Large shaft grounding device
By introducing a conductive substrate layer and a low contact resistance layer into the main shaft grounding device, combined with constant pressure loading and lubrication cooling mechanism, the problem of poor grounding effect was solved, and efficient conduction of static charge and reduction of electrolytic pits were achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHINA GENERAL NUCLEAR POWER OPERATION
- Filing Date
- 2025-05-15
- Publication Date
- 2026-06-26
AI Technical Summary
The existing shaft grounding device has poor grounding effect, with low contact stress, small contact area, and easy wear, which leads to increased grounding resistance, inability to effectively conduct static charge, and increased risk of electrolytic pitting.
The design incorporates a fixed fixture, a constant pressure loading mechanism, and a grounding slipper. The grounding slipper consists of a conductive substrate layer and a low contact resistance layer. The constant pressure loading mechanism maintains stable contact, and the combination of an oil dripping and cooling mechanism optimizes the contact area and resistance, thereby improving conductivity.
It improves grounding effectiveness, reduces static charge accumulation, lowers the risk of electrolytic pitting, extends the service life of the device, and is suitable for a wide range of shaft voltages.
Smart Images

Figure CN224418992U_ABST