a plurality of first metal pillars 11 and a plurality of second metal pillars 21 on the surfaces of a carrier 10 and a cover 20, respectively. The materials of the plurality of first metal pillars 11 and the plurality of second metal pillars 21 may be the same or different. In this embodiment, the number of the plurality of first metal pillars 11 is the same as the number of the plurality of second metal pillars 21. In this embodiment, the first metal pillars 11 are copper pillars. In this embodiment, the second metal pillars 21 are copper pillars. In this embodiment, the plurality of first metal pillars 11 have the same thickness, and the plurality of second metal pillars 21 have the same thickness. The thickness of the plurality of first metal pillars 11 may be between 0.1 mm and 1 mm; the thickness of the plurality of second metal pillars 21 may be between 0.1 mm and 1 mm.

[0051] Please see Figure 3As shown, a method for manufacturing a cavity-based encapsulation structure includes forming a soluble protective layer between at least one of the first metal pillars 11 and the second metal pillars 21. The soluble protective layer may include an alkali-soluble protective layer; in the following embodiments, the soluble protective layer is exemplified by an alkali-soluble protective layer. In this embodiment, alkali-soluble protective layers (13, 23) are formed between both the first metal pillars 11 and the second metal pillars 21. In this embodiment, the alkali-soluble protective layer is formed by coating or pouring a resin composition between the first metal pillars 11 and the second metal pillars 21, and then surface-drying it at a high temperature (e.g., between 90°C and 155°C) for 5 minutes. The thickness (h1) of the alkali-soluble protective layer 13 may be greater than, equal to, or less than the thickness of the first metal pillar 11. The thickness (h2) of the alkali-soluble protective layer 23 may be greater than, equal to, or less than the thickness of the second metal pillar 21. In this embodiment, the thickness (h1) of the alkali-soluble protective layer 13 is slightly greater than the thickness of the first metal pillar 11; the thickness (h2) of the alkali-soluble protective layer 23 is slightly greater than the thickness of the second metal pillar 21. In this embodiment, the total thickness of the alkali-soluble protective layer is h1 + h2. In some embodiments, the ratio of the total thickness of the alkali-soluble protective layer to the sum of the thicknesses of the first and second metal pillars is between 0.9 and 1.3, and can be 0.9, 1.0, 1.1, 1.2, or 1.3. In this embodiment, the ratio is greater than 1.1 and less than or equal to 1.3.

[0052] In this embodiment, the alkali-soluble protective layer is formed from a resin composition. The resin composition includes an alkali-soluble resin and a solvent, and may include, as needed, at least one of a photoinitiator, a filler, and a thermal crosslinking agent.

[0053] In some embodiments, the resin composition includes an alkali-soluble resin, a solvent, and a photoinitiator.

[0054] In some embodiments, the resin composition includes an alkali-soluble resin, a solvent, and a filler.

[0055] In some embodiments, the resin composition includes an alkali-soluble resin, a solvent, and a thermal crosslinking agent.

[0056] In some embodiments, the resin composition includes an alkali-soluble resin, a solvent, a photoinitiator, and a filler.

[0057] In some embodiments, the resin composition includes an alkali-soluble resin, a solvent, a photoinitiator, and a thermal crosslinking agent.

[0058] In some embodiments, the resin composition includes an alkali-soluble resin, a solvent, a photoinitiator, a filler, and a thermal crosslinking agent.

[0059] In some embodiments, the coated or infused resin composition is patterned and then cured.

[0060] In some embodiments, the alkali-soluble resin includes, but is not limited to, polyimide resin, acrylic resin, polyester resin, and water-soluble resin. The alkali-soluble resin can be used alone or in combination of two or more.

[0061] In some embodiments, the polyimide resin has a structure including that shown in formula (I):

[0062] Formula (I).

[0063] In formula (I), A is an independent tetravalent organic group derived from a dianhydride containing an aliphatic or aromatic ring group; B and C are independent divalent organic groups derived from diamines; and m and n are independent integers from 1 to 10000, for example: 200, 400, 600, 800, 1000, 1500, 2000, 3000, 4000, 5000, 6000, 7000, 8000, 9000. m and n may also each fall within the range formed by any two of the aforementioned values, but are not limited thereto.

[0064] Examples of dianhydrides include, but are not limited to: pyromellitic dianhydride (PMDA), 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), 3,3',4,4'-benzophenone tetracarboxylic dianhydride (BTDA), 4,4'-oxodiphthalic anhydride (ODPA), bis(3,4-dicarboxyphenyl)methane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 1,3-bis(3,4-diphenyl)propane dianhydride, etc. Carboxyphenoxy)phthalic anhydride, 1,4-bis(3,4-dicarboxyphenoxy)phthalic anhydride (HQDEA), 4,4'-bis(3,4-dicarboxyphenoxy)biphenyl dianhydride, 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, 4,4-(hexafluoroisopropylidene)diphthalic anhydride (BPADA), ethylene glycol dihydrotriphenylamine ester (TMEG), propylene glycol bis(triphenylamine) (TMPG), 1,2-Propanediol bis(triphenyltrihydric anhydride), Butylene glycol bis(triphenyltrihydric anhydride), 2-Methyl-1,3-Propanediol bis(triphenyltrihydric anhydride), Dipropylene glycol bis(triphenyltrihydric anhydride), 2-Methyl-2,4-Pentanediol bis(triphenyltrihydric anhydride), Diethylene glycol bis(triphenyltrihydric anhydride), Tetraethylene glycol bis(triphenyltrihydric anhydride), Hexaethylene glycol bis(triphenyltrihydric anhydride), Neopentyl glycol bis(triphenyltrihydric anhydride), Hydroquinone bis(triphenyltrihydric anhydride) (TAHQ), hydroquinone bis(2-hydroxyethyl) ether bis(triphenyltrihydric anhydride), 2-phenyl-5-(2,4-trimethyl)-1,4-hydroquinone bis(triphenyltrihydric anhydride), 2,3-dicyanohydroquinone cyclobutane-1,2,3,4-tetracarboxylic anhydride, 1,2,3,4-cyclopentanetetracarboxylic anhydride (CPDA), 1,2,4,5-cyclohexanetetracarboxylic anhydride (CHDA), bicyclo[2.2.1]heptane-2,3,5,6-tetracarboxylic anhydride (BHDA), bicyclo[2.2.2]octyl- 7-En-2,3,5,6-Tetracarboxylic dianhydride (BOTDA), bicyclo[2.2.2]octane-2,3,5,6-tetracarboxylic dianhydride (BODA), 2,3,5-tricarboxy-cyclopentylacetic dianhydride, bicyclo[2.2.1]heptane-2,3,5-tricarboxy-6-acetic dianhydride, decahydro-1,4,5,8-dimethylnaphthalene-2,3,6,7-tetracarboxylic dianhydride, but-1,2,3,4-tetracarboxylic dianhydride, and 3,3',4,4'-dicyclohexyltetracarboxylic dianhydride (HBPDA). The dianhydrides can be used alone or in combination of two or more.

[0065] Examples of diamines include, but are not limited to: m-phenylenediamine, p-phenylenediamine (pPDA), diaminodiphenyl ether (ODA), p-methylenediphenylamine (MDA), m-methylenediphenylamine, diaminophenoxybenzene, diaminophenoxybenzene, bis(4-aminophenyl)sulfone (4,4'-DDS), bis(3-aminophenyl)sulfone (3,3'-DDS), bis[4-(4-aminophenoxy)phenyl]sulfone (BAPS), 9,9-bis(4-aminophenyl)fluorene, 2,2'-dimethylbenzidine (m-Tolidine), 1,3-bis(3-aminophenoxy)benzene (TPE-M), 1,3-bis(4-aminophenoxy)benzene (TPE-R), 1,4- Bis(3-aminophenoxy)benzene (143BAPB), 1,4-bis(4-aminophenoxy)benzene (TPE-Q), 2,2'-bis[4-(4-aminophenoxy)phenyl]propane (BAPP), bis(4-aminophenyl)terephthalate (BPTP), 3,3'-dihydroxybenzidine (HAB), 5,5'-methylenebis(2-aminobenzoic acid) (MBAA), 5-amino-2-(p-aminophenyl)benzoxazole (5ABO), 6-amino-2-(p-aminophenyl)benzoxazole (6ABO), 9,9-di(4-amino-3-fluorophenyl)fluorene, 2-(trifluoromethyl)benzene-1,4-diamine, 2,3-bis(trifluoromethyl) 1,4-phenylenediamine, 2,6-bis(trifluoromethyl)-1,4-phenylenediamine, 2,5-bis(trifluoromethyl)-1,4-phenylenediamine, 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP), 2,2'-bis(trifluoromethyl)benzidine (TFMB), 2,2'-bis(trifluoromethyl)-4,4'-diaminophenyl ether (6-FODA), 3,3'-bis(trifluoromethyl)benzidine, 2,2'-bis-trifluoromethoxy-biphenyl-4,4'-diamine, 3,3'-bis-trifluoromethoxy-biphenyl-4,4'-diamine, 3,3''-bis(trifluoromethyl)-[1,1':4',1''-terphenyl]-4, 4''-Diamine, 2,2''-bis(trifluoromethyl)-[1,1':4',1''-terphenyl]-4,4''-diamine, 2-fluorobenzene-1,4-diamine, 2,5-difluorobenzene-1,4-diamine, 2,4,5,6-tetrafluorobenzene-1,3-diamine, 4,4'-diaminooctafluorobiphenyl, 4,4'-diamino-2,2'-difluorobiphenyl, 2,2',5,5'-tetrafluoro-[1,1'-biphenyl]-4,4'-diamine, 4-(4-amino-2,6-difluorophenyl)-3,5-difluoroaniline, 2,2-bis(3-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, 2,2-bis(4-aminophenyl)hexafluoropropane. Diamines may also include silanediamines having the structure shown in formula (II). Diamine can be used alone or in combination of two or more types.

[0066] Equation (II).

[0067] In equation (II), q can be the same or different, each being an independent integer from 0 to 5 (e.g., 1, 2, 3, 4), and p is an integer from 0 to 20, preferably from 0 to 10.

[0068] In some embodiments, C may be one of the following groups:

[0069] , , , , or .

[0070] Where R* are each independently hydrogen or In this group, W is an oxygen or amino group, R1 is a 2-8 carbon alkyl group that is directly bonded or substituted with a hydrocarbon group as needed, R2 is a hydrogen or methyl group, and -* indicates the linking site when other groups are attached to this group.

[0071] In some embodiments, the polyimide may be a solvent-soluble polyimide that undergoes chemical or thermal ring closure via a reaction of a diamine and a tetracarboxylic dianhydride. In some embodiments, the resin comprises a solvent-soluble polyimide. The solvent may be ethyl acetate, n-butyl acetate, γ-butyrolactone, ε-caprolactone, diethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, and propylene glycol monopropyl ether acetate, methyl ethyl ketone, cyclohexanone, cyclopentanone, N-methylpyrrolidone, dimethylformamide, dimethyl sulfoxide, N,N-dimethylacetamide, or any combination of two or more of the aforementioned solvents. The solid content of the solvent-soluble polyimide solution typically accounts for 5 wt% to 70 wt% of the solvent, preferably 10 wt% to 50 wt%.

[0072] In some of these embodiments, the acrylic resin is not particularly limited and is a compound or polymer synthesized from monomers such as methyl methacrylate, ethyl methacrylate, lower alkyl methacrylates, and methacrylic acid. Examples of acrylic resins include, but are not limited to: β-hydroxyethyl methacrylate (HEMA), isobornyl acrylate (IBOA), β-carboxyethyl acrylate (β-CEA), 2-phenoxyethyl acrylate, ethylene glycol dimethacrylate; EO-modified diacrylates of bisphenol A (n is an integer from 2 to 50) (EO is ethylene oxide, and n is the mole number of ethylene oxide added); EO-modified diacrylates of bisphenol F; BLEMMER PDE-100®, PDE-200®, PDE-400®, PDE-600®, PDP-400®, PDBE-200A®, PDBE-450A®, ADE-200®, ADE-300®, ADE-400A®, ADP-400® (NOF Co., Ltd.); Aronix M-210®, M-240® and / or M-6200® (manufactured by Toa Synthetic Chemical Industry Co., Ltd.); KAYARAD HDDA®, HX-220®, R-604® and / or R-684® (Nippon Kayaku Co., Ltd.); V-260®, V-312® and / or V-335HP® (Osaka Organic Chemical Ind., Ltd.); Trimethylolpropane triacrylate (TMPTA); Methylolpropane tetraacrylate; Glyceryl trihydroxypropyl ether triacrylate; Triethoxytrimethylolpropane triacrylate; Trimethylolpropane trimethacrylate; Tri(2-hydroxyethyl)isocyanate triacrylate (THEICTA); Pentaerythritol triacrylate; Pentaerythritol hexaacrylate; Aronix M-309®, M-400®, M-405®, M-450®, M-710®, M-8030® and / or M-8060® (Toa Synthetic Chemicals Co., Ltd.); KAYARADDPHA®, TMPTA®, DPCA-20®, DPCA-30®, DPCA-60® and / or DPCA-120® (Nippon Kayaku Co., Ltd.); V-295®, V-300®, V-360®, V-GPT®, V-3PA® and / or V-400® (Osaka Yuki KayakuKogyo Co., Ltd.). The above acrylic resins can be used alone or in mixtures of two or more.

[0073] In some embodiments, the polyester resin is not particularly limited and is obtained by polycondensation of dicarboxylic acids and polyols. Examples of dicarboxylic acids include, but are not limited to: phthalic acid, isophthalic acid, terephthalic acid, 2,6-toluenedicarboxylic acid, 4-methylphthalic acid, biphenyl-4,4'-dicarboxylic acid, 1,1'-biphenyl-3,3'-dicarboxylic acid, 1,1'-biphenyl-3,4-dicarboxylic acid, 1,1'-biphenyl-3,4'-dicarboxylic acid, 1,1'-biphenyl-3,5-dicarboxylic acid, 1,2-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, 1,3-cyclobutanedicarboxylic acid, 1,2-cyclopentanedicarboxylic acid, 4-(carboxymethyl)cyclohexanecarboxylic acid, 1,3-cyclohexanedicarboxylic acid, and 1,4-cyclohexanedicarboxylic acid. The carbon structure of the polyol can be a straight-chain or branched alkyl, cyclobutyl, cyclopentyl, cyclohexyl, phenyl, or its derivatives, with carbon numbers from C1 to C10. The above-mentioned polyester resins can be used alone or in combination of two or more.

[0074] The aforementioned water-soluble resins are not particularly limited and may include, but are not limited to, polyethylene glycol, polyoxyethylene, polyvinyl alcohol, polyacrylamide, polyvinylpyrrolidone, and superabsorbent polymers (copolymers of acrylic acid / acrylamide / polyvinyl alcohol). Water-soluble resins may be used alone or in combination of two or more.

[0075] To control the rheological properties, compression ratio, and dimensional stability of the alkali-soluble protective layer, the resin composition used to form the alkali-soluble protective layer preferably includes a filler material.

[0076] Examples of filler materials include, but are not limited to, titanium oxide, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, silicon oxide, calcium oxide, magnesium oxide, zinc oxide, barium sulfate, aluminum oxide, talc, mica, hydrotalcite, gibbsite, calcium hydroxide, silicon carbide, wollastonite, potassium titanate, barium titanate, magnesium sulfate, calcium sulfate, graphite, carbon black, zirconium oxide, antimony oxide, zinc hydroxide, zinc sulfide, aluminum nitride, silicon nitride, titanium nitride, diamond powder, zirconium silicate, aluminum phosphinate, aluminum silicate, magnesium silicate, calcium silicate, clay, kaolin, calcined talc, magnesium phosphate, boron nitride, aluminum borate, borosilicate glass, amorphous silica, crystalline silica, fused silica, spherical silica, diatomaceous earth, and organobentonite. Filler materials can be used alone or in combination of two or more.

[0077] To enhance photosensitivity and film-forming properties, the resin composition preferably includes a photoinitiator. The photoinitiator is preferably present in an amount of 1 wt% to 15 wt% of the total solids in the resin composition. The resin composition may also include a thermal crosslinking agent, which is present in an amount of 0 to 15 wt% of the total solids in the resin composition, if necessary.

[0078] In some embodiments, examples of photoinitiators include, but are not limited to: oxime compounds such as oxime derivatives; ketone compounds, such as acetophenones, benzophenones, and / or thioxanones; triazine compounds; benzoin compounds; metallocene compounds; acylphosphine compounds; and combinations of any two or more of the foregoing compounds, such as three, four, or five. From the viewpoint of exposure sensitivity, acylphosphine compounds or oxime compounds are preferred as photoinitiators.

[0079] Examples of oxime compounds, such as oxime derivatives, include, but are not limited to: compounds based on O-acyl oximes, 2-(o-benzoyl oxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(o-acetyl oxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]acetone, O-ethoxycarbonyl-α-oxyamino-1-phenylprop-1-one, or combinations of any two or more of the foregoing compounds (such as three, four, or five). Examples of compounds based on O-acyl oximes include, but are not limited to: 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-but-1-one, 1-(4-phenylthiophenyl)-butane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylthiophenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylthiophenyl)-octane-1-oxime-O-acetate, 1-(4-phenylthiophenyl)-but-1-oxime-O-acetate, or any combination of two or more of the foregoing compounds. Examples of acylphosphine compounds include, but are not limited to: bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, or combinations thereof.

[0080] A thermal crosslinking agent, comprising 0-15 wt% of the total solid weight in the resin composition, preferably 2 wt%-15 wt%. The thermal crosslinking agent includes one or more of phenolic compounds, alkoxymethylamine resins, and epoxy resins. The addition of the thermal crosslinking agent prevents the polyimide molecular chains from forming a crosslinked structure during exposure and baking. The main purpose of the thermal crosslinking agent is to crosslink with the -OH groups of the polyimide backbone or adjacent to the -OH groups at the ends during post-exposure hard baking via acid catalysis and heat treatment, creating a difference in solubility between the exposed and unexposed areas, thereby rapidly forming a pattern.

[0081] To the extent that it does not affect the effectiveness of this application, the resin composition used to form the alkali-soluble protective layer may or may not contain additives, depending on the user's application requirements. Examples of additives include, but are not limited to, one or more combinations of: higher fatty acid derivatives, surfactants, inorganic particles, curing agents, curing catalysts, fillers, antioxidants, ultraviolet absorbers, anti-coagulation agents, and leveling agents. When formulating additives, it is preferable to set their total amount to less than 10 wt% of the total solid weight of the resin composition.

[0082] Please see Figure 4 As shown, a method for manufacturing a cavity-shaped encapsulation structure includes laminating a plurality of first metal pillars 11 opposite to a plurality of second metal pillars 21, such that an alkali-soluble protective layer 16 fills the cavity defined by the plurality of first metal pillars 11 and the plurality of second metal pillars 21. Lamination connects the first metal pillars 11 and the second metal pillars 21. In this embodiment, both the first metal pillars 11 and the second metal pillars 21 are copper pillars. The lamination pressure can be between 20 kgf / cm². 2 ~40kgf / cm 2 For example: 22 kgf / cm 2 24 kgf / cm 2 26 kgf / cm 2 28kgf / cm 2 30kgf / cm 2 32kgf / cm 2 34 kgf / cm 2 36kgf / cm 2 38kgf / cm 2 The lamination pressure can also be within the range defined by any two of the above values.

[0083] Please see Figure 5 As shown, the method for manufacturing a cavity-shaped encapsulation structure includes removing an alkali-soluble protective layer with an alkaline solution to obtain a cavity defined by the top surface of the bottom cover 20, the sidewalls of the first metal pillar 11, the sidewalls of the second metal pillar 21, and the top surface of the carrier 10, with a thickness of H. The alkaline solution can be an alkaline aqueous solution. In this embodiment, the alkaline solution is a 5wt%~10wt% KOH aqueous solution, for example: 6wt%, 7wt%, 8wt%, or 9wt% KOH aqueous solution.

[0084] The method for manufacturing a cavity-shaped encapsulation structure in the second embodiment of this application is largely the same as that in the aforementioned embodiments. The main difference is that in the first embodiment, alkali-soluble protective layers 13 and 23 are formed between the first metal pillar 11 and the second metal pillar 21 (e.g., Figure 3 As shown), the second embodiment forms an alkali-soluble protective layer 213 only between a plurality of first metal pillars 11 (as shown). Figure 6 As shown in the diagram, in the second embodiment, the ratio of the total thickness of the alkali-soluble protective layer to the sum of the thicknesses of the first metal pillar and the second metal pillar is between 0.9 and 1.1. In this embodiment, the thickness of the alkali-soluble protective layer 213 is the total thickness of the alkali-soluble protective layer. The thickness of the alkali-soluble protective layer 213 can be higher than, equal to, or less than the sum of the thicknesses of the first metal pillar 11 and the second metal pillar 21, but the ratio between the two is between 0.9 and 1.1. Figure 6 Following the structure shown, a plurality of first metal pillars 11 are then arranged opposite to a plurality of second metal pillars 21 and laminated together, so that an alkali-soluble protective layer 213 fills the cavity defined by the plurality of first metal pillars 11 and the plurality of second metal pillars 21, resulting in the structure shown. Figure 4 As shown. Next, the alkali-soluble protective layer 213 protruding from the first metal column 11 and the second metal column 21 is removed with an alkaline solution to obtain the desired result. Figure 5 The encapsulation structure with a cavity is shown.

[0085] The method for manufacturing a cavity-shaped encapsulation structure in the third embodiment of this application is generally the same as that in the first embodiment, the main difference being that in the first embodiment, alkali-soluble protective layers 13 and 23 are formed between the first metal pillar 11 and the second metal pillar 21 (e.g., Figure 3 As shown), the third embodiment forms an alkali-soluble protective layer 223 only between the second metal pillars 21 (as shown). Figure 7 As shown in the figure, and in the third embodiment, the ratio of the total thickness of the alkali-soluble protective layer to the sum of the thicknesses of the first metal pillar and the second metal pillar is between 0.9 and 1.1. In this embodiment, the thickness of the alkali-soluble protective layer 223 is the total thickness of the alkali-soluble protective layer. The thickness of the alkali-soluble protective layer 223 may be higher than, equal to, or less than the sum of the thicknesses of the first metal pillar 11 and the second metal pillar 21, but the ratio between the two is between 0.9 and 1.1. Figure 7 Following the structure shown, a plurality of first metal pillars 11 are then arranged opposite to a plurality of second metal pillars 21 and laminated together, so that an alkali-soluble protective layer 223 fills the cavity defined by the plurality of first metal pillars 11 and the plurality of second metal pillars 21, resulting in the structure shown. Figure 4 As shown, this yields the intermediate structure used to manufacture the packaging structure. Next, the alkali-soluble protective layer 223 is removed with an alkaline solution to obtain the structure shown below. Figure 5 The encapsulation structure with a cavity is shown.

[0086] like Figure 5 As shown, the cavity-based packaging structure includes:

[0087] Carrier 10;

[0088] Cover 20;

[0089] A plurality of first metal pillars 11 are disposed on the surface of the carrier 10;

[0090] A plurality of second metal pillars 21 are disposed on the surface of the cover 20; and

[0091] In this configuration, a plurality of first metal pillars 11 are each disposed opposite to a plurality of second metal pillars 21, defining cavities that can be used to fill the soluble protective layer. Optionally, the soluble protective layer includes an alkali-soluble protective layer 223, which can be removed by an alkaline solution.

[0092] In some embodiments, the ratio of the total thickness of the alkali-soluble protective layer to the sum of the thicknesses of the first and second metal pillars is between 0.9 and 1.3. In the first comparative example, the manufacturing method of the cavity-containing encapsulation structure is substantially the same as that of the second embodiment described above, except that the ratio of the total thickness of the alkali-soluble protective layer to the sum of the thicknesses of the first and second metal pillars in the first comparative example is less than 1.5 and greater than 1.3. In the second comparative example, the manufacturing method of the cavity-containing encapsulation structure is substantially the same as that of the second embodiment described above, except that the ratio of the total thickness of the alkali-soluble protective layer to the sum of the thicknesses of the first and second metal pillars in the second comparative example is less than 0.9 and greater than 0.7. Based on the observation results of scanning electron microscopy (SEM), the structure obtained after lamination in the first comparative example (equivalent to...) Figure 4 The structure shown has the problem of poor metal bonding, while the structure obtained after lamination in the second comparative example has the problem of poor bonding of the alkali-soluble protective layer.

[0093] In summary, this application utilizes an alkali-soluble resin composition to form an alkali-soluble protective layer that can be removed by an alkaline solution, and by combining it with a specially customized process, it can provide a simple and cost-effective manufacturing method for a cavity-type encapsulation structure.

[0094] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0095] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0096] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An intermediate structure for manufacturing a packaging structure, characterized in that, It includes: carrier; Cover; A plurality of first metal pillars are disposed on the surface of the carrier; A plurality of second metal pillars are disposed on the surface of the cover; and Soluble protective layer; In this configuration, a plurality of the first metal pillars are each disposed opposite to a plurality of the second metal pillars, defining a cavity, and the soluble protective layer is filled in the cavity.

2. The intermediate structure for manufacturing a packaging structure according to claim 1, characterized in that, The soluble protective layer comprises an alkali-soluble protective layer formed by coating or pouring a resin composition between the first metal column and the second metal column.

3. The intermediate structure for manufacturing a packaging structure according to claim 1, characterized in that, The ratio of the total thickness of the soluble protective layer to the sum of the thicknesses of the first metal pillar and the second metal pillar is between 0.9 and 1.

3.

4. The intermediate structure for manufacturing a packaging structure according to claim 3, characterized in that, The ratio is between 0.9 and 1.

1.

5. The intermediate structure for manufacturing a packaging structure according to any one of claims 1 to 4, characterized in that, The thickness of the first metal column is between 0.1 mm and 1 mm; And / or, the thickness of the second metal column is between 0.1 mm and 1 mm.

6. The intermediate structure for manufacturing a packaging structure according to any one of claims 1 to 4, characterized in that, The carrier includes semiconductor elements.

7. The intermediate structure for manufacturing a packaging structure according to any one of claims 1 to 4, characterized in that, The carrier and the cover each independently comprise a single layered structure or a composite layer composed of multiple sub-layers made of different materials.

8. The intermediate structure for manufacturing a packaging structure according to claim 7, characterized in that, The carrier and the cover each independently include a silicon substrate, and the silicon substrate has an oxide layer. Optionally, the oxide layer includes a silicon dioxide layer.

9. A cavity-based packaging structure, characterized in that, It is obtained by dissolving the soluble protective layer in the intermediate structure for manufacturing the packaging structure as described in any one of claims 1 to 8.

10. A cavity-based packaging structure, characterized in that, It includes: carrier; Cover; A plurality of first metal pillars are disposed on the surface of the carrier; A plurality of second metal pillars are disposed on the surface of the cover; and In this configuration, a plurality of the first metal pillars are each disposed opposite to a plurality of the second metal pillars, defining cavities that can be used to fill the soluble protective layer.

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