A kind of gluing device for circuit board production
By designing an automatic flipping and gluing mechanism for the gluing device used in circuit board production, the problem of manual flipping required for single-sided gluing in traditional gluing machines has been solved, realizing automated and efficient processing of double-sided gluing of circuit boards.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WENZHOU HANGSHENG ELECTRONIC TECH CO LTD
- Filing Date
- 2025-07-18
- Publication Date
- 2026-06-26
AI Technical Summary
Traditional glue-coating machines can only coat one side of the circuit board, requiring manual flipping, which makes the glue-coating process cumbersome and inefficient.
Design a gluing device for circuit board production. It adopts a flipping component and a gluing mechanism to achieve double-sided gluing of circuit boards in one process. Automatic flipping is achieved through the cooperation of flipping bracket and positioning pin. Combined with adjustable support legs and material picking mechanism, the operation process is simplified.
It automates the double-sided gluing process for circuit boards, eliminating the need for manual flipping, improving gluing and processing efficiency, simplifying the operation process, and providing a convenient user experience.
Smart Images

Figure CN224405627U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board coating technology, and in particular to a coating device for circuit board production. Background Technology
[0002] Circuit boards (PCBs) provide electrical connections for electronic components, supporting and interconnecting them in electronic devices. They are formed on an insulating substrate using specific processes to create conductive lines and pads, enabling electrical connections between components. PCB manufacturing typically involves applying adhesive using a coating machine. However, in practice, we've found that traditional coating machines can only coat one side of the PCB. Coating the other side requires manual removal of the board, flipping it over, and then placing it back into the machine. This constant flipping increases the complexity and efficiency of the coating process. Conversely, grouping PCBs coated on one side and flipping them all together for coating adds another step, further reducing efficiency.
[0003] To address the aforementioned problems, this utility model provides improvements. Summary of the Invention
[0004] This utility model proposes a gluing device for circuit board production, which solves the above-mentioned problems existing in the use of the prior art.
[0005] The technical solution of this utility model is implemented as follows: A glue-applying device for circuit board production includes a glue-applying device body. A turntable is fixedly installed at the output end of the top of the glue-applying device body. A rotating bracket with equal spacing is embedded in the top of the turntable. A rotating component is provided on one side of the rotating bracket. The rotating bracket is movably installed on the turntable through the rotating component. A fixing plate is fixedly installed at one end of the inner side of the rotating bracket. A movable groove is opened at one end of the inner side of the rotating bracket. An adjusting plate is slidably installed in the inner cavity of the movable groove. Two limiting blocks are slidably installed on the inner side of the adjusting plate. Both limiting blocks are fixedly connected to the inner wall of the movable groove. An extrusion block located above the adjusting plate is slidably installed up and down in the inner cavity of the movable groove. A fixing threaded sleeve is fixedly connected to one side of the top of the rotating bracket. An adjusting screw is rotatably installed inside the fixing threaded sleeve. The bottom end of the adjusting screw is rotatably installed on the extrusion block. An adapting inclined surface adapted to the extrusion block is provided on the top of the adjusting plate.
[0006] The gluing device for circuit board production described above further includes a flipping assembly comprising a fixed sleeve fixedly connected to the inside of a turntable, wherein a rotating rod is rotatably mounted in the inner cavity of the fixed sleeve, and one end of the rotating rod is fixedly connected to a flipping bracket.
[0007] The present invention further comprises the following: the top and bottom of the rotating rod are provided with positioning slots, the top of the inner cavity of the fixed sleeve is provided with a sliding groove, and the inner cavity of the sliding groove is slidably fitted with a positioning pin that matches the positioning slot.
[0008] The present invention further comprises the following: a spring is fixedly connected to the end of the positioning pin away from the rotating rod, and the end of the spring away from the positioning pin is fixedly connected to the inner wall of the slide groove.
[0009] The present invention further comprises the following: a glue-applying device for circuit board production as described above, wherein a glue-applying mechanism adapted to a turntable is detachably installed on one side of the top of the glue-applying device body, and a plurality of adjustable support legs are fixedly installed on the bottom of the glue-applying device body.
[0010] The present invention further comprises the following: a conveying device is detachably installed on one side of the top of the main body of the adhesive coating device, and a material picking mechanism adapted to the conveying device is detachably installed on one side of the top of the main body of the adhesive coating device.
[0011] The present invention further comprises the following: the top of the adjusting screw is provided with a hexagonal groove, the top of the adjusting screw is provided with a straight groove communicating with the hexagonal groove, and the surface of the adjusting screw is provided with uniformly distributed anti-slip strips.
[0012] In summary, the beneficial effects of this utility model are as follows:
[0013] 1. This utility model adopts a structural design that allows for double-sided gluing of circuit boards. The circuit boards can be flipped and adjusted in one processing step without repeated handling, eliminating the need for secondary gluing, simplifying the processing steps, speeding up the gluing process, improving the efficiency of gluing, and providing convenience for users.
[0014] 2. This utility model, through the arrangement of a fixed sleeve, positioning pin, spring, positioning slot, and rotating rod, allows the rotating rod to rotate within the fixed sleeve when the flipping bracket rotates to flip the circuit board. Simultaneously, the two positioning slots change position accordingly. As the flipping bracket and rotating rod rotate, the positioning pin is pressed into the sliding groove, compressing the spring. After the flipping bracket rotates 180 degrees, the spring returns the positioning pin to its original position, locking it into the positioning slot at its current location. This fixes the flipping bracket in its current state, completing the flipping adjustment of the circuit board and enabling double-sided adhesive coating, providing convenience for users.
[0015] 3. This utility model, through the setting of the glue application mechanism and the adjustable support legs, can support and position the machine after it has been moved and stopped, preventing the machine from shaking randomly during operation and ensuring the normal operation of the circuit board glue application. The glue application mechanism is the glue application device of the glue application machine. When the circuit board is moved to the position of the glue application mechanism, the glue application mechanism can work to apply glue to the circuit board.
[0016] 4. This utility model uses a material handling mechanism and a conveying device. The conveying device is used to send out the processed circuit board workpiece, thereby facilitating the subsequent processing of the circuit board. The material handling mechanism is used to grab the circuit board workpiece and transfer it from the turntable to the conveying device. This is the prior art. It should be noted that the specific structure of the conveying device and the material handling mechanism can refer to the corresponding type of machine in a real factory.
[0017] 5. This utility model, through the setting of the adjusting screw, has hexagonal grooves and slotted grooves on the adjusting screw, which allows users to easily rotate the adjusting screw with corresponding tools, providing assistance and convenience for users' operation. The anti-slip strip can prevent the user's hand from slipping when manually rotating the adjusting screw, thus providing convenience for the user's work. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0020] Figure 2 This is a schematic diagram of the three-dimensional structure of the turntable;
[0021] Figure 3This is a three-dimensional structural diagram of the flip-up bracket;
[0022] Figure 4 This is a three-dimensional sectional view of the flip-up bracket.
[0023] Figure 5 This is a partial three-dimensional exploded view of the present invention;
[0024] Figure 6 This is a schematic diagram of the three-dimensional structure of the extrusion block.
[0025] In the diagram: 1. Main body of the glue application device; 2. Turntable; 3. Tilting bracket; 4. Fixed plate; 5. Movable groove; 6. Limiting block; 7. Adjusting plate; 8. Fixed threaded sleeve; 9. Adjusting screw; 10. Extrusion block; 11. Adaptive inclined plane; 12. Rotating rod; 13. Fixed sleeve; 14. Positioning pin; 15. Spring; 16. Positioning slot; 17. Glue application mechanism; 18. Conveying device; 19. Material handling mechanism; 20. Adjustable support leg. Detailed Implementation
[0026] The following will refer to the appendix in the embodiments of this utility model. Figure 1-6 The technical solutions in the embodiments of this utility model are clearly and completely described herein. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model. Example
[0027] A glue-applying device for circuit board production includes a main body 1. A turntable 2 is fixedly installed at the output end of the top of the main body 1. A rotating bracket 3 with equal spacing is embedded in the top of the turntable 2. A rotating component is provided on one side of the rotating bracket 3. The rotating bracket 3 is movably mounted on the turntable 2 through the rotating component. A fixing plate 4 is fixedly installed at one end of the inner side of the rotating bracket 3. A movable groove 5 is opened at one end of the inner side of the rotating bracket 3. An adjusting plate 7 is slidably installed in the inner cavity of the movable groove 5. Two limiting blocks 6 are slidably installed in the inner side of the adjusting plate 7. Both limiting blocks 6 are fixedly connected to the inner wall of the movable groove 5. An extrusion block 10 located above the adjusting plate 7 is slidably installed in the inner cavity of the movable groove 5. A fixing threaded sleeve 8 is fixedly connected to one side of the top of the rotating bracket 3. An adjusting screw 9 is rotatably installed inside the fixing threaded sleeve 8. The bottom end of the adjusting screw 9 is rotatably installed on the extrusion block 10. An adapting inclined surface 11 adapted to the extrusion block 10 is provided on the top of the adjusting plate 7.
[0028] The specific working process is as follows: First, turn the adjusting screw 9, which will cause the extrusion block 10 to move downwards. It should be noted that the extrusion block 10 slides up and down within the movable groove 5. This can be seen from... Figure 3The upper part of the movable groove 5 has an opening that connects to the outside, allowing the extrusion block 10 to slide up and down. The fixing threaded sleeve 8 also limits the extrusion block 10 to prevent it from falling. The fixing threaded sleeve 8 is fixed to the turntable 2 and is threadedly connected to the adjusting screw 9. Therefore, when the adjusting screw 9 is turned clockwise, it moves downwards; conversely, turning it counterclockwise moves it upwards, thus moving the extrusion block 10 up and down. The following explanation only uses clockwise rotation. When the adjusting screw 9 moves downwards, it pushes the extrusion block 10 down. At this time, the inclined surface at the bottom of the extrusion block 10 is in contact with the matching inclined surface 11 on the adjusting plate 7. As the extrusion block 10 is pushed, the inclined surface at the bottom of the extrusion block 10 and the matching inclined surface 11 on the adjusting plate 7... The inclined planes 11 cooperate with each other, and the pressing block 10 will press the adjusting plate 7 towards the fixed plate 4. At the same time, the adjusting plate 7 also slides in the movable groove 5, and the two limiting blocks 6 also slide inside the adjusting plate 7. In this way, the adjusting plate 7 can be limited, thereby ensuring the stability of the movement of the adjusting plate 7. Before this, the circuit board must be placed between the adjusting plate 7 and the fixed plate 4, and one end of the circuit board must be first locked in the groove on the fixed plate 4. Then, the other side of the circuit board is aligned with the groove on the adjusting plate 7. Then, as the adjusting plate 7 moves, it cooperates with the fixed plate 4 to clamp and fix the circuit board. Then, driven by the glue applicator body 1, the turntable 2 is rotated, and then all the flipping brackets installed on the turntable 2... 3 will also rotate and change position, and the circuit board will also change position accordingly. When the circuit board rotates to the position of the glue application mechanism 17, the glue application mechanism 17 will perform the glue application operation. Then the circuit board continues to rotate forward, and the subsequent circuit board will rotate to fill the position of the glue application mechanism 17. This process is repeated. Afterwards, the user can flip the circuit board with glue applied on one side during the interval when the turntable 2 stops rotating, so that the un-glued side faces upward. When flipping the flipping bracket 3, the flipping bracket 3 will drive the rotating rod 12 to rotate within the fixed sleeve 13. Then the positioning pin 14 will be squeezed out of the current positioning slot 16 by the rotating rod 12, and at the same time, the spring 15 will be compressed. Until the flipping bracket 3 is flipped 180 degrees, the spring 15 will press the positioning pin 14 to move out of the current positioning slot 16. Positioning pin 14 springs back to its original position and then engages with the positioning slot 16 at the current position, thus fixing the flip bracket 3 in its current state. It should be noted that the spring force of spring 15 is designed to be relatively large, so users need to exert force to flip the flip bracket 3. This ensures the stability of the flip bracket 3 during movement and subsequent glue application, guaranteeing the normal operation of the circuit board glue application and providing convenience for users. Therefore, a structure design that allows for double-sided glue application of the circuit board is adopted. The circuit board can be flipped and adjusted in one processing step without repeated handling, eliminating the need for secondary glue application, simplifying the processing steps, accelerating the glue application speed, and improving the efficiency of the circuit board glue application process.To provide convenience for users, the circuit board, after being coated with adhesive on both sides, is picked up by the picking mechanism 19 and then transferred to the conveyor 18 for delivery. Therefore, the design allows for double-sided adhesive coating of the circuit board. The circuit board can be flipped and adjusted in a single processing step without repeated picking and placing, eliminating the need for secondary adhesive coating, simplifying the processing steps, accelerating the adhesive coating speed, and improving the efficiency of the adhesive coating process, thus providing convenience for users.
[0029] The flipping assembly includes a fixed sleeve 13 fixedly connected to the inner side of the turntable 2. A rotating rod 12 is rotatably installed in the inner cavity of the fixed sleeve 13. One end of the rotating rod 12 is fixedly connected to the flipping bracket 3. Positioning slots 16 are provided at the top and bottom of the rotating rod 12. A sliding groove is provided at the top of the inner cavity of the fixed sleeve 13. A positioning pin 14 that matches the positioning slot 16 is slidably installed in the inner cavity of the sliding groove. A spring 15 is fixedly connected to the end of the positioning pin 14 away from the rotating rod 12. The end of the spring 15 away from the positioning pin 14 is fixedly connected to the inner wall of the sliding groove.
[0030] Specifically, the fixed sleeve 13, positioning pin 14, spring 15, positioning slot 16, and rotating rod 12 are configured such that when the flipping bracket 3 rotates and flips, the rotating rod 12 rotates within the fixed sleeve 13, and the two positioning slots 16 also change position accordingly. When the flipping bracket 3 and the rotating rod 12 rotate, they squeeze the positioning pin 14 into the slide groove, and compress the spring 15. After the flipping bracket 3 flips 180 degrees, the spring 15 causes the positioning pin 14 to spring back to its original position. Then, the positioning pin 14 engages with the positioning slot 16 at its current position, thus fixing the flipping bracket 3 in its current state, completing the flipping adjustment of the circuit board, realizing the double-sided gluing process of the circuit board, and providing convenience for users' work.
[0031] A glue-applying mechanism 17 adapted to the turntable 2 is detachably installed on one side of the top of the glue-applying device body 1, and multiple adjustable support legs 20 are fixedly installed on the bottom of the glue-applying device body 1.
[0032] Specifically, the glue application mechanism 17 and the adjustable support leg 20 are configured such that the adjustable support leg 20 can support and position the machine after it has moved and stopped, preventing the machine from shaking randomly during operation and ensuring the normal operation of the circuit board glue application. The glue application mechanism 17 is the glue application device of the glue application machine. When the circuit board is moved to the position of the glue application mechanism 17, the glue application mechanism 17 can work to apply glue to the circuit board. This is existing technology and will not be explained in detail in this article.
[0033] A conveying device 18 is detachably installed on one side of the top of the glue coating device body 1, and a material picking mechanism 19 adapted to the conveying device 18 is detachably installed on one side of the top of the glue coating device body 1.
[0034] Specifically, the material handling mechanism 19 and the conveying device 18 are configured such that the conveying device 18 is used to send out the processed circuit board workpiece, thereby facilitating the subsequent processing of the circuit board, while the material handling mechanism 19 is used to grab the circuit board workpiece and transfer it from the turntable 2 to the conveying device 18. This is the prior art. It should be noted that the specific structure of the conveying device 18 and the material handling mechanism 19 can be referenced from the corresponding type of machine in a real factory.
[0035] The top of the adjusting screw 9 has a hexagonal groove, and the top of the adjusting screw 9 has a straight groove that communicates with the hexagonal groove. The surface of the adjusting screw 9 is provided with evenly distributed anti-slip strips.
[0036] Specifically, the adjusting screw 9 is designed with hexagonal and slotted grooves, allowing users to easily rotate it with corresponding tools, thus providing assistance and convenience for operation. The anti-slip strip prevents the user's hand from slipping when manually rotating the adjusting screw 9, further enhancing user convenience.
[0037] It should be noted that the functions to be achieved by each hardware component in this utility model are supported by a large number of mature technologies and belong to the prior art. The essence of this utility model is to optimize and combine existing hardware and its connection methods for specific application scenarios to meet the adaptation requirements of specific application scenarios and solve the problems raised in the background technology (without involving improvements to the internal software of the hardware).
[0038] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A gluing device for a circuit board production, comprising a gluing device main body (1), characterized by: A turntable (2) is fixedly installed at the output end of the main body (1) of the glue application device. A rotating bracket (3) with equal spacing is embedded in the top of the turntable (2). A rotating component is provided on one side of each rotating bracket (3). The rotating bracket (3) is movably mounted on the turntable (2) via the rotating component. A fixing plate (4) is fixedly installed at one end of the inner side of the rotating bracket (3). A movable groove (5) is opened at one end of the inner side of the rotating bracket (3). An adjusting plate (7) is slidably installed in the inner cavity of the movable groove (5). The inner side of the adjusting plate (7)... Two limiting blocks (6) are slidably installed. Both limiting blocks (6) are fixedly connected to the inner wall of the movable groove (5). The inner cavity of the movable groove (5) is slidably installed with an extrusion block (10) located above the adjusting plate (7). A fixed threaded sleeve (8) is fixedly connected to one side of the top of the flipping bracket (3). An adjusting screw (9) is rotatably installed inside the fixed threaded sleeve (8). The bottom end of the adjusting screw (9) is rotatably installed on the extrusion block (10). The top of the adjusting plate (7) is provided with an adapting inclined surface (11) that matches the extrusion block (10).
2. The adhesive coating device for circuit board production according to claim 1, characterized in that: The flipping assembly includes a fixed sleeve (13) fixedly connected to the inside of the turntable (2), and a rotating rod (12) is rotatably installed in the inner cavity of the fixed sleeve (13). One end of the rotating rod (12) is fixedly connected to the flipping bracket (3).
3. The adhesive coating device for circuit board production according to claim 2, characterized in that: The top and bottom of the rotating rod (12) are provided with positioning slots (16), and the top of the inner cavity of the fixed sleeve (13) is provided with a sliding groove. The inner cavity of the sliding groove is slidably installed with a positioning pin (14) that matches the positioning slot (16).
4. The adhesive coating device for circuit board production according to claim 3, characterized in that: A spring (15) is fixedly connected to the end of the positioning pin (14) away from the rotating rod (12), and the end of the spring (15) away from the positioning pin (14) is fixedly connected to the inner wall of the slide groove.
5. The adhesive coating device for circuit board production according to claim 1, characterized in that: The glue applicator body (1) has a glue applicator mechanism (17) adapted to the turntable (2) detachably installed on one side of the top. The glue applicator body (1) has multiple adjustable support legs (20) fixedly installed at the bottom.
6. The adhesive coating device for circuit board production according to claim 1, characterized in that: A conveying device (18) is detachably installed on one side of the top of the glue coating device body (1), and a material picking mechanism (19) adapted to the conveying device (18) is detachably installed on one side of the top of the glue coating device body (1).
7. The adhesive coating device for circuit board production according to claim 1, characterized in that: The top of the adjusting screw (9) is provided with a hexagonal groove, and the top of the adjusting screw (9) is provided with a straight groove that communicates with the hexagonal groove. The surface of the adjusting screw (9) is provided with uniformly distributed anti-slip strips.