A chassis assembly

Abstract

The application belongs to the technical field of electrical equipment, and particularly relates to a machine case assembly. The machine case assembly provided by the application comprises a cooling box, a heat exchanger, a pump body and a switching unit. The cooling box comprises a box body and a sealing piece. The box body is used for storing cooling liquid. The box body is provided with a maintenance opening. The sealing piece is arranged on the box body. The sealing piece opens or closes the maintenance opening. The sealing piece and / or the box body is provided with a switching port. The input end of the heat exchanger is connected to the cooling box through a first connecting pipe. The output end of the heat exchanger is connected to the cooling box through a second connecting pipe. The pump body is arranged on the first connecting pipe or the second connecting pipe to provide power for the circulation of the cooling liquid. The switching unit is installed on the switching port. The machine case assembly provided by the application reduces the influence on the sealing performance of the cooling box and reduces the risk of cooling liquid leakage.

Description

Technical Field

[0001] This application belongs to the field of electrical equipment technology, and in particular relates to a chassis assembly. Background Technology

[0002] With the rapid development of information technology, the computing performance and integration of computer motherboards and their core components (such as graphics processing units (GPUs) and central processing units (CPUs) are constantly improving, leading to a sharp increase in power consumption and heat generation. To address these enormous heat dissipation demands, advanced cooling technologies such as immersion liquid cooling have emerged. In these solutions, the computer motherboard and its high-power components are typically sealed together in a cooling tank filled with coolant, allowing for efficient heat exchange through direct liquid contact.

[0003] However, for the motherboard to function properly, it requires the connection of various external cables. In related technologies, these cables must be directly connected to their respective interfaces on the motherboard, which are submerged in coolant. This necessitates creating numerous holes in the enclosure walls for the cables to pass through, compromising the coolant enclosure's seal and making it prone to coolant leakage. Utility Model Content

[0004] This application aims to at least partially solve the technical problem that the need to create numerous holes in the enclosure wall for cables to pass through affects the sealing performance of the cooling enclosure, thus easily leading to coolant leakage. To this end, this application provides an enclosure assembly.

[0005] This application provides a chassis assembly, the chassis assembly comprising:

[0006] A cooling box includes a box body and a sealing component. The box body is used to store coolant. The cooling box has a maintenance port. The sealing component is disposed on the box body. The sealing component opens or closes the maintenance port. The sealing component and / or the box body are provided with an adapter.

[0007] A heat exchanger, wherein the input end of the heat exchanger is connected to the cooling box via a first connecting pipe, and the output end of the heat exchanger is connected to the cooling box via a second connecting pipe;

[0008] A pump body is mounted on the first connecting pipe or the second connecting pipe to provide power for the flow of the coolant;

[0009] An adapter unit is installed at the adapter interface.

[0010] In the chassis assembly provided in this application, since an adapter unit is provided on the cooling box, the heat-generating components inside the cooling box can be connected to the outside through the adapter unit. Compared with the related technology, which requires a large number of holes to be opened on the cooling box for cables to pass through, in this application, only a few adapter interfaces are needed on the cooling box for installing the adapter unit, thereby reducing the impact on the sealing performance of the cooling box and reducing the risk of coolant leakage.

[0011] In some embodiments, the housing is provided with a first adapter interface, the package is provided with a second adapter interface, the first adapter interface and the second adapter interface are not coplanar, and the adapter unit includes a first adapter component and a second adapter component, the first adapter component is installed on the first adapter interface, and the second adapter component is installed on the second adapter interface.

[0012] In some embodiments, the first adapter assembly includes a first adapter plate and a first connector. The first adapter plate includes a first substrate and a plurality of first interfaces disposed on the first substrate. The first adapter plate is mounted to the first adapter interface via the first connector.

[0013] The second adapter assembly includes a second adapter plate and a second connector. The second adapter plate includes a second substrate and a plurality of second interfaces disposed on the second substrate. The second adapter plate is mounted to the second adapter interface via the second connector.

[0014] In some embodiments, the first connector includes a first outer connecting plate, a first inner connecting plate, and a first fastener. The first outer connecting plate is disposed outside the housing, the first inner connecting plate is disposed inside the housing, the first base plate is disposed between the housing and the first outer connecting plate, the first base plate covers the first adapter, a plurality of first interfaces are exposed on the first outer connecting plate and the first inner connecting plate, and the first fastener connects the first outer connecting plate, the first inner connecting plate, the housing, and the first base plate.

[0015] In some embodiments, the first fastener includes a first fastening part and a first locking part. The first fastening part is disposed on the first inner connecting plate. The first outer connecting plate has a first outer connecting hole. The first base plate has a first fixing hole. The housing has a first transition hole. The first fastening part passes through the first transition hole, the first fixing hole, and the first outer connecting hole. The first locking part connects to the first fastening part and locks the first outer connecting plate.

[0016] In some embodiments, the first connector further includes a waterproof component disposed between the first substrate and the housing.

[0017] In some implementations, the plurality of first interfaces include a motherboard main power supply interface, a power on / off signal interface, at least one processor auxiliary power supply interface, at least one expansion card power supply interface, and at least one data storage device interface; the plurality of second interfaces include at least one universal serial bus interface, at least one network communication interface, and at least one video output interface.

[0018] In some implementations, the power of the motherboard main power supply interface is greater than 600W, the power of the processor auxiliary power supply interface is greater than 500W, and the power of the expansion card power supply interface is greater than 900W.

[0019] In some embodiments, both the first substrate and the second substrate include a plurality of conductor layers, wherein at least one conductor layer is configured as a power distribution layer and at least another conductor layer is configured as a ground layer.

[0020] In some embodiments, the copper coverage of the power distribution layer and the ground layer is 90% to 95%. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the chassis assembly is shown.

[0023] Figure 2 It shows Figure 1 A schematic diagram of the intermediate cooling box.

[0024] Figure 3 It shows Figure 2 Assembly diagram of the middle housing and the first adapter assembly.

[0025] Figure 4 It shows Figure 2 Assembly diagram of the middle package and the second adapter assembly.

[0026] Figure 5 A schematic diagram of the structure of the first adapter assembly (second adapter assembly) is shown.

[0027] Figure 6 A structural schematic diagram of the first adapter assembly (second adapter assembly) is shown from another perspective.

[0028] Figure 7 It shows Figure 5An assembly diagram of the first inner connecting plate (second inner connecting plate) and the first fastening part (second fastening part).

[0029] Figure label:

[0030] 10-Chassis assembly, 100-Cooling tank, 110-Chassis, 111-Maintenance port, 112-First transition hole, 120-Packaging component, 121-Second transition hole, 130-Adapter, 131-First adapter, 132-Second adapter, 200-Outer shell, 300-Adapter unit, 400-First adapter assembly, 410-First adapter plate, 411-First base plate, 412-First interface, 420-First connector, 421-First external connection plate, 4212-Koiler Empty part, 422-first inner connecting plate, 423-first fastener, 4231-first fastening part, 4232-first locking part, 424-first waterproof component, 500-second adapter assembly, 510-second adapter plate, 511-second base plate, 512-second interface, 520-second connector, 521-second outer connecting plate, 522-second inner connecting plate, 523-second fastener, 5231-second fastening part, 5232-second locking part, 524-second waterproof component. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] It should be noted that all directional indications in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0033] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0035] With the rapid development of information technology, the computing performance and integration of computer motherboards and their core components (such as graphics processing units (GPUs) and central processing units (CPUs) are constantly improving, leading to a sharp increase in power consumption and heat generation. To address these enormous heat dissipation demands, advanced cooling technologies such as immersion liquid cooling have emerged. In these solutions, the computer motherboard and its high-power components are typically sealed together in a cooling tank filled with coolant, allowing for efficient heat exchange through direct liquid contact.

[0036] However, for a computer motherboard to function properly, it and its components need power from the computer via power cables. These include the 24-pin power connector for the motherboard, 1-3 sets of 8-pin power connectors for the CPU, and the GPU. The components and functional parts on the motherboard need to establish signal connections with external devices, such as SATA data cables between the motherboard and hard drives, power on / off / reset cables, audio cables connecting the motherboard to the chassis, signal cables connecting the motherboard to the display device, USB communication cables, and network cables. In related technologies, these cables must be directly connected to their respective motherboard connectors submerged in coolant. This necessitates creating numerous holes in the chassis walls for the cables to pass through, compromising the coolant's seal and increasing the risk of coolant leakage.

[0037] To improve the aforementioned technical problems to some extent, this application provides a chassis assembly that can improve the sealing performance of the cooling box and reduce the risk of coolant leakage.

[0038] This application is described below with reference to the accompanying drawings and specific embodiments:

[0039] Please see Figures 1-4This application provides a chassis assembly 10. The chassis assembly 10 includes a cooling tank 100, a heat exchanger, a pump body, and a transfer unit 300. The cooling tank 100 includes a housing 110 and a casing 120. The housing 110 stores coolant and has a maintenance port 111. The casing 120 is disposed on the housing 110 and can open or close the maintenance port 111. A transfer interface 130 is provided on the casing 120 and / or the housing 110. The heat exchanger input is connected to the cooling tank 100 via a first connecting pipe, and the heat exchanger output is connected to the cooling tank 100 via a second connecting pipe. The pump body is disposed on the first or second connecting pipe to provide power for coolant flow. The transfer unit 300 is mounted on the transfer interface 130.

[0040] The cooling tank 100 houses heating elements such as a computer motherboard and its components. These elements are immersed in coolant, allowing heat generated during operation to be dissipated into the environment. By controlling the pump, the coolant in the cooling tank 100, after heat exchange with the heating elements, is transported to a heat exchanger. The coolant is cooled by the heat exchanger and then pumped back into the cooling tank 100. This cycle ensures the heating elements within the cooling tank 100 operate in a normal environment. The chassis assembly 10 may also include a housing 200, within which the cooling tank 100, heat exchanger, pump, and adapter unit 300 are all housed.

[0041] The cooling box 100 has a maintenance port 111. A package 120 is connected to the cooling box 100. The package 120 opens or closes the maintenance port 111. When maintenance of the heating element is required, the package 120 is first operated to open the maintenance port 111. Then, the heating element is removed through the opened maintenance port 111 and taken out of the cooling box 100 for maintenance. This eliminates the need to drain the coolant from the cooling box 100 and then disassemble the heating element, making it simple, quick, and highly practical. When assembling the maintenance component, the operation is reversed; details are not provided here.

[0042] An adapter 130 is provided on the package 120 and / or the housing 110. This can be provided on the package 120, the housing 110, or both. The adapter 130 is internally connected to the housing 110. The adapter unit 300 is used for cable connection. Since the adapter unit 300 is installed on the adapter 130, all cables of external devices (hard drives, front panel of the chassis, monitors, etc.) that need to communicate with the motherboard can be connected to the adapter unit 300 and then to the motherboard, ensuring stable power supply to the motherboard and its components. Compared to related technologies that require numerous openings in the cooling box 100 for cables to pass through, this embodiment only requires a few adapters 130 for the adapter unit 300, thus reducing the impact on the cooling box 100's sealing and lowering the risk of coolant leakage.

[0043] Furthermore, since the cables of all external devices that need to communicate with the motherboard in this embodiment can be connected through the adapter unit 300, the placement of external devices can be more flexible. They do not need to be placed near the cooling box 100. In some special environments, these external devices can be placed in a safer location, thus improving safety.

[0044] In some embodiments, the housing 110 is provided with a first adapter 131, the package 120 is provided with a second adapter 132, the first adapter 131 and the second adapter 132 are not coplanar, and the adapter unit 300 includes a first adapter component 400 and a second adapter component 500, the first adapter component 400 is mounted on the first adapter 131, and the second adapter component 500 is mounted on the second adapter 132.

[0045] There are two adapter interfaces 130. The adapter interface 130 on the housing 110 is the first adapter interface 131, and the adapter interface 130 on the package 120 is the second adapter interface 132. Since the motherboard needs to connect to many external devices, the adapter unit 300 needs to have many interfaces. If all interfaces are integrated on one adapter board, different types of interfaces and signals will interfere with each other. Therefore, the adapter unit 300 in this embodiment includes a first adapter component 400 and a second adapter component 500. The first adapter component 400 and the second adapter component 500 are respectively installed on the first adapter interface 131 and the second adapter interface 132. Different interfaces are provided on the first adapter component 400 and the second adapter component 500, which is beneficial for functional partitioning and layout optimization.

[0046] Due to the limited overall size of the cooling box 100, the first adapter 131 and the second adapter 132 are not coplanar, meaning they are located on different sides of the cooling box 100, thus providing sufficient installation space for the first adapter assembly 400 and the second adapter assembly 500. Specifically, the maintenance port 111 is located on the top of the box 110, meaning the encapsulation component 120 is located on the top of the box 110, allowing the first adapter 131 to be located on the top of the box 110, and the second adapter 132 to be located on the side of the box 110.

[0047] In some embodiments, the first adapter assembly 400 includes a first adapter plate 410 and a first connector 420. The first adapter plate 410 includes a first substrate 411 and a plurality of first interfaces 412 disposed on the first substrate 411. The first adapter plate 410 is mounted to the first adapter interface 131 via the first connector 420. The second adapter assembly 500 includes a second adapter plate 510 and a second connector 520. The second adapter plate 510 includes a second substrate 511 and a plurality of second interfaces 512 disposed on the second substrate 511. The second adapter plate 510 is mounted to the second adapter interface 132 via the second connector 520.

[0048] The first substrate 411 and the second substrate 511 are glass fiber reinforced epoxy resin copper clad laminates, which have good electrical properties, mechanical properties, thermal properties and chemical stability.

[0049] The multiple first interfaces 412 include a motherboard main power supply interface, a power on / off signal interface, at least one processor auxiliary power supply interface, at least one expansion card power supply interface, and at least one data storage device interface. The multiple second interfaces 512 include at least one universal serial bus interface, at least one network communication interface, and at least one video output interface. Of course, the first substrate 411 and the second substrate 511 both have multiple first interfaces 412 on their inner and outer sides.

[0050] Specifically, the motherboard's main power connector can be an ATX 24-pin power connector; the processor auxiliary power connector can be an 8-pin CPU power connector, with a total of 3 sets; the expansion card power connector can be a PCIe 5.0 / PCIe 4.0 power connector, with a total of 4 sets; the data storage device interface can be a SATA 3.0 interface, with a total of 4 sets; the universal serial bus interface can be a USB 3.0 interface, with a total of 2 sets; the network communication interface can be an RJ45 interface, with a total of 2 sets; and the video output interface can be a VGA interface.

[0051] Please see Figures 5-7In some embodiments, the first connector 420 includes a first outer connector 421, a first inner connector 422, and a first fastener 423. The first outer connector 421 is disposed outside the housing 110, the first inner connector 422 is disposed inside the housing 110, the first substrate 411 is disposed between the housing 110 and the first outer connector 421, the first substrate 411 covers the first adapter 131, a plurality of first interfaces 412 are exposed on the first outer connector 421 and the first inner connector 422, and the first fastener 423 connects the first outer connector 421, the first inner connector 422, the housing 110, and the first substrate 411.

[0052] It should be noted that the way the first substrate 411 is mounted on the first adapter 131 via the first connector 420 is exactly the same as the way the second substrate 511 is mounted on the second adapter 132 via the second connector 520. In this embodiment, the method of mounting the first substrate 411 on the first adapter 131 via the first connector 420 is used as an example for explanation. The method of mounting the second substrate 511 on the second adapter 132 via the second connector 520 can be deduced by analogy.

[0053] The first adapter 131 can be rectangular. Both the first outer connecting plate 421 and the first inner connecting plate 422 are rectangular frame structures, meaning that both the first outer connecting plate 421 and the first inner connecting plate 422 have cutouts 4212. This allows multiple first interfaces 412 on the inner side of the first substrate 411 to be exposed through the cutouts 4212 of the first inner connecting plate 422, and multiple first interfaces 412 on the outer side of the first substrate 411 to be exposed through the cutouts 4212 of the first outer connecting plate 421, thus enabling connection with cables on the inner and outer sides. The first fastener 423 connects the first outer connecting plate 421, the first inner connecting plate 422, the housing 110, and the first substrate 411, thereby enabling the fixed installation of the first substrate 411 on the housing 110. Since the first outer connecting plate 421 and the first inner connecting plate 422 are both arranged around the multiple first interfaces 412, the first outer connecting plate 421 and the first inner connecting plate 422 can provide a certain degree of protection for the multiple first interfaces 412.

[0054] Similarly, the second connector 520 includes a second outer connector 521, a second inner connector 522, and a second fastener 523. The second outer connector 521 is disposed on the outside of the package 120, the second inner connector 522 is disposed on the inside of the package 120, the second substrate 511 is disposed between the package 120 and the second outer connector 521, the second substrate 511 covers the second adapter 132, and a plurality of second interfaces 512 are exposed on the second outer connector 521 and the second inner connector 522. The second fastener 523 connects the second outer connector 521, the second inner connector 522, the housing 110, and the second substrate 511.

[0055] In some embodiments, the first fastener 423 includes a first fastening part 4231 and a first locking part 4232. The first fastening part 4231 is disposed on the first inner connecting plate 422. The first outer connecting plate 421 has a first outer connecting hole. The first base plate 411 has a first fixing hole. The housing 110 has a first transition hole 112. The first fastening part 4231 passes through the first transition hole 112, the first fixing hole and the first outer connecting hole. The first locking part 4232 connects to the first fastening part 4231 and locks the first outer connecting plate 421.

[0056] The first fastening part 4231 and the first inner connecting plate 422 can be integrally formed. The first fastening part 4231 can be a screw, and the first locking part 4232 can be a nut. The first locking part 4232 is screwed to the first fastening part 4231. The first fastening part 4231 passes through the first transition hole 112, the first fixing hole, and the first outer connecting hole. The first locking part 4232 is located on the side of the first outer connecting plate 421 away from the housing 110 and abuts against the first outer connecting plate 421, thereby achieving locking and fixing the second outer connecting plate 521, the second inner connecting plate 522, the housing 110, and the second base plate 511 together.

[0057] Specifically, there may be multiple first fastening parts 4231, which are evenly distributed around the periphery of the first inner connecting plate 422 to improve connection stability. Similarly, there may be multiple first locking parts 4232, each corresponding to one of the multiple first fastening parts 4231. Correspondingly, the first outer connecting plate 421 also has multiple first outer connecting holes, the first base plate 411 also has multiple first fixing holes, and the housing 110 also has multiple first transition holes 112.

[0058] Similarly, the second fastener 523 includes a second fastening part 5231 and a second locking part 5232. The second fastening part 5231 is disposed on the second inner connecting plate 522. The second outer connecting plate 521 has a second outer connecting hole. The second base plate 511 has a second fixing hole. The housing 110 has a second transition hole 121. The second fastening part 5231 passes through the second transition hole 121, the second fixing hole and the second outer connecting hole. The second locking part 5232 connects to the second fastening part 5231 and locks the second outer connecting plate 521.

[0059] In some embodiments, the first connector 420 further includes a first waterproof component 424 disposed between the first substrate 411 and the housing 110.

[0060] A waterproof component is disposed between the first substrate 411 and the housing 110, that is, the waterproof component is attached to the outer wall of the housing 110, and the first substrate 411 is disposed on the side of the waterproof component away from the housing 110. Since the housing 110 contains coolant, the waterproof component can provide a certain degree of waterproofing, thereby minimizing the contact between the coolant and the first substrate 411 and improving the service life of the first substrate 411. A sealant can be applied between the waterproof component and the outer wall of the housing 110 to further improve the sealing performance and reduce coolant leakage.

[0061] The first waterproof component 424 is also a rectangular frame structure, and it is provided with multiple through holes. The first fastening part 4231 passes through the through holes to connect the first waterproof components 424 together. Specifically, the waterproof component can be a silicone gasket.

[0062] Similarly, the second connector 520 also includes a second waterproof component 524, which is disposed between the second substrate 511 and the housing 110.

[0063] In some implementations, the power of the motherboard main power connector is greater than 600W, the power of the processor auxiliary power connector is greater than 500W, and the power of the expansion card power connector is greater than 900W.

[0064] The motherboard's main power connector has a power output greater than 600W, which can ensure that other devices will not crash due to insufficient power supply when running at full load. The processor's auxiliary power connector has a power output greater than 500W, which can ensure that the CPU can obtain stable power under any circumstances, thereby achieving its ultimate performance. The expansion card power connector has a power output greater than 900W, which can reserve space for the next generation of graphics cards with higher power consumption.

[0065] In some embodiments, both the first substrate 411 and the second substrate 511 include a plurality of conductor layers, wherein at least one conductor layer is configured as a power distribution layer and at least another conductor layer is configured as a ground layer.

[0066] In other words, by setting a power layer dedicated to power distribution and a ground layer dedicated to grounding in the first substrate 411 and the second substrate 511, the DC impedance of the power supply network is greatly reduced, providing a stable and clean power supply for high-power components such as processors and graphics processors, and significantly improving the integrity of high-speed data signals.

[0067] Specifically, both the first substrate 411 and the second substrate 511 include six conductive layers, which are sequentially defined as the top layer (TOP), the first signal layer (S1), the power layer (POWER), the ground layer (GND), the second signal layer (S2), and the bottom layer (BOTTOM), each using copper with a thickness of not less than 1 ounce. The copper coverage of the power distribution layer and the ground layer is 90%–95%, meaning that a large area of ​​copper foil patterns is retained on these layers, with a copper foil area ratio of 90%–95%, thus providing an extremely low impedance power supply network for the processor and graphics processor. Of course, the copper coverage of the first signal layer, the second signal layer, and the bottom layer can also be 90%–95%.

[0068] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0069] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0070] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A chassis assembly, characterized in that, The chassis assembly includes: A cooling box includes a box body and a sealing component. The box body is used to store coolant and has a maintenance port. The sealing component is disposed on the box body and can open or close the maintenance port. The sealing component and / or the box body are provided with an adapter. A heat exchanger, wherein the input end of the heat exchanger is connected to the cooling box via a first connecting pipe, and the output end of the heat exchanger is connected to the cooling box via a second connecting pipe; A pump body is mounted on the first connecting pipe or the second connecting pipe to provide power for the flow of the coolant; An adapter unit is installed at the adapter interface.

2. The chassis assembly according to claim 1, characterized in that, The housing is provided with a first adapter interface, and the package is provided with a second adapter interface. The first adapter interface and the second adapter interface are not coplanar. The adapter unit includes a first adapter component and a second adapter component. The first adapter component is installed on the first adapter interface, and the second adapter component is installed on the second adapter interface.

3. The chassis assembly according to claim 2, characterized in that, The first adapter assembly includes a first adapter plate and a first connector. The first adapter plate includes a first substrate and a plurality of first interfaces disposed on the first substrate. The first adapter plate is mounted to the first adapter interface via the first connector. The second adapter assembly includes a second adapter plate and a second connector. The second adapter plate includes a second substrate and a plurality of second interfaces disposed on the second substrate. The second adapter plate is mounted to the second adapter interface via the second connector.

4. The chassis assembly according to claim 3, characterized in that, The first connector includes a first outer connecting plate, a first inner connecting plate, and a first fastener. The first outer connecting plate is disposed outside the housing, the first inner connecting plate is disposed inside the housing, the first base plate is disposed between the housing and the first outer connecting plate, the first base plate covers the first adapter, a plurality of the first interfaces are exposed on the first outer connecting plate and the first inner connecting plate, and the first fastener connects the first outer connecting plate, the first inner connecting plate, the housing, and the first base plate.

5. The chassis assembly according to claim 4, characterized in that, The first fastener includes a first fastening part and a first locking part. The first fastening part is disposed on the first inner connecting plate. The first outer connecting plate has a first outer connecting hole. The first base plate has a first fixing hole. The housing has a first transition hole. The first fastening part passes through the first transition hole, the first fixing hole and the first outer connecting hole. The first locking part is connected to the first fastening part and locks the first outer connecting plate.

6. The chassis assembly according to claim 4, characterized in that, The first connector also includes a waterproof component, which is disposed between the first substrate and the housing.

7. The chassis assembly according to claim 3, characterized in that, The plurality of first interfaces include a motherboard main power supply interface, a power on / off signal interface, at least one processor auxiliary power supply interface, at least one expansion card power supply interface, and at least one data storage device interface; the plurality of second interfaces include at least one universal serial bus interface, at least one network communication interface, and at least one video output interface.

8. The chassis assembly according to claim 7, characterized in that, The power of the motherboard main power supply interface is greater than 600W, the power of the processor auxiliary power supply interface is greater than 500W, and the power of the expansion card power supply interface is greater than 900W.

9. The chassis assembly according to claim 3, characterized in that, Both the first substrate and the second substrate include multiple conductor layers, wherein at least one conductor layer is configured as a power distribution layer and at least another conductor layer is configured as a ground layer.

10. The chassis assembly according to claim 9, characterized in that, The copper coverage of the power distribution layer and the ground layer is 90% to 95%.

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