A heat dissipation device

Abstract

This utility model provides a heat dissipation device, including a liquid cooling plate assembly and a manifold assembly. The liquid cooling plate assembly includes multiple parallel and oppositely arranged liquid cooling plates, with a bonding portion and a flow channel portion protruding from the bonding portion along the periphery of each liquid cooling plate. The upper and lower surfaces of the flow channel portion are planar. Each liquid cooling plate includes a first plate, a second plate, and a third plate stacked sequentially. The second plate protrudes along its upper and lower surfaces and bonds with the first and third plates to form the flow channel portion. The manifold assembly includes manifold interfaces corresponding to the liquid cooling plates, with manifold interfaces provided at both ends of the liquid cooling plates along their length. The manifold interfaces on the same side of adjacent liquid cooling plates are sequentially connected. This utility model provides a heat dissipation device that can improve the airtightness of the heat dissipation device and enhance the reliability of heat exchange.

Description

Technical Field

[0001] This utility model relates to the field of new energy, and in particular to a heat dissipation device. Background Technology

[0002] In battery cell cooling technology, the battery cell and heat sink are typically installed separately and alternately. The larger surface of the battery cell contacts the heat sink, and the coolant flowing within the heat sink cools the surface of the battery cell. Existing heat sinks usually consist of a heat exchange plate and a current collector, sealed together. The heat exchange plate often uses a hollow harmonica tube through which coolant flows. A connection compensation structure fixed to the heat exchange plate is installed on the current collector to achieve a seal. However, this battery cell cooling method often has the following problems: First, the connection process between the heat exchange plate and the current collector is complex and costly. Second, due to the simple structure and limited cross-sectional dimensions of the harmonica tube, the adjustment space is small, making it impossible to achieve an S-shaped heat dissipation loop through the current collector and other components when cooling is achieved through the side of the harmonica tube. Third, there is a risk of internal leakage between the heat exchange plate and the current collector, with cross-flow between the inlet and outlet pipes, affecting heat dissipation performance and posing a risk. Utility Model Content

[0003] The purpose of this invention is to provide a heat dissipation device that can reduce production costs and improve the heat exchange efficiency and sealing reliability of battery cells.

[0004] To solve the above technical problems, this utility model provides a heat dissipation device and a liquid cooling plate assembly. The liquid cooling plate assembly includes multiple liquid cooling plates arranged side by side and opposite to each other. Each liquid cooling plate includes a bonding portion arranged around its perimeter and a flow channel portion protruding from the bonding portion. The upper and lower surfaces of the flow channel portion are planar. The liquid cooling plate includes a first layer plate, a second layer plate, and a third layer plate arranged in sequence. The second layer plate protrudes along its upper and lower surfaces and is bonded to the first layer plate and the third layer plate to form the flow channel portion.

[0005] The manifold assembly includes a manifold interface corresponding to the liquid cooling plate, and the liquid cooling plate has manifold interfaces at both ends along its length; the manifold interfaces on the same side of adjacent liquid cooling plates are connected sequentially.

[0006] By using a cavity formed by the sealing of the second, first, and third layers, the sealing effect of the liquid cooling plate is significantly improved. The coolant flows in the cavity and forms a heat exchange circuit between the manifold interfaces, thereby improving the heat exchange efficiency of the battery cell.

[0007] Preferably, the second layer plate is provided with multiple first grooves and first protrusions along the direction from one side of the manifold interface to the other side of the manifold interface; the second layer plate is fitted to the first layer plate, the first grooves and the first layer plate form a first cavity, the first protrusions are sealed to the third layer plate, the first protrusions and the third layer plate form a second cavity, and the first grooves are sealed to the first layer plate.

[0008] Preferably, the liquid cooling plate has flow channels at both ends along its length, the flow channels penetrating the second layer plate, the first layer plate, and the third layer plate, and the flow channels are connected to the manifold interface.

[0009] Preferably, the manifold interface includes a first interface symmetrically arranged on both sides of the liquid cooling plate and a second interface connecting the first interfaces on two adjacent liquid cooling plates.

[0010] Preferably, the first interface is embedded in the flow channel opening and connected to the first layer plate or the third layer plate.

[0011] Preferably, the flow channel opening is located in the flow channel section; the manifold interface is connected to the first cavity and the second cavity.

[0012] Preferably, the first interface includes a pipe connection portion embedded in the flow channel opening and a pipe fixing portion for fixing the first layer plate or the third layer plate, wherein the length of the pipe connection portion is consistent with the thickness of the first layer plate or the third layer plate; the second interface is sleeved on the pipe wall of the first interface.

[0013] Preferably, the first layer plate and / or the third layer plate are provided with protrusions at corresponding positions in the flow channel, and the protrusions protrude along the pipe wall of the first interface.

[0014] By improving the connection and fixing relationship between the manifold interface and the flow channel, the airtightness of the first and second cavities is improved, thereby enhancing the heat exchange reliability of the liquid cooling plate.

[0015] Preferably, the first groove and the second groove on the second layer plate are formed by stamping, and the second layer plate, the first layer plate, and the third layer plate are brazed together.

[0016] The first and second grooves are formed by stamping, and the layers are connected and fixed by brazing, thereby improving the airtightness of the liquid cooling plate.

[0017] The present invention provides a heat dissipation device in which the liquid cooling plate integrates the connecting and fixing components in the current collector assembly, thereby reducing production costs; the current collector assembly is embedded in the liquid cooling plate, thereby improving the airtightness of the liquid cooling plate during the battery heat exchange process, and at the same time, the symmetrically arranged cavities formed by the three layers of plates improve the flow efficiency of the coolant and enhance the heat exchange efficiency of the battery cell. Attached Figure Description

[0018] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0019] Figure 1 A schematic diagram of a heat dissipation device provided by this utility model Figure 1 .

[0020] Figure 2 A schematic diagram of a heat dissipation device provided by this utility model Figure 2 .

[0021] Figure 3 A schematic diagram of a liquid-cooled plate structure provided by this utility model Figure 1 .

[0022] Figure 4 A schematic diagram of a liquid-cooled plate structure provided by this utility model Figure 2 .

[0023] Figure 5 for Figure 4 A cross-sectional view along the AA1 direction.

[0024] Figure 6 This is a side view of a heat dissipation device provided by the present invention.

[0025] Figure 7 This is a cross-sectional view of a heat dissipation device provided by this utility model along the BB1 ​​direction.

[0026] Figure 8 for Figure 7 Enlarged schematic diagram of part A in the middle.

[0027] Explanation of icon numbers:

[0028] 100-Heat dissipation device; 1-Liquid cooling plate assembly; 10-Liquid cooling plate; 101-Fitting part; 102-Flow channel part; 103-Flow channel opening; 11-First layer plate; 111-First cavity; 12-Second layer plate; 121-First groove; 122-First protrusion; 13-Third layer plate; 131-Second cavity; 11a-Protrusion; 2-Manifold assembly; 21-Manifold interface; 211-First interface; 211a-Pipe connection part; 211b-Pipe fixing part; 211c-Pipe wall; 212-Second interface. Detailed Implementation

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] To keep the drawings concise, only the parts relevant to this invention are shown schematically in each figure, and they do not represent the actual structure of the product. Furthermore, for ease of understanding, in some figures, only one of the components with the same structure or function is schematically depicted, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."

[0031] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0032] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0033] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0034] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the specific implementation methods of this utility model will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of this utility model. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.

[0035] See Figures 1-6The embodiment provides a heat dissipation device for heat dissipation of battery cells, including a liquid cooling plate 10 assembly and a manifold assembly 2. The liquid cooling plate assembly 1 achieves heat dissipation by connecting with the battery cells. The liquid cooling plate assembly 1 includes a plurality of liquid cooling plates 10 arranged in parallel and opposite to each other. The battery cells are disposed between adjacent liquid cooling plates 10 and the surface of the battery cells is connected to the liquid cooling plates 10 and dissipates heat through the liquid cooling plates 10. Specifically, the liquid cooling plate 10 includes a bonding portion 101 disposed around the periphery of the liquid cooling plate 10 and a flow channel portion 102 protruding from the bonding portion 101. The bonding portion 101 of the liquid cooling plate 10 is sealed and surrounds the outer periphery of the flow channel portion 102. The flow channel portion 102 is bonded to the surface of the battery cell. The liquid cooling plate 10 includes a second layer plate 12, a first layer plate 11, and a third layer plate 13. The first layer plate 11, the second layer plate 12, and the third layer plate 13 are stacked sequentially. The flow channel portion 102 of the first layer plate 11 and the third layer plate 13 is planar and is bonded to the battery cell. The flow channels 102 of the first layer plate 11 and the second layer plate 12, and the flow channels 102 of the third layer plate 13 and the second layer plate 12 are respectively sealed to form cavities, in which coolant can flow. The cavities are symmetrically arranged on both sides of the second layer plate 12 to achieve heat exchange between the cells on both sides of the liquid cooling plate 10. The manifold assembly 2 includes manifold interfaces 21 corresponding to the liquid cooling plate 10, and is arranged at both ends along the length of the liquid cooling plate 10. In the heat dissipation device, each liquid cooling plate 10 has a manifold interface 21 at both ends, and coolant is injected into the cavity through the manifold interface 21. To ensure uniform flow of coolant in the heat dissipation device, the manifold interfaces 21 on the same side of adjacent liquid cooling plates 10 are connected sequentially. By using three layers of plates to form coolant flow cavities, and forming a coolant heat exchange circuit through the cavities and manifold interfaces 21, the heat exchange efficiency of the cells can be improved. At the same time, due to the integrated arrangement of the cavities, the airtightness of the liquid cooling plate 10 can be improved.

[0036] In a specific embodiment, the second layer plate 12 is disposed between the first layer plate 11 and the third layer plate 13. The second layer plate 12 has multiple first grooves 121 and first protrusions 122 arranged along the direction from one side of the manifold interface 21 to the other side of the manifold interface 21. Typically, the first grooves 121 and first protrusions 122 are arranged at intervals. The second layer plate 12 is fitted to the first layer plate 11, and the first grooves 121 and the first layer plate 11 form a first cavity 111. At this time, the first protrusions 122 are fitted to the first layer plate 11. The second layer plate 12 is fitted to the third layer plate 13, and the first protrusions 122 and the third layer plate 13 form a second cavity 131. At this time, the first grooves 121 and the third layer plate 13 are fitted. The first cavity 111 and the second cavity 131 are independent of each other. It should be noted that the second layer plate 12 has multiple first grooves 121 and first protrusions 122. The first grooves 121 are interconnected, and the first protrusions 122 are interconnected. This method can form a cooling circuit on both sides of the liquid cooling plate 10, and the coolant can flow evenly on both sides of the liquid cooling plate 10, thus improving the heat exchange efficiency of the battery cell.

[0037] The liquid cooling plate 10 has flow channels 103 at both ends along its length. The flow channels 103 are connected to the manifold interface 21 for injecting coolant into the first cavity 111 and the second cavity 131 of the liquid cooling plate 10. The flow channels 103 extend through the second layer plate 12, the first layer plate 11, and the third layer plate 13. In a specific embodiment, the manifold interface 21 includes first interfaces 211 symmetrically arranged on both sides of the liquid cooling plate 10 and second interfaces 212 connecting the first interfaces 211 on two adjacent liquid cooling plates 10. The first interfaces 211 are embedded in the flow channels 103. When the first interface 211 is located on one side of the first layer plate 11, it is fixedly connected to the first layer plate 11; when the first interface 211 is located on one side of the third layer plate 13, it is fixedly connected to the third layer plate 13. To ensure smooth flow of coolant within the first cavity 111 and the second cavity 131, a flow channel 103 is provided in the flow channel section 102, and the manifold interface 21 is connected to the first cavity 111 and the second cavity 131.

[0038] The first interface 211 provided in the embodiment includes a pipe connection portion 211a embedded in the flow channel opening 103 and a pipe fixing portion 211b for fixing the first layer plate 11 or the third layer plate 13. The pipe fixing portion 211b is used to fix the flow channel opening 103 to the first layer plate 11 or the third layer plate 13. In order to enable the coolant to smoothly form a cooling circuit between the first cavity 111, the second cavity 131 and the manifold interface 21, the length of the pipe connection portion 211a is the same as the thickness of the first layer plate 11 or the third layer plate 13. The first interface 211 is also provided with a pipe wall 211c for conveying coolant. A second interface 212 is sleeved on the pipe wall 211c to connect two adjacent first interfaces 211, so as to realize the circulation of coolant in the heat dissipation device.

[0039] In a preferred embodiment, the first layer plate 11 and the third layer plate 13 have protrusions 11a at positions corresponding to the flow channel portion 102. The protrusions 11a protrude along the pipe wall 211c of the first interface 211, so that the first layer plate 11, the third layer plate 13, and the second layer plate 12 can form a cavity. Specifically, in an embodiment, the liquid cooling plate 10 may have the first layer plate 11 including the protrusions 11a, and the third layer plate 13 being a flat plate. The protrusion height of the first layer plate 11 is higher than the sum of the heights of the first protrusion 122 and the first groove 121, thereby forming a first cavity 111 between the second layer plate 12 and the first layer plate 11, and forming a second cavity 131 between the second layer plate 12 and the third layer plate 13. Similarly, the liquid cooling plate 10 may have the third layer plate 13 including the protrusions 11a, and the protrusion height of the third layer plate 13 is higher than the height difference between the first protrusion 122 and the first groove 121. Furthermore, the first layer plate 11 and the third layer plate 13 can also be provided with protrusions 11a protruding towards the first interface 211. When the first layer plate 11 and the third layer plate 13 include the protrusions 11a, the mating part 101 is located on the same horizontal plane as the second layer plate 12. By improving the connection and fixing relationship between the manifold interface 21 and the flow channel 103, the airtightness of the first cavity 111 and the second cavity 131 is improved, thereby improving the heat exchange efficiency of the liquid cooling plate 10 and the heat exchange reliability of the battery cell.

[0040] In a preferred embodiment, the first groove 121 and the second groove on the second layer plate 12 can be formed by stamping. The second layer plate 12, the first layer plate 11, and the third layer plate 13 are connected by brazing, and the manifold assembly 2 and the liquid cooling plate 10 assembly are also connected by brazing. In addition, the liquid cooling plate 10 provided in this embodiment can also be integrally formed by blow molding to improve the airtightness of the liquid cooling plate 10.

[0041] The heat dissipation device provided in this embodiment integrates the connecting and fixing components and the liquid cooling plate 10 in the current collector assembly. This means that the current collector tube in the liquid cooling plate 10 is integrally set with the liquid cooling plate 10, thereby reducing production costs. Furthermore, by embedding the current collector tube assembly 2 into the liquid cooling plate 10 and connecting it by brazing, the airtightness of the liquid cooling plate 10 in battery heat exchange is improved, overcoming the high production costs caused by the need for the harmonica tube to be connected and sealed with the connecting and fixing components. Simultaneously, by adopting a structure with three layers of symmetrically arranged cavities, the liquid cooling flow rate can be increased, improving the cell heat exchange efficiency.

[0042] It will be apparent to those skilled in the art that various modifications and variations can be made to the exemplary embodiments of the present invention without departing from the spirit and scope of the present invention. Therefore, it is intended that the present invention cover modifications and variations falling within the scope of the appended claims and their equivalents.

Claims

1. A heat dissipating device, characterized by, include: A liquid cooling plate assembly, comprising a plurality of liquid cooling plates arranged side by side and opposite to each other, wherein each liquid cooling plate includes a bonding portion disposed around the periphery of the liquid cooling plate and a flow channel portion protruding from the bonding portion, wherein the upper and lower surfaces of the flow channel portion are planar. The liquid cooling plate includes a first plate, a second plate, and a third plate stacked in sequence. The second plate protrudes along its upper and lower surfaces and fits against the first plate and the third plate to form the flow channel. The manifold assembly includes a manifold interface corresponding to the liquid cooling plate, and the liquid cooling plate has manifold interfaces at both ends along its length; the manifold interfaces on the same side of adjacent liquid cooling plates are connected sequentially.

2. A heat dissipating device as claimed in claim 1, characterized in that The second layer plate is provided with multiple first grooves and first protrusions along the direction from one side of the manifold interface to the other side of the manifold interface; the second layer plate is fitted to the first layer plate, the first grooves and the first layer plate form a first cavity, the first protrusions are sealed to the third layer plate, the first protrusions and the third layer plate form a second cavity, and the first grooves are sealed to the first layer plate.

3. A heat dissipating device as claimed in claim 2, characterized in that The liquid cooling plate has flow channels at both ends along its length. The flow channels penetrate the second layer plate, the first layer plate, and the third layer plate, and are connected to the manifold interface.

4. A heat dissipating device as claimed in claim 3, characterized in that The manifold interface includes a first interface symmetrically arranged on both sides of the liquid cooling plate and a second interface connecting the first interface on two adjacent liquid cooling plates.

5. A heat dissipating device as claimed in claim 4, characterized in that The first interface is embedded in the flow channel opening and connected to the first layer plate or the third layer plate.

6. A heat dissipating device as claimed in claim 3, characterized in that The flow channel opening is located in the flow channel section; the flow collection pipe interface is connected to the first cavity and the second cavity.

7. A heat dissipating device as claimed in claim 4, characterized in that The first interface includes a pipe connection portion embedded in the flow channel opening and a pipe fixing portion for fixing the first layer plate or the third layer plate. The length of the pipe connection portion is consistent with the thickness of the first layer plate or the third layer plate. The second interface is sleeved on the pipe wall of the first interface.

8. A heat dissipating device as claimed in claim 7, characterized in that The first layer plate and / or the third layer plate are provided with protrusions at corresponding positions in the flow channel, and the protrusions protrude along the pipe wall of the first interface.

9. The heat dissipating device of claim 2, wherein The first groove and the second groove on the second layer plate are formed by stamping, and the second layer plate, the first layer plate, and the third layer plate are brazed together.

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