A negative pressure adsorption type double-rotation precision polishing device for semiconductor wafer processing

Abstract

This utility model discloses a negative pressure adsorption type dual-rotation precision grinding device for semiconductor wafer processing, belonging to the technical field of semiconductor manufacturing equipment. The utility model includes a base and a protective tray, which together form a liquid collection tank and are connected to a water outlet pipe. A workpiece clamping and rotating mechanism is set at the center of the liquid collection tank, flexibly fixing the workpiece through negative pressure adsorption holes. The workpiece rotates in conjunction with a dual-rotation drive of a first drive motor and a second pulley. A drive housing is set at the upper end of the protective tray, housing a grinding head drive mechanism. The height of the grinding head is adjusted by a cylinder, and the grinding head rotates in conjunction with the second drive motor. A water pump and a water spray head are set on one side of the protective tray, precisely spraying water onto the center of the workpiece to simultaneously cool and wash away dust. This solution replaces mechanical clamping with negative pressure adsorption, avoiding workpiece deformation; the dual-rotation drive and the liftable grinding head work together to achieve multi-directional precision grinding; simultaneous water spraying for cooling and cleaning prevents high-temperature ablation and automatically collects waste liquid.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, specifically relating to a device for precision grinding of semiconductor workpiece surfaces, which is particularly suitable for grinding semiconductor wafers or chip carriers that require high precision and are easily damaged. Background Technology

[0002] In the manufacturing process of semiconductor devices, the flatness and smoothness of the workpiece surface directly affect its electrical performance and packaging quality; therefore, the polishing process is one of the key steps. In existing technologies, semiconductor workpiece polishing mainly employs contact polishing with rotary grinding heads, but this method has the following shortcomings:

[0003] 1. Poor workpiece clamping stability. Traditional clamping methods mostly involve mechanical clamping, which can easily lead to workpiece deformation or edge damage due to stress concentration, especially for thin or flexible semiconductor workpieces, where clamping is even more difficult;

[0004] 2. Insufficient grinding precision and flexibility. Grinding heads are usually fed at a fixed angle or in a single direction, making it difficult to adapt to the grinding needs of different positions on the workpiece, resulting in uneven grinding in certain areas;

[0005] 3. Poor cooling and cleaning effects. The high temperatures generated during grinding can easily burn the surface of the workpiece, and dust particles can easily adhere to the workpiece or equipment, affecting the accuracy of subsequent processing and the lifespan of the equipment;

[0006] 4. Inconvenient waste liquid collection. Metal shavings or coolant mixture generated during grinding can easily spread in the work area, requiring frequent manual cleaning and reducing production efficiency.

[0007] Therefore, there is an urgent need for a semiconductor polishing device with optimized structure and high functional integration to solve the above problems. Utility Model Content

[0008] 1. Technical problem to be solved:

[0009] To address the problems existing in the prior art, the purpose of this utility model is to provide a negative pressure adsorption type dual-rotation precision grinding device for semiconductor wafer processing. By optimizing the workpiece clamping, multi-directional grinding drive and synchronous cooling and cleaning structure, the grinding accuracy, stability and automation are improved, while solving the problem of waste liquid collection.

[0010] 2. Technical Solution:

[0011] To solve the above problems, the present invention adopts the following technical solution.

[0012] A negative pressure adsorption type dual-rotation precision grinding device for semiconductor wafer processing includes a base, a protective tray at the upper end of the base, and liquid collection tanks communicating with each other at corresponding positions on the protective tray and the base. A water outlet pipe communicating with the liquid collection tank is provided on the side of the base. A workpiece clamping and rotating mechanism is provided at the top center of the liquid collection tank. A drive housing is provided on one side of the upper end of the protective tray, and a grinding head drive mechanism is provided inside the drive housing. The grinding head of the grinding head drive mechanism is located above the eccentric part of the workpiece clamping and rotating mechanism. A water pump is provided on one side of the upper end of the protective tray near the drive housing, and a water spray head is provided on the side of the water pump. The water spray direction of the water spray head is towards the center position of the workpiece clamping and rotating mechanism.

[0013] Furthermore, the workpiece clamping and rotating mechanism includes a housing disposed at the bottom end of the liquid collection tank. A cylindrical groove is formed at the center of the upper end of the housing, and a rectangular groove is formed on the side. A first bracket is disposed on the side of the rectangular groove at the upper end of the housing, and a second bracket is disposed on the side of the cylindrical groove. A first drive motor is installed at the lower end of the first bracket, located in the rectangular groove. The output end of the first drive motor passes through the first bracket and is fixedly connected to a first pulley disposed at the upper end of the first bracket. An air pump is disposed in the cylindrical groove. A transmission bearing seat is disposed at the upper end of the second bracket. A second pulley is rotatably connected to the transmission bearing seat. The second pulley and the first pulley are connected by a first synchronous belt. A first spline bearing seat is fixed to the inner wall of the second pulley. A hollow first spline drive shaft is inserted into the first spline bearing seat. The output end of the air pump is rotatably connected to the first spline drive shaft. The wiring and air pipes of the first drive motor and the air pump extend from the housing to the rear end of the base.

[0014] Furthermore, the upper end of the housing is provided with an upper cover plate, and a hollow connecting shaft passes through the upper end of the upper cover plate. The lower end of the connecting shaft is fixedly connected to the top end of the first spline drive shaft, and a hollow workpiece carrier is fixedly connected to the upper end of the connecting shaft. The upper end of the workpiece carrier is provided with multiple negative pressure adsorption holes, and a waterproof and breathable membrane is provided inside the negative pressure adsorption holes. There is a gap between the workpiece carrier and the inner wall of the liquid collection tank.

[0015] Furthermore, the grinding head drive mechanism includes a third bracket, a fourth bracket, and a fixed base disposed at the bottom of the drive housing; a second drive motor is mounted on the lower end of the third bracket, the output end of the second drive motor passes through the bottom of the drive housing and extends upward; a third pulley is rotatably connected to the upper end of the third bracket, and the output end of the second drive motor is fixedly connected to the third pulley; a fourth pulley is rotatably connected to the upper end of the fixed base, and the fourth pulley is connected to the third pulley by a second synchronous belt; a second spline bearing seat is fixed to the inner wall of the fourth pulley, and a second spline drive shaft is inserted into the second spline bearing seat, the second spline drive shaft passing downward through the bottom of the drive housing; a connecting sleeve is fixedly connected to the bottom end of the second spline drive shaft, and a grinding head is fixedly connected to the lower end of the connecting sleeve.

[0016] Furthermore, a cylinder is installed at the inner bottom end of the fourth bracket, and the telescopic end of the cylinder extends upward through the fourth bracket; a lifting connecting plate is provided at the inner top end of the drive housing, and the lower end of one side of the lifting connecting plate is rotatably connected to the second spline drive shaft, and the lower end of the other side is fixedly connected to the telescopic end of the cylinder.

[0017] Furthermore, the water pump and spray head are located on the upper end of the protective tray and on one side of the drive housing, and the spray direction of the spray head is precisely towards the center position of the workpiece carrier plate of the workpiece clamping and rotating mechanism.

[0018] 3. Beneficial effects:

[0019] Compared with the prior art, the technical solution provided by this utility model has the following advantages:

[0020] (1) Stable and high-precision workpiece clamping: The workpiece is flexibly clamped by using the negative pressure adsorption hole of the workpiece carrier plate in conjunction with the waterproof and breathable membrane, avoiding deformation or damage caused by mechanical clamping, which is especially suitable for thin semiconductor workpieces; at the same time, the air pump and the first spline drive shaft can realize the rotation adjustment of the workpiece carrier plate, combined with the cylinder lifting adjustment of the grinding head drive mechanism, to meet the grinding needs of multiple angles and multiple positions, and improve the processing accuracy.

[0021] (2) Grinding and cooling are carried out simultaneously: The water pump and spray head can continuously spray water to the center of the workpiece carrier during the grinding process. On the one hand, it reduces the temperature of the contact area between the grinding head and the workpiece to prevent high temperature erosion; on the other hand, it washes away the dust particles generated by grinding, preventing them from adhering to the surface of the workpiece or inside the equipment, improving the cleaning effect and extending the service life of the equipment.

[0022] (3) Automatic collection of waste liquid and convenient maintenance: The connection structure between the collection tank and the base, together with the water outlet pipe, can collect the metal shavings and coolant mixture generated during the grinding process and discharge it directly through the water outlet pipe. This eliminates the need for frequent manual cleaning, reduces maintenance costs, and keeps the working environment clean.

[0023] (4) Compact structure and high integration: All functional mechanisms (clamping, grinding, cooling, waste liquid collection) are integrated into the closed space formed by the base and the protective tray, reducing external interference and improving the stability of equipment operation; the drive housing protects the grinding head drive mechanism, preventing dust or liquid from entering and extending the service life of the drive components.

[0024] It should be noted that the structures not described in this utility model are the same as or can be implemented using existing technology, and will not be elaborated here, as they do not involve the design points and improvement directions of this utility model. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0026] Figure 2 This is a half-sectional structural diagram of the entire utility model;

[0027] Figure 3 This is a schematic diagram of the workpiece clamping and rotating mechanism of this utility model;

[0028] Figure 4 This is a schematic diagram of the structure of the spline bearing housing of this utility model;

[0029] Figure 5 This is a schematic diagram of the structure of the grinding head drive mechanism of this utility model.

[0030] Explanation of the labels in the diagram:

[0031] 1. Base; 2. Protective tray; 3. Liquid collection tank; 4. Water outlet pipe;

[0032] 5. Workpiece clamping and rotating mechanism; 51. Housing; 511. Cylindrical groove; 512. Rectangular groove; 52. First support; 521. First drive motor; 522. First pulley; 53. Second support; 531. Air pump; 532. Transmission bearing seat; 533. Second pulley; 534. First synchronous belt; 54. First spline bearing seat; 55. First spline transmission shaft; 56. Top cover plate; 57. Connecting shaft; 58. Workpiece carrier; 59. Negative pressure adsorption hole;

[0033] 6. Drive housing;

[0034] 7. Grinding head drive mechanism; 71. Third support; 711. Second drive motor; 712. Third pulley; 72. Fourth support; 721. Cylinder; 73. Fixed seat; 731. Fourth pulley; 732. Second spline bearing seat; 733. Second spline drive shaft; 74. Second synchronous belt; 75. Lifting connecting plate; 76. Connecting sleeve; 77. Grinding head;

[0035] 8. Water pump; 9. Sprayer head. Detailed Implementation

[0036] To facilitate understanding of this utility model, a more comprehensive description of the utility model will be given below with reference to the accompanying drawings, which show several embodiments of the utility model. However, the utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the utility model will be more thorough and complete. Example

[0037] Please see Figures 1-5 A negative pressure adsorption type dual-rotation precision polishing device for semiconductor wafer processing is described below:

[0038] 1. Basic structure assembly (base and protective tray)

[0039] Place base 1 horizontally on the ground or equipment bracket, ensuring that the bottom surface of base 1 is in contact with the supporting surface (this can be calibrated using a level).

[0040] Align the protective tray 2 with the upper edge of the base 1 so that the contact surfaces of the protective tray 2 and the base 1 are in close contact (the two are fixed by positioning pins or bolts).

[0041] Check whether the collection tank 3 of the base 1 and the protective tray 2 are fully connected (i.e., the openings of the corresponding positions of the two are aligned) to ensure that the subsequent waste liquid can flow smoothly into the collection tank 3.

[0042] 2. Installation of workpiece clamping and rotating mechanism 5

[0043] The housing 51 is embedded into the bottom of the liquid collection tank 3 so that the bottom of the housing 51 contacts the upper surface of the base 1 (stability can be enhanced by fixing with bolts).

[0044] A first bracket 52 and a second bracket 53 are installed on the upper end of the housing 51: the first bracket 52 is located on the side of the rectangular groove 512 and is fixed to the housing 51 by bolts; the second bracket 53 is located on the side of the cylindrical groove 511 and is also fixed by bolts.

[0045] Install the first drive motor 521 at the lower end of the first bracket 52, ensuring that the motor output shaft passes vertically upward through the center hole of the first bracket 52 and is keyed to the first pulley 522 (lubricant needs to be applied to reduce friction).

[0046] A transmission bearing seat 532 is installed on the upper end of the second bracket 53, and the second pulley 533 is rotatably connected to the transmission bearing seat 532 through the bearing; the first synchronous belt 534 is sleeved on the outside of the first pulley 522 and the second pulley 533, and the tension is adjusted (this can be achieved by adjusting the length of the first synchronous belt).

[0047] The first spline bearing housing 54 is fixed to the inner wall of the second pulley 533 (by interference fit or bolts), and the hollow end of the first spline drive shaft 55 is inserted into the first spline bearing housing 54 (to ensure spline engagement), while the other end extends upward through the cylindrical groove 511 of the housing 51.

[0048] Install an air pump 531 in the cylindrical groove 511, and connect the air pump output shaft to the bottom end of the first spline drive shaft 55 through a coupling (the concentricity needs to be calibrated to avoid uneven loading).

[0049] Install the top cover plate 56 to cover the upper end of the housing 51. The center hole of the top cover plate 56 is clearance-fitted with the connecting shaft 57 (to ensure that the connecting shaft can rotate freely). The lower end of the connecting shaft 57 is fixedly connected to the top end of the first spline drive shaft 55 by a flat key, and the upper end is fixed to the center of the bottom surface of the workpiece carrier 58 by bolts.

[0050] Multiple negative pressure adsorption holes 59 (hole diameter 2-5mm, spacing 5-10mm) are opened on the upper end of the workpiece carrier 58. A waterproof and breathable membrane is pasted inside the hole (to prevent liquid from seeping into the adsorption hole). The waterproof and breathable membrane is made of PTFE material with a thickness of 0.1mm. Check the gap between the workpiece carrier 58 and the inner wall of the liquid collection tank 3 (5-10mm) to ensure that the grinding debris can fall into the liquid collection tank 3.

[0051] 3. Installation of grinding head drive mechanism 7

[0052] Place the drive housing 6 on one side of the upper end of the protective tray 2 (the side away from the workpiece clamping and rotating mechanism 5) and fix it to the protective tray 2 with bolts.

[0053] A third bracket 71, a fourth bracket 72, and a fixed seat 73 are installed at the bottom of the drive housing 6: the fixed seat 73 is close to the center of the bottom of the drive housing 6, the fourth bracket 72 is located on one side of the third bracket 71, and the third bracket 71 is located on the other side of the fixed seat 73.

[0054] A second drive motor 711 is installed at the lower end of the third bracket 71. The motor output shaft passes vertically upward through the center hole of the third bracket 71 and is keyed to the third pulley 712.

[0055] A fourth pulley 731 is installed on the upper end of the fixed seat 73 and is rotatably connected by a bearing; the second synchronous belt 74 is sleeved on the outside of the third pulley 712 and the fourth pulley 731, and the tension is adjusted.

[0056] The second spline bearing housing 732 is fixed to the inner wall of the fourth pulley 731, and the second spline drive shaft 733 is inserted into the second spline bearing housing 732 (spline engagement), with the other end penetrating downwards through the bottom of the drive housing 6 (to prevent liquid from seeping in through a sealed bearing).

[0057] A connecting sleeve 76 (connected by thread or flange) is installed at the bottom of the second spline drive shaft 733, and a grinding head 77 (the grinding head material is silicon carbide or diamond, selected according to the hardness of the workpiece) is fixed at the lower end of the connecting sleeve 76.

[0058] A cylinder 721 is installed at the bottom of the fourth bracket 72. The telescopic end of the cylinder 721 passes upward through the center hole of the fourth bracket 72. The lower end of one side of the lifting connecting plate 75 is rotatably connected to the top of the second spline drive shaft 733 through a bearing, and the lower end of the other side is fixed to the telescopic end of the cylinder 721 with bolts (to ensure that the second spline drive shaft 733 can move up and down along the axis when the cylinder is telescopic, so as to adjust the height of the grinding head).

[0059] 4. Cooling system installation (water pump and spray nozzles)

[0060] The water pump 8 is placed on the upper end of the protective tray 2, located between the drive housing 6 and the workpiece clamping and rotating mechanism 5, and fixed with bolts.

[0061] The water pump 8 has its inlet connected to an external water source (such as a water pipe), and its outlet connected to the inlet of the spray head 9 (connected via a flexible hose or rigid pipe, ensuring a tight seal).

[0062] Adjust the angle of the water spray head 9 so that its spray direction is precisely towards the center of the workpiece carrier plate 58 (this can be calibrated using an angle scale or laser).

[0063] 5. Connection of the wiring to the air pipe

[0064] The power cords and air pipes of the first drive motor 521 and air pump 531 in the workpiece clamping and rotating mechanism 5 are led out along the housing 51 and connected to the external control box through the wire groove reserved at the rear end of the base 1 (a metal flexible hose is required for protection to prevent wear).

[0065] The power line of the second drive motor 711 in the grinding head drive mechanism 7 is also led out to the external control box.

[0066] Connect the air pipe of cylinder 721 to an external air source (such as an air compressor) and install an air pressure regulating valve (to control the cylinder extension and retraction speed).

[0067] 6. Overall debugging

[0068] Before powering on, check that all components are securely connected, that the wiring / air pipes are unobstructed, and that the collection tank 3 is clean and free of debris.

[0069] Start the control box and test whether the first drive motor 521 rotates normally (observe whether the first synchronous belt 534 of the first pulley 522 and the second pulley 533 moves synchronously); test whether the air pump 531 outputs stable air pressure (which can be detected by a pressure gauge).

[0070] Test whether the second drive motor 711 rotates normally (observe the movement of the second synchronous belt 74 between the third pulley 712 and the fourth pulley 731); test whether the cylinder 721 can rise and fall smoothly (observe whether the movement of the lifting connecting plate 75 and the second spline drive shaft 733 is smooth).

[0071] Test whether the water pump 8 is pumping water normally and whether the water spray direction of the spray head 9 is accurate (this can be done by placing a measuring cup in the center of the workpiece carrier 58 and observing whether the water flow is concentrated).

[0072] Finally, run the machine under no-load for 5-10 minutes to check for abnormal heating, unusual noises, or vibrations in each component. Once everything is confirmed to be correct, complete the installation.

[0073] The operating steps and effects of this device are as follows:

[0074] 1. Workpiece clamping and positioning

[0075] Place the semiconductor workpiece (such as a wafer or chip carrier) to be polished on the upper end of the workpiece carrier 58, ensuring that the center of the workpiece coincides with the center of the workpiece carrier 58 (this can be assisted by a visual positioning system or manual marking).

[0076] When the air pump 531 is started, compressed air enters the bottom of the workpiece carrier 58 through the hollow channel of the first spline drive shaft 55 (a vent hole needs to be opened on the connecting shaft 57), and is blown outward through the negative pressure suction hole 59, forming a negative pressure zone on the lower surface of the workpiece (actually, the air between the workpiece and the carrier is drawn out, forming a suction force), thereby flexibly fixing the workpiece. Compared with mechanical clamping, this avoids workpiece deformation or edge damage caused by stress concentration, and is especially suitable for thin semiconductor workpieces with a thickness of <0.5mm.

[0077] 2. Grinding head position adjustment

[0078] The cylinder 721 is started by the external control box. The cylinder extension end pushes the lifting connecting plate 75 downward, which drives the second spline drive shaft 733 to move downward along the axis until the bottom surface of the grinding head 77 contacts the upper surface of the workpiece (the contact pressure can be detected by micrometer or by observing the small wear marks between the grinding head and the workpiece). If the grinding pressure needs to be adjusted, the extension stroke can be adjusted by controlling the air intake of the cylinder.

[0079] The height of the grinding head 77 can be precisely adjusted (adjustment accuracy ±0.1mm) to ensure uniform grinding pressure and avoid scratches or excessive thinning of the workpiece surface due to excessive pressure. At the same time, the second drive motor 711 drives the fourth pulley 731 to rotate through the second synchronous belt 74, which drives the second spline transmission shaft 733 to rotate synchronously, realizing the rotational grinding action of the grinding head. The speed can be controlled by adjusting the frequency of the second drive motor 711 (range 500-3000rpm).

[0080] 3. Workpiece rotation and synchronous grinding

[0081] Start the first drive motor 521. The motor output shaft drives the first pulley 522 to rotate, which in turn drives the second pulley 533 to rotate via the first synchronous belt 534. This, in turn, drives the first spline bearing seat 54 and the first spline drive shaft 55 to rotate (speed range 100-1000 rpm). The first spline drive shaft 55 drives the workpiece carrier 58 to rotate synchronously via the connecting shaft 57 (the workpiece rotates with the carrier, and the linear speed matches the rotation speed of the grinding head).

[0082] The rotation of the workpiece carrier 58 and the rotation of the grinding head form a compound motion, making the relative speed of the contact point between the grinding head and the workpiece uniform, and the surface roughness can reach below Ra0.1μm (high precision requirement); at the same time, the eccentric design of the grinding head (located at the eccentric point of the center of the workpiece carrier) can avoid direct collision between the grinding head and the center of the workpiece, and extend the grinding head life (wear rate reduced by more than 30%).

[0083] 4. Cooling and cleaning are carried out simultaneously.

[0084] Start the water pump 8. External water source (such as deionized water or coolant) is pressurized by the water pump and delivered to the spray head 9. The spray head (9) sprays water at a pressure of 0.5-1MPa towards the center of the workpiece carrier plate 58 (the water flow coverage radius is 10-15mm). The water flow spreads along the workpiece surface to the surrounding area and finally flows into the liquid collection tank 3.

[0085] During the grinding process, the friction between the grinding head and the workpiece generates high temperatures (up to 80-120℃). After the cooling water comes into contact with the high-temperature area, it quickly vaporizes and absorbs heat, keeping the temperature below 50℃ to prevent the workpiece surface from burning or the grinding head from annealing (reducing hardness).

[0086] The water flow washes away the metal shavings and dust particles (1-100μm in diameter) generated during grinding, causing them to flow into the collection tank 3 with the water flow, thus preventing the shavings from adhering to the workpiece surface (affecting subsequent packaging) or embedding in the grinding head gaps (accelerating grinding head wear).

[0087] 5. Waste liquid collection and discharge

[0088] Waste liquid (including cooling water, debris, and dust) in the collection tank 3 flows into an external waste liquid treatment system (such as a sedimentation tank or filtration device) through the water outlet pipe 4 on the side of the base 1, achieving automatic collection and separation.

[0089] The work area does not require frequent manual cleaning, reducing downtime (the waste liquid pool only needs to be cleaned once every 8 hours); at the same time, the closed structure of the collection tank 3 and the base 1 prevents waste liquid from splashing and keeps the equipment surface clean (reducing maintenance costs).

[0090] The above-described embodiments are merely illustrative of certain implementations of this utility model, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A negative pressure adsorption type dual-rotation precision polishing device for semiconductor wafer processing, comprising a base (1), characterized in that: The upper end of the base (1) is provided with a protective tray (2), and the corresponding positions of the protective tray (2) and the base (1) are provided with liquid collection tanks (3) that are interconnected. The side of the base (1) is provided with a water outlet pipe (4) that is connected to the liquid collection tank (3). The liquid collection tank (3) is provided with a workpiece clamping and rotating mechanism (5) at the top center. The protective tray (2) is provided with a drive box (6) on one side of the upper end. The drive box (6) is provided with a grinding head drive mechanism (7). The grinding head (77) of the grinding head drive mechanism (7) is located above the eccentric part of the workpiece clamping and rotating mechanism (5). The upper end of the protective tray (2) is provided with a water pump (8) on one side of the drive box (6), and a water spray head (9) is provided on the side of the water pump (8). The water spray direction of the water spray head (9) is towards the center of the workpiece clamping and rotating mechanism (5).

2. The negative pressure adsorption type dual-rotation precision grinding device for semiconductor wafer processing according to claim 1, characterized in that: The workpiece clamping and rotating mechanism (5) includes a housing (51) disposed at the bottom end of the liquid collection tank (3). A cylindrical groove (511) is provided at the center of the upper end of the housing (51), and a rectangular groove (512) is provided on the side. The upper end of the housing (51) is provided with a first support (52) on the side of the rectangular groove (512) and a second support (53) on the side of the cylindrical groove (511). The lower end of the first bracket (52) is equipped with a first drive motor (521) located in a rectangular groove (512). The output end of the first drive motor (521) passes through the first bracket (52) and is fixedly connected to the first pulley (522) located at the upper end of the first bracket (52). An air pump (531) is provided in the cylindrical groove (511), and a transmission bearing seat (532) is provided at the upper end of the second bracket (53). A second pulley (533) is rotatably connected to the transmission bearing seat (532), and the second pulley (533) is connected to the first pulley (522) through a first synchronous belt (534). The inner wall of the second pulley (533) is fixed with a first spline bearing seat (54), and a hollow first spline drive shaft (55) is inserted into the first spline bearing seat (54). The output end of the air pump (531) is rotatably connected to the first spline drive shaft (55). The wiring and air pipes of the first drive motor (521) and air pump (531) extend from the housing (51) to the rear end of the base (1).

3. The negative pressure adsorption type dual-rotation precision grinding device for semiconductor wafer processing according to claim 2, characterized in that: The upper end of the housing (51) is provided with an upper cover plate (56), and a hollow connecting shaft (57) passes through the upper end of the upper cover plate (56). The lower end of the connecting shaft (57) is fixedly connected to the top end of the first spline drive shaft (55), and a hollow workpiece carrier plate (58) is fixedly connected to the upper end of the connecting shaft (57). The upper end of the workpiece carrier (58) is provided with a plurality of negative pressure adsorption holes (59), and a waterproof and breathable membrane is provided in the negative pressure adsorption holes (59); there is a gap between the workpiece carrier (58) and the inner wall of the liquid collection tank (3).

4. The negative pressure adsorption type dual-rotation precision grinding device for semiconductor wafer processing according to claim 1, characterized in that: The grinding head drive mechanism (7) includes a third bracket (71), a fourth bracket (72), and a fixed seat (73) disposed at the bottom of the drive housing (6). The lower end of the third bracket (71) is equipped with a second drive motor (711), the output end of which passes through the bottom of the drive housing (6) and extends upward. The upper end of the third bracket (71) is rotatably connected to the third pulley (712), and the output end of the second drive motor (711) is fixedly connected to the third pulley (712); The upper end of the fixed base (73) is rotatably connected to a fourth pulley (731), and the fourth pulley (731) is connected to the third pulley (712) by a second synchronous belt (74). The inner wall of the fourth pulley (731) is fixed with a second spline bearing seat (732), and a second spline drive shaft (733) is inserted into the second spline bearing seat (732). The second spline drive shaft (733) extends downward through the bottom of the drive housing (6). The bottom end of the second spline drive shaft (733) is fixedly connected to a connecting sleeve (76), and the lower end of the connecting sleeve (76) is fixedly connected to a grinding head (77).

5. The negative pressure adsorption type dual-rotation precision grinding device for semiconductor wafer processing according to claim 4, characterized in that: A cylinder (721) is installed at the inner bottom end of the fourth bracket (72), and the telescopic end of the cylinder (721) extends upward through the fourth bracket (72). The inner top of the drive housing (6) is provided with a lifting connecting plate (75). The lower end of one side of the lifting connecting plate (75) is rotatably connected to the second spline drive shaft (733), and the lower end of the other side is fixedly connected to the telescopic end of the cylinder (721).

6. The negative pressure adsorption type dual-rotation precision grinding device for semiconductor wafer processing according to claim 1, characterized in that: The water pump (8) and the water spray head (9) are located on the upper end of the protective tray (2) and on one side of the drive box (6). The water spray direction of the water spray head (9) is precisely towards the center position of the workpiece carrier plate (58) of the workpiece clamping and rotating mechanism (5).

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