A type of adhesive tape bonding fixture

Abstract

This utility model provides an adhesive tape bonding fixture, including a first component, a second component, and a vacuum mechanism. The first component has a first adsorption hole, and the second component has a second adsorption hole. The vacuum mechanism communicates with the first and second adsorption holes to extract gas, causing the first adsorption hole to adsorb the circuit board and the second adsorption hole to adsorb the adhesive tape. The second component is hinged to the first component, allowing the second component to open relative to the first component or to engage with the first component, thereby bonding the adhesive tape to the circuit board. This utility model employs negative pressure adsorption, with the first and second components respectively fixing and adsorbing the circuit board and the adhesive tape, avoiding problems such as detachment and uneven bonding during the bonding process, and improving the bonding accuracy between the circuit board and the adhesive tape.

Description

Technical Field

[0001] This utility model belongs to the field of FPC processing technology, specifically relating to an adhesive tape bonding fixture. Background Technology

[0002] As a crucial component of smart electronic pens, the bonding precision between the FPC (Flexible Printed Circuit Board) and the adhesive backing affects the yield rate of the electronic pen. The adhesive backing serves to fix and protect the FPC.

[0003] In conventional techniques, the FPC and adhesive are usually bonded manually.

[0004] Due to the limitations of manual operation, the bonding accuracy between FPC and adhesive, including the flatness and consistency of the bonding, needs to be improved. The adhesive is prone to loosening, and the efficiency of manual operation is low. Utility Model Content

[0005] The purpose of this utility model embodiment is to provide an adhesive tape bonding fixture that can solve the problem of poor precision when manually bonding FPC to adhesive backing.

[0006] To solve the above-mentioned technical problems, this utility model is implemented as follows:

[0007] This utility model provides an adhesive tape bonding fixture, including a first component, a second component, and an air extraction mechanism;

[0008] The first component is provided with a first adsorption hole, and the second component is provided with a second adsorption hole. The air extraction mechanism is connected to the first adsorption hole and the second adsorption hole, and is used to extract gas so that the first adsorption hole adsorbs the circuit board and the second adsorption hole adsorbs the adhesive paper.

[0009] The second component is hinged to the first component to open the second component relative to the first component, or to engage the second component with the first component to adhere the adhesive tape to the circuit board.

[0010] Optionally, the first component is provided with a groove, and the first adsorption hole is disposed in the groove, the groove being used to accommodate the circuit board.

[0011] Optionally, the second component is provided with a protrusion, the second adsorption hole is located on the protrusion, the size of the protrusion is the same as the size of the groove, and the protrusion is used to place the adhesive tape.

[0012] Optionally, the number of grooves is multiple, and the number of protrusions is the same as the number of grooves, with one groove used to fix one circuit board.

[0013] Optionally, one of the first component and the second component is provided with a positioning hole, and the other of the first component and the second component is provided with a positioning post;

[0014] When the second component is engaged with the first component, the positioning post is inserted into the positioning hole.

[0015] Optionally, the adhesive tape bonding fixture may further include a housing and an air supply pipe;

[0016] The first component is fixed to the box body, the air extraction mechanism is fixed to the box body, the box body has a first air supply hole, the air supply pipe passes through the first air supply hole, wherein at least one air supply pipe is connected between the air extraction mechanism and the first adsorption hole, and the other air supply pipe is connected between the air extraction mechanism and the second adsorption hole.

[0017] Optionally, the adhesive tape bonding fixture further includes a sensor;

[0018] The sensor is disposed on the surface of one of the first component and the second component facing the other, and is electrically connected to the air extraction mechanism;

[0019] When the sensor detects that the second component is open relative to the first component, the air extraction mechanism is activated.

[0020] The sensor detects that the second component is engaged with the first component, and the air extraction mechanism is closed.

[0021] Optionally, the adhesive tape bonding fixture may further include a switching device;

[0022] The switching device is fixed to the housing and electrically connected to the air extraction mechanism, and is used to control the opening and closing of the air extraction mechanism.

[0023] Optionally, the second component includes a cover plate and a reinforcing plate;

[0024] The cover plate is hinged to the first component, the reinforcing plate is fixed to the surface of the cover plate away from the first component, the second adsorption hole is disposed on the cover plate, the reinforcing plate is provided with a second air supply hole communicating with the second adsorption hole, and the second air supply hole is connected to one of the first air supply holes through at least one air supply pipe.

[0025] Optionally, the first component includes a base and an adsorption plate;

[0026] The base is fixed to the box and hinged to the cover plate. The adsorption plate is fixedly connected to the base. The first adsorption hole is disposed on the adsorption plate. The base is provided with a third air supply hole communicating with the first adsorption hole. At least one air supply pipe is fixedly inserted through the first air supply hole and the third air supply hole.

[0027] In the adhesive tape bonding fixture provided in this embodiment of the invention, a first component has a first adsorption hole, and a second component has a second adsorption hole. A vacuum mechanism is connected to both the first and second adsorption holes via an air supply pipe. The second component is hinged to the first component, meaning the second component can rotate relative to the first component. When the second component opens relative to the first component, i.e., the angle between the second and first components gradually increases, the vacuum mechanism draws in gas, creating a negative pressure state within the first and second adsorption holes. At this time, the first component adsorbs and fixes the circuit board through the first adsorption hole, and the second component adsorbs and fixes the adhesive tape through the second adsorption hole. Subsequently, the second component is rotated, causing the angle between the second and first components to gradually decrease until the second and first components snap together. During this process, due to the vacuum adsorption effect, the reliability of the circuit board and adhesive tape fixing is enhanced, making them less prone to detachment, and the bonding surface between the circuit board and adhesive tape is smoother. When the vacuum mechanism stops working, the second component can be opened, and the bonded circuit board and adhesive tape product can be removed. This invention utilizes negative pressure adsorption. The first and second components respectively fix the circuit board and adhesive tape, preventing detachment and uneven adhesion during the bonding process and ensuring the bonding precision between the circuit board and the adhesive tape. Furthermore, compared to manual operation, both efficiency and accuracy are improved.

[0028] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more obvious and understandable, specific embodiments of this utility model are given below. Attached Figure Description

[0029] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0030] Figure 1 This is a schematic diagram of the adhesive tape bonding fixture structure provided in this embodiment of the utility model;

[0031] Figure 2 This is a schematic diagram of the adhesive tape bonding fixture provided in another embodiment of the present invention from another angle;

[0032] Figure 3 This is a schematic diagram of the cover plate in an embodiment of the present utility model;

[0033] Figure 4 This is a schematic diagram of the internal structure of the box in an embodiment of this utility model.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1. First component, 11. First adsorption hole, 12. Groove, 13. Positioning hole, 14. Base, 141. Third air supply hole, 142. Base body, 143. Connector, 144. Rotating shaft, 15. Adsorption plate, 151. Clearance, 2. Second component, 21. Second adsorption hole, 22. Protrusion, 23. Positioning post, 24. Cover plate, 25. Reinforcing plate, 251. Second air supply hole, 3. Box body, 31. First air supply hole, 32. Limiting component, 41. Sensor, 42. Switching device, 43. Pressure gauge, 5. Circuit board, 6. Adhesive tape, 7. Air supply pipe. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0037] The terms "first," "second," etc., used in the specification and claims of this utility model are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this utility model can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, the first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0038] The adhesive tape bonding fixture provided in this utility model will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0039] In the first embodiment, referring to Figures 1 to 2In a first embodiment, an adhesive tape bonding fixture is provided, including a first component 1, a second component 2, and a suction mechanism. The first component 1 is provided with a first adsorption hole 11, and the second component 2 is provided with a second adsorption hole 21. The suction mechanism is connected to the first adsorption hole 11 and the second adsorption hole 21, and is used to extract gas to adsorb the circuit board 5 through the first adsorption hole 11 and to adsorb the adhesive tape 6 through the second adsorption hole 21. The second component 2 is hinged to the first component 1 so that the second component 2 can be opened relative to the first component 1, or the second component 2 can be fastened to the first component 1, thereby bonding the adhesive tape 6 to the circuit board 5.

[0040] Specifically, such as Figure 1 and Figure 2 As shown in the figure, the adhesive tape bonding fixture provided in this embodiment of the present invention includes a first component 1, a second component 2, and a vacuum mechanism. The first component 1 is the base assembly, used to adsorb and fix the circuit board 5, and the second component 2 is the cover plate assembly, used to adsorb and fix the adhesive tape 6. In this embodiment, the circuit board is an FPC, and the adhesive tape 6 is an adhesive backing. The first component 1 has a first adsorption hole 11, and the second component 2 has a second adsorption hole 21. The number of first adsorption holes 11 and second adsorption holes 21 is set to multiple to increase the adsorption area and enhance the reliability of adsorption and fixation. It should be noted that the vacuum mechanism is not shown in the figure. The vacuum mechanism is a mechanical negative pressure mechanism, including but not limited to a vacuum generator, a vacuum pump, a centrifugal fan, an adsorption pump, or a manual negative pressure device. The suction mechanism is connected to the first adsorption hole 11 via a gas supply pipe, used to extract gas from the first adsorption hole 11, creating a negative pressure state within the first adsorption hole 11 to facilitate the adsorption and fixation of the circuit board 5. Simultaneously, the suction mechanism is connected to the second adsorption hole 21 via a gas supply pipe, used to extract gas from the second adsorption hole 21, creating a negative pressure state within the second adsorption hole 21 to facilitate the adsorption and fixation of the adhesive paper 6. Both the first component 1 and the second component 2 are equipped with gas supply pipe interfaces for fixed connection of gas supply pipes. The gas supply pipe connecting the suction mechanism to the first adsorption hole 11 is different from the gas supply pipe connecting the suction mechanism to the second adsorption hole 21, enabling independent operation of the adsorption actions of the first component 1 and the second component 2. When the suction mechanism is running, by extracting gas from the first adsorption hole 11, the first component 1 adsorbs and fixes the circuit board 5 through the first adsorption hole 11; by extracting gas from the second adsorption hole 21, the second component 2 adsorbs and fixes the adhesive paper 6 through the second adsorption hole 21.

[0041] Specifically, such as Figure 1 and Figure 2As shown, the second component 2 is hinged to the first component 1, meaning the second component 2 can rotate relative to the first component 1. A rotating shaft 144 is provided between the second component 2 and the first component 1 to drive the rotation of the second component 2. In one embodiment, the rotating shaft 144 is fixedly connected to the first component 1, and the second component 2 is hinged to the rotating shaft 144; in another embodiment, the rotating shaft 144 is hinged to the first component 1, and simultaneously fixedly connected to the second component 2. Rotating the second component 2 so that it is in an open state relative to the first component 1, i.e., the angle between the second component 2 and the first component 1 gradually increases until this angle reaches a preset value, which is a state convenient for installing the circuit board 5 and the adhesive tape 6, the circuit board 5 is placed at the first suction hole 11, and the vacuum mechanism is activated to perform negative pressure vacuuming, so that the first component 1 adsorbs and fixes the circuit board 5 through the first suction hole 11. Simultaneously, the adhesive tape 6 is placed at the second suction hole 21, and the vacuum mechanism is activated to perform negative pressure vacuuming, so that the second component 2 adsorbs and fixes the adhesive tape 6 through the second suction hole 21. Due to the vacuum adsorption effect, the flatness and fixing reliability of the circuit board 5 and adhesive tape 6 are improved, making them less prone to detachment. The surface of the first component 1 used to adsorb and fix the circuit board 5 is opposite to the surface of the second component 2 used to adsorb and fix the adhesive tape 6. After the circuit board 5 and adhesive tape 6 are fixed, the second component 2 is rotated in the opposite direction, so that the angle between the second component 2 and the first component 1 gradually decreases until the second component 2 and the first component 1 interlock, and the circuit board 5 and adhesive tape 6 are adhered to each other. The interlocking state of the second component 2 and the first component 1 can be that the second component 2 and the first component 1 are in contact or there is a certain air gap between them to avoid damaging the circuit board 5 and adhesive tape 6. At this time, the vacuum mechanism is closed, that is, the adsorption between the circuit board 5 and the first adsorption hole 11, and the adsorption between the adhesive tape 6 and the second component 2 disappear. After standing for a period of time, the second component 2 is opened, so that the angle between the second component 2 and the first component 1 gradually increases, making it easier to remove the bonded circuit board 5 and adhesive tape 6. At this time, the flatness of the bonding surface of the finished product is relatively uniform.

[0042] The adhesive bonding fixture provided in this embodiment of the invention employs negative pressure adsorption. The first and second components respectively fix and adsorb the circuit board and the adhesive tape, avoiding problems such as detachment and uneven bonding during the bonding process. When the second component is engaged with the first component, the circuit board and the adhesive tape are aligned and bonded, ensuring the bonding accuracy between the circuit board and the adhesive tape and reducing the risk of adhesive tape misalignment. Furthermore, the operation is relatively simple and highly automated, improving both efficiency and accuracy compared to manual operation.

[0043] In the second embodiment, refer to Figure 1 and Figure 2 The first component 1 is provided with a groove 12, and the first adsorption hole 11 is disposed in the groove 12. The groove 12 is used to accommodate the circuit board 5.

[0044] Specifically, such as Figure 1 and Figure 2 As shown, a groove 12 is formed on the first component 1, and a first adsorption hole 11 is disposed in the groove 12. The shape and size of the groove 12 match the circuit board 5, which facilitates the accommodation of the circuit board 5 and avoids misalignment during the bonding process. The number of grooves 12 can be one, two or more, to increase the number of circuit boards 5 that can be accommodated. Multiple first adsorption holes 11 are provided in the groove 12 to enhance the adsorption force.

[0045] Based on the second embodiment, referring to Figure 1 and Figure 3 The second component 2 is provided with a protrusion 22, and the second adsorption hole 21 is located on the protrusion 22. The size of the protrusion 22 is the same as the size of the groove 12. The protrusion 22 is used to place the adhesive paper 6.

[0046] Specifically, such as Figure 1 The first component 1 shown is in the state of adsorbing adhesive paper, as... Figure 3 The first component 1 shown is in its unadhesive state. The second component 2 has a protrusion 22 on its surface facing the first component 1, and a second adsorption hole 21 is located on the protrusion 22. The shape and size of the protrusion 22 are consistent with the groove 12 and the circuit board 5, and the protrusion 22 is used to hold the adhesive tape 6 that matches the circuit board 5. When the first component 1 and the second component 2 are engaged, the protrusion 22 corresponds to the groove 12, facilitating accurate adhesion of the adhesive tape 6 to the circuit board 5, improving precision, and preventing misalignment of the adhesive tape 6.

[0047] Based on the second embodiment, referring to Figure 1 and Figure 2 The number of grooves 12 is multiple, and the number of protrusions 22 is the same as the number of grooves 12. One groove 12 is used to fix one circuit board 5.

[0048] Specifically, such as Figure 1 and Figure 2 As shown, the number of grooves 12 is set to multiple, and the protrusions 22 correspond one-to-one with the grooves 12. One groove 12 is used to accommodate and fix one circuit board 5. This embodiment sets four grooves 12 to simultaneously achieve adhesive bonding of four circuit boards, and each protrusion 22 is used to fix the adhesive tape used for one circuit board. The multiple grooves 12 in this embodiment are interconnected, so that the gas flow inside the grooves 12 is uniform during vacuum adsorption, avoiding the problem of uneven distribution of adsorption force. It should be noted that: Figure 1 The first component 1 has a circuit board 5 in the two grooves 12 on the left side, and each protrusion 22 of the second component 2 is covered with adhesive tape 6. Figure 3No adhesive tape 6 was placed on the protrusion 22 in the middle.

[0049] In the third embodiment, refer to Figure 1 and Figure 2 One of the first component 1 and the second component 2 is provided with a positioning hole 13, and the other of the first component 1 and the second component 2 is provided with a positioning post 23; when the second component 2 and the first component 1 are engaged, the positioning post 23 is inserted into the positioning hole 13.

[0050] Specifically, such as Figure 1 and Figure 2 As shown, when the first component 1 is provided with a positioning hole 13, the second component 2 is provided with a positioning post 23; when the first component 1 is provided with a positioning post 23, the second component 2 is provided with a positioning hole 13. When the second component 2 and the first component 1 are engaged, the positioning post 23 is inserted into the positioning hole 13. That is, through the shaft hole positioning structure, the reliability of the engagement connection between the second component 2 and the first component 1 is improved, and the adhesive tape is prevented from shifting due to the misalignment of the second component 2, thus affecting the bonding effect. In this embodiment, four positioning posts 23 and four positioning holes 13 are provided, and each positioning post 23 corresponds one-to-one with a positioning hole 13.

[0051] In the fourth embodiment, reference is made to... Figure 2 and Figure 4 The adhesive tape bonding fixture also includes a housing 3 and an air supply pipe 7; the first component 1 is fixed on the housing 3, the air extraction mechanism is fixed inside the housing 3, the housing 3 has a first air supply hole 31, the air supply pipe 7 passes through the first air supply hole 31, wherein at least one air supply pipe 7 is connected between the air extraction mechanism and the first adsorption hole 11, and the other air supply pipe 7 is connected between the air extraction mechanism and the second adsorption hole 21.

[0052] Specifically, such as Figure 1 and Figure 2 As shown, the housing 3 is used to fix and support the entire tooling assembly. The first component 1 is fixed to the upper surface of the housing 3, and the air extraction mechanism is fixed inside the housing 3. There are at least two air supply pipes 7, each with a corresponding first air supply hole 31. One air supply pipe 7 connects the air extraction mechanism to the first suction hole 11, and the other air supply pipe 7 connects the air extraction mechanism to the second suction hole 21. It should be noted that, as Figure 2 The air supply pipe 7, which passes through the first air supply hole 31 on the middle housing 3, is used to connect the air extraction mechanism and the second suction hole 21, such as... Figure 4 The air supply pipe 7 through the first air supply hole 31 on the middle box 3 is used to connect the air extraction mechanism and the first adsorption hole 11.

[0053] In the fifth embodiment, reference is made to... Figure 1 and Figure 2 The adhesive tape bonding fixture also includes a sensor 41; the sensor 41 is disposed on the surface of one of the first component 1 and the second component 2 facing the other, and is electrically connected to the air extraction mechanism; when the sensor 41 detects that the second component 2 is open relative to the first component 1, the air extraction mechanism is activated; when the sensor 41 detects that the second component 2 is engaged with the first component 1, the air extraction mechanism is deactivated.

[0054] Specifically, such as Figure 1 and Figure 2 As shown, sensor 41 is disposed on the surface of either the first component 1 or the second component 2 facing the other: sensor 41 can be disposed on the surface of the first component 1 facing the second component 2, or on the surface of the second component 2 facing the first component 1. In this embodiment, sensor 41 is disposed on the surface of the first component 1 facing the second component 2, and sensor 41 is electrically connected to the suction mechanism. Sensor 41 includes, but is not limited to, mechanical contact sensors, pressure sensors, capacitive sensors, optical sensors, or magnetic sensors, used to detect the distance between the second component 2 and the first component 1. In this embodiment, a magnetic sensor is used. When it detects that the second component 2 and the first component 1 are close together, that is, when the second component 2 and the first component 1 are engaged, sensor 41 controls the suction mechanism to close, and the adsorption effect disappears. When it detects that the distance between the second component 2 and the first component 1 increases, that is, when the second component 2 is open relative to the first component 1, sensor 41 controls the suction mechanism to open, and the adsorption effect is initiated. Therefore, this embodiment achieves automatic control of the negative pressure adsorption function by setting a sensor.

[0055] Based on the fourth embodiment, referring to Figure 1 and Figure 2 The adhesive tape bonding fixture also includes a switch device 42; the switch device 42 is fixed on the housing 3 and electrically connected to the air extraction mechanism, and is used to control the opening and closing of the air extraction mechanism.

[0056] Specifically, such as Figure 1 and Figure 2As shown, this embodiment employs a manual control method for opening and closing the suction mechanism. The switch 42 is fixed to the side of the housing 3 and electrically connected to the suction mechanism. The switch 42 is manually adjusted to control the opening and closing of the suction mechanism: when the second component 2 is open relative to the first component 1, the switch 42 is manually controlled to open the suction mechanism; when the second component 2 is engaged with the first component 1, the switch 42 is manually controlled to close the suction mechanism. Furthermore, a pressure gauge 43 is installed on the housing 3 to detect the air pressure of the suction mechanism. The switch 42 and sensor 41 are connected in parallel to the suction mechanism; therefore, this invention provides both automatic and manual control methods. If one control method fails, the other can serve as a backup, ensuring the reliability of the control.

[0057] Based on the fourth embodiment, referring to Figure 1 and Figure 2 The second component 2 includes a cover plate 24 and a reinforcing plate 25; the cover plate 24 is hinged to the first component 1, the reinforcing plate 25 is fixed to the surface of the cover plate 24 away from the first component 1, the second adsorption hole 21 is disposed on the cover plate 24, and the reinforcing plate 25 is provided with a second air supply hole 251 communicating with the second adsorption hole 21. The second air supply hole 251 is connected to one of the first air supply holes 31 through at least one air supply pipe 7.

[0058] Specifically, such as Figure 1 and Figure 2 As shown, the cover plate 24 is hinged to the first component 1 via a pivot 144, and the reinforcing plate 25 is fixed to the surface of the cover plate 24 facing away from the first component 1. The cover plate 24 is provided with a second adsorption hole 21, and the reinforcing plate 25 is provided with a second air supply hole 251. The second air supply hole 251 communicates with the second adsorption hole 21, and the second air supply hole 251 is connected to a first air supply hole 31 via an air supply pipe 7. Figure 2 An air supply pipe 7 is inserted between the first air supply hole 31 and the second air supply hole 251 to provide negative pressure suction for the second adsorption hole 21. The reinforcing plate 25 provides a fixed position for the air supply pipe and increases the structural strength of the cover plate 24. In addition, a limiting member 32 is provided on the housing 3 near the cover plate 24 to limit the opening angle of the cover plate 24.

[0059] Based on the fourth embodiment, referring to Figure 1 and Figure 4The first component 1 includes a base 14 and an adsorption plate 15; the base 14 is fixed to the box body 3 and hinged to the cover plate 24, the adsorption plate 15 is fixedly connected to the base 14, the first adsorption hole 11 is disposed on the adsorption plate 15, the base 14 is provided with a third air supply hole 141 communicating with the first adsorption hole 11, and at least one air supply pipe 7 is fixedly inserted through the first air supply hole 31 and the third air supply hole 141.

[0060] Specifically, such as Figure 1 and Figure 4 As shown, the base 14 includes a base body 142 and a connector 143, which are fixed to the housing 3. The adsorption plate 15 is fixed to the base body 142, and the connector 143 is hinged to the cover plate 24 via a pivot 144. The adsorption plate 15 has a first adsorption hole 11, and the base body 142 has a third air supply hole 141. Figure 4 The first air inlet 31 and the third air inlet 141 are simultaneously connected to a fixed air inlet pipe 7 to perform negative pressure suction for the first adsorption hole 11. In addition, multiple clearance positions 151 are provided on the adsorption plate 15 to ensure that there is a certain air gap between the cover plate 24 and the adsorption plate 15 when they are fastened together, so that the components are not squeezed and damaged.

[0061] In the sixth embodiment, the circuit board 5 and the adhesive tape 6 are bonded using the following steps:

[0062] S1. Open the cover plate 24, place the circuit board 5 in the groove 12 of the adsorption plate 15, and place the adhesive tape 6 on the protrusion 22 of the cover plate 24. Check whether the adhesive tape 6 is dirty or damaged. At the same time, start the air suction mechanism to adsorb and fix the circuit board 5 and the adhesive tape 6, and remove the release paper of the adhesive tape 6.

[0063] S2. Close the cover plate 24 until the adhesive tape 6 and the circuit board 5 are bonded together. At this time, close the air extraction mechanism.

[0064] S3. After standing for a period of time, open the cover plate 24 and take out the bonded circuit board 5 and adhesive tape 6.

[0065] Therefore, by using the adhesive tape bonding fixture provided in this embodiment to bond the circuit board with adhesive tape, the circuit board and adhesive tape are fixed by the negative pressure suction, ensuring that the flatness and accuracy of the bonding surface meet the product requirements and improving the product yield.

[0066] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0067] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of the present invention.

Claims

1. A tooling for bonding adhesive tape, characterized in that, It includes a first component (1), a second component (2), and an air extraction mechanism; The first component (1) is provided with a first adsorption hole (11), and the second component (2) is provided with a second adsorption hole (21). The air extraction mechanism is connected to the first adsorption hole (11) and the second adsorption hole (21) to extract gas so that the first adsorption hole (11) adsorbs the circuit board (5) and the second adsorption hole (21) adsorbs the adhesive paper (6). The second component (2) is hinged to the first component (1) so that the second component (2) is opened relative to the first component (1), or the second component (2) is snapped into the first component (1) so that the adhesive tape (6) is bonded to the circuit board (5).

2. The adhesive tape bonding fixture according to claim 1, characterized in that, The first component (1) is provided with a groove (12), and the first adsorption hole (11) is provided in the groove (12). The groove (12) is used to accommodate the circuit board (5).

3. The adhesive tape bonding fixture according to claim 2, characterized in that, The second component (2) is provided with a protrusion (22), and the second adsorption hole (21) is located on the protrusion (22). The size of the protrusion (22) is the same as the size of the groove (12). The protrusion (22) is used to place the adhesive tape (6).

4. The adhesive tape bonding fixture according to claim 3, characterized in that, The number of grooves (12) is multiple, and the number of protrusions (22) is the same as the number of grooves (12). One groove (12) is used to fix one circuit board (5).

5. The adhesive tape bonding fixture according to claim 1, characterized in that, One of the first component (1) and the second component (2) is provided with a positioning hole (13), and the other of the first component (1) and the second component (2) is provided with a positioning post (23); When the second component (2) is engaged with the first component (1), the positioning post (23) is inserted into the positioning hole (13).

6. The adhesive tape bonding fixture according to claim 1, characterized in that, The adhesive tape bonding fixture also includes a housing (3) and an air supply pipe (7); The first component (1) is fixed on the box (3), the air extraction mechanism is fixed inside the box (3), the box (3) has a first air supply hole (31), the air supply pipe (7) passes through the first air supply hole (31), wherein at least one of the air supply pipes (7) is connected between the air extraction mechanism and the first adsorption hole (11), and the other air supply pipe (7) is connected between the air extraction mechanism and the second adsorption hole (21).

7. The adhesive tape bonding fixture according to claim 1, characterized in that, The adhesive tape bonding fixture also includes a sensor (41); The sensor (41) is disposed on the surface of one of the first component (1) and the second component (2) facing the other, and is electrically connected to the pumping mechanism; The sensor (41) detects that the second component (2) is open relative to the first component (1), and the air extraction mechanism is activated; The sensor (41) detects that the second component (2) is engaged with the first component (1), and the air extraction mechanism is closed.

8. The adhesive tape bonding fixture according to claim 6, characterized in that, The adhesive tape bonding fixture also includes a switching device (42); The switching device (42) is fixed on the housing (3) and electrically connected to the air extraction mechanism, and is used to control the opening and closing of the air extraction mechanism.

9. The adhesive tape bonding fixture according to claim 6, characterized in that, The second component (2) includes a cover plate (24) and a reinforcing plate (25); The cover plate (24) is hinged to the first component (1), the reinforcing plate (25) is fixed to the surface of the cover plate (24) away from the first component (1), the second adsorption hole (21) is disposed on the cover plate (24), the reinforcing plate (25) is provided with a second air supply hole (251) communicating with the second adsorption hole (21), and the second air supply hole (251) is connected to one of the first air supply holes (31) through at least one air supply pipe (7).

10. The adhesive tape bonding fixture according to claim 9, characterized in that, The first component (1) includes a base (14) and an adsorption plate (15); The base (14) is fixed on the box (3) and hinged to the cover plate (24). The adsorption plate (15) is fixedly connected to the base (14). The first adsorption hole (11) is provided on the adsorption plate (15). The base (14) is provided with a third air supply hole (141) communicating with the first adsorption hole (11). At least one air supply pipe (7) is fixedly inserted through the first air supply hole (31) and the third air supply hole (141).

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