Flexible circuit board film patch processing device

Abstract

The utility model discloses a flexible circuit board film patch processing device, including device base, be provided with longitudinal drive arrangement on the device base, be provided with processing platform on longitudinal drive arrangement, be provided with first air cylinder on processing platform, the utility model discloses through first air cylinder drive connecting plate movement, realize the clamping effect between connecting plate and processing platform to realize the clamping fixed one end to flexible circuit board, through the cooperation between longitudinal drive arrangement and processing platform, realized the longitudinal movement of processing platform, through the cooperation between second air cylinder, connecting piece and press roll, realized the adjustment of press roll height, realized the pressing effect of press roll to the unfixed part of flexible circuit board simultaneously, through the longitudinal movement effect of processing platform again, make press roll to the unfixed part of flexible circuit board push pressure to make flexible circuit board can be more level fixed on processing platform to make subsequent patch processing convenient.

Description

Technical Field

[0001] This utility model relates to the field of patch device technology, and in particular to a flexible circuit board thin film patch processing device. Background Technology

[0002] The utility model disclosed in CN216873477U relates to the technical field of devices for thin-film circuit board processing, and more particularly to a fixing device for automatic placement of thin-film circuit boards. The device includes a base plate, a placement plate on the upper side of the base plate, first limiting rods symmetrically arranged front and rear on the left side of the base surface of the base plate, and second limiting rods symmetrically arranged front and rear on the right side of the base surface of the base plate. A driving cylinder is located in the middle of the base surface of the base plate. A first support frame is located on the front side of the placement plate base surface, and a second support frame is located on the rear side of the placement plate base surface. Electric telescopic rods are provided on the base surfaces of both the first and second support frames. The driving ends of the electric telescopic rods pass through the first and second support frames respectively and are connected to connecting plates. A fixing plate is located on the lower side of the connecting plate. Buffer springs are evenly arranged between the base surface of the fixing plate and the bottom of the connecting plate. The overall device has a simple structure, is easy to operate, and has higher practicality.

[0003] The existing technology prevents flexible circuit boards from curling and deforming by pressing them at both ends. However, because the flexible circuit board is not smoothed out, the pressing parts at both ends of the flexible circuit board are in a flat state, while the middle patch processing area is still curled and deformed, affecting the accuracy of patch processing. Therefore, a flexible circuit board film patch processing device is needed to meet people's needs. Utility Model Content

[0004] The purpose of this invention is to provide a flexible circuit board film patch processing device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a flexible circuit board film patch processing device, comprising a device base, a longitudinal drive device mounted on the device base, a processing platform mounted on the longitudinal drive device, a first cylinder mounted on the processing platform, a connecting plate mounted on the first cylinder, a frame mounted on the device base, a second cylinder mounted on the frame, a connecting member mounted on the telescopic shaft of the second cylinder, a pressure roller rotatably connected to the bottom end of the connecting member, a transverse drive device mounted on the frame, an electric telescopic rod mounted on the transverse drive device, and a robotic arm mounted on the telescopic shaft of the electric telescopic rod.

[0006] Preferably, both the longitudinal drive device and the transverse drive device consist of a servo motor, a ball screw, and a ball slider.

[0007] Preferably, a positioning plate is provided on the top of the processing platform, and the positioning plate is arranged near the first cylinder.

[0008] Preferably, the processing platform has an ear block at the bottom of its side, and the first cylinder is mounted on the ear block.

[0009] Preferably, there are two sets of the first cylinder and the lug, which are respectively arranged on the two sides of the processing platform.

[0010] Preferably, a rubber strip is provided on the bottom end of the connecting plate.

[0011] Preferably, the pressure roller is made of rubber.

[0012] The beneficial effects of this utility model are:

[0013] In this invention, a first cylinder drives a connecting plate to move, achieving a clamping effect between the connecting plate and the processing platform, thereby clamping and fixing one end of the flexible circuit board. Through the cooperation between the longitudinal drive device and the processing platform, the longitudinal movement of the processing platform is realized. Through the cooperation between the second cylinder, the connecting part, and the pressure roller, the height of the pressure roller is adjusted, and the pressure roller presses on the unclamped part of the flexible circuit board. Then, through the longitudinal movement of the processing platform, the pressure roller pushes on the unclamped part of the flexible circuit board, so that the flexible circuit board is more flatly fixed on the processing platform, thus facilitating subsequent surface mount technology (SMT) processing.

[0014] This invention utilizes the cooperation between a lateral drive device, an electric telescopic rod, and a robotic arm, along with the longitudinal movement of the processing platform, to achieve the movement requirements in different directions during the chip placement process. This allows for the adjustment and change of the chip placement position during the process, thereby improving chip placement efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the pressure roller structure of a flexible circuit board film patch processing device proposed in this utility model;

[0016] Figure 2 This is a schematic diagram of the robotic arm structure of a flexible circuit board thin film patch processing device proposed in this utility model.

[0017] Figure 3 This is a schematic diagram of the processing platform of a flexible circuit board film patch processing device proposed in this utility model.

[0018] In the diagram: 1. Device base; 2. Longitudinal drive device; 3. Processing platform; 4. First cylinder; 5. Connecting plate; 6. Frame; 7. Second cylinder; 8. Connecting piece; 9. Pressure roller; 10. Lateral drive device; 11. Electric telescopic rod; 12. Robot arm; 13. Servo motor; 14. Ball screw; 15. Ball slider; 16. Positioning plate; 17. Ear block; 18. Rubber strip. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] Reference Figure 1-3 A flexible circuit board film bonding processing device includes a device base 1, a longitudinal drive device 2 on the device base 1, a processing platform 3 on the longitudinal drive device 2, a first cylinder 4 on the processing platform 3, a connecting plate 5 on the first cylinder 4, a frame 6 on the device base 1, a second cylinder 7 on the frame 6, a connecting member 8 on the telescopic shaft of the second cylinder 7, a pressure roller 9 rotatably connected to the bottom end of the connecting member 8, a transverse drive device 10 on the frame 6, an electric telescopic rod 11 on the transverse drive device 10, and a robotic arm 12 on the telescopic shaft of the electric telescopic rod 11.

[0021] The first cylinder 4 drives the connecting plate 5 to move, achieving a clamping effect between the connecting plate 5 and the processing platform 3, thereby clamping and fixing one end of the flexible circuit board. Through the cooperation between the longitudinal drive device 2 and the processing platform 3, the longitudinal movement of the processing platform 3 is realized. Through the cooperation between the second cylinder 7, the connecting piece 8 and the pressure roller 9, the height of the pressure roller 9 is adjusted, and the pressure roller 9 presses the unclamped part of the flexible circuit board. Then, through the longitudinal movement of the processing platform 3, the pressure roller 9 pushes the unclamped part of the flexible circuit board, so that the flexible circuit board is more flatly fixed on the processing platform 3, which facilitates subsequent chip mounting. Through the cooperation between the transverse drive device 10, the electric telescopic rod 11 and the robot 12, and in coordination with the longitudinal movement of the processing platform 3, the device realizes the movement requirements in different directions during the chip mounting process, thereby realizing the adjustment and change of the chip mounting position during the chip mounting process and improving the chip mounting efficiency.

[0022] Specifically, in this embodiment, both the longitudinal drive device 2 and the transverse drive device 10 are composed of a servo motor 13, a ball screw 14, and a ball slider 15, which improves the accuracy requirements of the movement of the processing platform 3 and the robot arm 12.

[0023] Specifically, in this embodiment, a positioning plate 16 is provided on the top of the processing platform 3. The positioning plate 16 is arranged near the first cylinder 4 to provide end positioning effect when the flexible circuit board is installed and fixed, so as to ensure that flexible circuit boards of the same specifications are always in the same positioning effect.

[0024] Specifically, in this embodiment, a lug 17 is provided at the bottom side of the processing platform 3, and the first cylinder 4 is provided on the lug 17 to avoid the first cylinder 4 occupying the upper space of the processing platform 3 and to prevent collisions between it and the robot arm 12 and the pressure roller 9.

[0025] Specifically, in this embodiment, there are two sets of first cylinder 4 and ear block 17, which are respectively arranged on the two sides of the processing platform 3 to improve the stability of the movement and pressing of the connecting plate 5.

[0026] Specifically, in this embodiment, a rubber strip 18 is provided on the bottom end of the connecting plate 5 to prevent the connecting plate 5 from directly contacting the flexible circuit board and to prevent damage.

[0027] Specifically, in this embodiment, the pressure roller 9 is made of rubber to reduce damage to the flexible circuit board during the rolling process.

[0028] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. A flexible circuit board thin-film bonding processing device, comprising a device base (1), characterized in that: The device base (1) is provided with a longitudinal drive device (2), the longitudinal drive device (2) is provided with a processing platform (3), the processing platform (3) is provided with a first cylinder (4), the first cylinder (4) is provided with a connecting plate (5), the device base (1) is provided with a frame (6), the frame (6) is provided with a second cylinder (7), the telescopic shaft of the second cylinder (7) is provided with a connector (8), the bottom end of the connector (8) is rotatably connected with a pressure roller (9), the frame (6) is provided with a transverse drive device (10), the transverse drive device (10) is provided with an electric telescopic rod (11), the telescopic shaft of the electric telescopic rod (11) is provided with a robot (12).

2. The flexible circuit board thin-film bonding processing apparatus according to claim 1, characterized in that: Both the longitudinal drive device (2) and the transverse drive device (10) are composed of a servo motor (13), a ball screw (14), and a ball slider (15).

3. The flexible circuit board thin-film bonding processing apparatus according to claim 1, characterized in that: A positioning plate (16) is provided on the top of the processing platform (3), and the positioning plate (16) is arranged near the first cylinder (4).

4. The flexible circuit board thin-film bonding processing apparatus according to claim 1, characterized in that: The processing platform (3) has an ear block (17) at the bottom side, and the first cylinder (4) is mounted on the ear block (17).

5. The flexible circuit board thin-film bonding processing apparatus according to claim 1, characterized in that: The first cylinder (4) and the ear block (17) are both in two sets, and are respectively arranged on the two sides of the processing platform (3).

6. The flexible circuit board thin-film bonding processing apparatus according to claim 1, characterized in that: A rubber strip (18) is provided on the bottom end of the connecting plate (5).

7. The flexible circuit board thin-film bonding processing apparatus according to claim 1, characterized in that: The pressure roller (9) is made of rubber.

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