A low-cost stainless steel semiconductor heating disc structure

Abstract

The utility model relates to the technical field of semiconductor manufacturing equipment, concretely is a kind of low-cost stainless steel semiconductor heating disc structure, including cover, pedestal, electric heater and shaft column, the side of pedestal and cover connection is provided with annular groove, cover is embedded in annular groove, and cover and pedestal are connected by the welding bead of outer circumferential annular and the electron beam welding connection of several welding spots inside array.It is adopted that the low-cost stainless steel semiconductor heating disc structure uses electron beam welding, avoids the damage of high temperature to electric heater insulating medium, improves heating disc reliability and service life;At the same time, electron beam welding cost is lower, can shorten production cycle, improve production efficiency;Its unique welding structure, such as annular groove cooperation outer circumferential annular welding bead and inside array welding spot, strengthens the connection strength and overall stability;Reasonable welding spot distribution ensures heating uniformity, and the cylindrical protruding design at welding spot improves welding precision.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and specifically to a low-cost stainless steel semiconductor heating plate structure. Background Technology

[0002] In semiconductor manufacturing, some processes need to be carried out in high-temperature and high-cleanliness environments. Stainless steel heating plates are widely used in such processes due to their excellent performance, providing a stable heating environment for semiconductor components such as wafers.

[0003] Currently, existing semiconductor stainless steel heating plates mainly consist of four modules: a cover plate, a base, an electric heater, and a shaft column. The metal electric heater is embedded in the cover plate, and the base and cover plate are welded together as a single unit using vacuum brazing. However, vacuum brazing has several drawbacks.

[0004] On the one hand, due to the use of nickel-based solder, which has a high melting point, the process temperature for vacuum brazing reaches around 1000℃. On the other hand, the insulating medium of the electric heater embedded in the heating plate (usually magnesium oxide powder) is quite sensitive to high temperatures. If it is exposed to such a high-temperature environment for a long time, the thermal stability of the insulating medium will be affected, and insulation withstand voltage failure will easily occur, which in turn will affect the normal use of the heating plate and the quality of semiconductor manufacturing.

[0005] On the other hand, vacuum brazing is more expensive and has a longer production cycle. The high cost increases the production costs for semiconductor manufacturers, while the longer production cycle affects production pace, reduces efficiency, and hinders companies from gaining a competitive edge in the market.

[0006] Therefore, in order to solve the problems existing in the current technology, it is necessary to develop a new stainless steel heating plate structure that adopts a non-brazing method, so as to reduce costs and improve production efficiency while ensuring the performance of the heating plate. Utility Model Content

[0007] To address the aforementioned issues, this invention provides a low-cost stainless steel semiconductor heating plate structure. This structure employs electron beam welding, which avoids damage to the insulating medium of the electric heater caused by high temperatures, thereby improving the reliability and service life of the heating plate. Simultaneously, electron beam welding is more cost-effective, shortening the production cycle and increasing production efficiency. Its unique welding structure, such as the annular groove combined with the outer annular weld bead and the internal array of weld points, enhances the connection strength and overall stability. A reasonable distribution of weld points ensures uniform heating, while the cylindrical protrusion design at the weld points improves welding precision.

[0008] The technical solution of this utility model is as follows:

[0009] A low-cost stainless steel semiconductor heating plate structure includes a cover plate, a base, an electric heater, and a shaft column. The base has an annular groove on one side where it connects to the cover plate. The cover plate is embedded in the annular groove. The cover plate and the base are connected by electron beam welding through an outer annular weld bead and an internal array of several solder points.

[0010] Furthermore, at least one ring of solder points is provided that are symmetrically distributed radially along the disk surface.

[0011] Furthermore, the number of solder joints shall not be less than 10.

[0012] Specifically, there are three rings of solder joints arranged from the center outwards.

[0013] Preferably, there are 8 solder joints evenly distributed in each ring.

[0014] Each weld point has a cylindrical protrusion on its base, and a through hole that matches the cylindrical protrusion is provided on the cover plate.

[0015] The beneficial effects of this utility model are as follows:

[0016] 1. This utility model discloses a low-cost stainless steel semiconductor heating plate structure. This low-cost stainless steel semiconductor heating plate structure reduces the welding temperature, protects the insulating medium of the electric heater, and uses electron beam welding to connect the cover plate and the base, avoiding damage to the insulating medium by high temperature, and improving the reliability and service life of the heating plate.

[0017] 2. This utility model discloses a low-cost stainless steel semiconductor heating plate structure. This low-cost stainless steel semiconductor heating plate structure reduces costs by using electron beam welding, which is lower in cost than vacuum brazing. This helps to reduce production costs and enhance the company's competitive advantage in the market.

[0018] 3. This utility model discloses a low-cost stainless steel semiconductor heating plate structure. This low-cost stainless steel semiconductor heating plate structure improves production efficiency. It adopts electron beam welding, which can shorten the production cycle, improve production efficiency, and meet the needs of semiconductor manufacturing enterprises to respond quickly to market demands.

[0019] 4. The present invention discloses a low-cost stainless steel semiconductor heating plate structure. This low-cost stainless steel semiconductor heating plate structure optimizes the welding structure and improves the connection strength. An annular groove is provided on the side where the base and the cover plate are connected. The cover plate is embedded in the annular groove and is connected by electron beam welding through an outer annular weld bead and an internal array of several weld points. This structure enhances the connection strength between the cover plate and the base and improves the overall stability of the heating plate.

[0020] 5. The present invention discloses a low-cost stainless steel semiconductor heating plate structure. The solder joints of the low-cost stainless steel semiconductor heating plate structure are reasonably distributed to ensure uniform heating, which helps to ensure the uniformity of the heating plate during the heating process and improve the quality of semiconductor manufacturing. Attached Figure Description

[0021] The advantages and solutions of this application will become clear to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this invention.

[0022] In the attached diagram:

[0023] Figure 1 This is a three-dimensional structural diagram of a low-cost stainless steel semiconductor heating plate structure according to an embodiment of the present invention.

[0024] Figure 2 This is a cross-sectional schematic diagram of a low-cost stainless steel semiconductor heating plate structure according to an embodiment of the present invention.

[0025] Figure 3 This is a schematic diagram of the solder joints of a low-cost stainless steel semiconductor heating plate structure according to an embodiment of the present invention.

[0026] The components represented by the various reference numerals in the diagram are:

[0027] This utility model includes: 1. cover plate, 11. weld point, 12. weld bead, 2. base, 21. annular groove, 22. cylindrical protrusion, 3. electric heater, and 4. shaft column. Detailed Implementation

[0028] The low-cost stainless steel semiconductor heating plate structure includes a cover plate 1, a base 2, an electric heater 3, and a shaft column 4. This part of the structure is prior art and is not the core innovation of this patent. This application will not elaborate on this specific structure.

[0029] like Figure 1 and Figure 2 As shown, an annular groove 201 is provided on the side where the base 2 is connected to the cover plate 1, and the cover plate 1 is embedded in the annular groove 201; in order to optimize welding efficiency and quality, the electron beam welding direction is adjusted from the circumferential direction to the height Z direction, that is, electron beam welding is performed between the cover plate 1 and the base 2 through the outer annular weld bead 12.

[0030] To avoid heat transfer and structural strength problems caused by insufficient outer welding area, a weld point 11 is designed at a specific position between the base 2 and the cover plate 1.

[0031] In this embodiment, as Figure 3As shown, three rings of solder points 11 are arranged outward from the center. The two outer rings have eight solder points 11 evenly distributed, and the inner ring has three solder points 11. The total number of solder points 11 is 19, which are completely symmetrically distributed. The position of the solder points 11 should be avoided to be directly above the electric heating wire.

[0032] Each weld point 11 has a cylindrical protrusion 22 on its base 2, and a through hole on the cover plate 1 that matches the cylindrical protrusion 22, in order to increase the welding area, improve the structural strength and reduce deformation.

[0033] The electric heater 3 is designed on the side of the base 2, i.e. the wafer side. Since the base 2 and the cover plate 1 are not welded on the front, there is an air gap. The air in this gap can prevent the heat generated by the electric heater 3 from being transferred to the cover plate 1 side, so that more heat is transferred to the wafer side, improving heat transfer efficiency and reducing power loss.

[0034] The welding sequence is as follows: first, weld the outer circumference weld 12, then gradually reduce the weld size along the inner diameter until all additional weld points 11 are welded. During the welding process, the welding equipment probe welds in the height Z direction to ensure post-weld sealing. The thickness of the cover plate 1 is generally >2mm, depending on the post-weld sealing requirements and the electron beam welding depth definition.

[0035] The stainless steel semiconductor heating plate structure of this embodiment achieves performance comparable to vacuum brazing by using electron beam welding through optimized weld bead positions, increased weld points, and adjusted electric heater positions. At the same time, it significantly reduces costs, greatly improves production efficiency, and ensures post-weld sealing. It is suitable for processes requiring high temperature and high cleanliness in semiconductor manufacturing.

Claims

1. A low-cost stainless steel semiconductor heating plate structure, comprising a cover plate (1), a base (2), an electric heater (3), and a shaft column (4), characterized in that, The base (2) is provided with an annular groove (201) on the side where it is connected to the cover plate (1). The cover plate (1) is embedded in the annular groove (201). The cover plate (1) and the base (2) are connected by electron beam welding through an outer annular weld bead (12) and several weld points (11) in an internal array.

2. The low-cost stainless steel semiconductor heating plate structure according to claim 1, characterized in that, At least one ring of solder points is provided that are symmetrically distributed radially along the disk surface (11).

3. The low-cost stainless steel semiconductor heating plate structure according to claim 2, characterized in that, The number of the solder joints (11) shall not be less than 10.

4. The low-cost stainless steel semiconductor heating plate structure according to claim 2, characterized in that, There are three rings of solder joints (11) arranged from the center outwards.

5. The low-cost stainless steel semiconductor heating plate structure according to claim 2, characterized in that, There are 8 solder joints evenly distributed in each ring (11).

6. The low-cost stainless steel semiconductor heating plate structure according to claim 1, characterized in that, Each weld point (11) has a cylindrical protrusion (22) on its base (2) and a through hole that matches the cylindrical protrusion (22) on the cover plate (1).

Images