A multi-site chip testing fixture
By using the clamping device and lifting mechanism of the multi-station chip testing fixture, the compatibility and stability problems of traditional fixtures are solved, enabling precise positioning and height adjustment of chips of various specifications, thereby improving testing efficiency and accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU FEIYU MICROELECTRONICS CO LTD
- Filing Date
- 2025-06-12
- Publication Date
- 2026-06-23
AI Technical Summary
Traditional chip testing fixtures have a simple structure and cannot be adapted to chips of different specifications, resulting in cumbersome operation, time and labor consumption, and unstable clamping, which affects the accuracy and efficiency of test results.
Design a multi-station chip testing fixture, which employs a clamping device and a lifting mechanism. Driven by a bidirectional threaded rod and a cylinder, it achieves precise chip positioning and height adjustment, and is compatible with various chip specifications and testing equipment.
It achieves precise clamping and positioning of various chip specifications and flexible height adjustment, improving the versatility of the fixture and testing efficiency, while reducing operational complexity and cost.
Smart Images

Figure CN224399447U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip testing technology, specifically a multi-station chip testing fixture. Background Technology
[0002] A chip is a miniature electronic device or component, also known as an integrated circuit. It integrates many electronic components, such as transistors, resistors, and capacitors, onto a tiny semiconductor wafer through semiconductor manufacturing processes, thereby achieving specific electronic functions. A chip test fixture is a specialized tool used to fix and position a chip for performance testing. It can accurately fix the chip in the test position, ensuring that the chip's pins are precisely aligned with the probes or interfaces of the test equipment, avoiding inaccurate test results due to positional deviations.
[0003] However, existing technologies still have the following problems:
[0004] Traditional chip test fixtures often have a simple structure, only suitable for specific chip sizes. When testing chips of different sizes, frequent fixture changes are necessary, which is not only cumbersome and time-consuming but also significantly increases testing costs. Moreover, existing fixtures are insufficient in terms of chip clamping stability and accuracy, making it easy for chips to shift during testing, thus affecting the accuracy of test results, leading to test errors or even test failures. Furthermore, most traditional fixtures lack flexible height adjustment functions, making it difficult to efficiently integrate with diverse testing equipment, greatly limiting the efficiency and quality of testing work. Utility Model Content
[0005] To address the problems of a single, unstable, and unadjustable fixed structure, the purpose of this invention is to provide a multi-station chip testing fixture.
[0006] To solve the above technical problems, the present invention adopts the following technical solution: a multi-station chip testing fixture, including a base plate, a lifting mechanism provided on the upper surface of the base plate, a clamping device fixedly connected to the upper surface of the lifting mechanism, the clamping device including a support plate, a bidirectional threaded rod rotatably connected between the inner walls of the support plate, a first moving block symmetrically threaded on the outer surface of the bidirectional threaded rod, a first clamping plate and a second clamping plate fixedly connected to the upper surfaces of the two first moving blocks respectively, and a handwheel fixedly connected to one end of the bidirectional threaded rod.
[0007] Preferably, the lifting mechanism includes multiple telescopic rods, the upper ends of which are fixedly connected to the lower surface of the support plate. A sliding module is slidably connected to the upper surface of the base plate and a cylinder is fixedly installed thereon. The output end of the cylinder is fixedly connected to one side of the sliding module. Side plates are symmetrically fixedly connected to the lower surface of the support plate. Lifting grooves are provided on the outer surfaces of the two side plates. The two ends of the sliding module are slidably connected to the lifting grooves.
[0008] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0009] This invention utilizes a combination of a clamping device and a lifting device. The support plate, the first clamping plate, and the second clamping plate each have multiple grooves of different specifications, allowing for precise adaptation to chips of various sizes and shapes. A handwheel drives a bidirectional threaded rod, causing the first and second clamping plates to move relative to each other. This, combined with the grooves, enables precise clamping and positioning of the chip. Furthermore, a cylinder pushes a sliding module, which, along with the inclined lifting grooves on the side plate and the telescopic rod, allows for flexible vertical lifting of the clamping device. This allows for rapid adaptation to the chip height requirements of different testing equipment, enhancing the versatility of the fixture. Attached Figure Description
[0010] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0011] Figure 1 This is a schematic diagram of the structure of this utility model.
[0012] Figure 2 This is a schematic diagram of the clamping device of this utility model.
[0013] Figure 3 This is a schematic diagram of the lifting mechanism of this utility model.
[0014] In the diagram: 10. Bidirectional threaded rod; 11. Base plate; 12. Lifting mechanism; 13. Clamping device; 14. Support plate; 15. First slide groove; 16. Second slide groove; 17. First moving block; 18. First clamping plate; 19. Second clamping plate; 20. Guide rod; 21. Second moving block; 22. Handwheel; 23. Telescopic rod; 24. Side plate; 25. Lifting groove; 26. Sliding module; 27. Cylinder; 28. Slide rail; 29. Slider. Detailed Implementation
[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0016] Example: Figure 1-3 As shown, this utility model provides a multi-station chip testing fixture, including a base plate 11. The upper surface of the base plate 11 is provided with a lifting mechanism 12. The lifting mechanism 12 is used to adjust the position of the clamping device 13 in the vertical direction to adapt to the chip height requirements of different testing equipment. The clamping device 13 is fixedly connected to its upper surface. The clamping device 13 includes a support plate 14. A bidirectional threaded rod 10 is rotatably connected between the inner walls of the support plate 14. The outer surface of the bidirectional threaded rod 10 is symmetrically threaded with a first moving block 17. The upper surfaces of the two first moving blocks 17 are respectively fixedly connected with a first clamping plate 18 and a second clamping plate 19. A handwheel 22 is fixedly connected to one end of the bidirectional threaded rod 10. Rotating the handwheel 22 can drive the bidirectional threaded rod 10 to rotate, thereby causing the first moving block 17 to drive the first clamping plate 18 and the second clamping plate 19 to move relative to or in opposite directions, thereby realizing the clamping and releasing of the chip.
[0017] Multiple grooves of different specifications are formed on both sides of the upper surface of the support plate 14 and both sides of the first clamping plate 18 and the second clamping plate 19. These grooves can be adapted to chips of different specifications. Through the movement of the first clamping plate 18 and the second clamping plate 19, precise positioning and preliminary fixation of multiple workstations can be achieved. Two second sliding grooves 16 and a first sliding groove 15 are formed on the upper surface of the support plate 14. The bidirectional threaded rod 10 is located inside the first sliding groove 15. Guide rods 20 are fixedly connected inside the two second sliding grooves 16. Second moving blocks 21 are symmetrically fixedly connected to the lower surfaces of the first clamping plate 18 and the second clamping plate 19. The second sliding grooves 16 pass through the second moving blocks 21. 1. It slides and fits against the inner wall of the second moving block 21. The first sliding groove 15 provides space for the bidirectional threaded rod 10 to rotate and move axially. The second sliding groove 16 cooperates with the guide rod 20 to guide and stabilize the movement of the first clamping plate 18 and the second clamping plate 19. The groove on one side of the first clamping plate 18 corresponds to the groove on one side of the upper surface of the support plate 14. The groove on one side of the second clamping plate 19 corresponds to the groove on the other side of the upper surface of the support plate 14. The groove on the other side of the first clamping plate 18 corresponds to the groove on the other side of the second clamping plate 19. Through the cooperation of the corresponding grooves, the chip can be clamped more precisely to ensure that the chip is stable in position during the test.
[0018] The lifting mechanism 12 includes multiple telescopic rods 23. Multiple mounting slots are provided on the outer surface of the base plate 11. The multiple mounting slots and multiple telescopic rods 23 are distributed in a rectangular array. This layout is conducive to the telescopic rods 23 supporting the support plate 14 stably and evenly, enhancing the stability of the entire clamping structure. The multiple telescopic rods 23 serve as auxiliary support and stabilize the clamping device 13. Their upper ends are fixedly connected to the lower surface of the support plate 14. A sliding module 26 is slidably connected to the upper surface of the base plate 11 and a cylinder 27 is fixedly installed. The output end of the cylinder 27 is fixedly connected to one side of the sliding module 26 for driving the sliding module 26 to move.
[0019] Side plates 24 are symmetrically fixedly connected to the lower surface of the support plate 14. Each side plate 24 has a lifting groove 25 on its outer surface. The two ends of the sliding module 26 are slidably connected to the lifting groove 25. Both lifting grooves 25 are inclined. Connecting pins are fixedly connected to both ends of the sliding module 26. The two connecting pins pass through the two lifting grooves 25 and slide against the outer surface of the lifting grooves 25. When the cylinder 27 pushes the sliding module 26, the connecting pins slide within the inclined lifting grooves 25, thereby raising and lowering the support plate 14. Slide rails 28 are symmetrically fixedly installed on the upper surface of the base plate 11. Sliding sliders 29 are slidably fitted onto the outer surface of each slide rail 28. The upper surfaces of the two sliding sliders 29 are slidably connected to the lower surface of the sliding module 26. The cooperation between the slide rails 28 and the sliding sliders 29 ensures the smooth movement of the sliding module 26, making the height adjustment process more stable.
[0020] Working principle: When a chip needs to be clamped, the handwheel 22 is rotated, which drives the bidirectional threaded rod 10 located in the first slide groove 15 to rotate. The outer surface of the bidirectional threaded rod 10 is symmetrically threaded onto the first moving block 17, and the upper surface of the first moving block 17 is fixedly connected to the first clamping plate 18 and the second clamping plate 19 respectively. When the bidirectional threaded rod 10 rotates, the first moving block 17 will move relative to or opposite to the axis of the bidirectional threaded rod 10, thereby driving the first clamping plate 18 and the second clamping plate 19 to move closer or further away. During this process, the guide rod 20 fixedly connected in the second slide groove 16 passes through the second moving block 21 and slides against the inner wall of the second moving block 21, guiding the movement of the first clamping plate 18 and the second clamping plate 19 and ensuring their stability and accuracy. The first clamping plate 18 and the second clamping plate 19, through their cooperation with the grooves on both sides of the upper surface of the support plate 14, can accurately clamp chips of different specifications.
[0021] When the height of the clamp needs to be adjusted to fit the testing equipment, cylinder 27 is activated. The output end of cylinder 27 pushes the sliding module 26. Because the two ends of the sliding module 26 are fixed with connecting pins, and the connecting pins pass through the inclined lifting groove 25 on the outer surface of the side plate 24 and slide against it, the connecting pins will slide within the lifting groove 25 when the sliding module 26 moves. This sliding will cause the support plate 14 to rise or fall, thereby adjusting the height of the clamping device 13. The telescopic rod 23 plays an auxiliary support role in this process, ensuring that the support plate 14 rises and falls smoothly. At the same time, the slide rails 28 symmetrically installed on the upper surface of the base plate 11 and the sliders 29 slidably sleeved on the outer surface of the slide rails 28 are slidably connected to the lower surface of the sliding module 26, further ensuring the smoothness of the movement of the sliding module 26 and making the height adjustment process more stable.
[0022] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.
Claims
1. A multi-station chip testing fixture, comprising a base plate (11), characterized in that: The upper surface of the base plate (11) is provided with a lifting mechanism (12), and a clamping device (13) is fixedly connected to the upper surface of the lifting mechanism (12); The clamping device (13) includes a support plate (14), and a bidirectional threaded rod (10) is rotatably connected between the inner walls of the support plate (14). The outer surface of the bidirectional threaded rod (10) is symmetrically threaded with a first moving block (17). The upper surfaces of the two first moving blocks (17) are respectively fixedly connected with a first clamping plate (18) and a second clamping plate (19). One end of the bidirectional threaded rod (10) is fixedly connected with a handwheel (22).
2. The multi-station chip testing fixture as described in claim 1, characterized in that, The lifting mechanism (12) includes multiple telescopic rods (23), the upper ends of the multiple telescopic rods (23) are fixedly connected to the lower surface of the support plate (14), the upper surface of the base plate (11) is slidably connected to a sliding module (26) and a cylinder (27) is fixedly installed thereon, the output end of the cylinder (27) is fixedly connected to one side of the sliding module (26), the lower surface of the support plate (14) is symmetrically fixedly connected to side plates (24), the outer surfaces of the two side plates (24) are provided with lifting grooves (25), and the two ends of the sliding module (26) are slidably connected to the lifting grooves (25).
3. The multi-station chip testing fixture as described in claim 1, characterized in that, The upper surface of the support plate (14) and both sides of the first clamping plate (18) and the second clamping plate (19) are provided with multiple grooves of different specifications.
4. The multi-station chip testing fixture as described in claim 1, characterized in that, The upper surface of the support plate (14) has two second sliding grooves (16) and a first sliding groove (15). The bidirectional threaded rod (10) is located inside the first sliding groove (15). Guide rods (20) are fixedly connected inside the two second sliding grooves (16). The lower surfaces of the first clamping plate (18) and the second clamping plate (19) are symmetrically fixedly connected with second moving blocks (21). The second sliding groove (16) passes through the second moving block (21) and slides against the inner wall of the second moving block (21).
5. A multi-station chip testing fixture as described in claim 2, characterized in that, Both of the lifting slots (25) are inclined, and both ends of the sliding module (26) are fixedly connected with connecting pins. The two connecting pins pass through the two lifting slots (25) respectively and slide against the outer surface of the lifting slots (25).
6. A multi-station chip testing fixture as described in claim 2, characterized in that, The upper surface of the base plate (11) is symmetrically fixed with slide rails (28), and the outer surfaces of the two slide rails (28) are slidably sleeved with sliders (29). The upper surfaces of the two sliders (29) are slidably connected to the lower surface of the sliding module (26).
7. A multi-station chip testing fixture as described in claim 3, characterized in that, The groove on one side of the first clamping plate (18) corresponds to the groove on one side of the upper surface of the support plate (14), the groove on one side of the second clamping plate (19) corresponds to the groove on the other side of the upper surface of the support plate (14), and the groove on the other side of the first clamping plate (18) corresponds to the groove on the other side of the second clamping plate (19).
8. A multi-station chip testing fixture as described in claim 1, characterized in that, The outer surface of the base plate (11) is provided with multiple mounting slots, and the multiple mounting slots and multiple telescopic rods (23) are distributed in a rectangular array.