A horizontal type sheet arranging device

Abstract

The utility model provides a horizontal formula piece device relates to photovoltaic, semiconductor production technical field is used to solve the problem that the piece of silicon wafer and similar wafer is not continuous and low stability. Horizontal formula piece device, including the piece mechanism and the piece mechanism of going out. The piece mechanism includes: a pair of mounting plate, at least a pair of first transmission roll and at least one second transmission roll, and sucking disc. A pair of first transmission roll is spaced apart between a pair of mounting plate along the first direction, and the second transmission roll is adjustably arranged between a pair of mounting plate up and down, and is located above a pair of first transmission roll, and the outer periphery ring of a pair of first transmission roll and second transmission roll is equipped with first conveyer belt. The downside surface of sucking disc forms the adsorption part. The piece mechanism of going out is close to the piece mechanism setting, and the piece mechanism of going out is located below the piece mechanism. The piece mechanism still includes the blocking mechanism, and the bottom height of blocking mechanism is lower than the downside height of first conveyer belt.

Description

Technical Field

[0001] This utility model relates to the fields of photovoltaic and semiconductor manufacturing technology, and in particular to a horizontal wafer stacking device. Background Technology

[0002] The wafer sorting machine is a crucial piece of equipment for inserting silicon wafers into baskets before cleaning. Its core component, the wafer sorting device, typically consists of a loading box (where stacked silicon wafers are pre-placed), a water jet separator, and suction heads. The sorting device is installed inside a water tank. During sorting, the silicon wafers in the loading box are separated by the water jet separator, and then sucked onto the conveyor belt on the suction head through suction holes. The conveyor belt, driven by a motor, transports the silicon wafers for insertion.

[0003] Current horizontal wafer sorting machines use a suction head consisting of a suction plate and thin circular belts attached to both sides of the suction plate. When a silicon wafer is blown open by a water jet, it is sucked onto the circular belts on the suction head. The circular belts then carry the wafer from the water to the next section of the transport line. During operation, when the first wafer is about to emerge from the water, the circular belts on the suction head stop rotating, allowing the first wafer to fall onto the next section of the transport line. Then the circular belts rotate, sucking up the second wafer from below the liquid surface for transport, and so on. However, the suction head of this device operates intermittently, resulting in low wafer sorting efficiency and instability. Utility Model Content

[0004] The present invention aims to at least partially solve one of the aforementioned technical problems. To this end, the present invention provides a horizontal wafer arrangement device to address the problems of discontinuous arrangement and low stability of silicon wafers and similar thin films.

[0005] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows:

[0006] This utility model embodiment provides a horizontal sheet arrangement device, including:

[0007] The suction mechanism includes:

[0008] A pair of mounting plates;

[0009] At least one pair of first drive rollers and at least one second drive roller, the pair of first drive rollers are spaced apart between the pair of mounting plates along a first direction, the second drive roller is adjustablely disposed between the pair of mounting plates, the second drive roller is located above the pair of first drive rollers, and a first conveyor belt is provided around the outer periphery of the pair of first drive rollers and the second drive roller;

[0010] A suction cup is connected between a pair of mounting plates and located between a pair of first drive rollers, and an adsorption portion is formed on the lower surface of the suction cup;

[0011] The suction cup is located inside the first conveyor belt. The first conveyor belt has a series of through holes arranged at intervals corresponding to the suction cup. The suction part cooperates with the through holes on the lower side of the first conveyor belt to jointly suction and convey the workpiece.

[0012] A film ejection mechanism is disposed close to the film suction mechanism and is located below the film suction mechanism;

[0013] The film suction mechanism and the film output mechanism are horizontally arranged, and a film output space is formed between the lower side of the first conveyor belt and the upper side of the film output mechanism. The film suction mechanism also includes a blocking mechanism, which is located at the end of the pair of mounting plates away from the film output mechanism. The bottom height of the blocking mechanism is lower than the height of the lower side of the first conveyor belt.

[0014] Furthermore, a hollow negative pressure cavity is formed inside the suction cup.

[0015] The suction portion on the lower surface of the suction cup is formed as a through groove, and the negative pressure chamber is connected to the outside through the through groove;

[0016] The upper surface of the suction cup has a connecting hole, through which the negative pressure chamber is connected to the outside world. The connecting hole is used to connect a water pumping device.

[0017] Furthermore, the through groove and the through hole string are located on the same straight line and are both arranged along the first direction.

[0018] Furthermore, it also includes racks.

[0019] One end of the frame is connected to the film suction mechanism, and the other end is connected to the film output mechanism.

[0020] Furthermore, the frame includes a pair of fixing plates.

[0021] The pair of fixing plates are arranged opposite each other, and the suction mechanism and the output mechanism are arranged between the pair of fixing plates.

[0022] Furthermore, the suction mechanism also includes a proximity switch.

[0023] The proximity switch is located at the end of the pair of mounting plates furthest from the film output mechanism.

[0024] Furthermore, the film output mechanism includes:

[0025] A pair of third drive rollers are sequentially spaced below the suction mechanism along the first direction, and the pair of third drive rollers are located between the pair of fixed plates.

[0026] A second conveyor belt is provided around the pair of third drive rollers along the first direction.

[0027] Furthermore, the upper side of the second conveyor belt is lower than the lower side of the first conveyor belt.

[0028] Furthermore, it also includes a water jet device, which comprises a main water jet.

[0029] The main water jet is connected to a pair of fixed plates and located below the suction cup. The nozzle of the main water jet is set facing the feeding direction of the workpiece, and is used to spray water flow towards the workpiece pile from the front.

[0030] Furthermore, the water jet device also includes at least one pair of side water jets.

[0031] A pair of side water jets are respectively disposed on the outside of the suction mechanism, and the spray nozzles of the pair of side water jets are arranged opposite each other for spraying water flow from the side toward the workpiece pile.

[0032] The technical solution of this utility model has at least the following beneficial effects:

[0033] The horizontal wafer arrangement device of this utility model includes a wafer suction mechanism and a wafer ejection mechanism arranged vertically. The first conveyor belt of the wafer suction mechanism has multiple segments of spaced through holes. During the transmission of the first conveyor belt, each segment of through holes cooperates with the suction part at the bottom of the suction cup in the wafer suction mechanism to realize the suction and conveying of a single workpiece (e.g., a silicon wafer), thereby realizing the continuous suction and arrangement of multiple workpieces without interference between them, effectively improving the wafer arrangement efficiency of the device.

[0034] In addition, the adsorbed silicon wafers are horizontally conveyed to the upper side of the wafer ejection mechanism via the first conveyor belt, and finally discharged horizontally by the wafer ejection mechanism. The wafer ejection space formed between the lower side of the first conveyor belt and the upper side of the wafer ejection mechanism can effectively limit the transmission of silicon wafers, thereby effectively improving the stability of wafer arrangement.

[0035] In addition, the wafer stacking device of this utility model embodiment is provided with a blocking mechanism at the end of the wafer suction mechanism that is away from the wafer output mechanism, thereby reducing the probability of the silicon wafers being sequentially suctioned being connected and improving the wafer output quality.

[0036] Furthermore, the wafer suction mechanism of the wafer stacking device in this embodiment of the present invention adjusts the height distance between the second drive roller and the pair of first drive rollers, thereby enabling the outer periphery of the second drive roller and the pair of first drive rollers to be wrapped with first conveyor belts of different lengths, thus accommodating the suction and conveying of silicon wafers of different sizes.

[0037] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0038] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale.

[0039] In the attached image:

[0040] Figure 1 This is a three-dimensional structural diagram of the horizontal tray arrangement device according to an embodiment of the present utility model;

[0041] Figure 2 This is another perspective view of the horizontal tray arrangement device according to an embodiment of the present utility model;

[0042] Figure 3 This is a three-dimensional structural diagram of the first cover plate of the suction cup in the horizontal sheet-laying device according to an embodiment of the present utility model;

[0043] Figure 4 This is a schematic diagram of the structure of the first cover plate of the suction cup in the horizontal sheet-laying device according to an embodiment of the present invention;

[0044] Figure 5 This is a schematic diagram of the structure of the second cover plate of the suction cup in the horizontal sheet-laying device according to an embodiment of the present invention;

[0045] Figure 6 This is a three-dimensional structural diagram of the suction mechanism according to an embodiment of the present utility model;

[0046] Figure 7 This is another perspective view of the suction mechanism of this utility model embodiment.

[0047] Explanation of reference numerals in the attached figures:

[0048] Frame-100; Fixing plate-110; Suction mechanism-200; Mounting plate-210; First drive roller-220; Second drive roller-230; First conveyor belt-240; Through hole string-241; Suction cup-250; First cover plate-251; Connecting hole-2511; Second cover plate-252; Through groove-2521; Negative pressure chamber-253; Functional hole-254; Proximity switch-260; Blocking mechanism-270; Film ejection mechanism-300; Third drive roller-310; Second conveyor belt-320; Water jet device-400; Main water jet-410; Side water jet-420. Detailed Implementation

[0049] In the description of this embodiment, it should be understood that the terms "length", "width", "height", "up", "down", "left", "right", "vertical", "horizontal", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0050] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0051] As a specific embodiment of this utility model, such as Figure 1 , Figure 2 as well as Figure 6 , Figure 7 As shown, this utility model embodiment provides a horizontal film stacking device, which may include a film suction mechanism 200 and a film output mechanism 300.

[0052] The suction mechanism 200 may include a pair of mounting plates 210, at least a pair of first drive rollers 220, at least a second drive roller 230, and a suction cup 250. The pair of first drive rollers 220 are spaced apart between the pair of mounting plates 210 along a first direction. The second drive roller 230 is adjustablely positioned between the pair of mounting plates 210, located above the pair of first drive rollers 220. A first conveyor belt 240 surrounds the outer periphery of the pair of first drive rollers 220 and the second drive roller 230. The suction cup 230 is connected between the pair of mounting plates 210 and located between the pair of first drive rollers 220. An adsorption portion is formed on the lower surface of the suction cup 210. The suction cup 250 is located inside the first conveyor belt 240. Multiple segments of spaced through holes 241 are formed on the first conveyor belt 240 corresponding to the adsorption portion of the suction cup 210. The adsorption portion cooperates with the corresponding through holes 241 on the lower surface of the first conveyor belt 240 to collaboratively adsorb and convey the workpiece.

[0053] The film output mechanism 300 is located close to the film suction mechanism 200, and the film output mechanism 300 is located below the film suction mechanism 200.

[0054] The film suction mechanism 200 and the film output mechanism 300 are horizontally arranged, and a film output space is formed between the lower side of the first conveyor belt 240 and the upper side of the film output mechanism 300. The film suction mechanism 200 also includes a blocking mechanism 270, which is located at the end of a pair of mounting plates 210 away from the film output mechanism 300. The bottom height of the blocking mechanism 270 is lower than the height of the lower side of the first conveyor belt 240.

[0055] Specifically, the horizontal film arrangement device of this utility model embodiment includes a film suction mechanism 200 and a film output mechanism 300 arranged vertically, wherein the film suction mechanism 200 is located above the film output mechanism 300 and is close to the film output mechanism 300 (the projected positions of the two can overlap or be spaced apart). As an example, the horizontal film arrangement device may also be provided with a frame 100, one end of which is connected to the film suction mechanism (200) and the other end is connected to the film output mechanism 300.

[0056] The suction mechanism 200 of this embodiment includes a pair of mounting plates 210, at least a pair of first drive rollers 220, at least a second drive roller 230, and a suction cup 250. The pair of mounting plates 210 are arranged opposite each other. The pair of first drive rollers 220 are spaced apart between the pair of mounting plates 210 along a first direction (e.g., the extension direction of the mounting plates 210). A second drive roller 230 is also connected between the pair of mounting plates 210, and the second drive roller 230 is positioned above the first drive rollers 220. A first conveyor belt 240 is arranged around the outer periphery of the pair of first drive rollers 220 and the second drive roller 230. A suction cup 250 is also connected between a pair of mounting plates 210. The suction cup 250 is located between a pair of first drive rollers 220 and inside the first conveyor belt 240. The first conveyor belt 240 has multiple segments of spaced through holes 241. During the transmission of the first conveyor belt 240, each segment of through holes 241 cooperates with the adsorption part at the bottom of the suction cup 250 to realize the adsorption and transmission of a single workpiece (e.g., a silicon wafer), thereby realizing the continuous adsorption and arrangement of multiple workpieces without interference between them, effectively improving the efficiency of the device arrangement.

[0057] It should be noted that the first transmission rollers 220 in this embodiment can be a pair or more than a pair, as long as they are spaced apart along the extension direction of the mounting plate 210; in addition, the first conveyor belt 240 includes at least a pair or more, and this application does not make specific limitations here.

[0058] Furthermore, by adjusting the height distance between the second drive roller 230 and the pair of first drive rollers 220, the wafer suction mechanism 200 can achieve the purpose of having a first conveyor belt 240 of different lengths wrapped around the outer periphery of the second drive roller 230 and the pair of first drive rollers 220, thereby enabling the suction and conveying of silicon wafers of different sizes.

[0059] As an example, when the second drive roller 230 is lower than the pair of first drive rollers 220, the length of the first conveyor belt 240 wrapped around the outer periphery of the first drive rollers 220 and 230 is shorter. In this case, the spacing between adjacent through-hole strings 241 on the first conveyor belt 240 is short, which is suitable for adsorbing small-sized silicon wafers. When the second drive roller 230 is higher than the pair of first drive rollers 220, the length of the first conveyor belt 240 wrapped around the outer periphery of the first drive rollers 220 and 230 is longer. In this case, the spacing between adjacent through-hole strings 241 on the first conveyor belt 240 is long, which is suitable for adsorbing large-sized silicon wafers. It should be noted that the wafer stacking device of this invention can adjust the transmission speed of the first conveyor belt 240 by adjusting the rotational speed of the first drive rollers 220 and 230, thereby adjusting the wafer stacking speed.

[0060] Furthermore, the adsorbed workpiece is horizontally conveyed to the upper side of the wafer ejection mechanism 300 via the first conveyor belt 240, and finally the wafer ejection mechanism 300 discharges the silicon wafer horizontally. The wafer ejection space formed between the lower side of the first conveyor belt 240 and the upper side of the wafer ejection mechanism 300 can effectively limit the transmission of the silicon wafer, effectively improving the stability of the wafer arrangement. In other words, the horizontal wafer arrangement device of this embodiment adsorbs the single silicon wafer below it through the bottom surface of the adsorption mechanism 200, and then horizontally conveys it to the upper side of the adjacent wafer ejection mechanism 300 below, and finally the wafer ejection mechanism 300 discharges the single silicon wafer horizontally. Thus, the horizontal transport and arrangement of silicon wafers is achieved by the staggered connection of the adsorption mechanism 200 and the wafer ejection mechanism 300, and the connection between the adsorption mechanism 200 and the wafer ejection mechanism 300 forms a corresponding limiting space, further ensuring the stable and reliable output of silicon wafers, and eliminating the need for additional auxiliary mechanisms to ensure that the silicon wafer is in contact with the adsorption mechanism 200 and the wafer ejection mechanism 300.

[0061] Finally, the film arrangement device of this application also provides a blocking mechanism 270 at one end of a pair of mounting plates 210 away from the film output mechanism 300, and the bottom height of the blocking mechanism 270 is lower than the height of the lower side of the first conveyor belt 240.

[0062] As an example, such as Figure 6 and Figure 7As shown, the blocking mechanism 270 may include at least a pair of rollers. These rollers are positioned on both sides of the wafer-suction mechanism 200, with their bottoms lower than the lower side of the first conveyor belt 240. Thus, during the process of the wafer-suction mechanism 200 suctioning and conveying the current silicon wafer, while making rolling contact with the wafer, it can also block one end of the following silicon wafer downwards, causing the next silicon wafer to be in an inclined position (i.e., the side closer to the conveying exit is higher). Therefore, before the next silicon wafer is completely suctioned by the wafer-suction mechanism 200, its upper surface has a certain gap with the first conveyor belt 240, thereby reducing the probability of wafers being connected in succession and improving the wafer output quality. Additionally, the blocking mechanism 270 may also include at least a pair of baffles, etc., which are not specifically limited in this application.

[0063] In other words, the horizontal wafer arrangement device of this application can solve the problems of discontinuous wafer arrangement and low stability of silicon wafers. It should be noted that the horizontal wafer arrangement device of this application is not only applicable to the transfer arrangement of silicon wafers, but also applicable to the arrangement of similar thin-film products (such as semiconductors).

[0064] In a specific embodiment of this utility model, a hollow negative pressure cavity 253 is formed inside the suction cup 250, and the adsorption portion on the lower surface of the suction cup 250 is formed as a through groove 2521, through which the negative pressure cavity 253 communicates with the outside. A connecting hole 2511 is formed on the upper surface of the suction cup 250, through which the negative pressure cavity 253 communicates with the outside, and the connecting hole 2511 is used to connect a water pumping device.

[0065] As an example, the suction cup 250 may include a first cover plate 251 and a second cover plate 252 that engage with each other, such as Figures 3-5 As shown, the first cover plate 251 and the second cover plate 252 cooperate to form an I-shaped negative pressure cavity 253 in the middle. The first cover plate 251 serves as the upper surface of the suction cup 250, and has a connecting hole 2511 at the position corresponding to the negative pressure cavity 253. The connecting hole 2511 extends through the thickness direction of the first cover plate 251, connecting the negative pressure cavity 253 to the outside. The connecting hole 2511 is used to connect a pumping device to realize the suction function. The second cover plate 252 serves as the lower surface of the suction cup 250, and has through slots 2521 on both sides of the area of ​​the negative pressure cavity 253. As an example, the through slots 2521 can be a string of circular holes composed of multiple spaced circular holes, a string of waist-shaped holes composed of multiple spaced waist-shaped holes, etc., which are not specifically limited here. The through slots 2521 connect the negative pressure cavity 253 to the outside of the bottom of the suction cup 250, and the through slots 2521, together with a single string of through holes 241, adsorb a single silicon wafer.

[0066] In addition, the suction cup 250 also has a functional hole 254 that penetrates the first cover plate 251 and the second cover plate 252. This hole is used to allow water flow and prevent the silicon wafer from being adsorbed onto the bottom surface of the suction cup 250 when the suction cup 250 is not in a suction state.

[0067] As a specific embodiment of this utility model, such as Figures 5-7 As shown, the through slot 2521 and the through hole string 241 are located on the same straight line and are both arranged along the first direction.

[0068] In other words, the through-slot 2521 and the through-hole string 241 are located on the same straight line along the extension direction of the mounting plate 210. This allows the through-slot 2521 and the through-hole string 241 to precisely align and cooperate when the first conveyor belt 240 is in operation, improving the quality and efficiency of adsorption. It should be noted that the length of a single through-hole string 241 is less than the length of the silicon wafer to be adsorbed.

[0069] As a specific embodiment of this utility model, such as Figure 1 and Figure 2 As shown, the frame 100 may include a pair of fixing plates 110, which are arranged opposite to each other, and a suction mechanism 200 and a delivery mechanism 300 are arranged between the pair of fixing plates 110.

[0070] In other words, the rack 100 can be configured as a pair of oppositely arranged fixed plates 110, with the wafer suction mechanism 200 and the wafer ejection mechanism 300 connected sequentially in the area between the pair of fixed plates 110, thus forming a wafer ejection channel together with the wafer suction mechanism 200 and the wafer ejection mechanism 300 to ensure stable and reliable wafer ejection.

[0071] As a specific embodiment of this utility model, such as Figure 1 , Figure 2 as well as Figure 6 , Figure 7 As shown, the film suction mechanism 200 also includes a proximity switch 260, which is located at the end of a pair of mounting plates 210 away from the film dispensing mechanism 300.

[0072] In other words, the wafer suction mechanism 200 also has a proximity switch 260 installed at the end of the mounting plate 210 away from the wafer ejection mechanism 300, for detecting whether the stacked silicon wafers have reached a preset height. As an example, the proximity switch 260 may include a detection unit and a sensing unit located below the detection unit. The sensing unit may, for example, be a sensing ring movably sleeved at the bottom of the detection unit. During operation, the bottom silicon wafer rises and presses against the sensing ring to contact the upper detection unit, thereby detecting whether the stacked silicon wafers have reached the preset height.

[0073] As a specific embodiment of this utility model, the film output mechanism 300 may include a pair of third drive rollers 310.

[0074] A pair of third drive rollers 310 are arranged sequentially at intervals below the suction mechanism 200 along the first direction. The pair of third drive rollers 310 are located between a pair of fixed plates 110. A second conveyor belt 320 is arranged around the pair of third drive rollers 310 along the first direction.

[0075] As an example, such as Figure 1 and Figure 2 As shown, the wafer ejection mechanism 300 can be installed on the side away from the wafer suction mechanism 200 between a pair of fixed plates 110. A pair of third drive rollers 310 are sequentially connected at intervals along the extension direction of the fixed plates 110 (i.e., the extension direction of the mounting plate 210). A second conveyor belt 320 is wound around the pair of third drive rollers 310 along the extension direction of the fixed plates 110. The upper side of the second conveyor belt 320 receives the silicon wafers transmitted by the wafer suction mechanism 200 to achieve horizontal discharge of the silicon wafers. The structure is simple and reliable, and easy to disassemble and maintain.

[0076] Preferably, the upper side of the second conveyor belt 320 is lower than the lower side of the first conveyor belt 240.

[0077] As a specific embodiment of this utility model, such as Figure 1 and Figure 2 As shown, the horizontal sheet-laying device may further include a water jet device 400, which may include a main water jet 410 and at least a pair of side water jets 420. The main water jet 410 is connected to a pair of fixed plates 110 and located below the suction cup 310. The nozzle of the main water jet 410 is positioned facing the feeding direction of the workpiece, and is used to spray water flow towards the workpiece pile from the front. The pair of side water jets 420 are respectively located on the outside of the sheet-collecting mechanism 200, and the nozzles of the pair of side water jets 420 are positioned opposite each other, and are used to spray water flow towards the workpiece pile from the side.

[0078] Specifically, a water jet device 400 is installed on one end of a pair of fixed plates 110 near the suction cup 310. The water jet device 400 is located below the suction cup 350 and is used to spray high-pressure water jets onto the silicon wafer stack below the suction cup 350 for wafer separation. The water jet device 400 includes a main water jet 410 and a side water jet 420. The main water jet 410 is positioned directly opposite the silicon wafer feeding direction, with its nozzle facing the front of the silicon wafer stack, for separating the silicon wafer stack from the front. To further improve the separation efficiency, a side water jet 420 is also installed outside the pair of suction mechanisms 200. The nozzles of the side water jet 420 face the sides of the silicon wafer stack, for spraying water onto the silicon wafer stack from both sides of the silicon wafer feeding direction for wafer separation.

[0079] It should be noted that the side water jet 420 can be set towards the front side of the silicon wafer stack or towards the oblique side of the silicon wafer stack. For example, the water jet nozzle of the side water jet 420 can spray water in sections at a 45° angle towards the corner of the silicon wafer stack.

[0080] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A horizontal tray arrangement device, characterized in that, include: The suction mechanism includes: A pair of mounting plates; At least one pair of first drive rollers and at least one second drive roller, the pair of first drive rollers are spaced apart between the pair of mounting plates along a first direction, the second drive roller is adjustablely disposed between the pair of mounting plates, the second drive roller is located above the pair of first drive rollers, and a first conveyor belt is provided around the outer periphery of the pair of first drive rollers and the second drive roller; A suction cup is connected between a pair of mounting plates and located between a pair of first drive rollers, and an adsorption portion is formed on the lower surface of the suction cup; The suction cup is located inside the first conveyor belt. The first conveyor belt has a series of through holes arranged at intervals corresponding to the suction cup. The suction part cooperates with the through holes on the lower side of the first conveyor belt to jointly suction and convey the workpiece. A film ejection mechanism is disposed close to the film suction mechanism and is located below the film suction mechanism; The film suction mechanism and the film output mechanism are horizontally arranged, and a film output space is formed between the lower side of the first conveyor belt and the upper side of the film output mechanism. The film suction mechanism also includes a blocking mechanism, which is located at the end of the pair of mounting plates away from the film output mechanism. The bottom height of the blocking mechanism is lower than the height of the lower side of the first conveyor belt.

2. The horizontal sheet-laying device according to claim 1, characterized in that, The suction cup has a hollow negative pressure cavity inside. The suction portion on the lower surface of the suction cup is formed as a through groove, and the negative pressure chamber is connected to the outside through the through groove; The upper surface of the suction cup has a connecting hole, through which the negative pressure chamber is connected to the outside world. The connecting hole is used to connect a water pumping device.

3. The horizontal tray arrangement device according to claim 2, characterized in that, The through slot and the through hole string are located on the same straight line and are both arranged along the first direction.

4. The horizontal tray arrangement device according to claim 1, characterized in that, Also includes racks, One end of the frame is connected to the film suction mechanism, and the other end is connected to the film output mechanism.

5. The horizontal sheet-laying device according to claim 4, characterized in that, The frame includes a pair of fixed plates. A pair of fixed plates are arranged opposite to each other, and the suction mechanism (200) and the output mechanism are arranged between the pair of fixed plates.

6. The horizontal tray arrangement device according to claim 1, characterized in that, The suction mechanism also includes a proximity switch. The proximity switch is located at the end of the pair of mounting plates furthest from the film output mechanism.

7. The horizontal sheet-laying device according to claim 5, characterized in that, The output mechanism includes: A pair of third drive rollers are sequentially spaced below the suction mechanism along the first direction, and the pair of third drive rollers are located between the pair of fixed plates. A second conveyor belt is provided around the pair of third drive rollers along the first direction.

8. The horizontal tray arrangement device according to claim 7, characterized in that, The upper side of the second conveyor belt is lower than the lower side of the first conveyor belt.

9. The horizontal tray arrangement device according to claim 5, characterized in that, It also includes a water jet device, which includes a main water jet. The main water jet is connected to a pair of fixed plates and located below the suction cup. The nozzle of the main water jet is set facing the feeding direction of the workpiece, and is used to spray water flow towards the workpiece pile from the front.

10. The horizontal sheet-laying device according to claim 9, characterized in that, The water jet device also includes at least one pair of side water jets. A pair of side water jets are respectively disposed on the outside of the suction mechanism, and the spray nozzles of the pair of side water jets are arranged opposite each other for spraying water flow from the side toward the workpiece pile.

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