A data center stacked heat dissipation ventilation device

Abstract

The utility model discloses a data center laminated heat dissipation ventilation device, including equipment placing frame, including equipment storage frame, with the equipment storage frame through screw fixed heat dissipation ventilation fan, install the fixed layer board of screw in the position between equipment storage frame opposite surface, the inside of equipment storage frame is equipped with airflow circulation cavity, the gas distribution part is including the gas collection cover of being installed in airflow circulation cavity and being welded on the equipment storage frame inboard wall, the gas distribution pipe of being penetrated equipment storage frame and being welded connection with gas collection cover, the heat dissipation flow guide subassembly is including the shunt pipe and airflow deflector of screw fixed connection, support strip and airflow deflector and shunt pipe support the suspended memory, benefit memory natural heat dissipation, when heat dissipation ventilation fan operation, the cold wind of external low temperature follows the path of airflow circulation cavity, gas collection cover, gas distribution pipe, shunt pipe, ventilation air port, airflow deflector flow, reaches the effect of air cooling heat dissipation ventilation.

Description

Technical Field

[0001] This utility model belongs to the field of data center heat dissipation technology, specifically relating to a data center layered heat dissipation and ventilation device. Background Technology

[0002] A data center is a dedicated physical facility that centrally stores and manages a large number of computing devices (servers, storage, network equipment, etc.) and supporting infrastructure (power supply, cooling, fire protection, security, etc.). It is also known as a server room. The computing devices are generally placed on multi-layered racks. The heat dissipation of the data center server room is generally achieved by using the server room air conditioner to supply air from the room, so that the equipment on the racks can achieve natural heat dissipation in a low-temperature environment.

[0003] When cooling computing devices, such as memory, are mounted on multi-layered racks, although the memory is in a low-temperature environment, the memory devices are placed on the shelves of the rack, and there is a large overlapping contact area between the memory and the shelves. The memory itself has heat dissipation holes. Under natural heat dissipation conditions, the temperature of the upper part of the memory may be significantly lower than that of the lower part, resulting in localized high temperatures. In addition, some cold air does not flow over the surface of the device, and the airflow around the memory is in a slow state. The utilization rate of cold air in the low-temperature environment is low. Improvements are needed to solve the problems mentioned above, such as large contact area with the memory leading to localized high temperatures, slow airflow, and lack of airflow outside the memory.

[0004] In order to address the problems of localized high temperatures, slow airflow, and lack of airflow outside the memory due to the large contact area between the support frame and the memory during operation of existing data center computer rooms, this application proposes a layered heat dissipation and ventilation device for data centers. Utility Model Content

[0005] The purpose of this invention is to provide a data center stacked heat dissipation and ventilation device to solve the problems mentioned in the background art, such as large contact area between the support and the memory resulting in local high temperature, slow airflow of cold air, and lack of airflow outside the memory.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a data center layered heat dissipation and ventilation device, comprising...

[0007] The equipment rack includes an equipment storage rack, a heat dissipation and ventilation fan fixed to the equipment storage rack by screws, and a fixed shelf installed by screws between the opposing surfaces of the equipment storage rack. The equipment storage rack has an airflow cavity inside.

[0008] The gas delivery component includes a gas collection hood installed in the airflow cavity and welded to the inner wall of the equipment storage rack, and a gas delivery pipe that penetrates the equipment storage rack and is welded to the gas collection hood.

[0009] The heat dissipation and airflow guiding assembly includes a split pipe and an airflow guiding plate that are fixedly connected by screws. The split pipe has an air storage chamber inside, and ventilation ports communicating with the air storage chamber are opened on the opposite surfaces of the split pipe.

[0010] Preferably, the equipment storage rack includes a horizontal plate at the bottom and vertical plates symmetrically distributed on the left and right, the airflow cavity is located inside the vertical plates, and the heat dissipation and ventilation fan is connected to the side wall at the bottom of the vertical plates.

[0011] Preferably, the vertical plate of the equipment storage rack has a first airflow port a that connects to the heat dissipation and ventilation fan and the airflow passage.

[0012] Preferably, the gas collection hood is a hollow cone shape that is narrow at one end and wide at the other end, and the gas delivery pipe is an inclined, hollow pipe structure.

[0013] Preferably, the end face of the diverter near the gas transmission pipe is provided with a second gas flow port a, which connects the gas transmission pipe and the gas storage chamber.

[0014] Preferably, the airflow guide plate is in an inclined state, and a concave guide groove is formed on the surface of the airflow guide plate.

[0015] Preferably, a vertical support bar is provided between the airflow guide plate and the diverter pipe.

[0016] Preferably, the ventilation path of the heat dissipation and ventilation fan is an airflow cavity, an air collection hood, an air supply pipe, a diversion pipe, a ventilation port, and an airflow guide plate within the equipment storage rack.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] 1. In this utility model, the device placement rack and support bars are designed to support the suspended memory, thereby reducing the contact area with the memory and facilitating natural heat dissipation of the memory.

[0019] 2. In this utility model, through the designed heat dissipation and airflow guiding component, when the heat dissipation and ventilation fan is running, the cold air at low external temperature flows along the path of the airflow cavity, air collection hood, air supply pipe, diversion pipe, ventilation port, and airflow guiding plate, and the cold air flows in a predetermined direction to achieve the effect of air cooling and ventilation. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the main structure of the equipment storage rack of this utility model;

[0022] Figure 3This is a three-dimensional structural diagram of the airflow guide plate of this utility model;

[0023] Figure 4 This is a top view of the fixed shelf structure of this utility model;

[0024] Figure 5 This is a cross-sectional view of the equipment storage rack of this utility model;

[0025] Figure 6 For the present utility model Figure 5 Enlarged structural diagram of section B in the middle;

[0026] Figure 7 For the present utility model Figure 2 Enlarged structural diagram of section A in the middle;

[0027] In the diagram: 1. Equipment storage rack; 2. Heat dissipation and ventilation fan; 3. Fixed shelf; 4. Airflow guide plate; 5. Support bar; 6. Gas supply pipe; 7. Diversion pipe; 8. Gas collection hood; 11. Airflow cavity; 41. Guide groove; 71. Ventilation vent; 72. Gas storage cavity. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figures 1 to 7This utility model provides a technical solution: a data center stacked heat dissipation and ventilation device, including an equipment placement rack, comprising an equipment storage rack 1, a heat dissipation and ventilation fan 2 fixed to the equipment storage rack 1 by screws, and a fixed shelf 3 installed by screws between the opposing surfaces of the equipment storage rack 1. The equipment storage rack 1 has an airflow cavity 11 inside. The storage data device is placed directly above the fixed shelf 3. When the heat dissipation and ventilation fan 2 is running, low-temperature cold air flows into the equipment storage rack 1, enters the airflow cavity 11, and exits from the airflow cavity 11 through a diversion pipe 7. The cold air flows at the bottom of the storage data device, achieving the purpose of heat dissipation and ventilation. The air supply component includes an air collection hood 8 installed inside the airflow cavity 11 and welded to the inner wall of the equipment storage rack 1, and an air supply pipe 6 penetrating the equipment storage rack 1 and welded to the air collection hood 8. The air collection hood 8 and the air supply pipe 6 are connected to the airflow cavity of the equipment storage rack 1. The airflow cavity 11 and the diversion pipe 7 allow the low-temperature cold air inside the diversion pipe 7 to enter the diversion pipe 7. The heat dissipation and air guiding assembly includes the diversion pipe 7 and the air guiding plate 4, which are fixedly connected by screws. The diversion pipe 7 has an air storage chamber 72 inside. Ventilation ports 71 communicating with the air storage chamber 72 are opened on the opposite surfaces of the diversion pipe 7. The diversion pipe 7 and the air guiding plate 4 are fixed to the fixed plate 3 by screws. The memory data device is placed on the surface of the diversion pipe 7 and the air guiding plate 4. The diversion pipe 7 and the air guiding plate 4 support the memory data device. The contact area between the diversion pipe 7 and the air guiding plate 4 and the memory data device is the top surface of the diversion pipe 7 and the air guiding plate 4, which has a rectangular orthographic projection. The memory data device is similar to being suspended on the diversion pipe 7 and the air guiding plate 4. The bottom surface of the memory data device can contact the external cold air to achieve the effect of natural heat dissipation. At the same time, the cold air discharged from the diversion pipe 7 flows to achieve the effect of air cooling and ventilation.

[0030] In this embodiment, the equipment storage rack 1 includes a horizontal plate at the bottom and vertical plates symmetrically distributed on the left and right. The airflow cavity 11 is located inside the vertical plate. The heat dissipation and ventilation fan 2 is connected to the side wall at the bottom of the vertical plate. A first airflow port a is provided on the vertical plate of the equipment storage rack 1 to connect the heat dissipation and ventilation fan 2 and the airflow cavity 11. When the heat dissipation and ventilation fan 2 is running, low-temperature cold air flows into the equipment storage rack 1 and enters the airflow cavity 11. The function of the first airflow port a is to allow the airflow generated by the operation of the heat dissipation and ventilation fan 2 to enter the airflow cavity 11.

[0031] In this embodiment, the gas collection hood 8 is a hollow cone shape with one end narrow and the other end wide, and the gas delivery pipe 6 is an inclined hollow pipe structure. The gas collection hood 8 and the gas delivery pipe 6 are connected to the airflow circulation chamber 11 and the diversion pipe 7 of the equipment storage rack 1, so that the low-temperature cold air inside the airflow circulation chamber 11 enters the diversion pipe 7.

[0032] In this embodiment, a second airflow port a is provided on the end face of the diversion pipe 7 near the gas transmission pipe 6 to connect the gas transmission pipe 6 and the gas storage chamber 72, so that the low-temperature cold air inside the airflow passage chamber 11 enters the diversion pipe 7.

[0033] In this embodiment, the airflow guide plate 4 is in an inclined state, and a concave guide groove 41 is provided on the surface of the airflow guide plate 4. The airflow guide plate 4 plays the role of guiding the flow, and the gas flows in the guide groove 41. Under the action of the airflow guide plate 4 and the guide groove 41, the cold air flows in a predetermined direction.

[0034] In this embodiment, a vertical support bar 5 is provided between the airflow guide plate 4 and the diversion pipe 7. The support bar 5, the airflow guide plate 4, and the diversion pipe 7 form a right-angled triangular structure, which serves to support the memory device.

[0035] In this embodiment, the ventilation path of the cooling and ventilation fan 2 is the airflow passage 11, the air collection hood 8, the air supply pipe 6, the diversion pipe 7, the ventilation port 71, and the airflow guide plate 4 inside the equipment storage rack 1. When the cooling and ventilation fan 2 is running, the cold air at low temperature outside flows along the path of the airflow passage 11, the air collection hood 8, the air supply pipe 6, the diversion pipe 7, the ventilation port 71, and the airflow guide plate 4.

[0036] Working principle and usage process of this utility model:

[0037] When the memory is placed on the multi-layered device storage rack 1, the memory is placed on the support bar 5, the airflow guide plate 4, and the diversion pipe 7.

[0038] The support bar 5, the airflow guide plate 4, and the diversion pipe 7 form a right-angled triangular structure to support the memory device;

[0039] The storage data device appears to be suspended above the distribution pipe 7, the airflow guide plate 4, and the support bar 5. The bottom surface of the storage data device can come into contact with external cool air to achieve a natural heat dissipation effect.

[0040] When the cooling and ventilation fan 2 is running, the cold air from the outside flows along the path of the airflow cavity 11, the air collection hood 8, the air supply pipe 6, the diversion pipe 7, the ventilation port 71, and the airflow guide plate 4.

[0041] Under the action of the airflow guide plate 4 and the guide groove 41, the cold air flows in a predetermined direction and the cold air discharged from the split pipe 7 flows to achieve the effect of air cooling and ventilation.

[0042] In summary, this application provides a stacked heat dissipation and ventilation device that reduces the contact area between the support and the memory to avoid local high temperatures, accelerates the flow of cold air, and allows it to circulate outside the memory. The support bar 5, the airflow guide plate 4, and the diversion pipe 7 support the suspended memory. When the heat dissipation and ventilation fan 2 is running, the cold air from outside flows along the path of the airflow cavity 11, the air collection hood 8, the air supply pipe 6, the diversion pipe 7, the ventilation port 71, and the airflow guide plate 4, achieving the effect of air cooling and ventilation.

[0043] Although embodiments of the present invention have been shown and described (see the detailed description above), it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A layered heat dissipation and ventilation device for data centers, characterized in that: include The equipment rack includes an equipment storage rack (1), a heat dissipation and ventilation fan (2) fixed to the equipment storage rack (1) by screws, and a fixed shelf (3) installed between the opposing surfaces of the equipment storage rack (1) by screws. The equipment storage rack (1) has an airflow cavity (11) inside. The gas delivery component includes a gas collection hood (8) installed in the airflow cavity (11) and welded to the inner wall of the equipment storage rack (1), and a gas delivery pipe (6) that passes through the equipment storage rack (1) and is welded to the gas collection hood (8); The heat dissipation and airflow guiding assembly includes a diversion pipe (7) and an airflow guiding plate (4) that are fixedly connected by screws. The diversion pipe (7) has an air storage chamber (72) inside. Ventilation ports (71) communicating with the air storage chamber (72) are opened on the opposite surfaces of the diversion pipe (7).

2. The data center stacked heat dissipation and ventilation device according to claim 1, characterized in that: The equipment storage rack (1) includes a horizontal plate at the bottom and vertical plates symmetrically distributed on the left and right. The airflow cavity (11) is located inside the vertical plate, and the heat dissipation and ventilation fan (2) is connected to the side wall at the bottom of the vertical plate.

3. The data center stacked heat dissipation and ventilation device according to claim 2, characterized in that: The equipment storage rack (1) has a first airflow port a on its vertical plate that connects the heat dissipation and ventilation fan (2) and the airflow passage (11).

4. The data center stacked heat dissipation and ventilation device according to claim 1, characterized in that: The gas collection hood (8) is a hollow cone shape that is narrow at one end and wide at the other end, and the gas delivery pipe (6) is an inclined hollow pipe structure.

5. A data center stacked heat dissipation and ventilation device according to claim 1, characterized in that: The diverter (7) has a second air outlet a on its end face near the gas delivery pipe (6) that connects the gas delivery pipe (6) and the gas storage chamber (72).

6. A data center layered heat dissipation and ventilation device according to claim 1, characterized in that: The airflow guide plate (4) is in an inclined state, and a concave guide groove (41) is provided on the surface of the airflow guide plate (4).

7. A data center layered heat dissipation and ventilation device according to claim 1, characterized in that: A vertical support bar (5) is provided between the airflow guide plate (4) and the diversion pipe (7).

8. A data center layered heat dissipation and ventilation device according to claim 1, characterized in that: The ventilation path of the cooling and ventilation fan (2) is the airflow passage (11) in the equipment storage rack (1), the air collection hood (8), the air supply pipe (6), the diversion pipe (7), the ventilation port (71), and the airflow guide plate (4).

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