Fixture structure for semiconductor laser packaging

Abstract

This utility model discloses a fixture structure for semiconductor laser packaging, relating to the field of laser packaging technology. The fixture structure for semiconductor laser packaging includes a base, a clamping assembly, a heat exchange assembly, and an air-cooling assembly. The base has adsorption holes for adsorbing laser components. The clamping assembly is located on the base and includes two movable plates that can move closer or further apart to clamp or release the laser components. The heat exchange assembly is located on the base and is used for heat exchange and heat dissipation of the laser components. The air-cooling assembly is located inside the base and surrounds the adsorption holes. The technical solution provided by this utility model improves the reliability of the fixture structure for semiconductor laser packaging.

Description

Technical Field

[0001] This utility model relates to the field of laser packaging technology, and in particular to a clamping structure for semiconductor laser packaging. Background Technology

[0002] In the packaging process of semiconductor lasers, the fixture structure plays a crucial role. It is not only used to fix and position key components such as laser chips, electrodes, and heat sinks to ensure the accuracy and reliability of the packaging process, but also plays an important role in heat conduction and heat dissipation.

[0003] During the packaging process of semiconductor lasers, the welding or curing tools generate heat when soldering or curing chips to other components. This heat is conducted to the chip and the fixture structure, causing the temperature to rise. In addition, thermal resistance exists at the contact interfaces between the chip and the fixture structure, and between the fixture structure and the heat sink during the packaging process, leading to heat accumulation between the chip and the fixture. Therefore, users are increasingly demanding higher heat dissipation performance from fixture structures.

[0004] Existing fixture structures generally use heat sinks or thermal conductive sheets for heat dissipation. However, in the packaging process of high-power semiconductor lasers, a lot of heat is generated, and heat sinks or thermal conductive sheets cannot meet the heat dissipation requirements, which in turn affects the performance of semiconductor lasers. Utility Model Content

[0005] The main objective of this invention is to propose a fixture structure for semiconductor laser packaging, aiming to improve the reliability of the fixture structure used for semiconductor laser packaging.

[0006] To achieve the above objectives, the present invention proposes a fixture structure for semiconductor laser packaging, comprising:

[0007] The base is provided with adsorption holes for adsorbing the laser element;

[0008] A clamping assembly is provided on the base, the clamping assembly including two movable plates that can move closer or further apart to clamp or release the laser element;

[0009] A heat exchange assembly is disposed on the base, the heat exchange element being used for heat exchange and heat dissipation of the laser element; and...

[0010] An air-cooled component is located inside the base and arranged around the adsorption hole.

[0011] In one embodiment, the air-cooled assembly includes:

[0012] A cooling fan is provided on the base; and,

[0013] A heat dissipation channel is located inside the base and surrounds the adsorption hole, with the air inlet of the heat dissipation channel facing the air outlet of the cooling fan.

[0014] In one embodiment, the base is provided with an air outlet and an air inlet, the cooling fan is located at the air inlet, and the air outlet of the heat dissipation channel is opposite to the air outlet.

[0015] In one embodiment, the base has an internal air extraction channel that communicates with the adsorption hole, and the air extraction channel is S-shaped.

[0016] In one embodiment, the base has a baffle inside, and the baffle is staggered with the outer wall of the exhaust channel to form the heat dissipation channel.

[0017] In one embodiment, the heat dissipation channel includes two branches located on both sides of the exhaust channel.

[0018] In one embodiment, a flow divider is provided at the air outlet of the cooling fan, the flow divider being used to divide and guide the airflow of the cooling fan.

[0019] In one embodiment, the heat exchange assembly includes:

[0020] The first heat dissipation fin is disposed on the side of the air-cooled assembly opposite to the base; and / or,

[0021] The second heat dissipation fin is located on one side of the two movable plates that are opposite to each other.

[0022] In one embodiment, the clamping assembly further includes:

[0023] Each of the moving plates is driven to have one of the power components;

[0024] A fixed rod is disposed on the side of the movable plate facing the power member, and the output shaft of the power member is drivenly connected to the fixed rod; and,

[0025] An elastic element is sleeved on the fixed rod and abuts against the movable plate.

[0026] In one embodiment, the base is provided with a plurality of telescopic support feet at its bottom, each of which is independently provided and is used to adjust the levelness of the base.

[0027] This invention provides a fixture structure for semiconductor laser packaging that includes a base, a clamping assembly, a heat exchange assembly, and an air-cooling assembly. The base has suction holes for adsorbing laser components. The clamping assembly, located on the base, comprises two movable plates that can move closer or further apart to clamp or release the laser components. The heat exchange assembly, also located on the base, dissipates heat from the laser components. The air-cooling assembly is located inside the base and surrounds the suction holes. Compared to existing fixture structures that use heat sinks or thermal pads, this invention, by simultaneously incorporating heat exchange and air-cooling components, achieves rapid and uniform heat dissipation for both the base and the laser components, improving the heat dissipation effect and reliability of the fixture structure for semiconductor laser packaging. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0029] Figure 1 A schematic diagram of one embodiment of the fixture structure for semiconductor laser packaging provided by this utility model;

[0030] Figure 2 for Figure 1 A schematic diagram of the structure of an embodiment from another perspective;

[0031] Figure 3 for Figure 1 A cross-sectional view of one embodiment.

[0032] Explanation of icon numbers:

[0033] 100. Base; 110. Adsorption hole; 120. Air inlet; 130. Air outlet; 140. Side plate; 150. Air extraction channel; 160. Telescopic support leg; 170. Guide groove; 180. Air extraction port;

[0034] 210. Moving plate; 211. Elastic component; 220. Power component;

[0035] 310. Cooling fan; 320. Heat dissipation channel; 321. Baffle; 330. Spread plate;

[0036] 410. First heat dissipation fin; 420. Second heat dissipation fin.

[0037] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0038] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0039] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0040] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0041] In the packaging process of semiconductor lasers, the fixture structure plays a crucial role. It is not only used to fix and position key components such as laser chips, electrodes, and heat sinks to ensure the accuracy and reliability of the packaging process, but also plays an important role in heat conduction and heat dissipation.

[0042] During the packaging process of semiconductor lasers, the welding or curing tools generate heat when soldering or curing chips to other components. This heat is conducted to the chip and the fixture structure, causing the temperature to rise. In addition, thermal resistance exists at the contact interfaces between the chip and the fixture structure, and between the fixture structure and the heat sink during the packaging process, leading to heat accumulation between the chip and the fixture. Therefore, users are increasingly demanding higher heat dissipation performance from fixture structures.

[0043] Existing fixture structures generally use heat sinks or thermal conductive sheets for heat dissipation. However, in the packaging process of high-power semiconductor lasers, a lot of heat is generated, and heat sinks or thermal conductive sheets cannot meet the heat dissipation requirements, which in turn affects the performance of semiconductor lasers.

[0044] This invention proposes a fixture structure for semiconductor laser packaging to improve the reliability of the fixture structure used for semiconductor laser packaging.

[0045] Please see Figure 1 and Figure 2 In one embodiment, the fixture structure for semiconductor laser packaging includes a base 100, a clamping assembly, a heat exchange assembly, and an air cooling assembly.

[0046] The base 100 is provided with adsorption holes 110 for adsorbing laser components. These laser components can be chips, electrodes, or heat sinks, etc., and are not specifically limited in this regard. In one embodiment, multiple adsorption holes 110 are provided at the center of the base 100 for adsorbing and positioning the laser components. In another embodiment, the adsorption holes 110 are connected to a vacuum device, which controls the adsorption holes 110 to adsorb or release the laser components; the vacuum device is not limited in this regard. Of course, in other embodiments, only one adsorption hole 110 may be provided; the specific number of adsorption holes 110 is not limited in this regard. The base 100 can be made of materials with good thermal conductivity and rigidity, such as copper, aluminum, aluminum nitride, or silicon carbide, to ensure the heat dissipation performance and reliability of the fixture structure used for semiconductor laser packaging; the material of the base 100 is not specifically limited in this regard.

[0047] A clamping assembly is disposed on the base 100 and includes two movable plates 210 that can move closer to or further away from each other to clamp or release the laser element. In one embodiment, a side plate 140 is provided on each opposite side of the upper surface of the base 100, and the two movable plates 210 are disposed on opposite sides of the adsorption hole 110 and are connected to the side plates 140 one-to-one. In one embodiment, a guide groove 170 is provided on the upper surface of the base 100, the guide groove 170 is offset from the adsorption hole 110, and the movable plates 210 are provided with corresponding protrusions that are embedded in the guide groove 170 and can slide along the guide groove 170. Of course, in other embodiments, the movable plates 210 can also be placed directly on the upper surface of the base 100, and there is no limitation on this. Thus, after the laser element is placed on the base 100, the adsorption hole 110 adsorbs the laser element to position it, and the two moving plates 210 move along the guide groove 170 to approach each other until they come into contact with the laser element. The two moving plates 210 clamp the laser element to facilitate the encapsulation of the laser element.

[0048] A heat exchange assembly is disposed on the base 100, and the heat exchange element is used to exchange heat and dissipate heat from the laser element. An air-cooling assembly is disposed inside the base 100 and surrounds the adsorption hole 110. The heat generated during the encapsulation process mainly accumulates around the laser element and the adsorption hole 110 of the base 100. In one embodiment, the base 100 is hollow, and the air-cooling assembly is disposed inside the base 100 to facilitate air-cooling of the base 100 and the laser element. In one embodiment, the heat exchange assembly is at least partially disposed on the lower surface of the base 100. The heat exchange assembly can directly exchange heat and dissipate heat from the base 100, and can also exchange heat with the air-cooling assembly, further improving the heat dissipation effect of the air-cooling assembly on the base 100. In one embodiment, the heat from the laser element is transferred to the moving plate 210. The heat exchange assembly is at least partially disposed on the moving plate 210 to dissipate heat from the moving plate 210, thereby achieving heat dissipation for the laser element.

[0049] The technical solution of this utility model includes a base 100, a clamping assembly, a heat exchange assembly, and an air-cooling assembly in a fixture structure for semiconductor laser packaging. The base 100 has adsorption holes 110 for adsorbing laser components. The clamping assembly is located on the base 100 and includes two movable plates 210 that can move closer or further apart to clamp or release the laser components. The heat exchange assembly is located on the base 100 and is used to exchange heat and dissipate heat from the laser components. The air-cooling assembly is located inside the base 100 and surrounds the adsorption holes 110. Compared to existing fixture structures that use heat sinks or thermal pads, this utility model's technical solution, by simultaneously incorporating heat exchange and air-cooling components, achieves rapid and uniform heat dissipation for both the base 100 and the laser components, improving the heat dissipation effect of the fixture structure for semiconductor laser packaging and thus enhancing its reliability.

[0050] Please see Figure 3 In one embodiment, the air-cooled component includes a cooling fan 310 and a heat dissipation channel 320. The cooling fan 310 is disposed on the base 100. The heat dissipation channel 320 is disposed inside the base 100 and surrounds the adsorption hole 110. The air inlet of the heat dissipation channel 320 is opposite to the air outlet of the cooling fan 310.

[0051] In one embodiment, the base 100 is provided with an air outlet 130 and an air inlet 120. A cooling fan 310 is located at the air inlet 120, with the air intake of the cooling fan 310 facing the air inlet 120, and the air outlet of the heat dissipation channel 320 facing the air outlet 130. The cooling fan 310 can be configured as an axial flow fan or a mixed flow fan, etc., and is not limited thereto. In one embodiment, the base 100 has an internal exhaust channel 150 communicating with the adsorption hole 110, and the exhaust channel 150 is S-shaped. In one embodiment, the base 100 is provided with an exhaust port 180, and the opening of the exhaust channel 150 is opposite to the exhaust port 180. In one embodiment, the exhaust direction of the exhaust port 180 is opposite to or perpendicular to the air outlet direction of the air outlet 130 and the air inlet direction of the air inlet 120 to avoid mutual interference. In one embodiment, the exhaust channel 150 connects all the adsorption holes 110 and forms an S-shaped path along the arrangement path of all the adsorption holes 110. The heat dissipation channel 320 is arranged around the exhaust channel 150. Further, in one embodiment, a baffle 321 is provided inside the base 100. The baffle 321 is staggered with the outer wall of the exhaust channel 150 to form the heat dissipation channel 320. Specifically, in one embodiment, the exhaust channel 150 includes three flow paths and a bend connecting two adjacent flow paths. The extension direction of the baffle 321 is parallel to the extension direction of the flow path. The baffle 321 is staggered with the outer wall of the exhaust channel 150. The baffle 321 cooperates with the outer wall of the flow path and the outer wall of the bend to form an S-shaped heat dissipation channel 320. Of course, in other embodiments, two or more flow paths may be provided, and one or more bends may be provided accordingly. There is no limitation here. Of course, in other embodiments, the exhaust channel 150 and the heat dissipation channel 320 may also be U-shaped, E-shaped, or L-shaped, etc. There is no limitation here.

[0052] The technical solution of this utility model embodiment, by setting a cooling fan 310 and a heat dissipation channel 320, with the heat dissipation channel 320 arranged around the adsorption hole 110, provides air cooling for the laser element and the base 100. The exhaust channel 150 is S-shaped, and the baffle 321 cooperates with the outer wall of the exhaust channel 150 to form the heat dissipation channel 320. This simplifies the structure and, while ensuring the function of the adsorption hole 110, extends the path of the heat dissipation channel 320, that is, extends the flow time of the cold air. This allows for sufficient air cooling for the laser element and the base 100, further improving the heat dissipation performance of the fixture structure used for semiconductor laser packaging, and thus improving the reliability of the fixture structure used for semiconductor laser packaging.

[0053] Please see Figure 3 In one embodiment, the heat dissipation channel 320 includes two branches located on both sides of the exhaust channel 150.

[0054] In one embodiment, baffles 321 are provided on both sides of each flow path. The baffles 321 on the same side of the exhaust channel 150 cooperate with the outer wall of one side of the exhaust channel 150 to form a branch. In one embodiment, a diverter plate 330 is provided at the air outlet of the cooling fan 310. The diverter plate 330 is used to divert and guide the airflow of the cooling fan 310. Specifically, in one embodiment, the air outlet of the cooling fan 310 is directly opposite the end of a flow path, the airflow direction of the cooling fan 310 is parallel to the extension direction of the flow path, and a branch is provided on each side of the flow path. The diverter plate 330 is provided at the end of the flow path near the air outlet to divert the airflow of the cooling fan 310 and guide the airflow into the two branches. In one embodiment, the cross-sectional shape of the diverter plate 330 is triangular to better control the direction of the airflow. Further, in one embodiment, the surface of the diverter plate 330 is smoothed to reduce resistance. Of course, in other embodiments, the cross-sectional shape of the diverter plate 330 can also be set to rectangular or arc-shaped, etc., and there is no limitation here. Of course, in other embodiments, two cooling fans 310 can also be provided, with one cooling fan 310 corresponding to each branch, and there is no limitation here. In one embodiment, the inner surface of the heat dissipation channel 320 is coated with thermally conductive silicone grease, that is, the outer surface of the baffle 321 and the outer wall of the exhaust channel 150 are coated with thermally conductive silicone grease to improve heat dissipation efficiency. Of course, in other embodiments, thermally conductive materials such as graphene or nano-metals can also be coated, and there is no limitation here.

[0055] The technical solution of this utility model embodiment, by setting two branches, enables the heat dissipation channel 320 to be fully and uniformly arranged around the adsorption hole 110, thereby realizing the air-cooling component to dissipate heat from the laser element and the base 100 in a comprehensive and uniform manner, further improving the heat dissipation performance of the fixture structure used for semiconductor laser packaging, and thus improving the reliability of the fixture structure used for semiconductor laser packaging.

[0056] Please see Figure 1 and Figure 2 In one embodiment, the heat exchange assembly includes a first heat dissipation fin 410 and a second heat dissipation fin 420. The first heat dissipation fin 410 is disposed on the side of the air-cooled assembly away from the base 100, and the second heat dissipation fin 420 is disposed on the side of the two movable plates 210 away from each other.

[0057] In one embodiment, a first heat dissipation fin 410 is disposed on the lower surface of the base 100, and the extension direction of the first heat dissipation fin 410 is perpendicular to the lower surface of the base 100, with multiple fins spaced apart. In one embodiment, the first heat dissipation fin 410 is in direct contact with the base 100, and is directly fixed to the base 100 by means of screwing, snapping, or riveting. Of course, in other embodiments, the lower surface of the base 100 is covered with a heat dissipation plate, and the first heat dissipation fin 410 is disposed on the side of the heat dissipation plate away from the base 100. Here, the arrangement of the first heat dissipation fin 410 is not limited. Further, in one embodiment, the extension direction of the second heat dissipation fin 420 is perpendicular to the extension direction of the first heat dissipation fin 410, and multiple second heat dissipation fins 420 are spaced apart on each movable plate 210. In one embodiment, the second heat dissipation fin 420 can be directly fixed to the movable plate 210. Of course, in other embodiments, the second heat dissipation fin 420 can also be connected to the movable plate 210 via a heat dissipation plate; no specific limitation is made here. The specific number of the first heat dissipation fin 410 and the second heat dissipation fin 420 can be flexibly set according to actual conditions; no limitation is made here. Of course, in other embodiments, only the first heat dissipation fin 410 or the second heat dissipation fin 420 may be provided; no limitation is made here.

[0058] The technical solution of this utility model embodiment increases the heat dissipation area of ​​the clamping structure for semiconductor laser packaging by setting a first heat dissipation fin 410 and a second heat dissipation fin 420, which can quickly dissipate heat to the outside air and achieve rapid heat dissipation. The first heat dissipation fin 410 is located on one side of the air-cooling component and can dissipate heat from the heat dissipation channel 320, further improving the heat dissipation effect of the air-cooling component; the second heat dissipation fin 420 can dissipate heat from the moving plate 210 that holds the laser element, avoiding heat accumulation in the clamping part, further improving the heat dissipation performance of the clamping structure for semiconductor laser packaging, and thus improving the reliability of the clamping structure for semiconductor laser packaging.

[0059] Please see Figure 1 and Figure 2 In one embodiment, the clamping assembly further includes a power member 220, a fixing rod, and an elastic member 211. Each movable plate 210 is drivenly connected to a power member 220, the fixing rod is located on the side of the movable plate 210 facing the power member 220, the output shaft of the power member 220 is drivenly connected to the fixing rod, and the elastic member 211 is sleeved on the fixing rod and abuts against the movable plate 210.

[0060] In one embodiment, the side plate 140 has a through hole, and the power component 220 is located on the side of the side plate 140 opposite to the movable plate 210. The output shaft of the power component 220 extends from the through hole to be drivenly connected to the movable plate 210. In one embodiment, the extension and retraction of the output shafts of the two power components 220 can drive the two movable plates 210 to move closer or further apart, and the two power components 220 can run and stop synchronously. The power component 220 can be configured as a motor, cylinder, or hydraulic cylinder; no limitation is made here. In one embodiment, the fixing rod and the second heat dissipation fin 420 are both located on the side of the movable plate 210 facing the power component 220. The arrangement of the second heat dissipation fin 420 avoids the position of the fixing rod, and the fixing rod connects the movable plate 210 and the output shaft of the power component 220. In one embodiment, the fixing rod and the output shaft are driven by a threaded joint. Of course, in other embodiments, the fixing rod and the output shaft can also be connected by bonding or welding; no limitation is made here. In one embodiment, the two ends of the elastic element 211 abut against the threaded joint and the movable plate 210 respectively to reduce the impact of the power transmission to the movable plate 210. The elastic element 211 can be configured as a rubber sleeve or silicone sleeve, etc., to reduce impact while preventing heat transfer to the power element 220. No specific limitations are imposed on the elastic element 211. In one embodiment, a buffer pad is provided on the side of the movable plate 210 facing the adsorption hole 110 to prevent damage to the laser element when the two movable plates 210 come close together to clamp the laser element. The buffer pad can be made of materials with good elasticity and thermal conductivity, such as foam metal or copper-based alloy. No limitations are imposed. Of course, in other embodiments, the material of the movable plate 210 can also be configured as a material with good elasticity and thermal conductivity. No limitations are imposed.

[0061] The technical solution of this utility model embodiment, by setting up a power component 220, realizes the automation of the fixture structure and improves the ease of use of the fixture structure for semiconductor laser packaging. By setting up a fixing rod and an elastic component 211, on the one hand, heat transfer to the power component 220 can be avoided, which would affect the operation of the power component 220 and ensure the normal use of the fixture structure for semiconductor laser packaging; on the other hand, the impact of the power component 220 on the moving plate 210 can be reduced, thereby improving the service life and reliability of the fixture structure for semiconductor laser packaging.

[0062] Please see Figure 1 In one embodiment, the base 100 is provided with a plurality of telescopic support feet 160 at its bottom. Each telescopic support foot 160 is independently provided and is used to adjust the level of the base 100.

[0063] In one embodiment, the base 100 is rectangular, and a telescopic support foot 160 is provided around the base 100. Of course, in other embodiments, the base 100 can also be circular or polygonal, and the number of telescopic support feet 160 can be flexibly set according to actual conditions. Here, the shape of the base 100 and the number of telescopic support feet 160 are not limited. In one embodiment, the telescopic support foot 160 includes an outer sleeve rod and an inner sleeve rod. One end of the outer sleeve rod is fixed to the base 100, and the other end of the outer sleeve rod is connected to the inner sleeve rod. The outer sleeve rod is hollow, and both the inner circumference of the outer sleeve rod and the outer circumference of the inner sleeve rod are threaded. The inner sleeve rod extends into the interior of the outer sleeve rod and is connected to the outer sleeve rod via threads. By adjusting the threaded connection length between the inner sleeve rod and the outer sleeve rod, the levelness of the base 100 can be adjusted. Further, in one embodiment, an anti-slip pad is provided at the end of the inner sleeve rod away from the outer sleeve rod to further ensure the stability of the base 100. Of course, in other embodiments, a driving element may be provided between the outer sleeve rod and the inner sleeve rod, or the telescopic support foot 160 may be directly set as an electric telescopic rod, etc. Here, the telescopic support foot 160 is not limited.

[0064] The technical solution of this utility model embodiment, by setting an individually adjustable telescopic support foot 160, can adjust the level of the base 100, so that the base 100 remains stable during the packaging process, thereby ensuring packaging accuracy and improving the reliability of the fixture structure used for semiconductor laser packaging.

[0065] The above description is merely an exemplary embodiment of the present utility model and does not limit the scope of protection of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.

Claims

1. A clamp structure for a semiconductor laser package, characterized by, include: The base is provided with adsorption holes for adsorbing the laser element; A clamping assembly is provided on the base, the clamping assembly including two movable plates that can move closer or further apart to clamp or release the laser element; A heat exchange assembly is disposed on the base, the heat exchange element being used for heat exchange and heat dissipation of the laser element; and... An air-cooled component is located inside the base and arranged around the adsorption hole.

2. The clamp structure for a semiconductor laser package according to claim 1, wherein The air-cooling component includes: A cooling fan is provided on the base; and, A heat dissipation channel is located inside the base and surrounds the adsorption hole, with the air inlet of the heat dissipation channel facing the air outlet of the cooling fan.

3. The clamp structure for a semiconductor laser package according to claim 2, wherein The base is provided with an air outlet and an air inlet, the cooling fan is located at the air inlet, and the air outlet of the heat dissipation channel is opposite to the air outlet.

4. The clamp structure for a semiconductor laser package according to claim 2, wherein The base has an internal air extraction channel that communicates with the adsorption holes, and the air extraction channel is S-shaped.

5. The clamp structure for a semiconductor laser package according to claim 4, wherein The base is equipped with a baffle, which is staggered with the outer wall of the exhaust channel to form the heat dissipation channel.

6. The clamp structure for a semiconductor laser package as described in claim 4, wherein, The heat dissipation channel includes two branches, which are located on both sides of the exhaust channel.

7. The fixture structure for semiconductor laser packaging as described in claim 6, characterized in that, The cooling fan is equipped with a flow divider at its outlet, which is used to divide and guide the airflow from the cooling fan.

8. The clamp structure for a semiconductor laser package as described in claim 1, wherein, The heat exchange assembly includes: The first heat dissipation fin is disposed on the side of the air-cooled assembly opposite to the base; and / or, The second heat dissipation fin is located on one side of the two movable plates that are opposite to each other.

9. The clamp structure for a semiconductor laser package as described in claim 1, wherein, The clamping assembly further includes: Each of the moving plates is driven to have one of the power components; A fixed rod is disposed on the side of the movable plate facing the power member, and the output shaft of the power member is drivenly connected to the fixed rod; and, An elastic element is sleeved on the fixed rod and abuts against the movable plate.

10. The clamp structure for a semiconductor laser package as described in claim 1, wherein, The base is provided with multiple telescopic support feet at its bottom. Each telescopic support foot is independently set and is used to adjust the levelness of the base.

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