Power module and motor controller

Abstract

The utility model provides a kind of power module and motor controller, power module is applicable to motor controller, power module includes drive board, connecting assembly, sensing component and power assembly;Connecting assembly is connected with drive board, to input or output current to drive board by connecting assembly;Sensing component is connected by drive board with connecting assembly, to be used for detecting whether there is current on connecting assembly;Power assembly is installed on drive board, and power assembly includes heat dissipation component and multiple chips connected with heat dissipation component, the opposite sides of heat dissipation component all have installation shell, and multiple chips are respectively arranged on corresponding installation shell with interval, to carry out heat dissipation to multiple chips by heat dissipation component, to solve the problem of low heat dissipation efficiency of power module in motor controller in prior art.

Description

Technical Field

[0001] This utility model relates to the field of motor controller technology, and more specifically, to a power module and a motor controller. Background Technology

[0002] Currently, power modules in motor controllers are responsible for driving the motor and controlling current and voltage. Since power modules generate a significant amount of heat during operation, if not dissipated in time, the module temperature may rise, affecting its performance and reliability. To achieve heat dissipation, heat sinks are typically installed on the power module to increase the heat dissipation area and improve cooling efficiency. Heat sinks are usually made of aluminum or copper, which have good thermal conductivity. Most commercially available power modules inside motor controllers use a method where the chip is laid flat on the water cooling surface of the controller housing, and the chip is cooled by the cooling water channels within the aluminum alloy housing.

[0003] However, the heat dissipation efficiency of the above method is limited. Since the driver board, insulating board, capacitor and other components are stacked on the top of the chip, and the DC and AC output parts are mostly connected with copper pillars, the overall assembly process is complicated and occupies a large space. This results in the motor controller being large in size, having a low degree of modularity and low power density, which in turn leads to low overall heat dissipation efficiency of the power module. Utility Model Content

[0004] The main objective of this invention is to provide a power module and a motor controller to solve the problem of low heat dissipation efficiency of the power module in the existing motor controller.

[0005] To achieve the above objectives, according to one aspect of the present invention, a power module is provided, suitable for a motor controller. The power module includes: a drive board; a connection component connected to the drive board to input or output current to the drive board; a sensing component connected to the connection component via the drive board to detect the presence of current on the connection component; and a power component mounted on the drive board, the power component including a heat dissipation component and multiple chips connected to the heat dissipation component. The heat dissipation component has mounting housings on opposite sides, and the multiple chips are respectively and spaced apart on corresponding mounting housings to dissipate heat from the multiple chips through the heat dissipation component.

[0006] Furthermore, the heat dissipation component is a copper-clad heat sink.

[0007] Furthermore, there are multiple heat dissipation components, which are mounted on the drive board at intervals.

[0008] Furthermore, each mounting housing is provided with a receiving slot. There is one receiving slot, and multiple chips are respectively set in the receiving slot on the corresponding mounting housing; or there are multiple receiving slots, and multiple chips are respectively set in one-to-one correspondence with multiple receiving slots on each mounting housing.

[0009] Furthermore, each mounting housing is provided with multiple insertion holes. Multiple chips located on the same mounting housing and multiple insertion holes on the mounting housing are respectively provided in a one-to-one correspondence. Multiple chips are respectively inserted into multiple insertion holes along the extension direction of the insertion holes.

[0010] Furthermore, the connection components include DC copper busbars and AC copper busbars, which are respectively connected to the drive board and are located on adjacent or opposite sides of the drive board.

[0011] Furthermore, there are multiple DC copper busbars, which are respectively and spaced apart on the drive board; and / or there are multiple AC copper busbars, which are respectively and spaced apart on the drive board.

[0012] Furthermore, the sensing element is a capacitor, and there are multiple sensing elements. These multiple sensing elements are arranged at intervals on the drive board, and each sensing element is located on the same side of the drive board as the DC copper busbar and the AC copper busbar.

[0013] Furthermore, the drive board, connection components, sensing components, and power components are integrated into a single structure.

[0014] According to another aspect of the present invention, a motor controller is provided, including a power module for mounting within a housing of the motor controller, the power module being the power module described above.

[0015] Applying the technical solution of this utility model, the power module is suitable for a motor controller. The power module includes a drive board, a connection component, a sensing component, and a power component. The connection component is connected to the drive board to input or output current to the drive board. The sensing component is connected to the connection component through the drive board to detect whether there is current on the connection component. The power component is mounted on the drive board and includes a heat dissipation component and multiple chips connected to the heat dissipation component. The heat dissipation component has mounting housings on both sides. The multiple chips are respectively and spaced apart on the corresponding mounting housings to dissipate heat from the multiple chips through the heat dissipation component.

[0016] By mounting multiple chips onto heat dissipation components, the heat dissipation components can be used to cool the chips. Meanwhile, the power components and sensing components are vertically integrated on the driver board to form a power module, which also uses the heat dissipation components to cool the chips, improving chip performance and increasing the overall power density of the power module. Furthermore, the connecting components are directly soldered to the driver board to provide current input and output to the power module, thereby improving the overall heat dissipation performance of the power module. This solves the problem of low heat dissipation efficiency of power modules in existing motor controllers. At the same time, the overall manufacturing process of the power module is simple, the structure is compact, the overcurrent capacity is better, the product has a high degree of modularity, and the maintainability is high. Attached Figure Description

[0017] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0018] Figure 1 A schematic diagram of the structure of a power module according to an embodiment of the present invention is shown;

[0019] Figure 2 A schematic diagram of the unassembled power module provided according to an embodiment of the present invention is shown.

[0020] The above figures include the following reference numerals:

[0021] 10. Driver board; 20. Connection assembly; 21. DC copper busbar; 22. AC copper busbar; 30. Sensing component; 40. Power component; 41. Heat dissipation component; 42. Chip; 43. Mounting housing; 431. Receiving slot. Detailed Implementation

[0022] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] Please refer to Figure 1 and Figure 2As shown, the present invention provides a power module suitable for a motor controller. The power module includes a drive board 10, a connection component 20, a sensing component 30, and a power component 40. The connection component 20 is connected to the drive board 10 to input or output current to the drive board 10. The sensing component 30 is connected to the connection component 20 through the drive board 10 to detect whether there is current on the connection component 20. The power component 40 is mounted on the drive board 10 and includes a heat dissipation component 41 and a plurality of chips 42 connected to the heat dissipation component 41. The heat dissipation component 41 has mounting housings 43 on both sides. The plurality of chips 42 are respectively and spaced on the corresponding mounting housings 43 to dissipate heat from the plurality of chips 42 through the heat dissipation component 41.

[0024] By applying the technical solution of this embodiment, multiple chips 42 are respectively mounted on the heat dissipation component 41 to dissipate heat from the chips 42. At the same time, the power component 40 and the sensing component 30 are vertically integrated on the drive board 10 to form a power module, so that the heat dissipation component 41 can dissipate heat from the chips 42, thereby improving the performance of the chips 42 and increasing the overall power density of the power module. The connecting component 20 is directly soldered to the drive board 10 to provide current input and output to the power module, thereby improving the overall heat dissipation performance of the power module. This solves the problem of low heat dissipation efficiency of the power module in the motor controller in the prior art. At the same time, the overall manufacturing process of the power module is simple, the overcurrent capacity is better, the product has a high degree of modularity, and the maintainability is high.

[0025] Specifically, in this embodiment, the heat dissipation component 41 is a copper-clad heat sink.

[0026] Optionally, there are multiple heat dissipation components 41, which are respectively mounted on the driver board 10 at intervals. In the above arrangement, multiple chips 42 are respectively disposed on each heat dissipation component 41, so that the multiple heat dissipation components 41 can dissipate heat from the multiple chips 42 respectively.

[0027] Specifically, each mounting housing 43 is provided with a receiving slot 431, and there is one receiving slot 431. Multiple chips 42 are respectively placed in the receiving slot 431 on the corresponding mounting housing 43. In this way, by laying the chips 42 flat in the receiving slot 431, the copper-clad water cooling heat sink can dissipate heat from the chips 42 through the mounting housing 43, thereby improving the performance of the chips 42.

[0028] Optionally, each mounting housing 43 is provided with a receiving slot 431, and there are multiple receiving slots 431. The multiple chips 42 are respectively provided with one-to-one correspondence with the multiple receiving slots 431 on each mounting housing 43.

[0029] Optionally, each mounting housing 43 is provided with multiple insertion holes. Multiple chips 42 located on the same mounting housing 43 and the multiple insertion holes on the mounting housing 43 are respectively arranged in a one-to-one correspondence, with the multiple chips 42 inserted into the multiple insertion holes along the extending direction of the insertion holes. This arrangement, by inserting multiple chips 42 into the insertion holes, allows for better contact between the hole walls on the mounting housing 43 and the chips 42, thereby dissipating heat from the chips 42.

[0030] Specifically, the connection component 20 includes a DC copper busbar 21 and an AC copper busbar 22, which are respectively connected to the drive board 10. The DC copper busbar 21 and the AC copper busbar 22 are located on adjacent or opposite sides of the drive board 10. This configuration, where the DC copper busbar 21 and the AC copper busbar 22 are connected to the drive board 10 to control the DC and AC current inputs of the motor, and where the DC copper busbar 21 and the AC copper busbar 22 are located on adjacent or opposite sides of the drive board 10, results in high overall power density and integration of the power module.

[0031] Optionally, there are multiple DC copper busbars 21, which are respectively and spaced apart on the drive board 10; wherein one end of each of the multiple DC copper busbars 21 is respectively and spaced apart on the drive board 10.

[0032] Optionally, there are multiple AC copper busbars 22, which are respectively and spaced apart on the drive board 10; wherein one end of each of the multiple AC copper busbars 22 is respectively and spaced apart on the drive board 10.

[0033] Specifically, the sensing element 30 is a capacitor, and there are multiple sensing elements 30. These multiple sensing elements 30 are spaced apart on the drive board 10, with each sensing element 30 located on the same side of the drive board 10 as the DC copper busbar 21 and the AC copper busbar 22. With this configuration, the multiple sensing elements 30 are connected to the DC copper busbar 21 and the AC copper busbar 22 via the drive board 10, allowing each sensing element 30 to detect the current on its corresponding DC copper busbar 21 and AC copper busbar 22, and transmit the detected current signal to the drive board 10 to enable the motor controller to control the motor.

[0034] In this embodiment, the driver board 10, the connection component 20, the sensing component 30, and the power component 40 are integrated into a single structure. With the above configuration, the connection component 20, the sensing component 30, and the power component 40 are respectively mounted on the driver board 10 to form an integrated structure. Furthermore, the connection component 20, the sensing component 30, and the power component 40 are all mounted on one side of the driver board 10, achieving a compact overall structure, high power density, and high heat dissipation efficiency of the power module.

[0035] In another aspect of this utility model, a motor controller is provided, including a power module for installation within a housing of the motor controller, wherein the power module is the aforementioned integrated power module.

[0036] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0037] The power module is suitable for motor controllers. The power module includes a drive board 10, a connection component 20, a sensing component 30, and a power component 40. The connection component 20 is connected to the drive board 10 to input or output current to the drive board 10. The sensing component 30 is connected to the connection component 20 through the drive board 10 to detect whether there is current on the connection component 20. The power component 40 is mounted on the drive board 10. The power component 40 includes a heat dissipation component 41 and a plurality of chips 42 connected to the heat dissipation component 41. The heat dissipation component 41 has mounting housings 43 on both sides. The plurality of chips 42 are respectively and spaced on the corresponding mounting housings 43 to dissipate heat from the plurality of chips 42 through the heat dissipation component 41. The above configuration, by mounting multiple chips 42 on heat dissipation components 41 respectively, utilizes the heat dissipation components 41 to dissipate heat from the chips 42. Simultaneously, the power component 40 and the sensing component 30 are vertically integrated on the drive board 10 to form a power module, which dissipates heat from the chips 42 through the heat dissipation components 41, thereby improving the performance of the chips 42 and increasing the overall power density of the power module. Furthermore, the connecting component 20 is directly soldered to the drive board 10 to provide current input and output to the power module, thus improving the overall heat dissipation performance of the power module. This solves the problem of low heat dissipation efficiency of power modules in existing motor controllers. At the same time, the overall manufacturing process of the power module is simple, the structure is compact, the overcurrent capacity is better, the product has a high degree of modularity, and the maintainability is high.

[0038] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0039] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0040] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0041] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0042] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A power module suitable for use in a motor controller, characterized in that, The power module includes: Driver board (10); A connection component (20) is connected to the drive board (10) to input or output current to the drive board (10) through the connection component (20); A sensing component (30) is connected to the connection assembly (20) via the drive plate (10) to detect whether there is current on the connection assembly (20); A power component (40) is mounted on the driver board (10). The power component (40) includes a heat dissipation component (41) and a plurality of chips (42) connected to the heat dissipation component (41). The heat dissipation component (41) has mounting housings (43) on opposite sides. The plurality of chips (42) are respectively spaced on the corresponding mounting housings (43) to dissipate heat from the plurality of chips (42) through the heat dissipation component (41).

2. The power module of claim 1, wherein, The heat dissipation component (41) is a copper-clad heat sink.

3. The power module of claim 2, wherein, There are multiple heat dissipation components (41), and the multiple heat dissipation components (41) are respectively installed on the drive plate (10) at intervals.

4. The power module of claim 1, wherein, Each of the aforementioned mounting housings (43) is provided with a receiving groove (431). There is one receiving slot (431), and the plurality of chips (42) are respectively disposed in the receiving slot (431) on the corresponding mounting housing (43); or There are multiple receiving slots (431), and each of the multiple chips (42) is respectively provided in a one-to-one correspondence with the multiple receiving slots (431) on each of the mounting housings (43).

5. The power module of claim 1, wherein, Each of the mounting housings (43) is provided with a plurality of insertion holes. The plurality of chips (42) located on the same mounting housing (43) and the plurality of insertion holes on the mounting housing (43) are respectively provided in a one-to-one correspondence. The plurality of chips (42) are respectively inserted into the plurality of insertion holes along the extension direction of the insertion holes.

6. The power module of claim 1, wherein, The connection assembly (20) includes a DC copper busbar (21) and an AC copper busbar (22), which are respectively connected to the drive board (10). The DC copper busbar (21) and the AC copper busbar (22) are respectively located on adjacent sides or opposite sides of the drive board (10).

7. The power module according to claim 6, characterized in that, There are multiple DC copper busbars (21), and the multiple DC copper busbars (21) are respectively and spaced apart on the drive board (10); and / or There are multiple AC copper busbars (22), and the multiple AC copper busbars (22) are respectively arranged on the drive board (10) at intervals.

8. The power module of claim 6, wherein, The sensing element (30) is a capacitor. There are multiple sensing elements (30), and the multiple sensing elements (30) are respectively arranged at intervals on the driving board (10). Each sensing element (30) is located on the same side of the driving board (10) as the DC copper busbar (21) and the AC copper busbar (22).

9. The power module of claim 1, wherein, The driving plate (10), the connecting assembly (20), the sensing component (30) and the power assembly (40) are an integrated structure.

10. An electric machine controller comprising a power module for mounting within a housing of the electric machine controller, characterized in that, The power module is the power module according to any one of claims 1 to 9.

Images