A general-purpose chip delivery track

By designing a universal chip delivery track and adopting a detachable cover plate and a splicing track main structure, the problems of poor compatibility and high cost in existing technologies have been solved, and a chip delivery solution that is easy to replace and low in cost has been achieved.

CN224428973UActive Publication Date: 2026-06-30KUNSHAN WONDERFUL AUTOMATION TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
KUNSHAN WONDERFUL AUTOMATION TECH CO LTD
Filing Date
2025-06-26
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing chip delivery tracks suffer from poor compatibility, high hardware costs, cumbersome and time-consuming replacement processes, and high inventory and management costs.

Method used

Design a universal chip transport track with a detachable cover and guide groove structure. The track can be adapted to different chip specifications by replacing the cover. The main body of the track is composed of a splicing structure, which simplifies the replacement and debugging process.

Benefits of technology

It achieves universal adaptability to chips of different specifications, reduces equipment costs and debugging time, simplifies operation procedures, and reduces inventory and management costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model discloses a universal chip transport track, including a track body and a cover plate detachably mounted on the track body. The track body has a chip transport track, and the cover plate has a guide groove that matches the chip. Chip pin receiving areas are provided on both sides of the guide groove. When the chip is transported on the chip transport track, the guide groove cooperates with the chip. This utility model uses a guide groove on the cover plate to position and guide the chip. By replacing the cover plate, it can adapt to the transport of chips of different specifications without replacing the track body. Therefore, no re-adjustment is required, making replacement convenient, reducing equipment costs, and shortening debugging time. The track body is composed of a first track body and a second track body spliced ​​together, with the splice forming a chip transport support area. No special positioning and guiding structure is needed on the track, resulting in a simple structure and low track manufacturing cost.
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Description

Technical Field

[0001] This utility model belongs to the field of chip delivery technology, and specifically relates to a universal chip delivery track. Background Technology

[0002] Chip transport tracks are key mechanisms in automated equipment (such as programmers, testers, and sorters) used for the precise transport and positioning of tube-packaged chips. Their core function is to ensure the chips are transported stably and orderly from the feeding end to the processing or testing position, maintaining the correct orientation and posture.

[0003] Chip transport tracks typically consist of a track body, a cover plate, and a drive mechanism. Currently, in automated chip programming and testing processes, when using chip transport tracks, it is usually necessary to select a dedicated chip transport track for different chip models. This has the following drawbacks: poor compatibility, as each chip specification requires a custom-made track, resulting in high hardware costs; cumbersome replacement, requiring the disassembly of multiple components and re-alignment, which is time-consuming and labor-intensive; and high inventory and management costs for multiple specifications of transport tracks. Based on the above-mentioned shortcomings of the existing technology, this application proposes a universal transport track.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to provide a universal chip delivery track, thereby overcoming the defects in the prior art.

[0006] To achieve the above objectives, this utility model provides a universal chip transport track, including a track body and a cover plate detachably mounted on the track body. The track body is provided with a chip transport track, and the cover plate is provided with a guide groove that matches the chip. Chip pin receiving areas are provided on both sides of the guide groove. When the chip is transported on the chip transport track, the guide groove cooperates with the chip.

[0007] Furthermore, as a preferred embodiment, the chip transmission track is a boss support structure, and the chip is transmitted on the boss support structure.

[0008] Furthermore, as a preferred embodiment, the track body is formed by splicing a first track body and a second track body, and the boss support structure is located at the splicing point.

[0009] Furthermore, as a preferred embodiment, the two sides of the boss support structure and the chip pin accommodating area of ​​the cover plate together form a transmission chamber, and the first track body is provided with an air cavity channel, which is connected to the transmission chamber.

[0010] Furthermore, as a preferred embodiment, the cover plate is provided with several observation ports at the guide groove.

[0011] Furthermore, as a preferred embodiment, the guide groove is provided with a guide groove chamfer structure.

[0012] Furthermore, as a preferred embodiment, the boss support structure is provided with support chamfer structures on both sides.

[0013] Furthermore, as a preferred embodiment, the cover plate is bolted to the track body.

[0014] Furthermore, preferably, the two sides of the cover plate are fixed to the first track body and the second track body, respectively.

[0015] Furthermore, as a preferred embodiment, the chip transmission track is a linear track.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] This utility model provides a guide groove on the cover plate, which positions and guides the chip. By replacing the cover plate, it can adapt to the transmission of chips of different specifications without replacing the main track. Therefore, there is no need to readjust, making replacement convenient, reducing equipment costs and shortening debugging time.

[0018] The track body of this invention is composed of a first track body and a second track body spliced ​​together. The splicing point forms the transmission support area for the chip. It eliminates the need for a dedicated positioning and guiding structure on the track, resulting in a simple structure and low manufacturing cost.

[0019] This utility model has a novel structure, good versatility, is simple to operate, and has low manufacturing cost. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a general-purpose chip delivery track according to the present invention;

[0021] Figure 2 This is a schematic diagram of another angle of the general-purpose chip delivery track according to this utility model;

[0022] Figure 3 This is a front view of a general-purpose chip delivery track according to the present invention;

[0023] Figure 4This is a front view of a universal chip transport track for transporting another type of chip according to this utility model;

[0024] Figure 5 For the present utility model Figure 1 Enlarged view of point A in the middle;

[0025] Figure 6 For the present utility model Figure 3 Enlarged view of point B in the middle;

[0026] Figure 7 For the present utility model Figure 4 A magnified view of a portion of point C in the middle;

[0027] Figure 8 This is an enlarged schematic diagram of the chamfered support structure of this utility model;

[0028] Reference numerals: 1-track body, 11-chip transmission track, 12-first track body, 13-second track body, 14-transmission chamber, 15-air cavity channel, 16-support chamfered structure, 2-cover plate, 21-guide groove, 22-chip pin receiving area, 23-guide groove chamfered structure, 24-observation port, 3-chip. Detailed Implementation

[0029] The specific embodiments of this utility model are described in detail below, but it should be understood that the protection scope of this utility model is not limited to the specific embodiments.

[0030] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form to prepare for the more detailed descriptions that follow.

[0031] Example 1:

[0032] like Figures 1-8 As shown, a general-purpose chip transport track includes a track body 1 and a cover plate 2 detachably mounted on the track body 1. The track body 1 is provided with a chip transport track 11, and the cover plate 2 is provided with a guide groove 21 that matches the chip 3. Chip pin receiving areas 22 are provided on both sides of the guide groove 21. When the chip 3 is transported on the chip transport track 11, the guide groove 21 cooperates with the chip 3.

[0033] In this embodiment, as a specific solution, the guide groove 21 is positioned and guided from above the main body of the chip 3.

[0034] In another specific embodiment, as a more specific solution, the guide groove 21 is provided with a guide groove chamfer structure 23 at the corner to prevent damage to the main body of the chip 3 during transmission.

[0035] In this embodiment, as a more specific solution, a replaceable silicone protective strip can also be provided at the corner of the guide groove 21 to protect the chip 3 and prevent damage to the chip.

[0036] In this embodiment, as a specific solution, the chip transmission track 11 is a boss support structure, and the chip 3 is transmitted on the boss support structure.

[0037] In this embodiment, as a specific solution, the track body 1 is formed by splicing a first track body 12 and a second track body 13, and the boss support structure is located at the splicing point.

[0038] In this embodiment, as a specific solution, the two sides of the boss support structure and the chip pin receiving area 22 of the cover plate 2 together form a transmission chamber 14. The first track body 12 is provided with an air cavity channel 15, which is connected to the transmission chamber 14.

[0039] In this embodiment, as a more specific solution, chip 3 can be transferred without contact by blowing air from the air cavity channel 15 into the chip transfer track 11.

[0040] In another specific embodiment, as a more specific solution, the two sides of the boss support structure are also provided with support chamfer structures 16, which can avoid touching the pins of the chip; more specifically, the height of the boss support structure needs to meet the following conditions: it can support the chip, but the corners cannot touch the pins of the chip.

[0041] In this embodiment, as a specific solution, the cover plate 2 is also provided with several observation ports 24 at the guide groove 21; through the observation ports 24, the operator can macroscopically observe macroscopic data such as the number of chips in the chip transmission track 11 during inspection.

[0042] In this embodiment, as a specific solution, the cover plate 2 is bolted to the track body 1; more specifically, the cover plate 2 is bolted to the first track body 12 and the second track body 13, while the first track body 12 and the second track body 13 are fixed on the chip production machine.

[0043] In this embodiment, as a specific solution, the chip transmission track 11 is a straight track.

[0044] In this embodiment, as a specific solution, the width of the chip transmission track 11, i.e. the boss support structure, is not limited, as long as it can support the chip.

[0045] This utility model has the following advantages:

[0046] 1. This utility model provides a guide groove on the cover plate, which positions and guides the chip. By replacing the cover plate, it can adapt to the transmission of chips of different specifications without replacing the main track. Therefore, there is no need to readjust, which is convenient, reduces equipment costs, and shortens debugging time.

[0047] 2. The main body of the track of this utility model is formed by splicing a first track body and a second track body. The splicing point forms the transmission support area of ​​the chip. There is no need to set a special positioning and guiding structure on the track. The structure is simple and the track manufacturing cost is low.

[0048] 3. This utility model has a novel structure, good versatility, is simple to operate, and has low manufacturing cost.

[0049] The foregoing description of specific exemplary embodiments of the present invention is for illustrative and explanatory purposes. These descriptions are not intended to limit the present invention to the precise forms disclosed, and it will be apparent that many changes and variations can be made in accordance with the foregoing teachings. The exemplary embodiments were chosen and described in order to explain the specific principles of the present invention and its practical application, thereby enabling those skilled in the art to implement and utilize various different exemplary embodiments of the present invention, as well as various different choices and variations. The scope of the present invention is intended to be defined by the claims and their equivalents.

Claims

1. A universal chip transport track, characterized in that: The device includes a track body and a cover plate detachably mounted on the track body. The track body is provided with a chip transfer track, and the cover plate is provided with a guide groove that matches the chip. Chip pin receiving areas are provided on both sides of the guide groove. When the chip is transferred on the chip transfer track, the guide groove cooperates with the chip.

2. The universal chip transport track according to claim 1, characterized in that: The chip transmission track is a boss support structure, and the chip is transmitted on the boss support structure.

3. A universal chip transport track according to claim 2, characterized in that: The main track body is formed by splicing together a first track body and a second track body, and the boss support structure is located at the splicing point.

4. A universal chip transport track according to claim 3, characterized in that: The two sides of the boss support structure and the chip pin accommodating area of ​​the cover plate together form a transmission chamber. The first track body is provided with an air cavity channel, which is connected to the transmission chamber.

5. A universal chip transport track according to claim 1, characterized in that: The cover plate also has several observation ports at the guide groove.

6. A universal chip transport track according to claim 1, characterized in that: The guide groove is provided with a chamfered structure.

7. A universal chip transport track according to claim 2, characterized in that: The boss support structure has chamfered support structures on both sides.

8. A universal chip transport track according to claim 1, characterized in that: The cover plate is bolted to the track body.

9. A universal chip transport track according to claim 3, characterized in that: The cover plate is fixed on the first track body and the second track body on both sides, respectively.

10. A universal chip transport track according to claim 1, characterized in that: The chip transmission track is a straight track.