Feeding and discharging device and processing system
By designing a loading and unloading device with staggered disks and toggle mechanisms, the problem of low automation in wafer loading and unloading was solved, achieving efficient and low-cost wafer transfer and storage, and improving the production efficiency of semiconductor manufacturing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN UNIV
- Filing Date
- 2025-04-28
- Publication Date
- 2026-06-23
AI Technical Summary
In the semiconductor manufacturing process, the low level of automation in wafer loading and unloading leads to low production efficiency. It requires manual assistance or complex robotic arm operations that occupy a large space and cannot achieve continuous production.
Design a loading and unloading device, including a first tray, a second tray, and a toggle component. Through staggered loading ports, unloading ports, and unloading ports, the toggle component drives the wafer to move within the accommodating cavity. Combined with motor drive, this achieves efficient wafer transfer and storage.
It simplifies the wafer handling process, reduces costs, improves production efficiency, and has a compact structure that occupies little space, allowing for better integration into semiconductor processing systems and enabling continuous production.
Smart Images
Figure CN224402061U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of semiconductor manufacturing equipment technology, specifically relating to loading and unloading devices and processing systems. Background Technology
[0002] In semiconductor manufacturing, wafer loading and unloading is a crucial step. This step involves moving unprocessed wafers to the work area and then moving them back to the storage area after processing. This process is essential for many semiconductor manufacturing processes, such as nanoimprint lithography, photolithography, and wafer cleaning. However, the automation level of this technology is generally low. Many processes still require manual assistance to remove the wafers from the carrier and place them in the designated position on the processing equipment, hindering continuous production and resulting in low production efficiency. Utility Model Content
[0003] In view of this, the first aspect of this application provides a loading and unloading device for moving a wafer, the loading and unloading device comprising:
[0004] The first tray has a feeding port;
[0005] A second disc body is disposed opposite to the first disc body, and a receiving cavity is formed between the first disc body and the second disc body. The second disc body has a discharge port communicating with the receiving cavity and the outside. The discharge port communicates with the receiving cavity, and the discharge port and the discharge port are staggered.
[0006] An actuating element is disposed within the accommodating cavity, and the actuating element is rotatable relative to the second disc body;
[0007] The wafer to be processed enters the receiving cavity from the feeding port. The actuating member rotates and drives the wafer to be processed to move relative to the second disk, thereby moving the wafer to be processed to the discharge port.
[0008] The second disc body is further provided with a discharge port that communicates with the receiving cavity. The discharge port and the outlet are spaced apart and staggered.
[0009] The processed wafer enters the receiving cavity from the discharge port. The actuating element rotates and drives the processed wafer to move relative to the second disk, thereby moving the processed wafer to the discharge port.
[0010] The wafer includes a first wafer, and the actuating member is provided with a first actuating groove. The shape of the first actuating groove corresponds to the shape of the first wafer. The opening size of the first actuating groove is less than or equal to the radial size of the first wafer. The first actuating groove is used to abut and accommodate a portion of the first wafer.
[0011] The wafer further includes a second wafer, the radial dimension of which is smaller than that of the first wafer. The actuating element is also provided with a second actuating groove, which penetrates the bottom of the first actuating groove. The shape of the second actuating groove corresponds to the shape of the second wafer. The opening size of the second actuating groove is less than or equal to the radial dimension of the second wafer. The second actuating groove is used to abut against and accommodate a portion of the second wafer.
[0012] Wherein, the first actuating groove accounts for 40% to 50% of the volume of the first wafer;
[0013] And / or, the second actuating groove accounts for 40% to 50% of the volume of the second wafer.
[0014] The loading and unloading device further includes a loading cylinder, which is detachably connected to the loading port. The loading cylinder is used to store the wafer to be processed. The wafer to be processed can move from the loading cylinder through the loading port into the receiving cavity.
[0015] The loading and unloading device also includes a feeding cylinder, which is detachably connected to the feeding port. The feeding cylinder is used to store the processed wafers. The processed wafers can move from the receiving cavity through the feeding port to the feeding cylinder.
[0016] The wafer includes a first wafer and a second wafer, wherein the radial dimension of the second wafer is smaller than the radial dimension of the first wafer;
[0017] The radial dimensions of the feeding cylinder and the unloading cylinder correspond to the radial dimensions of the first wafer; the loading and unloading device further includes a conversion cylinder with a through hole, the radial dimension of the through hole corresponding to the radial dimension of the second wafer, the conversion cylinder being placed inside the feeding cylinder and the through hole communicating with the receiving cavity; and / or, being placed inside the unloading cylinder and the through hole communicating with the receiving cavity.
[0018] The spacing between the first disk and the second disk is matched with the thickness of the wafer, and the spacing between the first disk and the second disk ranges from 0.5 mm to 1.5 mm.
[0019] The loading and unloading device further includes a motor, which has a second disc body on a side opposite to the first disc body. The motor is rotatably connected to the actuating member, and the motor is used to drive the actuating member to rotate relative to the second disc body.
[0020] The second aspect of this application provides a processing system, which includes a processing device and a loading / unloading device as provided in the first aspect of this application, wherein the processing device is located on one side of the discharge port.
[0021] The loading / unloading device and processing system provided in this application, through the cooperation between the first disk, the second disk, and the actuating component, enable the wafer to be transferred using the unloading port and the unloading port under the drive of the actuating component. Compared with the manual assistance or robotic arm clamping solutions in related technologies, the operation of this application is simple, efficient, and lower in cost, greatly improving production efficiency. Furthermore, this application utilizes the first disk and the second disk to form a receiving cavity, which has a compact structure and occupies little space, allowing the wafer transfer to be realized within the disk without occupying too much space. This allows the loading / unloading device to be better integrated into the semiconductor processing system, further improving production efficiency. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.
[0023] Figure 1 This is a schematic diagram of the structure of the loading and unloading device provided in one embodiment of this application.
[0024] Figure 2 This is a structural schematic diagram of the loading and unloading device provided in one embodiment of this application from another perspective.
[0025] Figure 3 An exploded view of the structure of the loading and unloading device provided in one embodiment of this application.
[0026] Figure 4 This is a schematic diagram of the structure of the toggle member provided in one embodiment of this application.
[0027] Figure 5 This is a schematic diagram of the structure of a partial loading and unloading device provided in one embodiment of this application.
[0028] Figure 6 This is a schematic diagram of the structure of the conversion cylinder provided in one embodiment of this application.
[0029] Figure 7 This is a schematic diagram of the processing system provided in one embodiment of this application.
[0030] Labeling description: Loading and unloading device 1, first disc 11, unloading port 111, second disc 12, discharge port 121, discharge port 122, actuating element 13, first actuating groove 131, second actuating groove 132, third actuating groove 133, unloading cylinder 14, discharge cylinder 15, buffer plate 151, elastic element 152, conversion cylinder 16, through hole 161, motor 17, processing system 2, processing device 21. Detailed Implementation
[0031] The following are preferred embodiments of this application. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.
[0032] Before introducing the technical solution of this application, let's go over the technical issues in related technologies in detail.
[0033] In semiconductor manufacturing, wafer loading and unloading is a crucial step. This step involves moving unprocessed wafers to the work area and then moving them back to the storage area after processing. This process is essential for many semiconductor manufacturing processes, such as nanoimprint lithography, photolithography, and wafer cleaning. However, the automation level of this technology is generally low. Many processes still require manual assistance to remove the wafers from the carrier and place them in the designated position on the processing equipment, hindering continuous production and resulting in low production efficiency.
[0034] Besides manual wafer movement, related technologies also include wafer transfer solutions using robotic arms, horizontal movement combined with translation, and multiple rotating hoppers. However, robotic arm solutions are relatively complex to operate, costly, and often require a large expected range of movement, resulting in significant space consumption. Horizontal movement solutions require workstations to be arranged horizontally, occupying considerable space and lacking simplification. Rotating hoppers only increase stacking capacity, with unclear functional distinctions between hoppers, and also occupy a large amount of space, potentially limiting their applicability to wafers of different sizes.
[0035] In view of this, in order to solve the above problems, please refer to the following: Figures 1-3 This embodiment provides a loading and unloading device 1 for moving wafers. The loading and unloading device 1 includes a first disk 11, a second disk 12, and a toggle member 13. The first disk 11 has a feeding port 111. The second disk 12 is disposed opposite to the first disk 11, and a receiving cavity is formed between the first disk 11 and the second disk 12. The second disk 12 has a discharge port 121 that connects the receiving cavity to the outside. The feeding port 111 connects to the receiving cavity, and the feeding port 111 and the discharge port 121 are staggered. The toggle member 13 is disposed in the receiving cavity and can rotate relative to the second disk 12. The wafer to be processed enters the receiving cavity from the feeding port 111. The toggle member 13 rotates and drives the wafer to be processed to move relative to the second disk 12, thereby moving the wafer to be processed to the discharge port 121.
[0036] The loading and unloading device 1 provided in this embodiment is used to move the wafer. The loading and unloading device 1 is applied to the processing system, which includes, but is not limited to, processing of nanoimprinting, wafer lithography, wafer cleaning, etc. This embodiment does not limit the application of such processing devices.
[0037] The first disk 11 and the second disk 12 can have shapes such as circular, elliptical, rectangular, or polygonal, and this embodiment is not limited in these aspects. The first disk 11 and the second disk 12 are correspondingly arranged; for example, the first disk 11 is located above the second disk 12. The first disk 11 and the second disk 12 are spaced apart, and a receiving cavity is formed between the first disk 11 and the second disk 12. Optionally, a limiting protrusion is provided on the periphery of the second disk 12, which is used to abut against the wafer to prevent the wafer from falling off the periphery of the second disk 12. Optionally, the loading and unloading device 1 also includes a connecting ring, which is connected between the first disk 11 and the second disk 12, and is used to abut against the wafer to prevent the wafer from falling off the periphery of the second disk 12.
[0038] The first disk 11 has a feeding port 111 connecting the outside and the receiving cavity, through which the wafer to be processed can enter the receiving cavity. The second disk 12 has a discharging port 121 connecting the receiving cavity and the outside, through which the wafer to be processed can be removed from the receiving cavity. The processing device is located on one side of the discharging port 121, and the wafer to be processed can be placed in the processing device through the discharging port 121 for processing. Furthermore, the feeding port 111 and the discharging port 121 are staggered, which can be understood as the orthographic projection of the feeding port 111 on the second disk 12 being spaced apart from the discharging port 121. This prevents the wafer entering the receiving cavity from the feeding port 111 from falling directly to the discharging port 121 under the action of gravity.
[0039] The actuating element 13 is used to move the wafer. The actuating element 13 is rotatable relative to the second disk 12. Optionally, one end of the actuating element 13 is fixed to the center of the second disk 12, and the other end is rotatable, thereby moving the wafer. In other words, the actuating element 13 is rotatable about the central axis of the second disk 12. Specifically, the actuating element 13 first rotates toward the wafer to be processed, then abuts against the wafer to be processed and moves the wafer to be processed until the wafer to be processed moves to the discharge port 121. Subsequently, the wafer to be processed leaves the actuating element 13 and passes through the discharge port 121 to be removed from the receiving cavity.
[0040] In summary, the loading and unloading device 1 provided in this embodiment, through the cooperation between the first disk 11, the second disk 12, and the actuating member 13, enables the wafer to be transferred using the unloading port 111 and the unloading port 121 under the drive of the actuating member 13. Compared with the manual assistance or robotic arm clamping schemes in related technologies, the operation of this application is simple and efficient, with lower costs, and greatly improves production efficiency. Furthermore, the first disk 11 and the second disk 12 form a receiving cavity, which has a compact structure and occupies little space, allowing the wafer transfer to be realized within the receiving cavity without occupying too much space. This allows the loading and unloading device 1 to be better integrated into the semiconductor processing system, further improving production efficiency.
[0041] Please refer to this as well. Figures 1-3 In one embodiment, the second disc body 12 is further provided with a discharge port 122 communicating with the accommodating cavity. The discharge port 122 is spaced apart from the discharge port 121 and the discharge port 121 are staggered.
[0042] The processed wafer enters the receiving cavity from the discharge port 121. The actuating member 13 rotates and drives the processed wafer to move relative to the second disk 12, thereby moving the processed wafer to the discharge port 122.
[0043] The second tray 12 is provided with a feeding port 122 that connects to the outside and the receiving cavity, and the processed wafer can be moved out of the receiving cavity through the feeding port 122. The feeding port 122 and the discharge port 121 are arranged at intervals, and the processed wafer can enter the receiving cavity through the discharge port 121.
[0044] Specifically, the wafer to be processed enters the receiving cavity through the feeding port 111, and is moved out of the receiving cavity through the discharge port 121 by the actuating element 13. Then, the wafer to be processed is processed to obtain the processed wafer. Subsequently, the processed wafer enters the receiving cavity again through the discharge port 121, and is moved out of the receiving cavity through the feeding port 122 by the actuating element 13. Then, the processed wafer is collected and stored for use.
[0045] The actuating member 13 first rotates toward the direction of the processed wafer, then abuts against the processed wafer and moves the processed wafer until the processed wafer moves to the discharge port 122. Subsequently, the processed wafer leaves the actuating member 13 and passes through the discharge port 122 to be removed from the receiving cavity.
[0046] Therefore, this embodiment provides a feeding port 122 on the second tray 12. The feeding port 122 can cooperate with the unloading port 111 and the discharge port 121 to decompose the wafer loading and unloading operation into two actions: unloading-discharging and feeding-storing. The wafer transfer is achieved by using a pick, which is simple and efficient and improves production efficiency. In addition, the loading and unloading device 1 has a compact structure and occupies little space, so that the wafer transfer can be achieved within the accommodating cavity without occupying too much space. This allows the loading and unloading device 1 to be better integrated into the semiconductor processing system, further improving production efficiency.
[0047] Please refer to this as well. Figures 1-4 In one embodiment, the wafer includes a first wafer, and the actuating member 13 is provided with a first actuating groove 131. The shape of the first actuating groove 131 corresponds to the shape of the first wafer. The opening size of the first actuating groove 131 is less than or equal to the radial size of the first wafer. The first actuating groove 131 is used to abut and accommodate a portion of the first wafer.
[0048] For example, the first wafer is circular, and the shape of the first actuating groove 131 is semi-circular or fan-shaped. The shape of the first actuating groove 131 corresponds to the shape of the first wafer, so that the groove wall of the first actuating groove 131 can abut against the first wafer, thereby driving the first wafer to move.
[0049] For example, the radial dimension of the first wafer is 4 inches, and the opening size of the first actuation slot 131 is less than or equal to 4 inches to facilitate the placement of a portion of the first wafer within the first actuation slot 131. Optionally, the volume of the first actuation slot 131 is less than half the volume of the first wafer. For example, the volume ratio of the first actuation slot 131 to the first wafer is 43.38%.
[0050] Therefore, this embodiment improves the connection performance between the toggle member 13 and the wafer by providing a first toggle groove 131 on the toggle member 13, so that the first wafer can be engaged in the first toggle groove 131, thereby improving the reliability of the toggle member 13 in moving the wafer.
[0051] Please refer to this as well. Figures 1-4 In one embodiment, the wafer further includes a second wafer, the radial dimension of which is smaller than that of the first wafer. The actuating member 13 is also provided with a second actuating groove 132, the second actuating groove 132 penetrating the bottom of the first actuating groove 131. The shape of the second actuating groove 132 corresponds to the shape of the second wafer. The opening size of the second actuating groove 132 is smaller than or equal to the radial dimension of the second wafer. The second actuating groove 132 is used to abut against and accommodate a portion of the second wafer.
[0052] The radial dimension of the second wafer is smaller than that of the first wafer. For example, the radial dimension of the first wafer is 4 inches and the radial dimension of the second wafer is 2 inches. The second actuating groove 132 penetrates the bottom of the first actuating groove 131, which can also be understood as the second actuating groove 132 being located at the bottom of the first actuating groove 131.
[0053] For example, the second wafer is circular, and the shape of the second actuating groove 132 is semi-circular or fan-shaped. The shape of the second actuating groove 132 corresponds to the shape of the second wafer, so that the groove wall of the second actuating groove 132 can abut against the second wafer, thereby driving the second wafer to move.
[0054] For example, the radial dimension of the second wafer is 2 inches, and the opening size of the second actuation slot 132 is less than or equal to 2 inches, so as to allow a portion of the second wafer to be placed within the second actuation slot 132. Optionally, the volume of the second actuation slot 132 is less than half the volume of the second wafer. For example, the volume ratio of the second actuation slot 132 to the second wafer is 47.18%.
[0055] Optionally, the wafer further includes a third wafer, the radial dimension of which is smaller than that of the second wafer. The actuating member 13 is also provided with a third actuating groove 133, the third actuating groove 133 penetrating the bottom of the second actuating groove 132. The shape of the third actuating groove 133 corresponds to the shape of the third wafer. The opening size of the third actuating groove 133 is smaller than or equal to the radial dimension of the third wafer. The third actuating groove 133 is used to abut against and accommodate part of the third wafer.
[0056] The radial dimension of the third wafer is smaller than that of the second wafer. For example, the radial dimension of the second wafer is 2 inches and the radial dimension of the third wafer is 1 inch. The third actuating groove 133 penetrates the bottom of the second actuating groove 132, which can also be understood as the third actuating groove 133 being located at the bottom of the second actuating groove 132.
[0057] For example, the third wafer is circular, and the shape of the third actuating groove 133 is semi-circular or fan-shaped. The shape of the third actuating groove 133 corresponds to the shape of the third wafer, so that the groove wall of the third actuating groove 133 can abut against the third wafer, thereby driving the third wafer to move.
[0058] For example, the radial dimension of the third wafer is 1 inch, and the opening size of the third actuation slot 133 is less than or equal to 1 inch, so as to allow a portion of the third wafer to be placed within the third actuation slot 133. Optionally, the volume of the third actuation slot 133 is less than half the volume of the third wafer. For example, the volume ratio of the third actuation slot 133 to the third wafer is 46.1%.
[0059] Therefore, this embodiment provides a second actuation groove 132 on the actuating member 13, enabling the actuating member 13 to adapt to the first wafer and the second wafer with different radial dimensions, and drive the wafers with different radial dimensions to move; furthermore, the second actuation groove 132 is located at the bottom of the first actuation groove 131, and the two do not interfere with each other, thus optimizing the structure of the actuating member 13 and reducing the length of the actuating member 13; it also eliminates the need to adjust the movement trajectory of the wafers with different radial dimensions in the accommodating cavity, thereby improving production efficiency.
[0060] For example, if the length of the actuator 13 is 4 inches or more, an arc-shaped notch is cut into the actuator 13 to form the first actuation groove 131. The arc is approximately 43.38% of the entire circle, nearly half, ensuring that the notch can fully hold the 4-inch wafer and move it accurately. Next, based on the notch, a smaller arc-shaped notch is cut with a diameter of 2 inches to form the second actuation groove 132, occupying 47.18% of the entire circle, again nearly half, which can well hold the 2-inch wafer, and this notch will not affect the original 4-inch notch. Because the edge of the 4-inch wafer is larger, it cannot slide into the 2-inch wafer notch. Similarly, based on the 2-inch arc-shaped notch, a smaller arc-shaped notch is cut with a diameter of 1 inch to form the third actuation groove 133, occupying approximately 46.10% of the entire circle, for adapting to 1-inch wafers. Through the above design, the actuator 13 is compatible with 1, 2, and 4-inch wafer sizes.
[0061] In one embodiment, the first actuating groove 131 accounts for 40% to 50% of the volume of the first wafer. Specifically, it can be 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49%, or 50%, etc. Preferably, the first actuating groove 131 accounts for 45% to 50% of the volume of the first wafer.
[0062] And / or, the second actuating groove 132 accounts for 40% to 50% of the volume of the second wafer, specifically for example, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49%, or 50%, etc. Preferably, the second actuating groove 132 accounts for 45% to 50% of the volume of the second wafer.
[0063] Therefore, by limiting the volume ratio of the first actuating groove 131 to the first wafer and the volume ratio of the second actuating groove 132 to the second wafer, this embodiment allows more of the first wafer to be disposed in the first actuating groove 131 and more of the second wafer to be disposed in the second actuating groove 132, thereby improving the connection performance between the actuating member 13 and the wafer and improving the reliability of the actuating member 13 driving the wafer to move.
[0064] Please refer to the above. Figures 1-5 In one embodiment, the loading and unloading device 1 further includes a loading cylinder 14, which is detachably connected to the loading port 111. The loading cylinder 14 is used to store the wafer to be processed. The wafer to be processed can be moved from the loading cylinder 14 through the loading port 111 into the receiving cavity.
[0065] The loading and unloading device 1 further includes a feeding cylinder 15, which is detachably connected to the feeding port 122. The feeding cylinder 15 is used to store the processed wafer. The processed wafer can move from the accommodating cavity through the feeding port 122 to the feeding cylinder 15.
[0066] The connection between the feeding cylinder 14 and the feeding port 111 can be a threaded connection, a snap-fit connection, a hinge connection, a pin connection, etc. The feeding cylinder 14 has a first inner cavity for storing the wafers to be processed. When the feeding cylinder 14 is detachably connected to the feeding port 111, the first inner cavity communicates with the feeding port 111, and the wafers to be processed placed in the first inner cavity can move through the feeding port 111 into the receiving cavity. Optionally, the shape of the feeding cylinder 14 matches the shape of the feeding port 111; for example, the feeding port 111 is circular, and the feeding cylinder 14 is cylindrical.
[0067] The connection between the feeding cylinder 15 and the feeding port 122 can be a threaded connection, a snap-fit connection, a hinge connection, a pin connection, etc. The feeding cylinder 15 has a second inner cavity for the processed wafer. When the feeding cylinder 15 is detachably connected to the feeding port 122, the second inner cavity communicates with the feeding port 122, allowing the processed wafer placed in the receiving cavity to move through the feeding port 122 into the second inner cavity. Optionally, the shape of the feeding cylinder 15 matches the shape of the feeding port 122; for example, the feeding port 122 is circular, and the feeding cylinder 15 is cylindrical.
[0068] Optionally, the loading and unloading device 1 further includes a buffer plate 151 and an elastic element 152 disposed within the feeding cylinder 15. The buffer plate 151 is used to support the wafer, and the elastic element 152 is disposed on the side of the buffer plate 151 opposite to the feeding port 122. This embodiment reduces the impact on the wafer caused by differences in falling height by providing the buffer plate 151 and the elastic element 152, thereby protecting the wafer.
[0069] Therefore, by setting up the feeding cylinder 14 and the unloading cylinder 15, the loading and unloading device 1 can store wafers to be processed and wafers after processing, thereby realizing the processing of large batches of wafers and further improving production efficiency.
[0070] Please refer to this as well. Figures 1-6In one embodiment, the wafer includes a first wafer and a second wafer, wherein the radial dimension of the second wafer is smaller than the radial dimension of the first wafer.
[0071] The radial dimensions of the feeding cylinder 14 and the unloading cylinder 15 correspond to the radial dimensions of the first wafer; the loading and unloading device 1 further includes a conversion cylinder 16 having a through hole 161, the radial dimension of the through hole 161 corresponding to the radial dimension of the second wafer, the conversion cylinder 16 being placed inside the feeding cylinder 14 and the through hole 161 communicating with the receiving cavity; and / or, being placed inside the unloading cylinder 15 and the through hole 161 communicating with the receiving cavity.
[0072] The first wafer to be processed can enter the receiving cavity through the feeding cylinder 14, and the processed first wafer can enter the discharge cylinder 15 from the receiving cavity. For example, if the first wafer is 4 inches, the radial dimensions of both the feeding cylinder 14 and the discharge cylinder 15 are 4 inches, thus satisfying the loading and unloading operations of 4-inch wafers. Optionally, the radial dimension of the feeding port 111 is greater than or equal to the radial dimension of a wafer, and the radial dimension of the discharge port 122 is greater than or equal to the radial dimension of a wafer.
[0073] The conversion cylinder 16 has a through hole 161 that extends through the conversion cylinder 16 along its axial direction. The second wafer to be processed can enter the receiving cavity through the unloading cylinder 14 equipped with the conversion cylinder 16, and the processed second wafer can enter the loading cylinder 15 equipped with the conversion cylinder 16 from the receiving cavity. For example, if the second wafer is 2 inches, the radial dimension of the through hole 161 is also 2 inches, thus accommodating the loading and unloading operations of 2-inch wafers.
[0074] Optionally, the wafer further includes a third wafer, the radial dimension of which is smaller than that of the second wafer. The loading / unloading device 1 further includes another conversion cylinder 16 with a via, the radial dimension of which corresponds to the radial dimension of the third wafer. The other conversion cylinder 16 is used to be placed inside the unloading cylinder 14 and the via communicates with the receiving cavity; and / or, is used to be placed inside the unloading cylinder 15 and the via communicates with the receiving cavity.
[0075] Another conversion cylinder 16 has a through-hole that extends through the conversion cylinder 16 along its axial direction. The third wafer to be processed can enter the receiving cavity through the unloading cylinder 14 equipped with the other conversion cylinder 16, and the processed third wafer can enter the loading cylinder 15 equipped with the other conversion cylinder 16 from the receiving cavity. For example, the third wafer is 1 inch, and the radial dimension of the through-hole is also 1 inch, thus satisfying the loading and unloading operations of 1-inch wafers.
[0076] Therefore, by setting a conversion cylinder 16 to match different wafer radial dimensions, this embodiment enables the feeding cylinder 14 and the unloading cylinder 15 to match wafers with different radial dimensions, thereby increasing the applicability of the loading and unloading device 1 and improving its convenience.
[0077] Optionally, when the conversion cylinder 16 is placed inside the feeding cylinder 14, the center of the through hole 161 coincides with the center of the feeding port 111. When the conversion cylinder 16 is placed inside the discharge cylinder 15, the center of the through hole coincides with the center of the discharge port 122.
[0078] This embodiment, by defining the relationship between the through hole 161, the via, the feed port 111, and the discharge port 122, can maintain the wafer landing position without changing it, ensuring that the landing position still corresponds to the center of the feed port 111 and the discharge port 122. This eliminates the need to adjust the movement trajectory of wafers with different radial dimensions within the accommodating cavity, thereby improving production efficiency.
[0079] In one embodiment, the spacing between the first disk 11 and the second disk 12 is matched with the thickness of the wafer, and the spacing between the first disk 11 and the second disk 12 ranges from 0.5 mm to 1.5 mm.
[0080] The specific spacing between the first disc 11 and the second disc 12 can be, for example, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, or 1.5mm. Preferably, the spacing between the first disc 11 and the second disc 12 is in the range of 0.65mm to 1mm.
[0081] Therefore, by matching the distance between the first disk 11 and the second disk 12 to the thickness of a wafer, this embodiment ensures that only one wafer can enter the receiving cavity at a time under the action of gravity. The structure is simple and easy to operate, and the number of wafers entering the receiving cavity is limited, thereby improving the reliability of the loading and unloading device 1 and increasing production efficiency.
[0082] Please refer to this as well. Figures 1-6 In one embodiment, the loading and unloading device 1 further includes a motor 17, which has the second disc 12 on the side opposite to the first disc 11. The motor 17 is rotatably connected to the actuating member 13, and the motor 17 is used to drive the actuating member 13 to rotate relative to the second disc 12.
[0083] For example, the motor 17 and the actuating member 13 are located on opposite sides of the second disc body 12. The loading and unloading device 1 also includes a connecting member that passes through the second disc body 12. One end of the connecting member is connected to the motor 17, and the other end is connected to the actuating member 13.
[0084] Optionally, the actuating element 13 is directly rotatably connected to the motor 17; or, the actuating element 13 is indirectly rotatably connected to the motor 17 through other components, such as gears, belts, shafts, etc. Optionally, the motor 17 is fixed to the second disc body 12, or the motor 17 is detachably connected to the second disc body 12.
[0085] Therefore, this embodiment uses a motor 17 to drive the actuating member 13 to rotate relative to the second disk 12, so that the actuating member 13 moves the wafer and realizes the transfer of the wafer between the feeding port 111, the discharge port 121 and the unloading port 122.
[0086] Please refer to this as well. Figures 1-7 This application also provides a processing system 2, which includes a processing device 21 and a loading and unloading device 1 as described above. The processing device 21 is located on one side of the discharge port 121.
[0087] The processing device 21 can be a nanoimprint lithography device, a photolithography device, a wafer cleaning device, etc., and this embodiment does not limit it.
[0088] The processing system 2 provided in this embodiment, by employing the loading and unloading device 1 provided in this application, utilizes the cooperation of the first disk 11, the second disk 12, and the actuating member 13 to enable the wafer to be transferred via the unloading port 111 and the unloading port 121 under the drive of the actuating member 13. Compared with the manual assistance or robotic arm clamping schemes in related technologies, the operation of this application is simple and efficient, with lower costs, and greatly improves production efficiency. Furthermore, the first disk 11 and the second disk 12 form a receiving cavity, which has a compact structure and occupies little space, allowing the wafer transfer to be realized within the disk without occupying too much space. This enables the loading and unloading device 1 to be better integrated into the semiconductor processing system 2, further improving production efficiency.
[0089] The loading and unloading device 1 provided in this embodiment can be integrated into existing semiconductor automated production equipment, such as nanoimprinting and photolithography equipment, thereby better connecting the beginning and end of the entire process flow, solving the problems of low automation level of current semiconductor manufacturing equipment, the need for manual assistance or high cost, and realizing true continuous production.
[0090] Taking a nanoimprint lithography device as an example, the loading and unloading device 1 is integrated into it to complete automatic loading and unloading. The flat-panel nanoimprint lithography device has a pressure-applying imprint head, driven by a servo electric cylinder, which can move up and down. With this device, wafers can be received and fed at the discharge port 121 to complete the imprinting process and then sent back to the device for storage, as detailed below:
[0091] Step 1: Wafer Retrieval. The imprint head moves upward, extending towards the discharge port 121 until its top is flush with the second tray 12. Initially, the actuating element 13 is positioned at the feed cylinder 14. At this time, the motor 17 drives the actuating element to rotate 120°, moving the wafer towards the discharge port 121. After the imprint head carries the wafer to be processed, it moves downward and exits from the discharge port 121, completing wafer retrieval.
[0092] Step 2: Processing. The imprint head carries the wafer to be processed and sequentially completes the steps of dispensing and homogenizing adhesive, imprinting and curing, and demolding to obtain the processed wafer.
[0093] Step 3: Wafer Feeding. The imprint head moves towards the discharge port 121, sending the processed wafer back into the device. The actuating component 13 continues to rotate 120°, moving it to the feeding cylinder 15 for storage, and then returns to the initial position. At this time, the wafers to be processed in the feeding cylinder 14 have been filled under the action of gravity. This process can be continuously repeated to achieve continuous production.
[0094] Unless otherwise stated or in case of conflict, the terms or phrases used in this application shall have the following meanings:
[0095] In this application, terms such as "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.
[0096] In this application, "one or more" refers to any one, any two, or any two or more of the listed items. "Several" refers to any two or more.
[0097] In this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0098] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.
[0099] In this application, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of these phrases in various locations throughout the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this application can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this application can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this application, provided there is no contradiction between them.
[0100] The above description represents some embodiments of this application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.
Claims
1. A loading and unloading device, characterized in that, The loading and unloading device is used to move the wafer, and the loading and unloading device includes: The first tray has a feeding port; A second disc body is disposed opposite to the first disc body, and a receiving cavity is formed between the first disc body and the second disc body. The second disc body has a discharge port communicating with the receiving cavity and the outside. The discharge port communicates with the receiving cavity, and the discharge port and the discharge port are staggered. An actuating element is disposed within the accommodating cavity, and the actuating element is rotatable relative to the second disc body; The wafer to be processed enters the receiving cavity from the feeding port. The actuating member rotates and drives the wafer to be processed to move relative to the second disk, thereby moving the wafer to be processed to the discharge port.
2. The loading and unloading device as described in claim 1, characterized in that, The second plate body is also provided with a discharge port communicating with the receiving cavity, the discharge port and the outlet are spaced apart and staggered; The processed wafer enters the receiving cavity from the discharge port. The actuating element rotates and drives the processed wafer to move relative to the second disk, thereby moving the processed wafer to the discharge port.
3. The loading and unloading device as described in any one of claims 1-2, characterized in that, The wafer includes a first wafer, and the actuating member is provided with a first actuating groove. The shape of the first actuating groove corresponds to the shape of the first wafer. The opening size of the first actuating groove is less than or equal to the radial size of the first wafer. The first actuating groove is used to abut and accommodate a portion of the first wafer.
4. The loading and unloading device as described in claim 3, characterized in that, The wafer further includes a second wafer, the radial dimension of which is smaller than that of the first wafer. The actuating element is also provided with a second actuating groove, the second actuating groove penetrating the bottom of the first actuating groove. The shape of the second actuating groove corresponds to the shape of the second wafer. The opening size of the second actuating groove is less than or equal to the radial dimension of the second wafer. The second actuating groove is used to abut and accommodate a portion of the second wafer.
5. The loading and unloading device as described in claim 4, characterized in that, The first actuation groove accounts for 40% to 50% of the volume of the first wafer; And / or, the second actuating groove accounts for 40% to 50% of the volume of the second wafer.
6. The loading and unloading device as described in claim 2, characterized in that, The loading and unloading device further includes a loading cylinder, which is detachably connected to the loading port. The loading cylinder is used to store the wafer to be processed. The wafer to be processed can move from the loading cylinder through the loading port into the receiving cavity. The loading and unloading device also includes a feeding cylinder, which is detachably connected to the feeding port. The feeding cylinder is used to store the processed wafers. The processed wafers can move from the receiving cavity through the feeding port to the feeding cylinder.
7. The loading and unloading device as described in claim 6, characterized in that, The wafer includes a first wafer and a second wafer, wherein the radial dimension of the second wafer is smaller than the radial dimension of the first wafer; The radial dimensions of the feeding cylinder and the unloading cylinder correspond to the radial dimensions of the first wafer; the loading and unloading device further includes a conversion cylinder with a through hole, the radial dimension of the through hole corresponding to the radial dimension of the second wafer, the conversion cylinder being placed inside the feeding cylinder and the through hole communicating with the receiving cavity; and / or, being placed inside the unloading cylinder and the through hole communicating with the receiving cavity.
8. The loading and unloading device as described in claim 1, characterized in that, The spacing between the first disk and the second disk is matched with the thickness of the wafer, and the spacing between the first disk and the second disk ranges from 0.5 mm to 1.5 mm.
9. The loading and unloading device as described in claim 1, characterized in that, The loading and unloading device also includes a motor, which has a second disc body on a side opposite to the first disc body. The motor is rotatably connected to the actuating member, and the motor is used to drive the actuating member to rotate relative to the second disc body.
10. A processing system, characterized in that, The processing system includes a processing device and a loading / unloading device as described in any one of claims 1-9, wherein the processing device is located on one side of the discharge port.