Wafer loading mechanism based on stepper motor control

Abstract

The utility model provides a kind of wafer loading mechanism based on stepping motor control, it includes support assembly, horizontal wafer taking assembly, wafer taking drive assembly, longitudinal transfer assembly, transfer drive assembly, vertical wafer loading assembly and wafer loading drive assembly, the loading mechanism is realized high-precision positioning control using stepping motor cooperation precision transmission mechanism, ensure that wafer pick-and-place position is accurate and correct, using modular design separates and organically integrates horizontal wafer, longitudinal transfer and vertical wafer loading function, compact structure and movement path optimization, improve equipment space utilization and operating efficiency, wafer suction cup can complete lateral wafer insertion action by longitudinal movement, simplify mechanical structure, reduce movement interference risk, improve system reliability, the whole mechanism uses rigid guide and linear bearing support, movement is stable and resistant to vibration, cooperate the accurate control of stepping motor, can realize long time high-repetition accuracy stable operation, greatly improve the automation level and production efficiency of wafer loading.

Description

Technical Field

[0001] This utility model relates to integrated circuit manufacturing equipment, and more particularly to a wafer loading mechanism based on stepper motor control. Background Technology

[0002] Patent document CN219513069U discloses a wafer transfer and loading device, which includes a housing, a wafer cassette loading assembly, and a window closing component. The housing has a first window on its side wall. The wafer cassette loading assembly is located on the side of the housing with the first window. The wafer cassette loading assembly includes a lifting platform that is movable relative to the housing. The window closing component is located on the lifting platform and can move between a first position and a second position under the drive of the lifting platform. In the first position, the window closing component closes the first window; in the second position, the window closing component opens the first window. The window closing component is located on the lifting platform of the wafer cassette loading assembly, and the first window is closed and released by the window closing component. However, this wafer loading device uses a single drive system to handle both wafer cassette opening and environmental sealing, sacrificing system modularity, control precision, and operational flexibility. Therefore, it is necessary to optimize its structure to overcome the aforementioned shortcomings. Utility Model Content

[0003] The purpose of this invention is to provide a wafer loading mechanism based on stepper motor control to improve its operational reliability and control accuracy.

[0004] The technical solution adopted by this utility model to solve its technical problem is:

[0005] A wafer loading mechanism based on stepper motor control, comprising:

[0006] A support assembly component having an assembly space;

[0007] A lateral wafer pick-up assembly is installed in a support assembly and connected to a wafer feeding device. It can move laterally in the support assembly and pick up the wafer from the wafer feeding device.

[0008] A wafer picking drive assembly is installed in the support assembly assembly and cooperates with the transverse wafer picking assembly. The wafer picking drive assembly drives the transverse wafer picking assembly to move.

[0009] A longitudinal transfer assembly is installed in the support assembly assembly and is connected to the transverse sheet-retrieving assembly and the loading container. It can move longitudinally in the support assembly assembly and switch between the transverse sheet-retrieving assembly and the loading container.

[0010] A transfer drive assembly is installed in the support assembly assembly and cooperates with the longitudinal transfer assembly, and the longitudinal transfer assembly is driven by the transfer drive assembly to move.

[0011] A vertical wafer carrier assembly is installed in a longitudinal transfer assembly and can move longitudinally together with the longitudinal transfer assembly. When it moves to a position corresponding to the lateral wafer pick-up assembly, it can pick up the wafer from the lateral wafer pick-up assembly. When it moves to a position corresponding to the loading container, it can place the wafer in the loading container.

[0012] A wafer drive assembly is installed in the longitudinal transfer assembly and cooperates with the vertical wafer carrier assembly. The wafer drive assembly drives the vertical wafer carrier assembly to move.

[0013] Specifically, the supporting assembly components include:

[0014] A support base frame is formed by enclosing plates and arranged longitudinally. The longitudinal transfer assembly and the transfer drive assembly are installed in the support base frame.

[0015] The support frame is formed by enclosing plates, which are arranged vertically and installed on the top of the support base frame;

[0016] The support top frame is formed by enclosing plates, which are arranged laterally and installed on the top of the support frame. The lateral plate picking assembly and the plate picking drive assembly are installed in the support top frame.

[0017] The lateral slice-taking assembly includes:

[0018] A pair of transverse guide rails are provided, each of which is installed in the support top frame and arranged transversely to connect with the wafer feeding equipment.

[0019] The slide carrier is arranged longitudinally, and its two ends are respectively connected to the transverse guide rail by sliders, so that it can move along the transverse guide rail;

[0020] The wafer chuck is installed at the bottom of the wafer chuck carrier and is connected to the vacuum equipment through a pipeline. It can move together with the wafer chuck carrier and is used to remove the wafer from the wafer feeding equipment.

[0021] The chip loading driver component includes:

[0022] The tablet-retrieving belt is provided in pairs, with each tablet-retrieving belt located above the transverse guide rail. Both ends of the belt are installed in the support top frame via synchronous gears, allowing it to reciprocate within the support top frame. Both ends of the tablet-retrieving frame are engaged with the tablet-retrieving belt, and the tablet-retrieving frame is moved by the tablet-retrieving belt.

[0023] The wafer picking motor is a stepper motor installed in the support frame. Its power output shaft is connected to the synchronous gear through a gear belt transmission structure, and the wafer picking motor drives the wafer picking ring belt to reciprocate.

[0024] The longitudinal transfer assembly includes:

[0025] A pair of longitudinal rails are provided, each of which is installed in the support base frame and is arranged longitudinally, extending from the retrieval suction cup to the bottom of the loading container.

[0026] A longitudinal guide rod is installed in the support base frame, located above the longitudinal ground rail, arranged longitudinally, and extending from the tablet retrieval suction cup to the bottom of the loading container;

[0027] The transfer carrier is formed by enclosing plates. Its bottom is connected to the longitudinal ground rail via a slider, and its top is connected to the longitudinal guide rod via a linear bearing, allowing it to move along the longitudinal ground rail and the longitudinal guide rod.

[0028] The transfer driver components include:

[0029] The transfer screw is located between the longitudinal ground rails and is arranged longitudinally. Its two ends are respectively installed in the support base through bearings and can rotate in the support base. The bottom of the transfer frame is engaged with the transfer screw through a transmission nut.

[0030] The transfer motor is a stepper motor installed in the support base. Its power output shaft is connected to the transfer screw through a gear and belt transmission structure. The transfer motor drives the transfer screw to rotate, and causes the transfer carrier to move along the longitudinal ground rail and longitudinal guide rod.

[0031] The vertical slide carrier assembly includes:

[0032] The vertical guide rails are provided in two pairs, with each pair of vertical guide rails installed on both sides of the transfer frame and arranged vertically.

[0033] The slide holders are provided in pairs, with each slide holder arranged on both sides of the transfer frame and connected to the vertical guide rail via a slide rail. They can move longitudinally together with the transfer frame and can also move independently vertically within the transfer frame.

[0034] The wafer chuck is located above the transfer carrier and below the wafer pick-up chuck. It is connected to the wafer carrier frame via a connecting column and is connected to the vacuum equipment via a pipeline. It can move together with the wafer carrier frame. The width of the wafer chuck is smaller than the width of the loading container and the diameter of the wafer. The wafer chuck can receive the wafer in the wafer pick-up chuck and transfer it to the loading container.

[0035] The chip driver assembly includes:

[0036] The slide carrier screw is located in the transfer carrier and is arranged vertically. Its two ends are respectively installed in the transfer carrier through bearings and can rotate in the transfer carrier.

[0037] The transition crossbeam is located in the transfer carrier. The transfer carrier has clearance slots on both sides, and each clearance slot extends vertically. The middle part of the transition crossbeam is connected to the plate screw through a transmission nut, and its two ends extend out from the clearance slots and engage with the plate seat.

[0038] The wafer carrier motor is installed in the transfer frame. Its power output shaft is connected to the wafer carrier screw. The wafer carrier motor drives the wafer carrier screw to rotate, and causes the transfer cross frame and wafer carrier frame to move vertically.

[0039] The advantages of this utility model are:

[0040] This loading mechanism uses a stepper motor and a precision transmission mechanism to achieve high-precision positioning control, ensuring accurate wafer pick-up and placement. Its modular design separates yet integrates the functions of lateral wafer picking, longitudinal transfer, and vertical wafer loading, resulting in a compact structure and optimized motion path. This improves equipment space utilization and operational efficiency. The wafer chuck completes lateral wafer insertion with a single longitudinal movement, simplifying the mechanical structure, reducing the risk of motion interference, and improving system reliability. The entire mechanism is supported by rigid guide rails and linear bearings, ensuring smooth and vibration-resistant movement. Combined with the precise control of the stepper motor, it achieves stable operation with high repeatability over extended periods, significantly enhancing the automation level and production efficiency of wafer loading. Attached Figure Description

[0041] Figure 1 This is one of the structural schematic diagrams of the wafer loading mechanism based on stepper motor control proposed in this utility model;

[0042] Figure 2 This is the second structural schematic diagram of the loading mechanism;

[0043] Figure 3 This is the third structural diagram of the loading structure. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0045] like Figures 1-3 As shown, the wafer loading mechanism based on stepper motor control proposed in this utility model includes a support assembly assembly, a horizontal wafer picking assembly, a wafer picking drive assembly, a vertical transfer assembly, a transfer drive assembly, a vertical wafer carrying assembly, and a wafer carrying drive assembly. The support assembly assembly has an assembly space. The horizontal wafer picking assembly is installed in the support assembly assembly and is connected to the wafer feeding equipment. It can move horizontally in the support assembly assembly to pick up the wafer from the wafer feeding equipment. The wafer picking drive assembly is installed in the support assembly assembly and cooperates with the horizontal wafer picking assembly. The wafer picking drive assembly drives the horizontal wafer picking assembly to move. The vertical transfer assembly is installed in the support assembly assembly and works with the horizontal wafer picking assembly. The wafer carrier assembly is connected to the loading container and can move longitudinally within the support assembly. It can switch between the transverse wafer pick-up assembly and the loading container. The transfer drive assembly is installed in the support assembly and cooperates with the longitudinal transfer assembly. The transfer drive assembly drives the longitudinal transfer assembly to move. The vertical wafer carrier assembly is installed in the longitudinal transfer assembly and can move longitudinally together with the longitudinal transfer assembly. When it moves to the position corresponding to the transverse wafer pick-up assembly, it can pick up the wafer from the transverse wafer pick-up assembly. When it moves to the position corresponding to the loading container, it can place the wafer in the loading container. The wafer carrier drive assembly is installed in the longitudinal transfer assembly and cooperates with the vertical wafer carrier assembly. The wafer carrier drive assembly drives the vertical wafer carrier assembly to move.

[0046] In this embodiment, the support assembly includes a support base frame 110, a support stand 120, and a support top frame 130. The support base frame is formed by enclosing plates and is arranged longitudinally. The longitudinal transfer component and the transfer drive component are installed in the support base frame. The support stand is formed by enclosing plates and is arranged vertically and installed on the top of the support base frame. The support top frame is formed by enclosing plates and is arranged transversely and installed on the top of the support stand frame. The transverse plate picking component and the plate picking drive component are installed in the support top frame.

[0047] The lateral wafer pick-up assembly includes a lateral guide rail 210, a wafer pick-up carrier 220, and a wafer pick-up chuck 230. There is a pair of lateral guide rails, each of which is installed in the support top frame and arranged laterally to connect with the wafer feeding equipment. The wafer pick-up carrier is arranged longitudinally, and its two ends are respectively connected to the lateral guide rails through sliders, so it can move along the lateral guide rails. The wafer pick-up chuck is installed at the bottom of the wafer pick-up carrier and is connected to the vacuum equipment through a pipeline. It can move together with the wafer pick-up carrier and pick up the wafer from the wafer feeding equipment.

[0048] The film picking drive assembly includes a film picking belt 310 and a film picking motor 320. There is a pair of film picking belts, each located above the transverse guide rail. Both ends of the belts are mounted in the support frame via synchronous gears, allowing them to reciprocate within the support frame. Both ends of the film picking carrier are engaged with the film picking belts, which carry the carriers as they move. The film picking motor is a stepper motor, mounted in the support frame. Its power output shaft engages with the synchronous gears via a gear belt transmission structure, driving the film picking belts to reciprocate. To ensure the consistency of the film picking belts' operation, the synchronous gears of the belts are engaged via a synchronous connecting rod 330.

[0049] The longitudinal transfer assembly includes a longitudinal ground rail 410, a longitudinal guide rod 420, and a transfer carrier 430. There is a pair of longitudinal ground rails, each of which is installed in the support base and is arranged longitudinally, extending from the tablet suction cup to the bottom of the loading container. The longitudinal guide rod is installed in the support base, located above the longitudinal ground rail, and is arranged longitudinally, extending from the tablet suction cup to the bottom of the loading container. The transfer carrier is formed by enclosing plates, with its bottom engaging with the longitudinal ground rail via a slider, and its top engaging with the longitudinal guide rod via a linear bearing, allowing it to move along the longitudinal ground rail and the longitudinal guide rod.

[0050] The transfer drive assembly includes a transfer screw 510 and a transfer motor 520. The transfer screw is located between the longitudinal ground rails and is arranged longitudinally. Its two ends are respectively mounted in the support base through bearings and can rotate in the support base. The bottom of the transfer frame is engaged with the transfer screw through a transmission nut. The transfer motor is a stepper motor and is mounted in the support base. Its power output shaft is engaged with the transfer screw through a gear and belt transmission structure. The transfer motor drives the transfer screw to rotate and moves the transfer frame along the longitudinal ground rails and longitudinal guide rods.

[0051] The vertical wafer carrier assembly includes a vertical guide rail 610, a wafer holder 620, and a wafer chuck 630. There are two pairs of vertical guide rails, each pair of which are installed on both sides of the transfer frame and arranged vertically. There is one pair of wafer holders, each wafer holder is arranged on both sides of the transfer frame and is connected to the vertical guide rails by slide rails. They can move longitudinally with the transfer frame and can also move vertically independently within the transfer frame. The wafer chuck is located above the transfer frame and below the wafer pick-up chuck. It is connected to the wafer holder through a transition column and is connected to the vacuum equipment through a pipeline. It can move with the wafer holder. The width of the wafer chuck is smaller than the width of the loading container and the diameter of the wafer. The wafer chuck can receive the wafer in the wafer pick-up chuck and transfer it to the loading container. In this embodiment, the wafer carrier chuck has a pair of wafer receiving positions, each located at both ends of the wafer carrier chuck and arranged longitudinally. These positions adsorb the middle of the wafer, allowing the wafer to be placed into loading containers in two directions. This can be used flexibly according to the specific layout of the equipment.

[0052] The wafer carrier drive assembly includes a wafer carrier screw 710, a transition crossbeam 720, and a wafer carrier motor 730. The wafer carrier screw is located in the transfer frame and is arranged vertically. Its two ends are respectively installed in the transfer frame through bearings and can rotate in the transfer frame. The transition crossbeam is located in the transfer frame. The transfer frame has clearance slots 431 on both sides, and each clearance slot extends vertically. The middle part of the transition crossbeam is engaged with the wafer carrier screw through a transmission nut. Its two ends extend out from the clearance slots and engage with the wafer carrier seat. The wafer carrier motor is installed in the transfer frame, and its power output shaft is engaged with the wafer carrier screw. The wafer carrier motor drives the wafer carrier screw to rotate and causes the transition crossbeam and the wafer carrier seat to move vertically.

[0053] In operation, the wafer pickup motor in the wafer pickup drive assembly starts, driving the wafer pickup belt via gears and a belt to move the wafer pickup carrier of the horizontal wafer pickup assembly along the horizontal guide rail, bringing the wafer pickup chuck directly above the wafer to be picked up in the wafer feeding device. The wafer feeding device then rises a short distance, aligning the wafer with the wafer pickup chuck. The chuck uses vacuum to adhere to the back of the wafer. The feeding device then descends to separate from the wafer, and the wafer pickup motor reverses, pulling the wafer pickup carrier back to its initial waiting position. Next, the transfer motor in the transfer drive assembly starts, driving the transfer screw to rotate, moving the vertical transfer assembly to a position directly below the horizontal wafer pickup assembly. At this point, the wafer carrier motor in the wafer carrier drive assembly starts, driving the wafer carrier screw to raise the wafer carrier chuck of the vertical wafer carrier assembly. When the wafer carrier chuck contacts the wafer adhered to the bottom surface by the wafer pickup chuck, the wafer carrier chuck uses vacuum to adhere to the wafer, and the wafer pickup chuck breaks the vacuum to complete the wafer transfer. The wafer carrier chuck then descends to create a safe space. The transfer motor then restarts, driving the longitudinal transfer assembly to move the wafer longitudinally. Depending on the position of the loading container, it moves to one end of the longitudinal ground rail or the other, until the wafer on the wafer chuck is precisely aligned with the wafer positioning slot in the target loading container. Since the width of the wafer chuck is smaller than the width of the loading container and the diameter of the wafer, the transfer motor continues precise micro-motion, driving the longitudinal transfer assembly to insert the wafer chuck and wafer laterally into the loading container, placing the wafer on the wafer positioning slot. Finally, the wafer chuck releases the wafer by breaking the vacuum, and the transfer motor reverses its direction, causing the longitudinal transfer assembly to withdraw the wafer chuck from the loading container and return to a safe position. All components of the entire system then coordinate and reset, awaiting the next cycle.

[0054] In the description of this utility model, it should be noted that when terms such as "upper," "lower," "inner," "outer," "left," and "right" appear to indicate orientation or positional relationships, they should be understood as being based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationships commonly used when the product of this utility model is in use, or the orientation or positional relationships commonly understood by those skilled in the art. These terms are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, when terms such as "first" and "second" appear, they are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, it should also be noted that unless otherwise explicitly specified and limited, terms such as "installation," "setting," and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

Claims

1. A wafer loading mechanism based on stepper motor control, characterized in that, include: A support assembly component having an assembly space; A lateral wafer pick-up assembly is installed in a support assembly and connected to a wafer feeding device. It can move laterally in the support assembly and pick up the wafer from the wafer feeding device. A wafer picking drive assembly is installed in the support assembly assembly and cooperates with the transverse wafer picking assembly. The wafer picking drive assembly drives the transverse wafer picking assembly to move. A longitudinal transfer assembly is installed in the support assembly assembly and is connected to the transverse sheet-retrieving assembly and the loading container. It can move longitudinally in the support assembly assembly and switch between the transverse sheet-retrieving assembly and the loading container. A transfer drive assembly is installed in the support assembly assembly and cooperates with the longitudinal transfer assembly, and the longitudinal transfer assembly is driven by the transfer drive assembly to move. A vertical wafer carrier assembly is installed in a longitudinal transfer assembly and can move longitudinally together with the longitudinal transfer assembly. When it moves to a position corresponding to the lateral wafer pick-up assembly, it can pick up the wafer from the lateral wafer pick-up assembly. When it moves to a position corresponding to the loading container, it can place the wafer in the loading container. A wafer drive assembly is installed in the longitudinal transfer assembly and cooperates with the vertical wafer carrier assembly. The wafer drive assembly drives the vertical wafer carrier assembly to move.

2. The wafer loading mechanism based on stepper motor control according to claim 1, characterized in that, Support assembly components include: A support base frame is formed by enclosing plates and arranged longitudinally. The longitudinal transfer assembly and the transfer drive assembly are installed in the support base frame. The support frame is formed by enclosing plates, which are arranged vertically and installed on the top of the support base frame; The support top frame is formed by enclosing plates, which are arranged laterally and installed on the top of the support frame. The lateral plate picking assembly and the plate picking drive assembly are installed in the support top frame.

3. A wafer loading mechanism based on stepper motor control according to claim 2, characterized in that, The lateral slice-taking assembly includes: A pair of transverse guide rails are provided, each of which is installed in the support top frame and arranged transversely to connect with the wafer feeding equipment. The slide carrier is arranged longitudinally, and its two ends are respectively connected to the transverse guide rail by sliders, so that it can move along the transverse guide rail; The slide retrieval suction cup is installed at the bottom of the slide retrieval carrier and is connected to the vacuum equipment through a pipeline. It can move together with the slide retrieval carrier.

4. A wafer loading mechanism based on stepper motor control according to claim 3, characterized in that, The chip loading driver component includes: The tablet-retrieving ring belt is provided in pairs, with each tablet-retrieving ring belt located above the transverse guide rail. Both ends of the ring belt are respectively installed in the support top frame via synchronous gears, allowing it to reciprocate within the support top frame. Both ends of the tablet-retrieving carrier are engaged with the tablet-retrieving ring belt. The wafer picking motor is a stepper motor installed in the support frame, and its power output shaft is connected to the synchronous gear through a gear belt transmission structure.

5. A wafer loading mechanism based on stepper motor control according to claim 3, characterized in that, The longitudinal transfer assembly includes: A pair of longitudinal rails are provided, each of which is installed in the support base frame and is arranged longitudinally, extending from the retrieval suction cup to the bottom of the loading container. A longitudinal guide rod is installed in the support base frame, located above the longitudinal ground rail, arranged longitudinally, and extending from the tablet retrieval suction cup to the bottom of the loading container; The transfer carrier is formed by enclosing plates. Its bottom is connected to the longitudinal ground rail via a slider, and its top is connected to the longitudinal guide rod via a linear bearing, allowing it to move along the longitudinal ground rail and the longitudinal guide rod.

6. A wafer loading mechanism based on stepper motor control according to claim 5, characterized in that, The transfer driver components include: The transfer screw is located between the longitudinal ground rails and is arranged longitudinally. Its two ends are respectively installed in the support base through bearings and can rotate in the support base. The bottom of the transfer frame is engaged with the transfer screw through a transmission nut. The transfer motor is a stepper motor, which is installed in the support frame. Its power output shaft is connected to the transfer screw through a gear and belt transmission structure.

7. A wafer loading mechanism based on stepper motor control according to claim 3 or 5, characterized in that, The vertical slide carrier assembly includes: The vertical guide rails are provided in two pairs, with each pair of vertical guide rails installed on both sides of the transfer frame and arranged vertically. The slide holders are provided in pairs, with each slide holder arranged on both sides of the transfer frame and connected to the vertical guide rail via a slide rail. They can move longitudinally together with the transfer frame and can also move independently vertically within the transfer frame. The slide suction cup is located above the transfer carrier and below the slide pick-up suction cup. It is connected to the slide holder via a connecting column and is connected to the vacuum equipment via a pipeline. It can move together with the slide holder.

8. A wafer loading mechanism based on stepper motor control according to claim 7, characterized in that, The chip driver assembly includes: The slide carrier screw is located in the transfer carrier and is arranged vertically. Its two ends are respectively installed in the transfer carrier through bearings and can rotate in the transfer carrier. The transition crossbeam is located in the transfer carrier. The transfer carrier has clearance slots on both sides, and each clearance slot extends vertically. The middle part of the transition crossbeam is connected to the plate screw through a transmission nut, and its two ends extend out from the clearance slots and engage with the plate seat. A wafer carrier motor is installed in a transfer carrier, and its power output shaft is connected to a wafer carrier screw.

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