A circular groove type VC heat dissipation module

Abstract

The utility model relates to the technical field of heat dissipation module, concretely to a round groove type VC heat dissipation module, the heat dissipation module includes: heat dissipation mechanism, the heat dissipation mechanism includes lower cover subassembly and upper cover subassembly, wherein upper cover subassembly covers on lower cover subassembly, the lower cover subassembly includes lower cover body, the top of lower cover body is provided with evaporation cavity and is sunken, the evaporation cavity inside is provided with liquid storage cavity and is sunken, the upper cover subassembly includes the heat spreader, is provided with a plurality of heat conduction grooves on the heat spreader, the lower cover body top and evaporation cavity between form the arc type flow guide surface no.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation module technology, specifically a circular groove type VC heat dissipation module. Background Technology

[0002] With the maturation and further development of the electronics industry, users' demands for computer power are increasing, and the expansion of hardware and software and the increase in space occupied by them mean that, in order to generate high power, electronic components will inevitably release more heat, according to the principle of conservation of energy in physics.

[0003] Currently, most graphics card cooling modules on the market are flat-panel VCs (Vibration Cooling Modules). With continuous improvements in chip manufacturing processes, chip sizes are getting smaller and smaller, while heat generation is increasing. Under these circumstances, even using VCs to dissipate heat from the chip makes it difficult to improve cooling performance. Utility Model Content

[0004] The purpose of this utility model is to provide a circular groove type VC heat dissipation module, which has the advantages of simple structure, isolated design and good heat dissipation performance, and solves the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a circular groove type VC heat dissipation module, comprising: a heat dissipation mechanism, the heat dissipation mechanism comprising a lower cover assembly and an upper cover assembly, wherein the upper cover assembly covers the lower cover assembly, the lower cover assembly comprises a lower cover body, the top of the lower cover body is provided with an evaporation chamber, the evaporation chamber is provided with a liquid storage chamber, the upper cover assembly comprises a heat spreader plate, and the heat spreader plate is provided with a plurality of heat conduction grooves.

[0006] Preferably, an arc-shaped flow guide surface is formed between the top of the lower cover body and the evaporation chamber, and an arc-shaped flow guide surface is formed between the evaporation chamber and the liquid storage chamber. Four mounting seats are provided at the bottom of the lower cover body.

[0007] Preferably, the depth of the evaporation chamber is between 1 and 2 mm.

[0008] Preferably, the depth of the liquid storage cavity is between 1 and 2 mm.

[0009] Preferably, each of the heat conduction grooves has a semi-circular vertical cross-section, and several heat conduction grooves are equidistantly opened on the heat spreader plate, with the distance between the edges of two adjacent heat conduction grooves being between 0.2 and 0.6 mm.

[0010] Preferably, protective gaps are provided between the heat conduction grooves on both sides of the plurality of heat conduction grooves and the two sides of the heat spreader.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] This utility model provides a circular groove type VC heat dissipation module, which includes a lower cover assembly and an upper cover assembly. The overall structure is simple and reasonably designed. The heat dissipation mechanism includes a lower cover assembly and an upper cover assembly, with the upper cover assembly covering the lower cover assembly. The lower cover assembly includes a lower cover body, with an evaporation chamber recessed at the top of the lower cover body. A liquid storage chamber is recessed inside the evaporation chamber. The upper cover assembly includes a heat spreader plate with several heat conduction grooves. Conventional VC has a small effective contact surface with the heat pipe. Because flat VC requires the heat pipe to be flattened, for a 6mm diameter heat pipe, the actual arc length of the single heat pipe in contact with the VC is only 5mm. The circular groove type VC can greatly increase the arc length of the contact with the heat pipe to about 9.42mm. Due to the higher heat transfer efficiency of the heat pipe and VC, the heat dissipation performance of the module is enhanced. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0014] Figure 2 This is a frontal view of the disassembled structure of this utility model;

[0015] Figure 3 This is a schematic diagram of the split structure of this utility model from a bottom view;

[0016] Figure 4 This utility model Figure 2 Enlarged schematic diagram of the structure at point A;

[0017] Figure 5 This is a schematic diagram of the installation position of this utility model;

[0018] Figure 6 This is a schematic diagram of the installation of this utility model.

[0019] The reference numerals and names in the figure are as follows:

[0020] 1. Heat dissipation mechanism; 11. Lower cover assembly; 111. Lower cover body; 112. Evaporation chamber; 113. Liquid storage chamber; 114. Airflow guide surface one; 115. Airflow guide surface two; 116. Mounting base; 12. Upper cover assembly; 121. Heat spreader; 122. Heat conduction groove; 2. Aluminum base plate; 3. Thermal paste; 4. Heat pipe; 5. Fins; 6. Bracket; 7. Frame; 8. Axial fan; 9. Fan screws. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In the description of the embodiments of this utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing the embodiments of this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this utility model, "multiple" means two or more, unless otherwise explicitly specified.

[0023] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0024] Please see Figures 1 to 4This utility model provides an embodiment of a circular groove-type VC heat dissipation module, comprising: a heat dissipation mechanism 1, which includes a lower cover assembly 11 and an upper cover assembly 12, wherein the upper cover assembly 12 covers the lower cover assembly 11, the lower cover assembly 11 includes a lower cover body 111, an evaporation chamber 112 is recessed at the top of the lower cover body 111, and a liquid storage chamber 113 is recessed inside the evaporation chamber 112, the upper cover assembly 12 includes a heat spreader 121, a plurality of heat conduction grooves 122 are formed on the heat spreader 121, and an arc-shaped flow guide surface 114 is formed between the top of the lower cover body 111 and the evaporation chamber 112. An arc-shaped flow guide surface 115 is formed between the evaporation chamber 112 and the liquid storage chamber 113. Four mounting seats 116 are provided at the bottom of the lower cover body 111. The depth of the evaporation chamber 112 is between 1 and 2 mm, and the depth of the liquid storage chamber 113 is between 1 and 2 mm. The vertical cross-section of each heat conduction groove 122 is semi-circular, and several heat conduction grooves 122 are equidistantly opened on the heat spreader 121. The distance between the edges of two adjacent heat conduction grooves 122 is between 0.2 and 0.6 mm. Protective gaps are provided between the heat conduction grooves 122 on both sides of the heat spreader 122 and the two sides of the heat spreader 121.

[0025] Please see Figure 5 and Figure 6 During installation, heat pipe 4 is installed on heat dissipation mechanism 1, bracket 6 is installed at the bottom of frame 7, two fins 5 are connected through bracket 6 and fixed to heat pipe 4, then axial fan 8 is installed on frame 7 and fixed to frame 7 with fan screws 9, then heat dissipation mechanism 1 is installed on aluminum base plate 2, and thermal paste 3 is applied to the bottom of aluminum base plate 2 to complete the installation.

[0026] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A circular groove type VC heat dissipation module, characterized in that, include: The heat dissipation mechanism (1) includes a lower cover assembly (11) and an upper cover assembly (12), wherein the upper cover assembly (12) covers the lower cover assembly (11), the lower cover assembly (11) includes a lower cover body (111), the top of the lower cover body (111) is provided with an evaporation chamber (112), and the evaporation chamber (112) is provided with a liquid storage chamber (113) inside the evaporation chamber (112), and the upper cover assembly (12) includes a heat spreader plate (121), and a plurality of heat conduction grooves (122) are provided on the heat spreader plate (121).

2. The circular groove type VC heat dissipation module according to claim 1, characterized in that: An arc-shaped flow guide surface (114) is formed between the top of the lower cover body (111) and the evaporation chamber (112), and an arc-shaped flow guide surface (115) is formed between the evaporation chamber (112) and the liquid storage chamber (113). Four mounting seats (116) are provided at the bottom of the lower cover body (111).

3. The circular groove type VC heat dissipation module according to claim 1, characterized in that: The depth of the evaporation chamber (112) is between 1 and 2 mm.

4. The circular groove type VC heat dissipation module according to claim 1, characterized in that: The depth of the liquid storage chamber (113) is between 1 and 2 mm.

5. A circular groove type VC heat dissipation module according to claim 1, characterized in that: Each of the heat conduction grooves (122) has a semi-circular vertical cross section, and several heat conduction grooves (122) are equally spaced on the heat spreader plate (121), with the distance between the edges of two adjacent heat conduction grooves (122) being between 0.2 and 0.6 mm.

6. A circular groove type VC heat dissipation module according to claim 1, characterized in that: A protective gap is provided between the heat conduction grooves (122) on both sides of the plurality of heat conduction grooves (122) and the two sides of the heat spreader (121).

Images