A cleaning device for IC chip production

Abstract

The utility model discloses a kind of cleaning device for IC chip production, including plasma cleaning machine main body and auxiliary mechanism, the front of plasma cleaning machine main body is rotatably connected with sealing door, auxiliary mechanism is located at the front of plasma cleaning machine main body, auxiliary mechanism is used to store the IC chip to be cleaned and the IC chip cleaned, auxiliary mechanism includes auxiliary frame and placing frame, auxiliary frame is located at the side of plasma cleaning machine main body, and placing frame is located in the inside of auxiliary frame.The utility model is supported to placing frame by utilizing the mutual cooperation of auxiliary frame, placing frame, mid-plate and mounting assembly, placing frame is placed to IC chip, it is favorable to the IC chip to be cleaned and the IC chip after cleaning is placed, it is convenient to IC chip is taken nearby in time, it is favorable to the IC chip cleaned is taken out, the IC chip to be cleaned can be directly placed into the inside of plasma cleaning machine main body nearby.

Description

Technical Field

[0001] This utility model relates to the field of IC chip manufacturing and cleaning, and in particular to a cleaning device for IC chip manufacturing. Background Technology

[0002] IC chips are typically made by integrating a large number of microelectronic components onto a plastic substrate to form an integrated circuit and then fabricating it into a chip. During the production of IC chips, a cleaning operation is usually performed, which requires the use of IC chip cleaning equipment.

[0003] Application No. 202320049260.2 mentions a cleaning device for IC chip production, including a plasma cleaner body. Both sides of the plasma cleaner body are hinged with sealing doors. The sealing doors are opened to place the IC chip inside the plasma cleaner body for cleaning.

[0004] When placing IC chips, the IC chips to be cleaned are usually taken from elsewhere, and then the cleaned IC chips are removed from the inside of the plasma cleaner and placed in a dedicated placement location. However, this method is inconvenient for staff to place the IC chips and has certain limitations. Utility Model Content

[0005] The purpose of this invention is to provide a cleaning device for IC chip production, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a cleaning device for IC chip production, comprising:

[0007] The main body of the plasma cleaner has a sealed door rotatably connected to its front side;

[0008] An auxiliary mechanism, located on the front of the plasma cleaner body, is used to store the IC chip to be cleaned and the cleaned IC chip. The auxiliary mechanism includes:

[0009] An auxiliary frame is located on the side of the main body of the plasma cleaner;

[0010] A placement frame, which is located inside the auxiliary frame.

[0011] Preferably, the auxiliary mechanism further includes:

[0012] The mounting component is located at the bottom of the auxiliary frame and is used to fix the auxiliary frame to the main body of the plasma cleaner.

[0013] The auxiliary component is located on the placement frame;

[0014] A partition plate is fixedly embedded inside the auxiliary frame and is located between adjacent placement frames.

[0015] Preferably, the auxiliary component includes:

[0016] An operation frame, which is fixedly connected to the outside of the placement frame;

[0017] A sealing cap, which is slidably fitted onto the outside of the placement frame.

[0018] Preferably, the mounting components include:

[0019] Mounting plate, which is fixedly connected to the bottom of the auxiliary frame;

[0020] A positioning plate is fixedly connected to the side of the plasma cleaner body. A through groove is provided on the side of the mounting plate, and the positioning plate is slidably inserted into the inner cavity of the through groove.

[0021] Preferably, the mounting components further include:

[0022] A diagonal brace plate, which is fixedly connected between the mounting plate and the auxiliary frame;

[0023] A locking element, which is located on a mounting plate.

[0024] Preferably, the locking element includes:

[0025] A threaded column is fixedly connected to the side of the plasma cleaner body. A circular groove is provided on the side of the mounting plate, and the threaded column is slidably inserted into the inner cavity of the circular groove.

[0026] A locking ring, wherein the locking ring is threadedly sleeved on the outside of the threaded post.

[0027] The technical effects and advantages of this utility model are as follows:

[0028] This invention utilizes the cooperation of an auxiliary frame, a placement frame, a partition plate, a sealing cover, and an installation component. The auxiliary frame supports the placement frame, the placement frame holds the IC chip, and the placement frame is located inside the auxiliary frame. The sealing cover protects the interior of the placement frame, and the installation component secures and installs the auxiliary frame. This facilitates the placement of both the IC chip to be cleaned and the cleaned IC chip, enabling centralized processing and convenient, timely retrieval of the IC chip. Furthermore, after the cleaned IC chip is removed, the IC chip to be cleaned can be directly placed into the main body of the plasma cleaner, reducing the workload of workers and improving cleaning efficiency. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0030] Figure 2 This is a schematic diagram of the auxiliary frame structure of this utility model.

[0031] Figure 3 This utility model Figure 1 Enlarged structural diagram at point A in the middle.

[0032] Figure 4 This utility model Figure 1 Enlarged structural diagram at point B.

[0033] In the diagram: 1. Main body of the plasma cleaner; 2. Sealed door; 3. Auxiliary mechanism; 31. Auxiliary frame; 32. Placement frame; 33. Middle partition plate; 34. Operation frame; 35. Sealing cover; 36. Mounting plate; 37. Positioning plate; 38. Diagonal brace plate; 39. Threaded column; 310. Locking ring. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] This utility model provides, for example Figure 1-3 The image shows a cleaning apparatus used in IC chip production.

[0036] Example 1: Includes a plasma cleaner body 1 and an auxiliary mechanism 3. The principle of cleaning IC chips using the plasma cleaner body 1 is gas ionization. The IC chip to be cleaned is taken out from the inside of the placement frame 32 and placed into a vacuum chamber. Then, an appropriate amount of gas is introduced, and the gas is ionized by a high-frequency electric field or microwave field to form plasma. The plasma consists of positively charged ions, negatively charged electrons, and neutral particles. Then, a surface reaction occurs. The high-energy particles in the plasma collide with contaminants on the object surface, removing the surface contaminants through physical bombardment and chemical reaction. These high-energy particles include ions, electrons, and free radicals, which can react with organic contaminants, oxides, and particles on the surface, decomposing them into volatile gases or small molecules. Then, the decomposed contaminants are discharged from the chamber by a vacuum pump, completing the cleaning process. The front of the plasma cleaner body 1 is connected to a sealing door 2, which facilitates the closure of the interior of the plasma cleaner body 1. The auxiliary mechanism 3 is located on the front of the plasma cleaner body 1. The auxiliary mechanism 3 is used to store the IC chip to be cleaned and the IC chip after cleaning. The auxiliary mechanism 3 includes an auxiliary frame 31 and a placement frame 32. The auxiliary frame 31 supports the placement frame 32 and facilitates the placement of the placement frame 32. There are two placement frames 32, which can be used to place the IC chip to be cleaned and the IC chip after cleaning, respectively. This facilitates the placement of the IC chip on the plasma cleaner body 1, and makes it easier to pick up the IC chip nearby, saving the staff from having to pick up the IC chip back and forth. This makes the operation more convenient and reduces the labor intensity of the staff. The auxiliary frame 31 is located on the side of the plasma cleaner body 1, and the placement frame 32 is located inside the auxiliary frame 31.

[0037] Furthermore, the auxiliary mechanism 3 also includes an installation component, auxiliary parts, and a partition plate 33. The partition plate 33 facilitates the division of the interior of the auxiliary frame 31 to store the two placement frames 32 separately. The installation component is located at the bottom of the auxiliary frame 31 and is used to fix the auxiliary frame 31 to the plasma cleaner body 1. The auxiliary parts are located on the placement frames 32. The partition plate 33 is fixedly embedded in the interior of the auxiliary frame 31 and is located between adjacent placement frames 32.

[0038] Specifically, the auxiliary components include an operating frame 34 and a sealing cover 35. The operating frame 34 facilitates the handling and removal of the placement frame 32. The sealing cover 35 helps to cover the interior of the placement frame 32, preventing external impurities from entering and protecting the IC chip. A rubber frame can be glued to the inner wall of the sealing cover 35, which helps to create a certain friction between the sealing cover 35 and the placement frame 32. The operating frame 34 is fixedly connected to the outside of the placement frame 32, and the sealing cover 35 is slidably sleeved on the outside of the placement frame 32.

[0039] Specifically, the mounting components include a mounting plate 36 and a positioning plate 37. The mounting plate 36 provides support for the auxiliary frame 31, facilitating its installation. The positioning plate 37 connects to the mounting plate 36, providing support for its installation and increasing the stability of the auxiliary frame 31. The mounting plate 36 is fixedly connected to the bottom of the auxiliary frame 31, and the positioning plate 37 is fixedly connected to the side of the plasma cleaner body 1. A through groove is provided on the side of the mounting plate 36, and the positioning plate 37 slides through the inner cavity of the through groove.

[0040] More specifically, the mounting components also include a bracing plate 38 and a locking element. The bracing plate 38 provides bottom support for the mounting plate 36 and the auxiliary frame 31 to increase the stability of the auxiliary frame 31. The bracing plate 38 is fixedly connected between the mounting plate 36 and the auxiliary frame 31, and the locking element is located on the mounting plate 36.

[0041] Example 2: Based on Example 1, the locking component includes a threaded post 39 and a locking ring 310. The threaded post 39 facilitates the connection with the mounting plate 36, thereby facilitating the positioning of the mounting plate 36. The locking ring 310 helps to limit the relative position of the mounting plate 36 and the threaded post 39, thereby facilitating the installation and disassembly of the auxiliary frame 31 for use as needed. The threaded post 39 is fixedly connected to the side of the plasma cleaner body 1. A circular groove is provided on the side of the mounting plate 36. The threaded post 39 is slidably inserted into the inner cavity of the circular groove. The locking ring 310 is threadedly sleeved on the outside of the threaded post 39.

[0042] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A cleaning apparatus for IC chip production, characterized by comprising: include: The plasma cleaner body (1) has a sealing door (2) rotatably connected to the front of the plasma cleaner body (1). An auxiliary mechanism (3) is located on the front of the plasma cleaner body (1). The auxiliary mechanism (3) is used to store the IC chip to be cleaned and the cleaned IC chip. The auxiliary mechanism (3) includes: Auxiliary frame (31) is located on the side of the plasma cleaner body (1); Placement frame (32), which is located inside auxiliary frame (31).

2. The cleaning apparatus for IC chip production according to claim 1, wherein The auxiliary mechanism (3) also includes: The mounting component is located at the bottom of the auxiliary frame (31) and is used to fix the auxiliary frame (31) to the plasma cleaner body (1); An auxiliary component, which is located on the placement frame (32); The partition (33) is fixedly embedded inside the auxiliary frame (31) and is located between adjacent placement frames (32).

3. The cleaning apparatus for IC chip production according to claim 2, wherein The auxiliary components include: Operation frame (34), the operation frame (34) is fixedly connected to the outside of the placement frame (32); A sealing cap (35) is slidably fitted onto the outside of the placement frame (32).

4. The cleaning apparatus for IC chip production according to claim 2, wherein The installation components include: Mounting plate (36), which is fixedly connected to the bottom of auxiliary frame (31); Positioning plate (37) is fixedly connected to the side of the plasma cleaner body (1). The side of the mounting plate (36) is provided with a through groove. The positioning plate (37) is slidably inserted into the inner cavity of the through groove.

5. A cleaning apparatus for IC chip production according to claim 4, characterized in that, The installation components also include: A diagonal brace (38) is fixedly connected between the mounting plate (36) and the auxiliary frame (31); A locking element is located on the mounting plate (36).

6. A cleaning apparatus for IC chip production according to claim 5, characterized in that, The locking element includes: Threaded column (39), the threaded column (39) is fixedly connected to the side of the plasma cleaner body (1), the side of the mounting plate (36) is provided with a circular groove, and the threaded column (39) is slidably inserted into the inner cavity of the circular groove. Locking ring (310), which is threaded onto the outside of threaded post (39).

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