Heat transfer printing apparatus
By integrating two heating surfaces of the heating element into the heat transfer equipment for hot baking and hot pressing, the problem of large equipment size is solved, achieving miniaturization and cost reduction, while improving the quality of the heat transfer film.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN ANKER SMART TECH CO LTD
- Filing Date
- 2025-05-21
- Publication Date
- 2026-06-26
Smart Images
Figure CN224408693U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of printing equipment technology, and in particular to a heat transfer printing device. Background Technology
[0002] Related heat transfer equipment typically includes a curing device for heat-baking the substrate to be cured and a pressing device for hot-pressing the substrate to be transferred. In addition, heat transfer equipment usually also needs to have a feeding device for feeding the substrate to be cured into the curing device and a feeding device for feeding the substrate to be transferred into the pressing device, which results in the overall size of the heat transfer equipment being large, and thus the heat transfer equipment occupying a large space. Utility Model Content
[0003] An embodiment of this application provides a heat transfer printing device, the heat transfer printing device comprising:
[0004] A heating element having a first heating surface and a second heating surface, wherein the first heating surface and the second heating surface are respectively disposed at different positions of the heating element;
[0005] A heat-drying component, movably connected to a heating element, is arranged with a first heating surface to form a heat-drying cavity, which is used to accommodate the substrate to be cured; and
[0006] A pressing component is movably connected to a heating element, and the pressing component is positioned opposite to the second heating surface.
[0007] Among them, the heat transfer equipment has a hot baking state and a hot pressing state;
[0008] In the hot-drying state, the substrate to be cured is placed in the hot-drying chamber, and the first heating surface heats up to heat the substrate to be cured.
[0009] Under hot pressing conditions, the substrate to be transferred is placed between the pressing component and the second heating surface. The second heating surface heats up and adheres to the pressing component to perform hot pressing on the substrate to be transferred.
[0010] The beneficial effects of the heat transfer equipment provided in this application are:
[0011] This application integrates a heating structure for hot-baking the substrate to be cured and a heating structure for hot-pressing the substrate to be transferred onto the same heating element, serving as the first and second heating surfaces of the heating element. The first and second heating surfaces are positioned at different locations on the heating element to avoid interference between the hot-baking and hot-pressing functions. The hot-baking element and the pressing element are movably connected to the heating element, so that the hot-baking element and the first heating surface form a hot-baking cavity in the hot-baking state to heat-bake the substrate to be cured, and the pressing element is positioned opposite and in contact with the second heating element in the hot-pressing state to hot-press the substrate to be transferred. Thus, the hot-baking and hot-pressing functions of the heat transfer equipment do not need to be achieved by separate curing and pressing devices, but can be achieved by an integrated device that combines hot-baking and hot-pressing functions. This helps to reduce the size of the heat transfer equipment, thereby reducing the space occupied by the heat transfer equipment and reducing the cost of the heat transfer equipment. Attached Figure Description
[0012] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.
[0013] Figure 1 This is a three-dimensional structural schematic diagram of a heat transfer device provided in some embodiments of this application;
[0014] Figure 2 yes Figure 1 A side view of the heat transfer equipment in the embodiment;
[0015] Figure 3 yes Figure 1 A top view of the heat transfer equipment in the embodiment;
[0016] Figure 4 yes Figure 3 The diagram shows a cross-sectional view of the heat transfer equipment cut along section AA.
[0017] Figure 5 This is a cross-sectional structural schematic diagram of a heat transfer device provided in other embodiments of this application. Detailed Implementation
[0018] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.
[0019] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0020] This application provides a heat transfer printing device, which can be applied to, but is not limited to, DTF (Direct-to-Film) printing. DTF printing is a digital printing technology that involves directly printing ink onto a heat transfer film, then adding hot melt adhesive powder to the ink and heating and curing it to ensure the hot melt adhesive powder adheres evenly to the ink pattern, forming a transferable hot melt adhesive layer. High temperature and pressure are then used to activate and adhere the hot melt adhesive layer on the heat transfer film to the target material, thus completing the process of transferring the ink pattern to the target material. The target material can be, for example, but is not limited to, cotton, polyester, blended fabrics, and other materials. The heat transfer printing device provided in this application can be used for heat curing and hot pressing of the heat transfer film.
[0021] Please see 1 and Figure 2 , Figure 1 This is a three-dimensional structural schematic diagram of the heat transfer equipment provided in some embodiments of this application. Figure 2 yes Figure 1 A side view of the thermal transfer equipment in the embodiment.
[0022] In this embodiment, the heat transfer equipment 10 has a baking state and a hot pressing state. In the baking state, the heat transfer equipment 10 can be used to bake the substrate to be cured. In the hot pressing state, the heat transfer equipment 10 can be used to hot press the substrate to be transferred. The substrate to be cured refers to a heat transfer film with an ink pattern printed on it and hot melt adhesive added, where the hot melt adhesive has not been cured by heat to form a transferable hot melt adhesive layer. The substrate to be transferred refers to a heat transfer film with a transferable hot melt adhesive layer. After curing, the substrate to be cured can form the substrate to be transferred.
[0023] The heat transfer printing equipment 10 includes a heating element 100, which has a first heating surface 101 and a second heating surface 102. The first heating surface 101 is used to heat-bake the substrate to be cured, thereby curing it. The second heating surface 102 is used to hot-press the substrate to be transferred, thereby transferring the pattern on the substrate to the target material. The first heating surface 101 and the second heating surface 102 are respectively disposed at different positions on the heating element 100.
[0024] The first heating surface 101 and the second heating surface 102 can be formed on different parts of the heating element 100. Optionally, the first heating surface 101 and the second heating surface 102 are arranged opposite to each other. The first heating surface 101 and the second heating surface 102 can be two opposite surfaces of the heating element 100, such as the upper surface and the lower surface of the heating element 100. For example, the upper surface of the heating element 100 can be the first heating surface 101, which provides heat for the hot baking process, and the lower surface of the heating element 100 can be the second heating surface 102, which provides heat and pressure for the hot pressing process.
[0025] In other embodiments, the first heating surface 101 and the second heating surface 102 may also be disposed at other locations of the heating element 100. For example, the first heating surface 101 and the second heating surface 102 may be bent and connected. The first heating surface 101 may be the side surface of the heating element 100, and the second heating surface 102 may be the lower surface of the heating element 100.
[0026] Understandably, all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.
[0027] The heat transfer equipment 10 also includes a heating element 200. The heating element 200 is used to heat-dry the substrate to be cured in conjunction with the first heating surface 101 in the heat-drying state. The heating element 200 can be covered on the first heating surface 101 in the heat-drying state. The heating element 200 can be movably connected to the heating element 100, and is used to allow the heat transfer equipment 10 to enter or exit the heat-drying state by moving relative to the heating element 100.
[0028] The substrate to be cured may have one side with an ink pattern printed on it and another side without an ink pattern printed on it. During hot baking, the side of the substrate with the ink pattern printed on it may face away from the first heating surface 101, while the other side is in contact with the first heating surface 101. For example, the first heating surface 101 may be the upper surface of the heating element 100, so that the substrate to be cured will contact the first heating surface 101 under gravity. The first heating surface 101 can act as a heat source below the substrate to be cured, providing heat to the substrate during the hot baking process so that the hot melt adhesive on the side with the ink pattern printed on it adheres to the ink pattern and forms a transferable layer. The hot melt adhesive before curing may be in powder form.
[0029] Optionally, the heating element 200 is hinged to the heating element 100. The heating element 200 can rotate relative to the heating element 100 to allow the heat transfer equipment 10 to enter or exit the heating state. For example, the end of the heating element 200 away from its hinge position with the heating element 100 can move away from the heating element 100 to allow the heat transfer equipment 10 to exit the heating state, so as to place the substrate to be cured or remove the cured heat transfer film. It can be understood that the cured heat transfer film can be regarded as the substrate to be transferred. Similarly, the end of the heating element 200 away from its hinge position with the heating element 100 can move towards the heating element 100 until it contacts the heating element 100, so that the heat transfer equipment 10 enters the heating state.
[0030] In other embodiments, the heating element 200 may also be movably connected to the heating element 100 in other ways. For example, the heating element 200 may be slidably connected to the heating element 100, so as to allow the heat transfer device 10 to enter or exit the heating state by sliding relative to the heating element 100.
[0031] The heat transfer equipment 10 also includes a pressing member 300. The pressing member 300 is used to press the substrate to be transferred against the second heating surface 102 under hot pressing conditions. The pressing member 300 can be attached to the second heating surface 102 under hot pressing conditions. The heating element 100 can be movably connected to the pressing member 300, and is used to move relative to the pressing member 300 to allow the heat transfer equipment 10 to enter or exit the hot pressing state.
[0032] During hot pressing, the substrate to be transferred can be placed between the second heating surface 102 and the pressing member 300. During operation, the heat transfer equipment 10 can be placed on an operating table, such as, but not limited to, a desktop or floor. The pressing member 300 serves as a pressing platform to prevent heat conduction from the second heating surface 102 to the operating table, thus preventing damage to the operating table. The surface of the pressing member 300 that contacts the second heating surface 102 can be a flat surface. The target material for printing the pattern, such as clothing material, can be placed on the pressing platform before hot pressing. The substrate to be transferred can be stacked on top of the target material. The substrate to be transferred has one side with a transferable layer, and this side of the substrate can face the pressing member 300 during hot pressing, i.e., away from the second heating surface 102, and this side of the substrate contacts the target material during hot pressing. During the hot pressing process, the heating element 100 can squeeze the covering element 300 under the action of external force. At this time, the substrate to be transferred and the target material are located between the second heating surface 102 and the covering element 300. The layer on the substrate to be transferred will be activated by high temperature and pressure and adhere to the target material, thereby completing the pattern transfer.
[0033] Optionally, the pressing element 300 is hinged to the heating element 100. The heating element 100 can rotate relative to the pressing element 300 to allow the heat transfer equipment 10 to enter or exit the hot-press state. For example, the end of the heating element 100 away from its hinge position with the pressing element 300 can move away from the pressing element 300 to allow the heat transfer equipment 10 to exit the hot-press state, so as to place the target material and the substrate to be transferred, or to remove the target material and the heat transfer film after transfer; similarly, the end of the heating element 100 away from its hinge position with the pressing element 300 can move towards the pressing element 300 until the second heating surface 102 is in contact with the surface of the pressing element 300, so that the heat transfer equipment 10 enters the hot-press state.
[0034] In other embodiments, the heating element 100 may also be movably connected to the pressing element 300 in other ways. For example, the heating element 100 may be slidably connected to the pressing element 300, so as to allow the heat transfer equipment 10 to enter or exit the heating state by sliding relative to the pressing element 300.
[0035] In this embodiment, at least one of the heating element 200 and the pressing element 300 may be hinged to the heating element 100. The heating element 200 and the pressing element 300 may be movably connected to the heating element 100 in the same or different ways. In other embodiments, the heating element 200 and the pressing element 300 may also be movably connected to the heating element 100 in a manner other than hinged connection.
[0036] The first heating surface 101 and the second heating surface 102 can be arranged opposite to each other. For example, the upper surface of the heating element 100 may include the first heating surface 101, and the lower surface of the heating element 100 may include the second heating surface 102. The drying element 200 and the pressing element 300 can be located on opposite sides of the heating element 100, for example, the drying element 200 can be located on the upper side of the heating element 100, and the pressing element 300 can be located on the lower side of the heating element 100. The first heating surface 101 and the second heating surface 102 can be two surfaces spaced apart along the thickness direction of the heating element 100, and the drying element 200 and the pressing element 300 can be spaced apart on opposite sides of the heating element 100 along the thickness direction of the heating element 100, thereby reducing the floor space of the heat transfer equipment 10.
[0037] Please see Figures 1 to 4 , Figure 3 yes Figure 1 A top view of the heat transfer equipment in this embodiment. Figure 4 yes Figure 3 The diagram shows a cross-sectional view of the heat transfer equipment cut along section AA.
[0038] In some embodiments, the heating element 100 includes a heating portion 110, where a first heating surface 101 and a second heating surface 102 are both surfaces of the heating portion 110. The heating portion 110 may include a self-heating heating medium 111, which has a first heating surface 101 and a second heating surface 102. The heating medium 111 provides the heat required for hot baking and hot pressing, and its heat can be transferred to the heat transfer film through the first heating surface 101 and the second heating surface 102. With this design, the first heating surface 101 and the second heating surface 102 of the heating element 100 can be two uniformly heated surfaces.
[0039] In other embodiments, the heating element 110 can also be designed with other structures. For example, the heating element 110 may include two heating media 111, which respectively form a first heating surface 101 and a second heating surface 102. A partition may be provided between the two heating media 111 to block heat transfer between them, so that the heat transfer equipment 10 can set the temperature parameters of the first heating surface 101 and the second heating surface 102 individually as needed. Alternatively, the first heating surface 101 and the second heating surface 102 of the heating element 110 may be non-self-heating surfaces, and a heating element may be embedded inside the heating element. The heating element can transfer heat to the first heating surface 101 and the second heating surface 102 to heat them up.
[0040] The first heating surface 101 and the second heating surface 102 can be two opposing surfaces of the heating element 110 along the height direction of the heat transfer equipment 10. For example, the first heating surface 101 can be the top surface of the heating element 110, and the second heating surface 102 can be the bottom surface of the heating element 110. The heat-drying component 200, the heating element 110, and the covering component 300 can be stacked along the height direction of the heat transfer equipment 10. The height direction of the heat transfer equipment 10 is... Figure 2 The vertical direction is shown. In other embodiments, the distribution of the first heating surface 101 and the second heating surface 102 is not limited to this. For example, the first heating surface 101 and the second heating surface 102 can be two surfaces of the heating part 110 that are bent and connected.
[0041] The heating element 100 may further include a mounting portion 120, which is fixedly connected to the heating element 110 and movably connected to the heating element 200 and the covering element 300, respectively. Figure 3 and Figure 4 As shown, one end of the mounting portion 120 can be hinged to the heating element 200, and the other end can be hinged to the pressing element 300. In other embodiments, at least one of the heating element 200 and the pressing element 300 can be movably connected to the mounting portion 120 by a connection other than hinge, such as a sliding connection. In other embodiments, the heating element 110 can also be directly movably connected to the heating element 200 and the pressing element 300, so that the heating element 100 does not need to be provided with the mounting portion 120.
[0042] In some embodiments, the heating element 200 and the first heating surface 101 surround to form a heating cavity 201, which is used to accommodate the substrate to be cured. In the heating state, the substrate to be cured is placed in the heating cavity 201, and the first heating surface 101 heats up to heat the substrate to be cured.
[0043] It should be noted that the heating element 200, together with the first heating surface 101, forms a heating cavity 201, which is a feature of the heat transfer equipment 10 provided in this application embodiment. However, this does not mean that the heating element 200 of the heat transfer equipment 10 must always form a heating cavity 201 with the first heating surface 101. It is understood that the heating element 200 forms a heating cavity 201 with the heating element 100 at least during the heating state. The heating element 200 can move relative to the heating element 100 to allow the heat transfer equipment 10 to enter or exit the heating state (heat control of the first heating surface 101 is not considered here). When the heat transfer equipment 10 is not in the heating state, the heating element 200 may not form a heating cavity 201 with the heating element 100, which does not affect the inclusion of the above-mentioned feature in the heat transfer equipment 10.
[0044] The substrate to be cured is located within the hot-drying cavity 201, with one side in contact with the first heating surface 101, and the other side, on which the ink pattern is printed, exposed within the hot-drying cavity 201 and separated from the hot-drying component 200. Heat from the first heating surface 101 can be transferred from one side of the substrate to the other, allowing the hot melt adhesive powder on the other side of the substrate to form a transferable hot melt adhesive layer, thus curing the heat transfer film. During the curing process, substances such as glycerol in the ink evaporate into the hot-drying cavity 201.
[0045] In some embodiments, the heat-drying component 200 may have a first vent 202, which communicates with the heat-drying chamber 201 during the heat-drying process. This vent 202 is used to expel substances such as glycerol that appear in the heat-drying chamber 201 during the heat-drying process, thereby improving the evaporation efficiency of glycerol and reducing the probability of oil return. Oil return is the phenomenon where glycerol precipitates from the heat transfer film after heat drying and is caused by the incomplete evaporation of glycerol from the ink during the heat-drying process. In other embodiments, the heat-drying component 200 may not have the first vent 202.
[0046] Optionally, the heat transfer apparatus 10 also includes a filter assembly 400. The filter assembly 400 can be disposed on the heating element 200 and covers the first vent 202, for filtering substances discharged through the first vent 202 during the heating process, thereby reducing or even eliminating odors emitted by the heat transfer apparatus 10 during the heating process. The filter assembly 400 may include a filter element 410, which covers the first vent 202. The filter element 410 includes a material with filtering properties, such as, but not limited to, filter cotton.
[0047] The filter assembly 400 may further include a protective cover 420. The protective cover 420 may cover the first vent 202 and, together with the heating element 200, form a filter chamber 401. The filter element 410 is disposed in the filter chamber 401. The protective cover 420 has a second vent 402 communicating with the filter chamber 401. Glycerin, air, and other substances discharged through the first vent 202 can be filtered by the filter element 410 and then discharged to the outside through the second vent 402.
[0048] In some embodiments, the protective cover 420 may be detachably connected to the heat-drying element 200, for example, but not limited to, a detachable cover, so that the heat transfer apparatus 10 can remove the protective cover 420 when the filter element 410 needs to be replaced. The filter element 410 may be detachably connected to the heat-drying element 200 for easy removal during replacement. The filter element 410 may also be fixedly connected to the heat-drying element 200 and destructively removed during replacement.
[0049] Optionally, the protective cover 420 has a plurality of second vent holes 402. The plurality of second vent holes 402 can be arranged in an array, for example, in a... Figure 3 The circular array arrangement is shown. Of course, the multiple second exhaust holes 402 can also be arranged as through-hole arrays of other shapes, such as square arrays, elliptical arrays, etc. By setting multiple second exhaust holes 402 arranged in an array, the size of each second exhaust hole 402 can be reduced while allowing substances such as glycerin and air to be discharged to the outside in a concentrated and large quantity, thereby reducing the possibility of external impurities entering the filter chamber 401 through the second exhaust holes 402.
[0050] The filter assembly 400 may also include a fan 430. The fan 430 may be disposed in the filter chamber 401 and located on one side of the filter element 410, for generating airflow from the first exhaust port 202 to the second exhaust port 402. The mounting position of the fan 430 may correspond to the second exhaust port 402. By generating airflow with the fan 430, the filter assembly 400 can improve the evaporation efficiency of substances such as glycerin, which is beneficial to improving the quality of the heat transfer film after drying. Understandably, neither the protective cover 420 nor the fan 430 are essential components of the filter assembly 400.
[0051] It should be understood that the terms "comprising" and "having," and any variations thereof, used in this application and the appended claims, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.
[0052] In some embodiments, the heating element 200 may be provided with a receiving groove 203, and a first exhaust port 202 is formed in the groove wall of the receiving groove 203. The filter assembly 400 may be at least partially disposed in the receiving groove 203. The protective cover 420 of the filter assembly 400 may be formed with the groove wall of the receiving groove 203 to create a filter cavity 401. The filter element 410 and the fan 430 of the filter assembly 400 may both be installed in the receiving groove 203, and the installation methods may include, but are not limited to, limiting by protrusions on the groove wall, bonding, snap-fitting, etc.
[0053] By placing the filter assembly 400 in the receiving groove 203, the internal space utilization of the heat transfer equipment 10 can be improved, and the size of the heat transfer equipment 10 can be reduced. In other embodiments, the receiving groove 203 is not a necessary structure for the heat-drying component 200, and the filter assembly 400 can be placed on the surface of the heat-drying component 200 and protrude from the surface of the heat-drying component 200.
[0054] In some applications, during the heat transfer process of the heat transfer equipment 10, the heat-drying component 200 can be lifted first, exposing the first heating surface 101. At this time, the heat transfer film with the printed ink pattern can be placed on the first heating surface 101, with the side bearing the printed ink pattern facing away from the first heating surface 101, and hot melt adhesive powder placed on that side. Then, the heat-drying component 200 can be lowered to form a heat-drying cavity 201, exposing the heat transfer film within it. The heat transfer equipment 10 can then control the first heating surface 101 to heat up, thereby curing the heat transfer film. After curing, the heat transfer film can be removed for hot pressing.
[0055] In some embodiments, the pressing member 300 is movably connected to the heating member 100, and the pressing member 300 is disposed opposite to the second heating surface 102. Under hot-press conditions, the substrate to be transferred is placed between the pressing member 300 and the second heating surface 102, and the second heating surface 102 is attached to the pressing member 300 and hot-pressed onto the substrate to be transferred. At this time, the second heating surface 102 heats up.
[0056] It should be noted that the pressure member 300 is disposed opposite to the second heating surface 102, which is a feature of the heat transfer equipment 10 provided in this application embodiment, but it does not mean that the pressure member 300 of the heat transfer equipment 10 must always be disposed opposite to the second heating surface 102. It can be understood that the pressure member 300 is disposed opposite to the second heating surface 102 at least in the hot-press state. The pressure member 300 can move relative to the heating member 100 to allow the heat transfer equipment 10 to enter or exit the hot-press state (the heating control of the second heating surface 102 is not considered here). When the heat transfer equipment 10 is not in the hot-press state, the pressure member 300 may not be disposed opposite to the second heating surface 102. For example, the surface of the pressure member 300 near the second heating surface 102 may form an angle greater than 0 with the second heating surface 102, which does not affect the fact that the heat transfer equipment 10 includes the above-mentioned features.
[0057] In some application scenarios, during the hot pressing process of the heat transfer equipment 10, the heated component 200 can be lifted together with the heated component 100, exposing the second heated surface 102. At this time, the target material of the pattern to be transferred can be placed on the surface of the covering component 300. Subsequently, the substrate to be transferred, i.e., the cured heat transfer film, can be placed in the area of the target material to be transferred. After placement, the heated component 200 and the heated component 100 can be lowered together, so that the second heated surface 102 is in contact with the surface of the covering component 300. Then, the heat transfer equipment 10 can control the second heated surface 102 to start heating. At the same time, the second heated surface 102 and the surface of the covering component 300 can cooperate to squeeze the substrate to be transferred and the target material to be transferred, so as to perform hot pressing on the substrate to be transferred and the target material to complete the transfer of the pattern.
[0058] The heating element 100 can compress the pressing element 300 under external force to provide the pressure required for heat pressing. In some embodiments, the external force can come from an operator, such as a pushing force provided to the operator, which can act on the side of the heating element 200 away from the heating element 100. In other embodiments, the external force can come from a locking structure between the heating element 100 and the pressing element 300, such as, but not limited to, a snap-locking structure, a button-locking structure, etc., which can provide a locking force for the heating element 100 and the pressing element 300 when the second heating surface 102 is in contact with the surface of the pressing element 300, so that the second heating surface 102 and the surface of the pressing element 300 are in close contact.
[0059] In the hot-drying process, the heat transfer equipment 10 can be used to set the hot-drying parameters. These parameters can be set after the substrate to be cured is placed in and before the hot-drying component 200 is placed down, or they can be set before the substrate is placed in, or after the hot-drying component 200 is placed down, depending on the requirements. In the hot-pressing process, the heat transfer equipment 10 can be used to set the hot-pressing parameters. These parameters can be set before the target material and the substrate to be transferred are placed in, or they can be set after the target material and the substrate to be transferred are placed in, depending on the requirements. The hot-drying parameters include the temperature parameters of the first heating surface 101 when heated, and the hot-pressing parameters include the temperature parameters of the second heating surface 102 when heated; these two parameters can be the same or different.
[0060] It should be noted that the above is merely an illustrative description of the usage process of the heat transfer equipment 10, intended to more clearly describe the shape, structure, and function of the heat transfer equipment 10. In actual applications, the usage process of the heat transfer equipment 10 is not limited to the above example.
[0061] In some embodiments, the heating element 200 may be provided with a first handle 510 for moving the heating element 200 relative to the heating element 100 under the action of an external force, so as to allow the user to control the heat transfer equipment 10 to enter or exit the heating state. The heating element 100 may be provided with a second handle 520 for moving the heating element 100 relative to the pressing element 300 under the action of an external force, so as to allow the user to control the heat transfer equipment 10 to enter or exit the hot pressing state. It is understood that the first handle 510 and the second handle 520 can also be used to provide the heating element 100 with a force to compress the pressing element 300 under the action of an external force during the hot pressing process. Of course, in practical applications, the parts of the heat transfer equipment 10 that can receive external forces are not limited to this.
[0062] Optionally, both the heating element 200 and the pressing element 300 are hinged to the heating element 100. The first handle 510 and the second handle 520 can overlap to allow the user to simultaneously operate both handles to control the heat transfer equipment 10 into or out of the hot-pressing state. For example, when the heat transfer equipment 10 needs to enter or exit the heating state, the user can hold the first handle 510 to control the movement of the heating element 200; when the heat transfer equipment 10 needs to enter or exit the hot-pressing state, the user can simultaneously hold the first handle 510 and the second handle 520 to control the movement of the heating element 200 and the heating element 100 relative to the pressing element 300, thereby allowing the heating element 200 to move together with the heating element 100. The direction in which the first handle 510 and the second handle 520 overlap can be the thickness direction of the heating element 100.
[0063] In other embodiments, the first handle 510 and the second handle 520 may not overlap and need not be operated together. The heat transfer device 10 may also achieve movement control of the heated part 200 and the heating part 100 in other ways without having to provide the first handle 510 and the second handle 520.
[0064] In some embodiments, along the height direction of the heat transfer apparatus 10, the first heating surface 101 can be the top surface of the heating element 110, and the second heating surface 102 can be the bottom surface of the heating element 110. The side surface of the heating element 110 can be connected to one side of the mounting part 120, and the heating element 110 and the mounting part 120 cooperate to form a mounting groove 103. The mounting groove 103 has the first heating surface 101 as its bottom wall surface and the side surface of the mounting part 120 as its side wall surface.
[0065] The heat-drying component 200 may be at least partially located within the mounting groove 103. The mounting groove 103 constitutes at least a portion of the heat-drying cavity 201. The filter assembly 400 may be disposed on the top surface of the heat-drying component 200 along the height direction of the heat transfer apparatus 10. The receiving groove 203 may be disposed on the top surface of the heat-drying component 200. In other embodiments, the relative position of the filter assembly 400 and the heat-drying component 200 is not limited thereto, and the receiving groove 203 may also be disposed on other side surfaces of the heat-drying component 200. For example, the filter assembly 400 may be disposed on the outer peripheral side of the heat-drying component 200, and the receiving groove 203 may be correspondingly disposed on the outer peripheral surface of the heat-drying component 200.
[0066] Similarly, the fact that the heated component 200 is at least partially located in the mounting groove 103 is a feature of the heat transfer equipment 10 provided in this embodiment. However, this does not mean that the heated component 200 must always be located in the mounting groove 103. The heated component 200 can also be moved out of the mounting groove 103 by moving relative to the heating element 100, which does not affect the fact that the heat transfer equipment 10 includes the above-mentioned feature. In this embodiment, at least in the heated state, the heated component 200 is at least partially located in the mounting groove 103.
[0067] The second heating surface 102 may be coplanar with the bottom surface of the mounting portion 120. The covering member 300 may be in contact with both the second heating surface 102 and the bottom surface of the mounting portion 120. In other embodiments, under hot-press conditions, the covering member 300 may only be in contact with the second heating surface 102 and separate from the bottom surface of the mounting portion 120. In this case, a height difference may be formed between the second heating surface 102 and the bottom surface of the mounting portion 120.
[0068] It should be noted that the heat transfer equipment 10 provided in this application embodiment is not limited to the structure described above. In this embodiment, along the height direction of the heat transfer equipment 10, the heat-drying component 200 is positioned above the heating element 110, and the covering component 300 is positioned below the heating element 110. In other embodiments, the heat-drying component 200 may be positioned below the heating element 110, and the covering component 300 may be positioned above the heating element 110. Of course, the relative positions of the heating element 110, the heat-drying component 200, and the covering component 300 are not limited to this.
[0069] Please see Figure 5 , Figure 5 This is a cross-sectional structural schematic diagram of a heat transfer device provided in other embodiments of this application.
[0070] In some embodiments, along the height direction of the heat transfer apparatus 10, the first heating surface 101 can be the bottom surface of the heating element 110, and the second heating surface 102 can be the top surface of the heating element 110. The side surface of the heating element 110 can be connected to one side of the mounting part 120, and the heating element 110 and the mounting part 120 cooperate to form a mounting groove 103. The mounting groove 103 has the second heating surface 102 as its bottom wall surface and the side surface of the mounting part 120 as its side wall surface.
[0071] In the hot-pressing state, the pressing component 300 is at least partially located in the mounting groove 103 and adheres to the second heating surface 102. During hot pressing, the target material and the substrate to be transferred can be stacked in the mounting groove 103. In the hot-drying state, the hot-drying component 200 covers the bottom surface of the heating part 110. The first heating surface 101 can serve as the bottom surface of the heating part 110, forming a hot-drying cavity 201 with the hot-drying component 200. During hot drying, the substrate to be cured can receive heat from the first heating surface 101 above. The substrate to be cured can be fixed to a fixing component provided on the first heating surface 101 or the hot-drying component 200 to stably occupy the hot-drying cavity 201. This fixing component is, for example, but not limited to, a support column, a hook, etc., and can be designed according to the actual situation. The filter assembly 400 can be provided on the outer periphery of the hot-drying component 200. The specific structure and setting method can be referred to the above, and will not be repeated here.
[0072] It should be understood that the terminology used in this specification and appended claims is for the purpose of describing particular embodiments only and is not intended to limit the application. As used in this specification and appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise. Similarly, the terms “first” and “second” in the description of this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as “first” or “second” may explicitly or implicitly include one or more of the stated features. Furthermore, the term “multiple” in the description of this application means two or more, unless otherwise explicitly specified.
[0073] In summary, the embodiments of this application achieve an integrated design of the hot drying structure and the hot pressing structure through the above design, which is beneficial to reduce the floor space of the heat transfer equipment 10. Moreover, the heat transfer equipment 10 is easy to use, which is beneficial to improve the efficiency of use and reduce the cost of use. The embodiments of this application also integrate a filter component 400 in the heat transfer equipment 10, which can reduce or even eliminate the odor that occurs in the heat transfer equipment 10 during the hot drying process, and is beneficial to improve the quality of the heat transfer film obtained by hot drying.
[0074] In the description of this application, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0075] The above description is only a partial embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural changes made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A heat transfer printing device, characterized in that, The heat transfer equipment includes: A heating element having a first heating surface and a second heating surface, wherein the first heating surface and the second heating surface are respectively disposed at different positions of the heating element; A heat-drying component, movably connected to a heating element, the heat-drying component and the first heating surface forming a heat-drying cavity, the heat-drying cavity being used to accommodate a substrate to be cured; and A pressure member is provided, which is movably connected to the heating element and is disposed opposite to the second heating surface. The heat transfer equipment has both a hot baking state and a hot pressing state. In the hot-drying state, the substrate to be cured is placed in the hot-drying cavity, and the first heating surface heats up to heat the substrate to be cured. In the hot-press state, the substrate to be transferred is placed between the covering member and the second heating surface. The second heating surface heats up and adheres to the covering member to perform hot pressing on the substrate to be transferred.
2. The heat transfer equipment according to claim 1, characterized in that, The first heating surface and the second heating surface are arranged opposite to each other, and the heating element and the covering element are respectively located on opposite sides of the heating element.
3. The heat transfer equipment according to claim 2, characterized in that, At least one of the heating element and the covering element is hinged to the heating element.
4. The heat transfer equipment according to claim 3, characterized in that, Both the heating element and the pressing element are hinged to the heating element; the heating element is provided with a first handle for rotating relative to the heating element under the action of external force; the heating element is provided with a second handle for rotating relative to the pressing element under the action of external force; wherein, the first handle and the second handle are arranged overlappingly.
5. The heat transfer equipment according to claim 1, characterized in that, The heating element includes a heating part and a mounting part. The first heating surface and the second heating surface are two opposing surfaces of the heating part along the height direction of the heat transfer equipment. The mounting part is fixedly connected to the heating part and is movably connected to the heat drying part and the covering part, respectively.
6. The heat transfer equipment according to claim 5, characterized in that, Along the height direction, the first heating surface is the top surface of the heating element, and the second heating surface is the bottom surface of the heating element; the side of the heating element is connected to one side of the mounting part, and the heating element and the mounting part cooperate to form a mounting groove, the mounting groove having the first heating surface as the bottom wall surface and the side of the mounting part as the side wall surface; The heating element is at least partially located in the mounting groove, which forms at least part of the heating cavity; the second heating surface is coplanar with the bottom surface of the mounting portion; the covering element is in contact with the second heating surface and the bottom surface of the mounting portion.
7. The heat transfer equipment according to claim 5, characterized in that, Along the height direction, the first heating surface is the bottom surface of the heating part, and the second heating surface is the top surface of the heating part; the side of the heating part is connected to one side of the mounting part, and the heating part and the mounting part cooperate to form a mounting groove, the mounting groove having the second heating surface as the bottom wall surface and the side of the mounting part as the side wall surface; In the hot-pressed state, the pressure-covering component is at least partially located in the mounting groove and is in contact with the second heating surface; In the hot-drying state, the hot-drying component is placed over the bottom surface of the heating element.
8. The heat transfer equipment according to claim 1, characterized in that, The hot-drying component is provided with a first exhaust hole, which is connected to the hot-drying chamber during the hot-drying state; the heat transfer equipment includes a filter assembly, which is disposed on the hot-drying component and covers the first exhaust hole, for filtering the substances discharged through the first exhaust hole during the hot-drying process.
9. The heat transfer equipment according to claim 8, characterized in that, The heating element is provided with a receiving groove, and the first exhaust hole is opened in the groove wall of the receiving groove; the filter assembly is at least partially disposed in the receiving groove.
10. The heat transfer equipment according to claim 8, characterized in that, The filtering component includes: A protective cover is detachably connected to the hot-drying component and is placed over the first exhaust hole, forming a filter cavity with the hot-drying component; A filter element, wherein the filter element is disposed in the filter chamber and covers the first exhaust port; and A fan is disposed in the filter chamber and located on one side of the filter element; The protective cover has a second exhaust port that communicates with the filter chamber, and the fan is used to generate airflow from the first exhaust port to the second exhaust port.