Wafer carrying device and wafer processing apparatus

Abstract

The utility model belongs to wafer processing technical field discloses a kind of wafer bearing device and wafer processing equipment.Wafer bearing device includes bearing body and vacuum adsorption structure.Bearing body is ring shape with through hole in middle, the bearing body can rotate around its axis;Vacuum adsorption structure is recessed in the upper surface of the bearing body and is set along the circumference of the bearing body, and the vacuum adsorption structure is configured to vacuum adsorption to the edge of wafer.In the processing process of wafer, when replacing cutter wheel size, wafer bearing device does not need to be replaced, to avoid affecting the processing efficiency and processing quality of wafer.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer carrier device and wafer processing equipment. Background Technology

[0002] 3D stacked chips are three-dimensional structures formed by vertically stacking multiple chips together through a packaging layer. This significantly reduces the communication distance between chips, increases data transmission speed, and reduces power consumption. Therefore, 3D stacked chips have a huge application market in artificial intelligence, big data, and new energy fields. The core of 3D stacked chips lies in thinning the wafers to a thickness of several micrometers while maintaining high flatness to achieve chip positioning, stacking, and connection. As the number of stacked wafers increases, uneven wafer edges can lead to insufficient wafer bonding, easily causing cracks or fragments during subsequent wafer grinding and thinning processes, severely affecting quality and yield. To avoid this, one of the two stacked wafers undergoes edge trimming before bonding.

[0003] During wafer trimming, the wafer is held in place on a rotatable wafer stage. A grinding wheel, driven by a spindle located on the side of the wafer stage, grinds the wafer along its edge. A recess is located in the center of the wafer stage, containing a lifting mechanism that raises and lowers the wafer. A suction nozzle is positioned on the upper surface of the wafer stage along the circumference of the recess; this nozzle is connected to an external vacuum pump, allowing the wafer to be vacuum-held when placed on it.

[0004] Grinding wheels come in various thicknesses. During wafer grinding, it may be necessary to change the grinding wheel. When replacing a thin wheel with a thick wheel, the thick wheel creates a larger thin edge on the wafer, which, due to insufficient edge strength, can easily cause curling. Conversely, when replacing a thick wheel with a thin wheel, the larger diameter of the recess in the wafer stage leaves a portion of the wafer suspended. When the thin wheel grinds this suspended portion, the wafer is prone to breakage due to excessive localized pressure.

[0005] Therefore, when changing to different specifications of cutting wheels, it is necessary to adapt and change to a wafer stage with a corresponding dip groove diameter.

[0006] However, replacing the corresponding platform along with the cutter wheel would require a series of operations such as disassembly, reassembly, and parameter readjustment, which is equivalent to reinstalling and debugging the equipment, severely reducing work efficiency.

[0007] Therefore, there is an urgent need for a wafer carrier device, wafer processing equipment, and a control method for wafer processing equipment to solve the above problems. Utility Model Content

[0008] The purpose of this utility model is to provide a wafer carrier device and a wafer processing equipment, which eliminates the need to replace the wafer carrier device when replacing a thin cutter wheel with a thick cutter wheel or vice versa during the wafer processing, thereby avoiding affecting the wafer processing efficiency and quality.

[0009] To achieve this objective, the present invention adopts the following technical solution:

[0010] Wafer carrier device, including:

[0011] The supporting body is in the shape of a ring with a through hole in the middle, and the supporting body can rotate around its own axis;

[0012] A vacuum adsorption structure is recessed on the upper surface of the carrier body and arranged circumferentially along the carrier body. The vacuum adsorption structure is configured to vacuum adsorb the edge of the wafer.

[0013] Optionally, the vacuum adsorption structure includes pores, and the carrier body is provided with an annular cavity communicating with the pores, the annular cavity being configured to communicate with a vacuum pump.

[0014] Optionally, the vacuum adsorption structure includes a plurality of air holes, which are arranged sequentially at intervals along the circumference of the support body.

[0015] Optionally, along the circumference of the support body, two adjacent air holes are offset radially from each other along the support body.

[0016] Optionally, the shape of the pores can be circular, elliptical, or polygonal.

[0017] Optionally, the vacuum adsorption structure is a continuous groove structure.

[0018] Optionally, the groove structure includes a plurality of sub-grooves connected sequentially along the circumference of the supporting body, the sub-grooves being arc-shaped or serrated.

[0019] Optionally, the groove body is serrated, and the serrations are straight or oblique.

[0020] Optionally, the wafer carrier device further includes a lifting mechanism, the output end of which is disposed in the through hole and is capable of moving up and down relative to the carrier body.

[0021] The wafer processing equipment includes a cutting wheel and the aforementioned wafer carrier device, wherein the cutting wheel is rotatable about its own axis to process the wafer on the wafer carrier device.

[0022] The beneficial effects of this utility model are:

[0023] The wafer carrier device provided by this utility model places the wafer on the upper surface of the carrier body and connects the vacuum adsorption structure to an external vacuum pump. The vacuum pump evacuates the vacuum adsorption structure, thereby vacuum adsorbing the wafer onto the upper surface of the carrier body. Since the vacuum adsorption structure is arranged circumferentially along the carrier body, it can vacuum adsorb the wafer's edge, preventing edge curling when replacing the thin-blade wheel with a thick-blade wheel during grinding. In designing this wafer carrier device, compared to the size of the recess in the center of the wafer stage in existing technologies, the diameter of the through-hole in the center of the carrier body is designed to be smaller. This allows the carrier body to provide as much support as possible for the wafer near the center. When the thick-blade wheel is replaced with a thin-blade wheel during grinding, although the local pressure on the wafer increases when the thin-blade wheel acts on it, the wafer will not break at the position directly opposite the through-hole because the carrier body provides as much support as possible for the wafer near the center.

[0024] This avoids the need to adapt the wafer stage when changing the cutting wheel, as is required in existing technologies, and also eliminates the need to readjust relevant parameters, thus improving the efficiency of wafer processing.

[0025] The wafer processing equipment provided by this utility model can guarantee the processing quality and efficiency of wafers. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the structure of the wafer processing equipment provided in Embodiment 1 of this utility model;

[0028] Figure 2 This is a schematic diagram of the first form of the vacuum adsorption structure in the wafer carrier device provided in Embodiment 1 of this utility model;

[0029] Figure 3 This is a schematic diagram of the second form of the vacuum adsorption structure in the wafer carrier device provided in Embodiment 1 of this utility model;

[0030] Figure 4 This is a schematic diagram of the third form of the vacuum adsorption structure in the wafer carrier device provided in Embodiment 1 of this utility model;

[0031] Figure 5This is a schematic diagram of the fourth form of the vacuum adsorption structure in the wafer carrier device provided in Embodiment 1 of this utility model;

[0032] Figure 6 This is a schematic diagram of the fifth form of the vacuum adsorption structure in the wafer carrier device provided in Embodiment 1 of this utility model;

[0033] Figure 7 This is a schematic diagram of the sixth form of the vacuum adsorption structure in the wafer carrier device provided in Embodiment 1 of this utility model;

[0034] Figure 8 This is a schematic diagram of the seventh form of the vacuum adsorption structure in the wafer carrier device provided in Embodiment 1 of this utility model;

[0035] Figure 9 This is a flowchart of the control method for the wafer processing equipment provided in Embodiment 2 of this utility model.

[0036] In the picture:

[0037] 10. Cutter wheel; 20. Spindle;

[0038] 1. Support body; 2. Vacuum adsorption structure; 21. Air pores; 3. Base. Detailed Implementation

[0039] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0040] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0041] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0042] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0043] Example 1

[0044] See Figure 1 This embodiment provides a wafer processing equipment, which includes a cutting wheel 10 and a wafer carrier device. The wafer carrier device is used to carry wafers, and the cutting wheel 10 can rotate around its own axis to process the wafers on the wafer carrier device.

[0045] Furthermore, the wafer processing equipment also includes a spindle 20, with a cutter wheel 10 fixedly mounted at the output end of the spindle 20. The spindle 20 rotates around its own axis, thereby driving the cutter wheel 10 to rotate.

[0046] See Figure 1 Specifically, in this embodiment, the wafer carrier device includes a carrier body 1 and a vacuum adsorption structure 2.

[0047] The supporting body 1 is in the shape of a ring with a through hole in the middle, and the supporting body 1 can rotate around its own axis.

[0048] The vacuum adsorption structure 2 is recessed on the upper surface of the support body 1 and is arranged along the circumference of the support body 1. The vacuum adsorption structure 2 is configured to perform vacuum adsorption on the edge of the wafer.

[0049] The wafer carrier device provided in this embodiment places the wafer on the upper surface of the carrier body 1, connects the vacuum adsorption structure 2 to an external vacuum pump, and uses the vacuum pump to evacuate the vacuum adsorption structure 2, thereby vacuum adsorbing the wafer onto the upper surface of the carrier body 1. Since the vacuum adsorption structure 2 is arranged circumferentially along the carrier body 1, it can vacuum adsorb the wafer's edge, preventing edge curling when replacing a thin-blade wheel with a thick-blade wheel during grinding. This avoids the need to adapt the wafer stage when changing the blade wheel, as required in the prior art, and eliminates the need to readjust relevant parameters, improving wafer processing efficiency and ensuring wafer processing quality.

[0050] Specifically, when designing the wafer carrier device, the shape of the through hole in the middle of the carrier body 1 can be designed to be as small as possible, so that the carrier body 1 can provide as much support as possible for the wafer near the center. When the thick cutter wheel is replaced with a thin cutter wheel during the grinding process, although the local pressure on the wafer increases when the thin cutter wheel acts on the wafer, the wafer will not break at the position directly opposite the through hole because the carrier body 1 provides as much support as possible for the wafer near the center.

[0051] For example, the thickness of the cutting wheel 10 includes 5mm and 3mm. When processing the wafer using a 3mm thick cutting wheel 10, although the local pressure on the wafer is relatively large when the cutting wheel 10 acts on the wafer, the support body 1 provides as much support as possible for the wafer near the center, so the wafer will not break at the position directly opposite the via. When the 3mm thick cutting wheel 10 is replaced with a 5mm thick cutting wheel 10, since the vacuum adsorption structure 2 is arranged along the circumference of the support body 1, the vacuum adsorption structure 2 can perform vacuum adsorption on the edge of the wafer. Therefore, although the cutting wheel 10 processes the wafer thinner, the wafer edge will not curl.

[0052] It is understandable that the upper end of the vacuum adsorption structure 2 adsorbs the wafer, while the lower end is connected to an external vacuum pump.

[0053] Furthermore, the wafer carrier device also includes a lifting mechanism, the output end of which is disposed in a through hole and can be lifted relative to the carrier body 1.

[0054] Specifically, the wafer carrier also includes a base 3, which is a hollow cylinder. The lifting mechanism includes a lifting drive and a lifting rod. The lifting drive is disposed in the hollow cylinder, and the lifting rod is the output end of the lifting mechanism. The lower end of the lifting rod is connected to the output end of the lifting drive, and the upper end of the lifting rod can be raised and lowered relative to the through hole of the carrier body 1.

[0055] Alternatively, the lifting drive can be a motor or a cylinder.

[0056] When the wafer carrier is carrying the wafer, the vacuum adsorption structure 2 is connected to an external vacuum pump, which evacuates the vacuum adsorption structure 2, thereby vacuum adsorbing the wafer onto the upper surface of the carrier body 1. At this time, the lifting rod is at its lowest point, and the upper end of the lifting rod is not higher than the upper surface of the carrier body 1 to avoid the upper end of the lifting rod interfering with the placement of the wafer. Preferably, at this time, the upper end of the lifting rod is lower than the upper surface of the carrier body 1.

[0057] When the wafer grinding process is completed and the wafer needs to be transferred away, the vacuum adsorption structure 2 releases the vacuum adsorption of the wafer, and then controls the lifting rod to rise until the lifting rod lifts the wafer from the upper surface of the carrier body 1, so that there is a certain distance between the wafer and the upper surface of the carrier body 1, making it easier for the robot to pick up the wafer.

[0058] Optionally, see Figure 2 and Figure 4 In some embodiments, the vacuum adsorption structure 2 is a continuous groove structure.

[0059] The vacuum adsorption structure 2 has a continuous groove structure, which can form continuous adsorption points on the circumferential edge of the wafer, thus effectively preventing the edge of the wafer from curling when the thin blade is replaced with a thick blade during wafer grinding.

[0060] Alternatively, the vacuum adsorption structure 2 can be in the form of an annular groove.

[0061] Alternatively, the groove structure includes multiple sub-grooves connected sequentially along the circumference of the bearing body 1, the sub-grooves being arc-shaped or sawtooth-shaped.

[0062] The groove structure includes multiple sub-grooves connected sequentially along the circumference of the support body 1, so as to ensure that every part of the circumference of the wafer edge has a vacuum adsorption point, thus fully avoiding edge curling of the wafer.

[0063] The slots are arc-shaped or sawtooth-shaped. This design ensures that the adsorption points on the wafer edge are not always at the same distance from the wafer center. Some adsorption points are farther from the wafer center, while others are closer to the wafer center. The adsorption points that are closer to the wafer center can further prevent the wafer edge from curling.

[0064] Optionally, see Figure 2 The groove structure includes multiple sub-grooves connected sequentially along the circumference of the supporting body 1, and the sub-grooves are arc-shaped.

[0065] Further optional, see Figure 3 and Figure 4 The groove body is serrated, and the serrations are either straight or oblique.

[0066] It is understandable that when the vacuum adsorption structure 2 is a continuous groove structure, a connecting cavity is provided in the support body 1 that communicates with the lower end of the vacuum adsorption structure 2. The connecting cavity is a columnar cavity or an annular cavity. The upper end of the connecting cavity is connected to the lower end of the vacuum adsorption structure 2, and the lower end of the connecting cavity is connected to the vacuum pump.

[0067] Further optional, see Figures 5-8 In some embodiments, the vacuum adsorption structure 2 includes pores 21.

[0068] The carrier body 1 has an annular cavity that communicates with the vent 21. The annular cavity is configured to communicate with a vacuum pump. The vacuum pump evacuates the annular cavity, thereby creating a vacuum inside the vent 21, which allows the wafer to be stably adsorbed onto the upper surface of the carrier body 1.

[0069] Specifically, the vacuum adsorption structure 2 includes multiple air holes 21, which are arranged sequentially at intervals along the circumference of the support body 1.

[0070] The lower end of each pore 21 is connected to an annular cavity.

[0071] Multiple pores 21 are arranged sequentially and spaced apart along the circumference of the carrier body 1, which can form multi-point adsorption on the wafer along the circumference of the wafer edge, effectively preventing the wafer edge from curling and affecting the wafer processing quality.

[0072] Optionally, see Figures 5-7 Along the circumference of the supporting body 1, multiple pores 21 are distributed in a ring-shaped interval.

[0073] Optionally, the shape of the pore 21 can be circular, elliptical, or polygonal.

[0074] For example, see Figure 5 The vents 21 are circular in shape, and multiple vents 21 are distributed in a ring-shaped interval along the circumference of the support body 1. Optionally, in some embodiments, when the vents 21 are circular in shape, a side adsorption groove communicating with the vents 21 is provided on the side of the support body 1 away from the center of the vents 21. The side adsorption groove can provide better adsorption for the wafer edge and fully avoid the wafer edge from curling due to being too thin.

[0075] For example, see Figure 6 The pores 21 are rectangular in shape, and multiple pores 21 are distributed in a ring-like pattern along the circumference of the support body 1. The length of the pores 21 extends radially along the support body 1. This arrangement allows the end of the pore 21 furthest from the center of the support body 1 to adhere to a position closer to the edge of the wafer, effectively preventing the wafer edge from curling.

[0076] For example, see Figure 7 The pores 21 are elliptical in shape, and multiple pores 21 are distributed in a ring-like pattern along the circumference of the support body 1. The long axis of the pores 21 extends radially along the support body 1. This arrangement allows the end of the pore 21 furthest from the center of the support body 1 to adhere to a position closer to the edge of the wafer, effectively preventing the wafer edge from curling.

[0077] Optionally, see Figure 8 Multiple pores 21 are arranged sequentially at intervals along the circumference of the support body 1. Adjacent pores 21 are radially offset along the circumference of the support body 1. This arrangement allows some pores 21 to be positioned closer to the inner ring of the support body 1, while others are positioned closer to the outer ring. The sequential arrangement of multiple pores 21 along the circumference of the support body 1 enables multi-point adsorption of the wafer along the circumferential edge. Simultaneously, the pores 21 positioned closer to the outer ring of the support body 1 can adsorb onto the more peripheral parts of the wafer edge, effectively preventing edge curling.

[0078] Specifically, when the vacuum adsorption structure 2 includes multiple pores 21, an annular cavity is provided inside the support body 1, which is connected to the lower end of each pore 21. At the same time, a connecting cavity is also provided on the support body 1. The connecting cavity is columnar, with the upper end of the connecting cavity connected to the lower end of the annular cavity and the lower end of the connecting cavity connected to the vacuum pump. In this way, the vacuum pump can evacuate the pores 21, thereby making the wafer stably adsorbed on the upper surface of the support body 1.

[0079] Further optionally, in some embodiments, a positioning annular flange is provided on the upper surface of the carrier body 1 along the circumference of the carrier body 1, and the inner side of the positioning annular flange can position the wafer placed on the carrier body 1.

[0080] Example 2

[0081] See Figure 9 This embodiment provides a control method for wafer processing equipment, used to control the wafer processing equipment of Embodiment 1, including the following steps:

[0082] S1. Place the wafer to be processed on the upper surface of the carrier body 1 of the wafer carrier device;

[0083] S2. Control the vacuum pump to evacuate the vacuum adsorption structure 2 so that the wafer is vacuum adsorbed on the upper surface of the carrier body 1.

[0084] S3. Control the tool wheel 10 to rotate around its own axis, and at the same time control the carrier body 1 to rotate around its own axis until the tool wheel 10 completes the grinding process on the wafer.

[0085] The control method for the wafer processing equipment provided in this embodiment uses the aforementioned wafer processing equipment to process wafers, with a wafer carrier holding the wafer. When carrying the wafer, the wafer carrier places the wafer on the upper surface of the carrier body 1, connects the vacuum adsorption structure 2 to an external vacuum pump, and uses the vacuum pump to evacuate the vacuum adsorption structure 2, thereby vacuum adsorbing the wafer onto the upper surface of the carrier body 1. Since the vacuum adsorption structure 2 is arranged circumferentially along the carrier body 1, it can vacuum adsorb the wafer's edge, preventing edge curling when replacing a thin blade with a thick blade during grinding. This avoids the need to adapt the wafer stage when changing blades, as required in the prior art, and eliminates the need to readjust relevant parameters, improving wafer processing efficiency and ensuring wafer processing quality.

[0086] More specifically, the control method for the wafer processing equipment provided in this embodiment includes:

[0087] The lower end of the lifting rod of the control lifting mechanism is lower than the upper surface of the bearing body 1;

[0088] The wafer to be processed is placed on the upper surface of the carrier body 1;

[0089] Start the vacuum pump to evacuate the vacuum adsorption structure 2, so that the wafer is vacuum adsorbed on the upper surface of the carrier body 1.

[0090] The spindle 20 drives the cutter wheel 10 to rotate around its own axis, and at the same time controls the wafer carrier device to rotate around its own axis, so that the cutter wheel 10 completes the grinding process on the wafer;

[0091] After the wafer grinding process is completed, the lifting rod of the control lifting mechanism rises, lifting the wafer away from the upper surface of the support body 1.

[0092] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A wafer carrier device, characterized in that, include: The supporting body (1) is in the shape of a ring with a through hole in the middle, and the supporting body (1) can rotate around its own axis; A vacuum adsorption structure (2) is recessed on the upper surface of the support body (1) and arranged along the circumference of the support body (1). The vacuum adsorption structure (2) is configured to perform vacuum adsorption on the edge of the wafer.

2. The wafer carrier device according to claim 1, characterized in that, The vacuum adsorption structure (2) includes pores (21), and the carrier body (1) is provided with an annular cavity communicating with the pores (21), and the annular cavity is configured to communicate with a vacuum pump.

3. The wafer carrier device according to claim 2, characterized in that, The vacuum adsorption structure (2) includes a plurality of pores (21), which are arranged sequentially at intervals along the circumference of the carrier body (1).

4. The wafer carrier device according to claim 3, characterized in that, Along the circumference of the bearing body (1), two adjacent air holes (21) are offset radially along the bearing body (1).

5. The wafer carrier device according to claim 2, characterized in that, The shape of the pore (21) is circular, elliptical or polygonal.

6. The wafer carrier device according to claim 1, characterized in that, The vacuum adsorption structure (2) has a continuous groove structure.

7. The wafer carrier device according to claim 6, characterized in that, The groove structure includes a plurality of sub-grooves connected sequentially along the circumference of the bearing body (1), and the sub-grooves are arc-shaped or sawtooth-shaped.

8. The wafer carrier device according to claim 7, characterized in that, The groove body is serrated, and the serrations are straight or oblique.

9. A wafer processing equipment, including a cutting wheel (10), characterized in that, It also includes a wafer carrier as described in any one of claims 1-8, wherein the cutting wheel (10) is rotatable about its own axis to process the wafer on the wafer carrier.

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