A controller and mobile platform

Abstract

The utility model discloses a kind of controller and mobile platform, controller includes shell, control circuit board, radiator and fan, wherein, control circuit board is set in shell, the side of control circuit board has chip;Radiator is set in shell, and is located the side of control circuit board close to chip, radiator is equipped with corresponding vent with chip;Fan is set in shell, and is located the side of radiator away from control circuit board, for providing the heat dissipation airflow of flow to radiator and vent.Radiator can cover control circuit board in wide range, fan can be heat dissipation for control circuit board by radiator in wide range;Meanwhile, radiator is directly heat dissipated to chip by the setting of vent by airflow through vent.It can be seen from the above, radiator uses the structure form described above, fan can not only be heat dissipated for control circuit board in wide range by radiator, but also can be preferably heat dissipated to the partial area of control circuit board.

Description

Technical Field

[0001] This utility model relates to the field of controller technology, and in particular to a controller and a mobile platform. Background Technology

[0002] A controller, such as a domain controller, is a critical network server used to manage and control computers, users, and resources within a domain. In the automotive field, domain controllers are responsible for managing and controlling various functions, including but not limited to powertrain, chassis control, and information processing in smart cockpits.

[0003] In related technologies, the controller includes a housing and a circuit board, with the circuit board located inside the housing. To better dissipate heat from the chips on the circuit board, the housing is typically made of metal, and its inner side has protrusions for contacting and dissipating heat from the chips on the circuit board. However, machining the metal housing using CNC machining is extremely costly and not conducive to mass production. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a controller and a mobile platform that can provide better heat dissipation for the control circuit board.

[0005] In a first aspect, embodiments of this application provide a controller, including:

[0006] shell;

[0007] A control circuit board is disposed inside the housing, and a chip is provided on one side of the control circuit board;

[0008] A heat sink is disposed inside the housing and located on the side of the control circuit board close to the chip. The heat sink has ventilation openings corresponding to the chip.

[0009] A fan, disposed in the housing and located on the side of the heat sink away from the control circuit board, is used to provide cooling airflow to the heat sink and the vent.

[0010] According to some embodiments of the present invention, the radiator is provided with one or more ventilation openings. If the radiator is provided with multiple ventilation openings, the multiple ventilation openings are arranged corresponding to multiple positions on the control circuit board.

[0011] According to some embodiments of the present invention, the outer shell is made of plastic.

[0012] According to some embodiments of the present invention, the heat sink includes a heat-conducting plate and heat dissipation fins. The heat dissipation fins are disposed on one side of the heat-conducting plate, and the side of the heat-conducting plate away from the heat dissipation fins is used to be attached to the control circuit board. The vent is disposed on the heat-conducting plate.

[0013] According to some embodiments of the present invention, the outer casing includes a first housing and a second housing connected to each other, the control circuit board is connected to the inner side of the first housing, and the second housing, the fan and the heat sink are connected.

[0014] According to some embodiments of the present invention, the first housing includes a base plate and a surrounding edge, the surrounding edge being connected to the perimeter of the base plate, a reinforcing rib being provided between the base plate and the surrounding edge, and the reinforcing rib having a support position for supporting the control circuit board; and / or,

[0015] The base plate is provided with a positioning post, and the control circuit board is provided with a positioning hole, with the positioning post passing through the positioning hole.

[0016] According to some embodiments of the present invention, the second housing is provided with a fan slot, and the fan is secured in the fan slot.

[0017] According to some embodiments of the present invention, the periphery of the first housing is provided with a plurality of fixing holes, and the distance between any two fixing holes along the long side and the short side of the controller is set to a multiple of a preset distance.

[0018] According to some embodiments of the present invention, the controller is configured as a domain controller, and the second housing is provided with a debugging port.

[0019] Secondly, embodiments of this application provide a mobile platform, including the controller housing described above;

[0020] As can be seen from the above technical solutions, the embodiments of this application have the following advantages: the control circuit board and the heat sink are attached together, and the control circuit board transfers heat to the heat sink. At the same time, part of the airflow generated by the fan flows to the heat sink, thereby dissipating heat from the heat sink, which in turn enables the heat sink to dissipate heat from the control circuit board. Meanwhile, another part of the airflow generated by the fan flows to the vent, and this part of the airflow directly passes through the chip on the control circuit board, thereby quickly dissipating heat from the chip on the circuit board.

[0021] Understandably, the heatsink can cover a large area of ​​the control circuit board, allowing the fan to dissipate heat from the board over a wide area. Simultaneously, the heatsink's ventilation openings allow airflow to directly cool the chips. Therefore, with this structural design, the heatsink not only provides extensive cooling for the control circuit board but also offers optimal heat dissipation. Attached Figure Description

[0022] Figure 1 This is an exploded view of the controller according to an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the structure of the heat sink according to an embodiment of the present utility model;

[0024] Figure 3 This is a schematic diagram of the structure of the second housing according to an embodiment of the present utility model;

[0025] Figure 4 This is a schematic diagram of the first housing structure at one angle according to an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the first housing from another angle according to an embodiment of the present invention.

[0027] The meanings of the reference numerals in the attached figures are as follows:

[0028] 100. Outer shell; 110. First shell; 111. Base plate; 112. Edge; 113. Reinforcing rib; 114. Support position; 115. Lug; 1151. Fixing hole; 116. Positioning post; 117. Guide part; 120. Second shell; 121. Debugging port; 122. Fan slot; 123. Plug-in part; 200. Control circuit board; 300. Heat sink; 310. Heat conduction plate; 311. Vent; 312. Positioning hole; 320. Heat dissipation fins; 400. Fan; 500. Thermal adhesive; 600. Locking bolt. Detailed Implementation

[0029] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0030] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, up, down, etc., indicating the directional or positional relationship, are based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0032] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0033] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0034] The present invention will now be described in further detail with reference to the accompanying drawings.

[0035] Please see Figures 1 to 2 A controller provided in this embodiment of the present invention includes a housing 100, a control circuit board 200, a heat sink 300, and a fan 400. The control circuit board 200 is disposed inside the housing 100 and has a chip on one side. The heat sink 300 is disposed inside the housing 100 and located on the side of the control circuit board 200 closer to the chip. The heat sink 300 has a vent 311 corresponding to the chip. The fan 400 is disposed inside the housing 100 and located on the side of the heat sink 300 away from the control circuit board 200, and is used to provide cooling airflow to the heat sink 300 and the vent 311.

[0036] Furthermore, the number of ventilation openings 311 is unlimited and can be set according to actual needs. For example, if chips are set in multiple locations on the control circuit board 200, the heat sink 300 can be set in multiple locations accordingly, with each ventilation opening 311 corresponding to a chip in a specific location. Of course, if there are also locations on the control circuit board 200 that generate a lot of heat, ventilation openings 311 can be set in the corresponding locations on the heat sink 300 to correspond to those locations.

[0037] In practical applications, the control circuit board 200 is attached to the heat sink 300, and the control circuit board 200 transfers heat to the heat sink 300. Simultaneously, a portion of the airflow generated by the fan 400 flows to the heat sink 300, thereby dissipating heat from the heat sink 300, which in turn allows the heat sink 300 to dissipate heat from the control circuit board 200. Meanwhile, another portion of the airflow generated by the fan 400 flows to the vent 311, and this portion of airflow directly passes over the chips on the control circuit board 200, thus quickly dissipating heat from the chips on the circuit board.

[0038] It is understandable that the heat sink 300 can cover a large area of ​​the control circuit board 200, and the fan 400 can dissipate heat from the control circuit board 200 over a large area through the heat sink 300; at the same time, the airflow through the ventilation openings 311 allows airflow to directly dissipate heat from the chip. As can be seen from the above, with the aforementioned structural form, the fan 400 can not only dissipate heat from the control circuit board 200 over a large area through the heat sink 300, but also achieve better heat dissipation for the control circuit board 200.

[0039] In some embodiments, please refer to Figures 1 to 2 In order to enable the heat sink 300 to better dissipate heat from a portion of the control circuit board 200, thermally conductive adhesive 500 is provided between the portion of the control circuit board 200 and the heat sink 300. In this way, the components in that portion of the control circuit board 200 can transfer heat to the heat sink 300 through the thermally conductive adhesive 500, thereby enabling the heat sink 300 to better dissipate heat from the control circuit board 200.

[0040] In some embodiments, please refer to Figures 1 to 2 The housing 100 is made of plastic. It is understood that, instead of the common approach, using a metal housing 100 can better dissipate heat from the control circuit board 200. This application employs the aforementioned heat dissipation system, which can better dissipate heat from the control circuit board 200. Therefore, the housing 100 of this application can be made of plastic. Plastic parts are lighter, thereby reducing the weight and processing costs of the controller, and improving the controller's versatility and convenience.

[0041] In some embodiments, the controller is configured as a domain controller, but is not limited to a domain controller; other controllers may also be used, such as a boundary controller, a wireless controller, or an industrial controller.

[0042] In some embodiments, please refer to Figures 1 to 2 The heat sink 300 includes a heat-conducting plate 310 and heat dissipation fins 320. The heat dissipation fins 320 are arranged side-by-side on one side of the heat-conducting plate 310. The side of the heat-conducting plate 310 away from the heat dissipation fins 320 is designed to be in contact with the control circuit board 200. A vent 311 is provided on the heat-conducting plate 310. It is understood that the heat-conducting plate 310 and the control circuit board 200 are in contact with each other, providing a large contact area, thus allowing the control circuit board 200 to better transfer heat to the heat sink 300. Simultaneously, the arrangement of the heat dissipation fins 320 allows the airflow generated by the fan 400 to have a large contact area with the heat dissipation fins 320, thus allowing the airflow to better dissipate heat from the heat sink 300, and consequently, to better dissipate heat from the control circuit board 200.

[0043] In some embodiments, please refer to Figures 1 to 2 The outer casing 100 includes a first casing 110 and a second casing 120 connected to each other. A control circuit board 200 is connected to the inner side of the first casing 110, a cooling fan 400 is connected to the inner side of the second casing 120, and a heat sink 300 is connected to the cooling fan 400. Understandably, during controller assembly, the operator can first install the control circuit board 200 onto the inner side of the first casing 110, and then install the cooling fan 400 and heat sink 300 onto the second casing 120. The first casing 110 and the second casing 120 are then connected, thus assembling the required controller. Therefore, controller assembly is relatively convenient. Furthermore, when the controller needs repair, separating the first casing 110 and the second casing 120 separates the control circuit board 200 from the heat sink 300, allowing for convenient repair of the control circuit board 200.

[0044] Furthermore, to connect the second housing 120, the cooling fan 400, and the radiator 300, corresponding locking holes are provided on each of these components. Locking bolts 600 are inserted into each locking hole to securely install the second housing 120, the cooling fan 400, and the radiator 300 together. This arrangement facilitates installation between the second housing 120, the cooling fan 400, and the radiator 300, ensuring that the air inlet of the second housing 120, the cooling fan 400, and the radiator 300 are aligned, thus guaranteeing that the cooling fan 400 can effectively dissipate heat from the radiator 300.

[0045] In some embodiments, please refer to Figures 1 to 3 The second housing 120 has an adjustment port 121 on its top and / or side. The adjustment port 121 can be used for daily debugging of the control circuit board 200, making the controller application more convenient.

[0046] In some embodiments, please refer to Figures 1 to 4 The first housing 110 includes a base plate 111 and a surrounding edge 112. The surrounding edge 112 is connected to the perimeter of the base plate 111. Reinforcing ribs 113 are provided between the base plate 111 and the surrounding edge 112, and each reinforcing rib 113 has a support position 114 for supporting the control circuit board 200. It is understood that by providing the reinforcing ribs 113, the connection strength between the base plate 111 and the surrounding edge 112 is increased, thereby increasing the strength of the first housing 110. At the same time, the reinforcing ribs 113 support the control circuit board 200, thereby maintaining a certain distance between the control circuit board 200 and the base plate 111, thus providing better heat dissipation for the control circuit board 200.

[0047] To ensure precise mounting of the control circuit board 200 onto the first housing 110, in some embodiments, the base plate 111 is provided with positioning posts 116, and the control circuit board 200 is provided with positioning holes 312 (see reference). Figure 2 Therefore, when the control circuit board 200 is mounted on the first housing 110, the positioning post 116 passes through the positioning hole 312, thereby accurately positioning the control circuit board 200 within the first housing 110. With this configuration, when the first housing 110 is connected to the second housing 120, the heat sink 300 is aligned with the control circuit board 200, allowing the heat sink 300 to effectively dissipate heat from the control circuit board 200.

[0048] Furthermore, the second housing 120 is provided with a fan slot 122, in which the fan 400 is secured. Specifically, when the second housing 100, the cooling fan 400, and the radiator 300 are installed together, the operator can easily assemble the cooling fan 400 with the second housing 120, and then align the radiator 300 with the cooling fan 400. This allows the locking bolts 600 to be easily inserted sequentially through the connecting holes on the second housing 100, the cooling fan 400, and the radiator 300, thereby securing the second housing 100, the cooling fan 400, and the radiator 300 together.

[0049] In some embodiments, please refer to Figure 1 , Figure 4 and Figure 5The first housing 110 has multiple fixing holes 1151 around its perimeter. The first housing 110 and the second housing 120 are arranged in a rectangular shape. The distance between any two fixing holes 1151 along the long or short side of the controller is set to a multiple of a preset distance.

[0050] In one specific structural form, four fixing holes 1151 are provided, located on opposite sides of the first housing 110. For example, each of the two long sides of the first housing 110 has two lugs 115, and each lug 115 has a fixing hole 1151. The spacing between the two fixing holes 1151 on one side is different from the spacing between the two fixing holes 1151 on the other side. For example, the spacing between the two fixing holes 1151 on one side is set to 100mm, and the spacing between the two fixing holes 1151 on the other side is set to 150mm. Thus, the spacing between any two fixing holes 1151 can be set to a multiple of 25mm.

[0051] With this configuration, when the controller is installed on an external device, the external device has several connection holes arranged in a 25mm pattern. When the controller is installed on an external device, the distance between any two fixing holes 1151 is set to a multiple of 25mm. When the controller is installed on an external device at any angle, each fixing hole 1151 can be matched with the connection hole, so that the controller can be easily fixed to the external device with bolts.

[0052] In some embodiments, please refer to Figure 1 and Figure 4 One of the first housing 110 and the second housing 120 is provided with a protruding guide portion 117, and the guide portion 117 is provided with a guide groove. The other housing is provided with a plug portion 123, which is inserted into the guide portion 117, thereby realizing the positioning between the first housing and the second housing 120, and thus aligning the threaded hole of the first housing 110 with the threaded hole of the second housing 120. Therefore, the first housing 110 and the second housing 120 can be conveniently fixed together by bolts.

[0053] This application discloses a mobile platform; please refer to [link / reference]. Figures 1 to 2 This includes the controller mentioned above.

[0054] Understandably, the mobile platform uses the aforementioned controller, with the control circuit board 200 and heat sink 300 mounted in contact. The control circuit board 200 transfers heat to the heat sink 300. Simultaneously, a portion of the airflow generated by the fan 400 flows to the heat sink 300, thereby dissipating heat from the heat sink 300 and consequently, allowing the heat sink 300 to dissipate heat from the control circuit board 200. Meanwhile, another portion of the airflow generated by the fan 400 flows to the vent 311, directly passing over the chips on the control circuit board 200, thus rapidly dissipating heat from the chips on the circuit board.

[0055] It is understandable that the heat sink 300 can cover a large area of ​​the control circuit board 200, and the fan 400 can dissipate heat from the control circuit board 200 over a large area through the heat sink 300; at the same time, the airflow through the ventilation openings 311 allows airflow to directly dissipate heat from the chip. As can be seen from the above, with the aforementioned structural form, the fan 400 can not only dissipate heat from the control circuit board 200 over a large area through the heat sink 300, but also achieve better heat dissipation for the control circuit board 200.

[0056] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.

Claims

1. A controller characterized by comprising: include: shell; A control circuit board is disposed inside the housing, and a chip is provided on one side of the control circuit board; A heat sink is disposed inside the housing and located on the side of the control circuit board close to the chip. The heat sink has ventilation openings corresponding to the chip. A fan, disposed in the housing and located on the side of the heat sink away from the control circuit board, is used to provide cooling airflow to the heat sink and the vent.

2. The controller of claim 1, wherein, The radiator is provided with one or more ventilation openings. If the radiator is provided with multiple ventilation openings, the multiple ventilation openings are arranged corresponding to multiple positions on the control circuit board.

3. The controller of claim 1, wherein, The outer casing is made of plastic.

4. The controller of claim 1, wherein, The heat sink includes a heat-conducting plate and heat dissipation fins. The heat dissipation fins are disposed on one side of the heat-conducting plate. The side of the heat-conducting plate away from the heat dissipation fins is used to fit against the control circuit board. The vent is disposed on the heat-conducting plate.

5. The controller of claim 1, wherein, The housing includes a first housing and a second housing connected to each other. The control circuit board is connected to the inside of the first housing, and the second housing, the fan, and the heat sink are connected.

6. The controller according to claim 5, characterized in that, The first housing includes a base plate and a surrounding edge, the surrounding edge being connected to the perimeter of the base plate, and a reinforcing rib being provided between the base plate and the surrounding edge. The reinforcing rib has support positions for supporting the control circuit board; and / or, The base plate is provided with a positioning post, and the control circuit board is provided with a positioning hole, with the positioning post passing through the positioning hole.

7. The controller according to claim 5, characterized in that, The second housing is provided with a fan slot, and the fan is secured in the fan slot.

8. The controller according to claim 5, characterized in that, The first housing has multiple fixing holes around its perimeter. The distance between any two fixing holes along the long and short sides of the controller is set to a multiple of a preset distance.

9. The controller according to claim 5, characterized in that, The controller is configured as a domain controller, and the second housing has a debug port.

10. A mobile platform, characterized in that, Includes the controller described in any one of claims 1-9.

Images