A heat dissipation structure and a terminal device

Abstract

The application relates to the technical field of terminal equipment, and provides a heat dissipation structure and terminal equipment. The heat dissipation structure comprises: a heat dissipation assembly, the heat dissipation assembly is located between at least one heat generating device and a first inner wall of a shell in a first direction, the inner surface of the shell comprises the first inner wall, the heat dissipation assembly is used for conducting heat dissipated by the at least one heat generating device to the shell; and a first graphene film structure, the first graphene film structure is arranged on the first inner wall, the first graphene film structure is provided with a vacancy area, the vacancy area is arranged through the first graphene film structure in the first direction, the heat dissipation assembly is at least partially arranged in the vacancy area, the first direction is the thickness direction of the first graphene film structure, and the first graphene film structure is used for receiving heat dissipated by the shell and dispersing the received heat. By arranging the first graphene film structure with the vacancy area on the first inner wall of the shell and at least partially arranging the heat dissipation assembly in the vacancy area, the heat dissipation capacity is improved.

Description

Technical Field

[0001] This application relates to the field of terminal equipment technology, and in particular to a heat dissipation structure and a terminal equipment. Background Technology

[0002] With the development of communication technology, terminal devices are being used more and more widely in daily work and life, and their functions are becoming increasingly diverse. This increased functionality often translates to increased power consumption, leading to greater heat dissipation pressure on terminal devices. The effectiveness of heat dissipation directly impacts the performance, reliability, lifespan, and user experience of terminal devices. Therefore, improving the heat dissipation capacity of terminal devices is a pressing issue that the industry needs to address. Utility Model Content

[0003] This application provides a heat dissipation structure and terminal device. By setting a first graphene film structure with a vacant area on the first inner wall of the housing, and setting a heat dissipation component in the vacant area, the heat dissipation component is located between the first inner wall of the housing and at least one heat-generating device. While utilizing the heat dissipation capacity of the graphene film, the heat dissipation structure is ensured to dissipate heat along the Z-axis, thereby improving the overall heat dissipation capacity of the heat dissipation structure.

[0004] In a first aspect, a heat dissipation structure is provided, comprising: a heat dissipation component located between at least one heat-generating device and a first inner wall of a housing in a first direction, the inner surface of the housing including the first inner wall, the heat dissipation component being used to conduct heat emitted by at least one heat-generating device to the housing; and a first graphene film structure disposed on the first inner wall, the first graphene film structure having a vacancy region disposed therein, the vacancy region being disposed through the first graphene film structure along a first direction, the heat dissipation component being at least partially disposed in the vacancy region, the first direction being the thickness direction of the first graphene film structure, the first graphene film structure being used to receive heat emitted by the housing and disperse the received heat.

[0005] The heat dissipation structure provided in this application embodiment involves distributing a heat dissipation component between the first inner wall of the housing and at least one heat-generating device. A first graphene film structure with a vacant area is disposed on the first inner wall of the housing, and the heat dissipation component is at least partially disposed in the vacant area. This allows the heat dissipation component to conduct the heat emitted by the heat-generating device to the housing, while the first graphene film structure receives and disperses the heat dissipated by the housing. Therefore, this heat dissipation structure can promptly conduct the heat emitted by the heat-generating device to the housing and also evenly distribute the heat on the housing, resulting in a strong heat dissipation capacity.

[0006] In some implementations of the first aspect, the heat dissipation component includes at least one of: a thermal pad, thermal gel, a metal component, a thermoelectric cooler, and a fan. In this implementation, the heat dissipation component can be a combination of one or more heat dissipation solutions, improving the applicability and flexibility of the heat dissipation structure.

[0007] In some implementations of the first aspect, all heat dissipation components are located in the empty area.

[0008] For example, the heat dissipation components being entirely located in the empty area can be: the heat dissipation components being completely located in the empty area in the first direction; or the heat dissipation components being entirely located in the empty area can also be: one end of the heat dissipation components in the first direction is located in the empty area, and the other end of the heat dissipation components in the first direction is located outside the empty area.

[0009] In some implementations of the first aspect, the heat dissipation component is connected to the first inner wall.

[0010] For example, the connection between the heat dissipation component and the first inner wall is detachable. This design allows users to disassemble the heat dissipation component as needed, facilitating cleaning and replacement and improving the user experience.

[0011] For example, the connection between the heat dissipation component and the first inner wall can be a fixed connection.

[0012] In some implementations of the first aspect, the heat dissipation component is integrally formed with the housing. This design eliminates the need for a separate heat dissipation component, reducing the overall complexity of the heat dissipation structure and improving its stability.

[0013] For example, the heat dissipation component and the housing portion integrally formed with the heat dissipation component can be made of metal.

[0014] In some implementations of the first aspect, the heat dissipation structure further includes a gasket disposed between at least one heat-generating device and the heat dissipation assembly. In this implementation, by placing a gasket between at least one heat-generating device and the heat dissipation assembly, the impact force exerted on the heat-generating device by the heat dissipation assembly integrally formed with the housing can be avoided, thereby protecting the heat-generating device from damage.

[0015] In some implementations of the first aspect, at least one heating device includes a first heating device, and the vacant region includes a first sub-vacant region, which corresponds to the first heating device. The first sub-vacant region includes a through hole or a through notch. In this implementation, using a through hole or a through notch as the first sub-vacant region corresponding to the first heating device results in a simple structure that is easy to implement.

[0016] For example, the through hole is located in the middle of the first graphene film structure, and the through gap is located at the edge of the first graphene film structure.

[0017] For example, the cross-sectional area of ​​a through hole or a through notch in the first sub-vacancy region in the first direction is greater than or equal to the cross-sectional area of ​​the first heating device in the first direction.

[0018] For example, the cross-sectional area of ​​a through hole or a through notch in the first sub-vacancy region in the first direction may also be smaller than the cross-sectional area of ​​the first heating device in the first direction.

[0019] In some implementations of the first aspect, at least one heating device includes a second heating device, and the vacant region includes a second sub-vacant region, which corresponds to the second heating device. The second sub-vacant region includes multiple through holes. In this implementation, multiple through holes are used as the second sub-vacant region corresponding to the second heating device, thereby ensuring the structural stability of the first graphene film structure while achieving Z-axis heat dissipation.

[0020] In some implementations of the first aspect, the heat dissipation structure further includes a second graphene film structure disposed on the first outer wall of the housing. The outer surface of the housing includes the first outer wall, which corresponds to the first inner wall. In this implementation, by disposing of the second graphene film structure on the first outer wall, the heat dissipation capacity of the heat dissipation structure is further improved.

[0021] In some implementations of the first aspect, the first graphene film structure is a single-piece film, or the first graphene film structure is formed by splicing multiple graphene films to create vacant regions.

[0022] In a second aspect, a terminal device is provided, the terminal device including the heat dissipation structure in any of the implementations of the first aspect above, the terminal device including at least one heat-generating device and a housing, the heat dissipation structure and at least one heat-generating device being located inside the housing.

[0023] In some implementations of the second aspect, the terminal device is an in-vehicle terminal device.

[0024] For example, in-vehicle terminal equipment can be T-Box devices, smart in-vehicle terminals, in-vehicle communication modules, in-vehicle Wi-Fi devices, in-vehicle Bluetooth devices, etc.

[0025] In some implementations of the second aspect, the heat dissipation structure also includes a printed circuit board, with at least one heat-generating device fixed on the printed circuit board. This implementation can achieve heat dissipation for the heat-generating device on the printed circuit board, thereby extending the lifespan of the heat-generating device.

[0026] It is understandable that the beneficial effects of the second aspect mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0027] Figure 1 This is a cross-sectional schematic diagram of a local structure using graphene thin film for heat dissipation in related technologies;

[0028] Figure 2 This is a cross-sectional view of the heat dissipation structure in one embodiment of this application;

[0029] Figure 3 for Figure 2 A top view of the first graphene film structure in the heat dissipation structure shown.

[0030] Figure 4 This is a top view of the first graphene film structure in the heat dissipation structure in different embodiments of this application;

[0031] Figure 5 This is a cross-sectional view of the heat dissipation structure in one embodiment of this application;

[0032] Figure 6 This is a three-dimensional structural diagram of a terminal device in one embodiment of this application;

[0033] Figure 7 for Figure 6 The right view of the terminal device shown;

[0034] Figure 8 for Figure 7 Cross-sectional view at point AA;

[0035] Figure 9 for Figure 6 An exploded view of the terminal equipment shown;

[0036] Figure 10 for Figure 9 Right view of the first graphene film structure in the terminal device shown;

[0037] Figure 11 for Figure 10 Cross-sectional view at BB;

[0038] Figure 12 for Figure 9 A three-dimensional structural diagram of the upper housing in the terminal device shown;

[0039] Figure 13 This is a right view of a terminal device according to another embodiment of this application;

[0040] Figure 14 for Figure 13 Cross-sectional view at CC;

[0041] Figure 15 for Figure 13 A three-dimensional structural diagram of the upper housing in the terminal device shown;

[0042] Figure 16 for Figure 13 An exploded view of the terminal equipment shown;

[0043] Figure 17 This is a three-dimensional structural diagram of a terminal device in another embodiment of this application;

[0044] Figure 18 for Figure 17 The right view of the terminal device shown;

[0045] Figure 19 for Figure 18 Cross-sectional view at DD;

[0046] Figure 20 for Figure 17 An exploded view of the terminal equipment shown;

[0047] Figure 21 for Figures 17 to 20 The illustrated embodiment is a three-dimensional structural diagram of the protective layer in the terminal device;

[0048] Figure 22 This is a right view of a terminal device according to another embodiment of this application;

[0049] Figure 23 for Figure 22 Cross-sectional view at EE;

[0050] Figure 24 for Figure 22 An exploded view of the terminal device shown. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0052] In the description of the embodiments of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" and "second" may explicitly or implicitly include at least one of that feature.

[0053] In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise expressly and specifically limited.

[0054] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0055] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0056] In the description of this application, it should be understood that the terms "inner", "outer", "side", "upper", "bottom", "front", "rear", etc., indicating the orientation or positional relationship are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0057] In the description of this application, it should be noted that the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0058] References to "one embodiment" or "some embodiments" in the embodiments described in this application mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0059] It should also be noted that in the embodiments of this application, the same reference numerals are used to represent the same component or part. For the same part in the embodiments of this application, the reference numerals may only be used to mark one part or component as an example. It should be understood that the reference numerals are also applicable to other identical parts or components.

[0060] The technical solutions provided in the embodiments of this application will be described below with reference to the accompanying drawings.

[0061] In the field of terminal devices, with the improvement of terminal device performance, the heat dissipation problem of terminal devices has received increasing attention, especially for some terminal devices whose working environments have high requirements for heat dissipation capabilities. The following is an example of a vehicle-mounted terminal device.

[0062] For example, when a vehicle is exposed to direct sunlight, the interior air temperature can reach over 70°C. Furthermore, many interior materials radiate heat secondaryly under high temperatures, further raising the interior temperature; in some cases, the localized temperature inside the vehicle can reach as high as 105°C. Therefore, given such a harsh working environment, in-vehicle terminal equipment needs to possess excellent heat dissipation capabilities. Understandably, heat dissipation capability is also crucial for other terminal devices, which will not be elaborated upon here.

[0063] It should be understood that because graphene has an extremely high thermal conductivity, graphene films made of graphene can be pasted onto the surface of structural components to achieve rapid heat equalization and reduce the local temperature of high-temperature areas.

[0064] It should also be understood that the graphene material used to make graphene films can be one layer of graphene, two layers of graphene, or more layers of graphene, or it can be other graphene-containing composite materials with similar properties to one or two layers of graphene. The specific composition of the graphene material is not limited or described in the embodiments of this application.

[0065] Figure 1The diagram shown is a cross-sectional schematic of a local structure for heat dissipation using graphene thin film in related technologies.

[0066] like Figure 1 As shown, a graphene film 110 is disposed on the structural member 120, and the graphene film 110 is located between the structural member 120 and the heat source 130; the graphene film 110 includes graphene material 111 and an edge banding 112. The structural member 120 can be a portion of the housing of the terminal device, and the heat source 130 can be a heating element in the terminal device.

[0067] For example, Figure 1 The Z-axis direction shown can be understood as the direction from the inside of the terminal device toward the outside of the terminal device's casing, or it can be understood as the direction from the heating element inside the terminal device toward the outside of the casing.

[0068] Understandably, the graphene film 110 exhibits strong in-plane heat uniformity, but its longitudinal thermal conductivity along the Z-axis is relatively weak. Specifically, due to the anisotropic thermal conductivity of graphene material 111, the resulting graphene film 110 has strong in-plane heat uniformity but weak longitudinal thermal conductivity along the Z-axis; furthermore, the graphene film 110 also includes... Figure 1 The edge 112 shown further reduces the heat dissipation capacity of the graphene film in the Z-axis direction. As a result, although the graphene film 110 can uniformly heat the received heat on the plane, it cannot quickly conduct the heat dissipated by the heat source 130 to the structural component 120.

[0069] It should also be understood that for many terminal devices (such as in-vehicle terminal devices), planar heat dissipation capability and Z-axis thermal conductivity are quite important. Figure 1 The insufficient heat dissipation capability of the heat dissipation solution shown in the figure will result in the inability to dissipate heat well inside the terminal device, leading to poor heat dissipation and ultimately affecting the performance and lifespan of the terminal device.

[0070] To address the aforementioned technical problems, this application provides a heat dissipation structure comprising a heat dissipation component and a first graphene film structure. The first graphene film structure is disposed on the first inner wall of the housing, and the heat dissipation component is located between the first inner wall of the housing and at least one heat-generating device. A vacant region is provided on the first graphene film structure, penetrating the structure along a first direction. The heat dissipation component is at least partially disposed within the vacant region. This allows the heat generated by the heat-generating device to be directly conducted to the housing through the heat dissipation component, improving the heat dissipation of the terminal device in the Z-axis direction. Simultaneously, the first graphene film structure can receive and disperse the heat emitted by the housing, achieving uniform heat distribution on the housing. Therefore, the heat dissipation structure provided by this application not only conducts the heat dissipated by the heat-generating device away but also achieves uniform heat distribution on the housing, meaning that the heat dissipation structure provided by this application simultaneously possesses planar heat distribution capability and Z-axis thermal conductivity capability.

[0071] This application also provides a terminal device, which includes the above-described heat dissipation structure, and further includes at least one heat-generating device and a housing as described above.

[0072] It is understood that the terminal device in the embodiments of this application may also include other parts required for the terminal device to perform its functions. Depending on the type of terminal device, the specific composition of other parts may vary, and this application will not limit or elaborate on this.

[0073] It should also be understood that the terminal device in this application can be any possible terminal device, and this application does not limit the specific type of terminal device.

[0074] For example, the terminal devices provided in the embodiments of this application can be vehicle-mounted terminal devices, laptop computers, desktop computers, tablet computers, point-of-sale (POS) terminals (such as POS machines, cash registers, etc.), ultra-mobile personal computers (UMPCs), personal digital assistants (PDAs), self-service terminals, industrial computers, smart TVs, point-of-sale (POS) machines, gaming devices, handheld computers (or portable computers), netbooks, wearable computing devices, walkie-talkies, netbooks, etc.

[0075] In some embodiments, the terminal device may be a non-handheld terminal device.

[0076] It should be understood that for handheld terminal devices (such as mobile phones, tablets, etc.), since users need to hold the terminal device to operate it, in order to avoid the terminal device casing overheating and affecting the user experience, it is generally more inclined to heat the heat dissipated from the terminal device to the casing evenly. However, for non-handheld terminal devices (such as vehicle terminal devices, laptops, desktop computers, etc.), since users do not need to hold the device to operate it, it is possible to first consider dissipating the heat from the inside of the terminal device, and then consider the even heating of the heat at the casing. Therefore, the terminal device in the embodiments of this application can be a non-handheld terminal device.

[0077] For example, the terminal device can be an in-vehicle terminal device.

[0078] For example, in-vehicle terminal equipment can be T-Box devices, smart in-vehicle terminals, in-vehicle communication modules, in-vehicle Wi-Fi devices, in-vehicle Bluetooth devices, etc.

[0079] It should be understood that the full English name of the T-box device is Telematics Box. The T-box device can also be called: vehicle T-BOX, remote information processor or vehicle networking terminal. This application embodiment does not limit or elaborate on this.

[0080] For ease of understanding, the heat dissipation structure in this application will be described exemplarily below with reference to the accompanying drawings.

[0081] See Figure 2 This is a cross-sectional schematic diagram of the heat dissipation structure in one embodiment of this application. Figure 3 for Figure 2 A top view of the first graphene film structure in the heat dissipation structure shown. Figure 4 This is a top view of the first graphene film structure in the heat dissipation structure of different embodiments of this application.

[0082] It should be noted that in the embodiments of this application, "graphene film" and "graphene thin film" have the same meaning, so the two expressions can be used interchangeably.

[0083] like Figure 2 As shown, the heat dissipation structure 200 includes a heat dissipation component 230 and a first graphene film structure 240. Both the heat dissipation component 230 and the first graphene film structure 240 are disposed in the housing 210. Figure 2 The Z-axis direction shown is the first direction, which is also the thickness direction of the first graphene film structure 240. In the first direction, the heat dissipation component 230 is located between at least one heat-generating device 220 and the first inner wall 211 of the housing 210. The inner surface of the housing 210 includes the first inner wall 211. The heat dissipation component 230 is used to conduct the heat emitted by at least one heat-generating device 220 to the housing 210.

[0084] like Figure 2 As shown, a first graphene film structure 240 is disposed on the first inner wall 211. A vacant region 241 is provided on the first graphene film structure 240. The vacant region 241 is disposed through the first graphene film structure 240 along the first direction. A heat dissipation component 230 is disposed in the vacant region 241. The first graphene film structure 240 is used to receive the heat emitted by the shell 210 and to disperse the received heat.

[0085] For example, the first graphene film structure 240 is an integral film, or the first graphene film structure 240 is formed by hollowing out a single graphene film; in this case, the first graphene film structure 240 includes a single graphene film, and the first graphene film structure 240 with a void region 241 can be obtained by hollowing out the entire graphene film.

[0086] For example, the first graphene film structure 240 may include multiple graphene films, and the vacant region 241 is formed by splicing the multiple graphene films; or the first graphene film structure 240 is formed by splicing multiple graphene films to form the vacant region 241; that is, the first graphene film structure 240 may be formed by splicing multiple graphene films, and the vacant region 241 is formed by splicing. The embodiments of this application do not limit or elaborate on the formation method of the vacant region 241.

[0087] It should be understood that the heat-generating device 220 can be any device that requires heat dissipation. In particular, the heat-generating device 220 can be some high-power or high-heat devices or chips, such as processors, power amplifiers, power supplies, etc. The specific type of the heat-generating device 220 is not limited in the embodiments of this application.

[0088] In some embodiments, at least one heating element 220 is fixedly disposed on a printed circuit board 250.

[0089] Understandable, Figure 2 The embodiment shown takes the heat dissipation structure 200 for dissipating heat from one heat-generating device 220 as an example. In other embodiments, the heat dissipation structure 200 can dissipate heat from two or more heat-generating devices 220. The embodiments of this application do not limit the number of heat-generating devices 220 corresponding to the heat dissipation structure 200.

[0090] Or rather, Figure 2 In the illustrated embodiment, the heat dissipation structure 200 corresponds to one heat-generating device 220. In other embodiments, the heat dissipation structure 200 may correspond to two or more heat-generating devices 220. The embodiments of this application do not limit the number of heat-generating devices 220 corresponding to the heat dissipation structure 200.

[0091] In some embodiments, when the heat dissipation structure 200 dissipates heat for multiple heat-generating devices 220, the heat dissipation component 230 corresponds to multiple heat-generating devices 220. In this case, the heat dissipation component 230 may include multiple heat sinks, each heat sink corresponding to one heat-generating device 220. Of course, one heat sink may also correspond to two or more heat-generating devices 220, which will not be elaborated in this application.

[0092] In some embodiments, when the heat dissipation structure 200 dissipates heat for multiple heat-generating devices 220, the vacant region 241 corresponds to multiple heat-generating devices 220. In this case, the vacant region 241 may include multiple sub-vacant regions, each sub-vacant region corresponding to one heat-generating device 220. Of course, one sub-vacant region may also correspond to two or more heat-generating devices 220, which will not be elaborated in this application.

[0093] For example, such as Figure 2 and Figure 3 The heat dissipation structure 200 shown dissipates heat from a heat-generating device 220. The vacant region 241 corresponding to the heat-generating device 220 is a through hole (or via) opened in the middle of the first graphene film structure 240. Figure 2 In the illustrated embodiment, the cross-sectional area of ​​the through hole in the first direction is greater than the cross-sectional area of ​​the heating device 220 in the first direction. In other embodiments, the cross-sectional area of ​​the through hole included in the vacant region 241 in the first direction may also be equal to or less than the cross-sectional area of ​​the heating device 220 in the first direction. This application does not limit or elaborate on this aspect.

[0094] For example, such as Figure 2 The heat dissipation structure 200 shown dissipates heat from a heat-generating device 220. The cross-sectional area of ​​the heat dissipation component 230 corresponding to the heat-generating device 220 in the first direction is equal to the cross-sectional area of ​​the heat-generating device 220 in the first direction. In other embodiments, the cross-sectional area of ​​the heat dissipation component 230 corresponding to the heat-generating device 220 in the first direction may also be greater than or less than the cross-sectional area of ​​the heat-generating device 220 in the first direction. This application does not limit or elaborate on this.

[0095] It is understandable that the position of the vacant region 241 on the first graphene film structure 240 corresponds to the position of the heating device 220, that is, the position of the vacant region 241 on the first graphene film structure 240 changes with the position of the heating device 220.

[0096] For example, in some embodiments, such as Figure 4As shown in Figure a, the void region 241 can also be a through-hole formed in the first graphene film structure 240. The through-hole refers to the void region formed along the edge of the first graphene film structure 240.

[0097] For example, such as Figure 3 As shown, the cross-sectional shape of the through hole forming the vacant region 241 is rectangular.

[0098] In some embodiments, such as Figure 4 As shown in Figure b, the cross-sectional shape of the through hole forming the vacant region 241 can also be elliptical. Of course, the cross-sectional shape of the through hole forming the vacant region 241 can also be circular, polygonal or other combined shapes. This application embodiment does not limit or elaborate on this.

[0099] In some other embodiments, the vacant region 241 corresponding to the heating device 220 may also be a plurality of through holes opened in the first graphene film structure 240, that is, a plurality of small through holes correspond to a heating device 220.

[0100] In some embodiments, such as Figure 4 As shown in Figure c, multiple through holes form a void region 241. The cross-sectional shape of the through holes is square. In other embodiments, the through holes may also be other shapes. This application does not limit or elaborate on this.

[0101] In some embodiments, the vacant region 241 may simultaneously include Figure 3 The through hole shown Figure 4 The through-hole shown in Figure a is a through-hole. Figure 4 The through hole shown in Figure b, and Figure 4 The present application does not limit or elaborate on at least two of the multiple through holes shown in Figure c.

[0102] It is understood that the first graphene film structure 240 is a thin film made of graphene material. The graphene material can be single-layer or multi-layer graphene. The graphene material can also be a heat dissipation material composed of graphene and polymer. The graphene material can also be a heat dissipation material obtained by combining graphene with metals (such as copper, aluminum, etc.). The specific types of graphene materials are not described or limited in the embodiments of this application.

[0103] In some embodiments, the first graphene film structure 240 includes a core and an edge, the edge covering the core to form a thin film structure, and the edge covering can ensure the stability of the core; wherein: the core can be a single layer of graphene or a multilayer of graphene.

[0104] For example, the edge material of the first graphene film structure 240 can be polyimide (PI), or other materials, which will not be elaborated in this application.

[0105] In some embodiments, the heat dissipation component 230 may include at least one of a thermal pad, thermal gel, metal component, thermoelectric cooler, and fan.

[0106] For example, a thermal pad refers to a filler uniformly distributed in a silicone rubber substrate to form an efficient heat conduction channel. The filler can be alumina, magnesium oxide, or boron nitride, etc. The thermal pad can fill the empty area 241 to form a heat dissipation component 230. The specific composition of the thermal pad is not limited or described in the embodiments of this application.

[0107] For example, the thermally conductive gel is a high-performance thermal interface material (TIM) existing in a gel state; in this embodiment, the thermally conductive gel can fill the vacant region 241 to form a heat dissipation component 230. This embodiment does not limit or elaborate on the specific composition of the thermally conductive gel.

[0108] For example, the metal part can be any possible metal material, and the metal part can be a block of metal material. The block of metal material can be set in the empty area 241 to form a heat dissipation component 230. The specific composition of the metal part is not limited or described in this application embodiment.

[0109] For example, a thermoelectric cooler (TEC) is a solid-state electronic device that achieves cooling and heating based on the thermoelectric effect (Peltier effect). The thermoelectric cooler is disposed in the vacant region 241 to form a heat dissipation component. The specific structure of the thermoelectric cooler is not limited or described in the embodiments of this application.

[0110] For example, the heat dissipation component 230 can also be formed by providing a fan in the empty area 241, which will not be described in detail in this embodiment.

[0111] In some embodiments, the heat dissipation component 230 is connected to the first inner wall 211. For example, the heat dissipation component 230 may be fixedly connected to the first inner wall 211, or the heat dissipation component 230 may be detachably connected to the first inner wall 211.

[0112] Of course, the heat dissipation component 230 can also be connected to the heat-generating device 220, or the heat dissipation component 230 can also be connected to the first graphene film structure 240. This application does not limit or elaborate on the specific fixing method of the heat dissipation component 230.

[0113] In some other embodiments, the heat dissipation component 230 is integrally formed with the housing 210, for example, the heat dissipation component 230 can be a boss on the housing 210.

[0114] For example, the heat dissipation component 230 can be formed by stamping the housing 220, which will not be elaborated or limited in the embodiments of this application.

[0115] In some embodiments, when the heat dissipation component 230 is integrally formed with the housing 210, the heat dissipation structure 200 may further include a gasket disposed between the heat dissipation component 230 and the heat-generating device 220. The gasket is used to prevent the heat dissipation component 230 from directly contacting the heat-generating device 220, thereby buffering the impact force of the heat dissipation component 230, which is part of the housing 210, on the heat-generating device 220.

[0116] For example, the pad can be a thermal pad or a thermal gel, and this application does not limit or elaborate on this.

[0117] In other embodiments, the heat dissipation structure 200 may further include a second graphene film structure, the second graphene film structure being disposed on such a surface. Figure 2 The first outer wall 212 of the housing 210 shown is included on the outer surface of the housing 210, and the first outer wall 212 corresponds to the first inner wall 211.

[0118] It is understood that there is no need to create empty regions on the second graphene film structure. The other components and properties of the second graphene film structure can be referred to the previous description of the first graphene film structure 240, and this application will not repeat them here.

[0119] In some embodiments, the heat dissipation components 230 are all disposed in the empty area 241.

[0120] For example, Figure 2 As shown, one end of the heat dissipation component 230 in the Z direction is located in the empty region 241, and the other end is located outside the empty region 241; or in other words, the thickness of the heat dissipation component 230 in the Z direction is greater than the thickness of the empty region 241 in the Z direction. This application defines this arrangement as a form in which the heat dissipation component 230 is entirely located in the empty region 241.

[0121] For example, the heat dissipation component 230 can also be completely located in the empty region 241 in the Z direction, or the thickness of the heat dissipation component 230 in the Z direction can be equal to or less than the thickness of the empty region 241 in the Z direction. This application also defines this arrangement as a form in which the heat dissipation component 230 is completely located in the empty region 241.

[0122] In some other embodiments, the heat dissipation component 230 is partially disposed in the vacant area 241. The following refers to... Figure 5 An example is provided.

[0123] See Figure 5 This is a cross-sectional schematic diagram of the heat dissipation structure in another embodiment of this application. Figure 5 As shown, the heat dissipation structure 200 includes a heat dissipation component 230' and a first graphene film structure 240. Both the heat dissipation component 230' and the first graphene film structure 240 are disposed within the housing 210. Figure 5 The Z-axis direction shown is the first direction, which is also the thickness direction of the first graphene film structure 240. In the first direction, the heat dissipation component 230' is located between at least one heat-generating device 220 and the first inner wall 211 of the housing 210. The inner surface of the housing 210 includes the first inner wall 211. The heat dissipation component 230' is used to conduct the heat emitted by at least one heat-generating device 220 to the housing 210.

[0124] like Figure 5 As shown, a first graphene film structure 240 is disposed on the first inner wall 211. A vacant region 241 is provided on the first graphene film structure 240. The vacant region 241 is disposed through the first graphene film structure 240 along the first direction. A heat dissipation component 230' is disposed in the vacant region 241. The first graphene film structure 240 is used to receive the heat emitted by the shell 210 and to disperse the received heat.

[0125] Figure 5 The heat dissipation structure shown is similar to Figure 2 The heat dissipation structures shown are basically the same, the difference being... Figure 5 The heat dissipation component 230' shown is... Figure 2 The specific structure of the heat dissipation component 230 shown is different; the following mainly focuses on... Figure 5 The heat dissipation component 230' shown is described in detail. Other parts not mentioned can be referred to. Figure 2 The relevant description.

[0126] like Figure 5 As shown, the end of the heat dissipation component 230' furthest from the heat-generating device 220 in the Z direction is disposed in the vacant region 241, while the end of the heat dissipation component 230' closest to the heat-generating device 220 in the Z direction surrounds the heat-generating device 220; or, in other words, the end of the heat dissipation component 230' furthest from the heat-generating device 220 in the Z direction is disposed in the vacant region 241, the end of the heat dissipation component 230' closest to the heat-generating device 220 in the Z direction forms a groove surrounding the heat-generating device, and the end of the heat-generating device 220 closest to the heat dissipation component 230' in the Z direction is disposed in the groove. Figure 5As shown, in this embodiment, the heat dissipation component 230' has no contact with the first graphene film structure 240. In other embodiments, the portion of the heat dissipation component 230' outside the vacant region 241 may be in contact with the first graphene film structure 240; this application does not limit or elaborate on this aspect. It should be understood that... Figure 2 and Figure 5 This illustration only shows a portion of the structure of a terminal device that includes the heat dissipation structure 200 described in this application, or in other words, the terminal device includes the aforementioned heat dissipation structure 200. For ease of understanding, the terminal device in the embodiments of this application will be described exemplarily below with reference to the accompanying drawings.

[0127] The following description uses a T-box device as an example to illustrate the terminal device used in this application.

[0128] See Figure 6 This is a three-dimensional structural diagram of a terminal device according to an embodiment of this application. Figure 7 for Figure 6 The right view of the terminal device shown. Figure 8 for Figure 7 Cross-sectional view at point AA Figure 9 for Figure 6 An exploded view of the terminal device shown.

[0129] like Figures 6 to 9 As shown, the terminal device 300 includes a housing 310, a heat-generating device 320, a heat dissipation component 330, and a first graphene film structure 340, wherein the heat-generating device 320, the heat dissipation component 330, and the first graphene film structure 340 are all disposed in the housing 310. Figure 7 and Figure 8 The Z-axis direction shown is the first direction, which is also the thickness direction of the first graphene film structure 340. In the first direction, the heat dissipation component 330 is located between the heat-generating device 320 and the first inner wall 311 of the housing 310. The inner surface of the housing 310 includes the first inner wall 311. The heat dissipation component 330 is used to conduct the heat dissipated by the heat-generating device 320 to the housing 310.

[0130] like Figure 8 and Figure 9 As shown, a first graphene film structure 340 is disposed on the first inner wall 311. A vacant region 341 is provided on the first graphene film structure 340. The vacant region 341 is disposed through the first graphene film structure 340 along the first direction. A heat dissipation component 330 is disposed in the vacant region 341. The first graphene film structure 340 is used to receive the heat emitted by the shell 310 and to disperse the received heat. In other words, the first graphene film structure 340 is used to receive the heat emitted by the shell 310 and to make the received heat evenly dispersed in the first graphene film structure 340, thereby achieving the effect of uniform heat dissipation of the shell 310.

[0131] exist Figures 6 to 9 In the illustrated embodiment, only one heating element 320 of the terminal device 300 is shown. In other embodiments, the terminal device 300 may include two or more heating elements 320. The number of heating elements 320 is not limited in the embodiments of this application.

[0132] It should also be understood that the heat-generating device 320 can be any device in the terminal device 300 that requires heat dissipation. In particular, the heat-generating device 320 can be some high-power or high-heat devices or chips, such as processors, power amplifiers, power supplies, etc. The specific type of the heat-generating device 320 is not limited in the embodiments of this application.

[0133] Understandably, the specific description of the heating element 320 can be found in the previous description of the heating element 220, and will not be repeated here.

[0134] like Figures 6 to 9 As shown, the terminal device 300 also includes a printed circuit board 350, wherein the heating device 320 is disposed on the printed circuit board 350, or in other words, the heating device 320 is a device on the printed circuit board 350.

[0135] Understandably, many other components can be placed on printed circuit board 350, but for the sake of simplicity in the diagram... Figure 8 and Figure 9 Only a portion of the components are shown.

[0136] For example, Figures 6 to 9 The diagram illustrates a non-heat-generating device 351. The non-heat-generating device 351 can be a low-power or low-heat-generating device or chip. For example, the non-heat-generating device 351 can be a signal interface, audio device, etc. This application does not limit or elaborate on this.

[0137] For example, such as Figures 6 to 9 As shown, the printed circuit board 350 is also provided with a first interface 352, a second interface 353 and a third interface 354. The first interface 352 and the second interface 353 can be used for radio frequency communication, and the third interface 354 can be used for communication between the terminal device and the gateway or OBD (On-Board Diagnostics). Of course, other interfaces can also be connected to the printed circuit board 350, which are not limited or described in this application.

[0138] exist Figures 6 to 9 In the illustrated embodiment, only one heating element 320 of the terminal device 300 is shown. The vacant region 341 corresponding to the heating element 320 is a through hole (or via) formed in the middle of the first graphene film structure 340. Figures 6 to 9 In the embodiment shown, the cross-sectional area of ​​the through hole in the first direction is equal to the cross-sectional area of ​​the heating device 320 in the first direction.

[0139] For example, in Figures 6 to 9 In the embodiment shown, the heat dissipation component 330 corresponds to the heat-generating device 320, and the heat dissipation component 330 is located in the empty area 341; the heat dissipation component 330 is schematically represented as a rectangular block.

[0140] It should be understood that Figures 6 to 9 In the illustrated embodiment, the heat dissipation components 330 are all disposed in the empty area 341. The relationship between the heat dissipation components 330 and the empty area 341 can be referred to the previous description of the relationship between the heat dissipation components 230 and the empty area 241, and will not be repeated here.

[0141] It is understood that the heat dissipation component 330 may include at least one of a thermal pad, thermal gel, metal component, thermoelectric cooler, and fan. For a detailed description of the heat dissipation component 330, please refer to the preceding description of the heat dissipation component 230; it will not be repeated here.

[0142] For ease of understanding, the first graphene film structure 340 is illustrated below with reference to the figure.

[0143] Figure 10 for Figure 9 The right view of the first graphene film structure in the terminal device shown. Figure 11 for Figure 10 Cross-sectional view at BB. (See diagram below.) Figure 10 and Figure 11 As shown, a void region 341 is formed on the first graphene film structure 340; the first graphene film structure 340 includes a core 342 and a rim 343, wherein the core 342 is surrounded by the rim 343, or in other words, the core 342 is covered by the rim 343.

[0144] It is understood that the core 342 is made of graphene material, which can be single-layer or multi-layer graphene. Graphene material can also be a heat dissipation material composed of graphene and polymer, or a heat dissipation material obtained by combining graphene with metals (such as copper, aluminum, etc.). The edge 343 can be made of polyimide (PI), or other materials. This application embodiment does not elaborate on or limit the specific material types of the core 342 and the edge 343.

[0145] It should also be understood that the specific description of the first graphene film structure 340 can be found in the previous description of the first graphene film structure 240, and will not be repeated here.

[0146] To facilitate understanding, the following explanation is provided in conjunction with the accompanying diagram. Figures 6 to 9 The casing of the terminal device shown is illustrated by way of example.

[0147] like Figures 6 to 9 As shown, in this embodiment, housing 310 includes upper housing 313 and lower housing 314. Figure 12 for Figure 9 The diagram shows a three-dimensional structural schematic of the upper casing of the terminal device.

[0148] For example, the upper housing 313 and the lower housing 314 can be detachably connected, which makes it convenient for users to disassemble and assemble the terminal device.

[0149] For example, such as Figure 8 As shown, the first inner wall 311 is the inner wall of the upper shell 313, and the first graphene film structure 340 is attached to the first inner wall 311. For example, the first graphene film structure 340 can be attached to the first inner wall 311 by an adhesive, or the first graphene film structure 340 can be attached to the first inner wall 311 by other means. This application embodiment does not limit or elaborate on this.

[0150] It should be understood that any existing and applicable adhesive can be used, and the specific types of adhesives described in this application are not limited or elaborated.

[0151] like Figure 12 As shown, the upper housing 313 also includes four support members 315, which are located at the four corners of the upper housing 313. The four support members 315 are used to support the printed circuit board 350, or in other words, the printed circuit board 350 is disposed on the four support members 315. For example, the printed circuit board 350 can be snapped onto the four support members 315, or the printed circuit board 350 can be fixedly connected to the four support members 315, or it can be detachably connected to the four support members 315; of course, the printed circuit board 350 can also be fixed inside the housing 310 in other ways, which are not limited or described in this application.

[0152] Figure 13 This is a right view of a terminal device according to another embodiment of this application. Figure 14 for Figure 13 Cross-sectional view at CC Figure 15 for Figure 13 The diagram shows a three-dimensional structure of the upper housing in the terminal device. Figure 16 for Figure 13 An exploded view of the terminal device shown.

[0153] Understandable, Figures 13 to 16 The three-dimensional structural diagram of the terminal device in the illustrated embodiment can be referenced. Figure 6 This will not be repeated or elaborated upon here.

[0154] like Figures 13 to 16 As shown, the terminal device 400 includes a housing 410, a heat-generating device 420, a heat dissipation component 430, and a first graphene film structure 440, wherein the heat-generating device 420, the heat dissipation component 430, and the first graphene film structure 440 are all disposed in the housing 410. Figure 13 and Figure 14 The Z-axis direction shown is the first direction, which is also the thickness direction of the first graphene film structure 440. In the first direction, the heat dissipation component 430 is located between the heat-generating device 420 and the first inner wall 411 of the housing 410. The inner surface of the housing 410 includes the first inner wall 411. The heat dissipation component 430 is used to conduct the heat dissipated by the heat-generating device 420 to the housing 410.

[0155] It should be understood that, Figures 13 to 16 In the embodiment shown, the heat dissipation component 430 is integrally formed with the housing 410.

[0156] For example, the heat dissipation component 430 is a boss formed on the housing 410, which can be formed by stamping the housing 410.

[0157] like Figures 13 to 16 As shown, in this embodiment, housing 410 includes upper housing 413 and lower housing 414.

[0158] For example, the upper housing 413 and the lower housing 414 can be detachably connected, which makes it convenient for users to disassemble and assemble the terminal device.

[0159] It should be understood that, Figures 13 to 16 In the embodiment shown, the housing 410 includes an upper housing 413 and a lower housing 414. The heat dissipation assembly 430 is formed on the upper housing 413. Therefore, the upper housing 413 can be stamped to form the heat dissipation assembly 430.

[0160] It should also be understood that since the heat dissipation component 430 is integrally formed with the upper housing 413, the material of the heat dissipation component 430 can be the same as that of the upper housing 413. For example, both the heat dissipation component 430 and the upper housing 413 can be made of metal. For a detailed description of the heat dissipation component 430, please refer to the previous description of the heat dissipation component 230, which will not be repeated here.

[0161] For example, Figures 13 to 16 The terminal device shown also includes a gasket 460, which is disposed between the heat dissipation assembly 430 and the heat-generating device 420. The gasket 460 is used to prevent the heat dissipation assembly 430 from directly contacting the heat-generating device 420, thereby buffering the impact force of the heat dissipation assembly 430, which is integrally formed with the housing, on the heat-generating device 420.

[0162] For example, the pad 460 may be a thermal pad or a thermal gel, and this application does not limit or elaborate on this.

[0163] like Figure 15 As shown, the upper housing 413 also includes four support members 415, which are located at the four corners of the upper housing 413. The four support members 415 are used to support the printed circuit board 450, or in other words, the printed circuit board 450 is disposed on the four support members 415. For example, the printed circuit board 450 can be snapped onto the four support members 415, or the printed circuit board 450 can be fixedly connected to the four support members 415, or it can be detachably connected to the four support members 415; of course, the printed circuit board 450 can also be fixed inside the housing 410 in other ways, which are not limited or described in this application.

[0164] like Figure 14 and Figure 16 As shown, a first graphene film structure 440 is disposed on the first inner wall 411. A vacant region 441 is provided on the first graphene film structure 440. The vacant region 441 is disposed through the first graphene film structure 440 in the first direction. A heat dissipation component 430 is disposed in the vacant region 441. The first graphene film structure 440 is used to receive the heat emitted by the shell 410 and to disperse the received heat. In other words, the first graphene film structure 440 is used to receive the heat emitted by the shell 410 and to make the received heat evenly dispersed in the first graphene film structure 440, thereby achieving the effect of uniform heat dissipation of the shell 410.

[0165] For example, in Figures 13 to 16 In the illustrated embodiment, the heat dissipation component 430 corresponds to the heat-generating device 420; in Figure 13 and Figure 14 The heat dissipation component 430 is located in the empty area 441.

[0166] It should be understood that Figure 13 and Figure 14 In this configuration, all heat dissipation components 430 are located in the empty area 441. The relationship between heat dissipation components 430 and empty area 441 can be referred to the previous description of the relationship between heat dissipation components 230 and empty area 241, and will not be repeated here.

[0167] like Figure 14 As shown, the first inner wall 411 is the inner wall of the upper shell 413, and the first graphene film structure 440 is attached to the first inner wall 411. For example, the first graphene film structure 440 can be attached to the first inner wall 411 by an adhesive, or the first graphene film structure 440 can be attached to the first inner wall 411 by other means. This application embodiment does not limit or elaborate on this.

[0168] It should be understood that any existing and applicable adhesive can be used, and the specific types of adhesives described in this application are not limited or elaborated.

[0169] exist Figures 13 to 16 In the illustrated embodiment, only one heating element 420 of the terminal device 400 is shown. In other embodiments, the terminal device 400 may include two or more heating elements 420. The number of heating elements 420 is not limited in the embodiments of this application.

[0170] It should also be understood that the heat-generating device 420 can be any device in the terminal device 400 that requires heat dissipation. In particular, the heat-generating device 420 can be some high-power or high-heat devices or chips, such as processors, power amplifiers, power supplies, etc. The specific type of the heat-generating device 420 is not limited in the embodiments of this application.

[0171] Understandably, the specific description of the heating element 420 can be found in the previous description of the heating element 220, and will not be repeated here.

[0172] like Figures 13 to 16 As shown, the terminal device 400 also includes a printed circuit board 450, wherein the heating device 420 is disposed on the printed circuit board 450, or in other words, the heating device 420 is a device on the printed circuit board 450.

[0173] Understandably, many other components can be placed on the printed circuit board 450, but for the sake of simplicity in the diagram... Figure 14 and Figure 16 Only a portion of the components are shown.

[0174] For example, Figures 13 to 16 The diagram illustrates a non-heat-generating device 451. The non-heat-generating device 451 can be a low-power or low-heat-generating device or chip. For example, the non-heat-generating device 451 can be a signal interface, audio device, etc. This application does not limit or elaborate on this.

[0175] For example, such as Figures 13 to 16 As shown, the printed circuit board 450 is also provided with a first interface 452, a second interface 453 and a third interface 454. The first interface 452 and the second interface 453 can be used for radio frequency communication, and the third interface 454 can be used for communication between the terminal device and the gateway or OBD (On-Board Diagnostics). Of course, other interfaces can also be connected to the printed circuit board 450, which are not limited or described in this application.

[0176] exist Figures 13 to 16In the illustrated embodiment, only one heating element 420 of the terminal device 400 is shown. The vacant region 441 corresponding to the heating element 420 is a through hole (or via) formed in the middle of the first graphene film structure 440. Figures 13 to 16 In the embodiment shown, the cross-sectional area of ​​the through hole in the first direction is equal to the cross-sectional area of ​​the heating device 420 in the first direction.

[0177] For example, in Figures 13 to 16 In the illustrated embodiment, the heat dissipation component 430 corresponds to the heat-generating device 420, and the heat dissipation component 430 is located in the vacant region 441. Accordingly, the position of the heat dissipation component 430 on the upper housing 413 can be determined based on the specific position of the heat-generating device 420 in the housing 410; furthermore, the position of the vacant region 441 on the first graphene film structure 440 can also be determined based on the specific position of the heat-generating device 420 in the housing 410.

[0178] It is understandable that the specific structure of the first graphene film structure 440 is similar to... Figure 10 and Figure 11 The structure of the first graphene film structure 340 shown is basically the same. Therefore, the specific description of the first graphene film structure 440 can be referred to the previous content about the first graphene film structure 340, and will not be repeated here.

[0179] See Figure 17 This is a three-dimensional structural diagram of the terminal device in another embodiment of this application. Figure 18 for Figure 17 The right view of the terminal device shown. Figure 19 for Figure 18 Cross-sectional view at DD Figure 20 for Figure 17 An exploded view of the terminal device shown.

[0180] like Figures 17 to 20 As shown, the terminal device 500 includes a housing 510, a heat-generating device 520, a heat dissipation component 530, and a first graphene film structure 540, wherein the heat-generating device 520, the heat dissipation component 530, and the first graphene film structure 540 are all disposed in the housing 510. Figure 18 and Figure 19 The Z-axis direction shown is the first direction, which is also the thickness direction of the first graphene film structure 540. In the first direction, the heat dissipation component 530 is located between the heat-generating device 520 and the first inner wall 511 of the housing 510. The inner surface of the housing 510 includes the first inner wall 511. The heat dissipation component 530 is used to conduct the heat dissipated by the heat-generating device 520 to the housing 510.

[0181] like Figure 19 and Figure 20As shown, a first graphene film structure 540 is disposed on the first inner wall 511. A vacant region 541 is provided on the first graphene film structure 540. The vacant region 541 is disposed through the first graphene film structure 540 in the first direction. A heat dissipation component 530 is disposed in the vacant region 541. The first graphene film structure 540 is used to receive the heat emitted by the shell 510 and to disperse the received heat. In other words, the first graphene film structure 540 is used to receive the heat emitted by the shell 510 and to make the received heat evenly dispersed in the first graphene film structure 540, thereby achieving the effect of uniform heat dissipation for the shell 510.

[0182] For example, in Figures 17 to 20 In the illustrated embodiment, the heat dissipation component 530 corresponds to the heat-generating device 520. Figures 17 to 19 The heat dissipation component 530 is located in the empty area 541.

[0183] It should be understood that Figures 17 to 19 In this configuration, all heat dissipation components 530 are located in the empty area 541. The relationship between heat dissipation components 530 and empty area 541 can be referred to the previous description of the relationship between heat dissipation components 230 and empty area 241, and will not be repeated here.

[0184] It should be understood that, Figures 17 to 20 In the illustrated embodiment, the terminal device 500 further includes a second graphene film structure 560, which is disposed on such a surface. Figure 19 and Figure 20 The first outer wall 512 of the housing 510 shown is included on the outer surface of the housing 510, wherein the first outer wall 512 corresponds to the first inner wall 511.

[0185] like Figure 20 As shown, no gaps are formed in the second graphene film structure 560, meaning the second graphene film structure 560 covers the first outer wall 512 of the shell 510. The second graphene film structure 560 can uniformly distribute the received heat, thereby achieving a heat equalization effect on the shell 510; that is, in Figures 17 to 20 In the illustrated embodiment, the second graphene film structure 560 and the first graphene film structure 540 are used together to perform heat equalization on the shell 510.

[0186] It is understood that the other components and properties of the second graphene film structure 560 can be referred to the previous description of the first graphene film structure 240, and will not be repeated here.

[0187] It should be understood that, Figures 17 to 20 In the illustrated embodiment, the terminal device 500 may further include a protective layer 570, which is disposed on the first outer wall 512; as shown Figure 19As shown, the protective layer 570 covers the second graphene film structure 560, thus protecting the second graphene film structure 560, reducing wear during use, and extending the service life of the second graphene film structure 560.

[0188] Figure 21 for Figures 17 to 20 The illustrated embodiment presents a three-dimensional structural diagram of the protective layer in the terminal device, as shown below. Figure 21 As shown, a recessed area 571 is provided on the protective layer 570. The recessed area 571 is located on the side of the protective layer 570 that is in contact with the first outer wall 512. The recessed area 571 is used to accommodate the second graphene film structure 560.

[0189] exist Figures 17 to 20 In the illustrated embodiment, only one heating element 520 of the terminal device 500 is shown. In other embodiments, the terminal device 500 may include two or more heating elements 520. The number of heating elements 520 is not limited in the embodiments of this application.

[0190] It should also be understood that the heat-generating device 520 can be any device in the terminal device 500 that requires heat dissipation. In particular, the heat-generating device 520 can be some high-power or high-heat devices or chips, such as processors, power amplifiers, power supplies, etc. The specific type of the heat-generating device 520 is not limited in the embodiments of this application.

[0191] Understandably, the specific description of the heating element 520 can be found in the previous description of the heating element 220, and will not be repeated here.

[0192] like Figures 17 to 20 As shown, the terminal device 500 also includes a printed circuit board 550, wherein the heating device 520 is disposed on the printed circuit board 550, or in other words, the heating device 520 is a device on the printed circuit board 550.

[0193] Understandably, many other components can be placed on the printed circuit board 550, but for the sake of simplicity in the diagram... Figure 19 and Figure 20 Only a portion of the components are shown.

[0194] For example, Figures 17 to 20 The diagram illustrates a non-heat-generating device 551. The non-heat-generating device 551 can be a low-power or low-heat-generating device or chip. For example, the non-heat-generating device 551 can be a signal interface, audio device, etc. This application does not limit or elaborate on this.

[0195] For example, such as Figures 17 to 20As shown, the printed circuit board 550 is also provided with a first interface 552, a second interface 553 and a third interface 554. The first interface 552 and the second interface 553 can be used for radio frequency communication, and the third interface 554 can be used for communication between the terminal device and the gateway or OBD (On-Board Diagnostics). Of course, other interfaces can also be connected to the printed circuit board 550, which are not limited or described in this application.

[0196] exist Figures 17 to 20 In the illustrated embodiment, only one heating element 520 of the terminal device 500 is shown. The vacant area 541 corresponding to the heating element 520 is a through hole (or via) formed in the middle of the first graphene film structure 540. Figures 17 to 20 In the embodiment shown, the cross-sectional area of ​​the through hole in the first direction is equal to the cross-sectional area of ​​the heating device 520 in the first direction.

[0197] For example, in Figures 17 to 20 In the illustrated embodiment, the heat dissipation component 530 corresponds to the heat-generating device 520, and the heat dissipation component 530 is located in the vacant region 541. Accordingly, the position of the heat dissipation component 530 on the upper housing 513 can be determined according to the specific position of the heat-generating device 520 in the housing 510. Furthermore, the position of the vacant region 541 on the first graphene film structure 540 can also be determined according to the specific position of the heat-generating device 520 in the housing 510.

[0198] It is understood that the heat dissipation component 530 is schematically represented as a rectangular block. It is also understood that the heat dissipation component 530 may include at least one of a thermal pad, thermal gel, metal component, thermoelectric cooler, and fan. A detailed description of the heat dissipation component 530 can be found in the preceding description of the heat dissipation component 230, and will not be repeated here.

[0199] It should also be understood that the specific structure of the first graphene film structure 540 is related to... Figure 10 and Figure 11 The structure of the first graphene film structure 340 shown is basically the same. Therefore, the specific description of the first graphene film structure 540 can be referred to the previous content about the first graphene film structure 340, and will not be repeated here.

[0200] To facilitate understanding, the following explanation is provided in conjunction with the accompanying diagram. Figures 17 to 20 The casing of the terminal device shown is illustrated by way of example.

[0201] like Figures 17 to 20 As shown, in this embodiment, housing 510 includes upper housing 513 and lower housing 514. Figure 20 The three-dimensional structure of the upper housing 513 in the terminal device shown can be referred to Figure 12 And related descriptions, which will not be elaborated here.

[0202] For example, the upper housing 513 and the lower housing 514 can be detachably connected, which makes it convenient for users to disassemble and assemble the terminal device.

[0203] For example, such as Figure 19 As shown, the first inner wall 511 is the inner wall of the upper shell 513, and the first graphene film structure 540 is attached to the first inner wall 511. For example, the first graphene film structure 540 can be attached to the first inner wall 511 by an adhesive, or the first graphene film structure 540 can be attached to the first inner wall 511 by other means. This application embodiment does not limit or elaborate on this.

[0204] It should be understood that any existing and applicable adhesive can be used, and the specific types of adhesives described in this application are not limited or elaborated.

[0205] Understandably, the upper housing 513 also includes four support members 515. Figure 19 (Only two are shown in the diagram). Support members 515 are located at the four corners of the upper housing 513. The four support members 515 are used to support the printed circuit board 550, or in other words, the printed circuit board 550 is disposed on the four support members 515. For example, the printed circuit board 550 can be snapped onto the four support members 515, or the printed circuit board 550 can be fixedly connected to the four support members 515, or it can be detachably connected to the four support members 515; of course, the printed circuit board 550 can also be fixed inside the housing 510 in other ways, which are not limited or described in this application.

[0206] Figure 22 This is a right view of a terminal device according to another embodiment of this application. Figure 23 for Figure 22 Cross-sectional view at EE, Figure 24 for Figure 22 An exploded view of the terminal device shown.

[0207] Understandable, Figures 22 to 24 The three-dimensional structural diagram of the terminal device in the illustrated embodiment can be referenced. Figure 17 This will not be repeated or elaborated upon here.

[0208] like Figures 22 to 24 As shown, the terminal device 600 includes a housing 610, a heating element 620, a heat dissipation component 630, and a second graphene film structure 660. The heating element 620 and the heat dissipation component 630 are both disposed in the housing 610, while the second graphene film structure 660 is disposed outside the housing 610. Figure 22 and Figure 23The Z-axis direction shown is the first direction, which is also the thickness direction of the second graphene film structure 660. In the first direction, the heat dissipation component 630 is located between the heat-generating device 620 and the first inner wall 611 of the housing 610. The inner surface of the housing 610 includes the first inner wall 611. The heat dissipation component 630 is used to conduct the heat dissipated by the heat-generating device 620 to the housing 610.

[0209] like Figure 23 As shown, the second graphene film structure 660 is disposed on the first outer wall 611, wherein the outer surface of the shell 610 includes the first outer wall 612, which corresponds to the first inner wall 611; the second graphene film structure 660 is used to receive the heat emitted by the shell 610 and disperse the received heat, or in other words, the second graphene film structure 660 is used to receive the heat emitted by the shell 610 and make the received heat uniformly dispersed in the second graphene film structure 660, thereby achieving the effect of uniform heat distribution on the shell 610.

[0210] like Figure 23 and Figure 24 As shown, no gaps are formed in the second graphene film structure 660, meaning the second graphene film structure 660 covers the first outer wall 612 of the shell 610. The second graphene film structure 660 can uniformly distribute the received heat, thereby achieving a heat equalization effect on the shell 610; that is, in Figures 22 to 24 In the embodiment shown, the second graphene film structure 660 is used to heat the shell 610.

[0211] It should be understood that Figures 22 to 24 In the illustrated embodiment, the terminal device 600 only uses the second graphene film structure 660 to heat the housing 610, while Figures 17 to 21 In the illustrated embodiment, the terminal device 500 uses a first graphene film structure 540 and a second graphene film structure 560 to heat the housing 510; or, in other words, Figures 22 to 24 The illustrated embodiments are relative to Figures 17 to 21 In the embodiment shown, the first graphene film structure is reduced, while the other parts are basically the same.

[0212] It is understood that the other components and properties of the second graphene film structure 660 can be referred to the description of the first graphene film structure 240 above, and will not be repeated here.

[0213] It should be understood that, Figures 22 to 24 In the illustrated embodiment, the terminal device 600 may further include a protective layer 670, which is disposed on the first outer wall 612; as shown Figure 23As shown, the protective layer 670 covers the second graphene film structure 660, thus protecting the second graphene film structure 660, reducing wear during use, and extending the service life of the second graphene film structure 660.

[0214] Understandable, Figures 22 to 24 The protective layer 670 in the terminal device shown is... Figures 17 to 20 The protective layer 570 in the terminal device shown is basically the same, therefore, for a detailed introduction to the protective layer 670, please refer to [link / reference needed]. Figure 21 The previous introduction to protective layer 570 will not be repeated here.

[0215] exist Figures 22 to 24 In the illustrated embodiment, only one heating element 620 of the terminal device 600 is shown. In other embodiments, the terminal device 600 may include two or more heating elements 620. The number of heating elements 620 is not limited in the embodiments of this application.

[0216] It should also be understood that the heat-generating device 620 can be any device in the terminal device 600 that requires heat dissipation. In particular, the heat-generating device 620 can be some high-power or high-heat devices or chips, such as processors, power amplifiers, power supplies, etc. The specific type of the heat-generating device 620 is not limited in the embodiments of this application.

[0217] Understandably, the specific description of the heating element 620 can be found in the previous description of the heating element 220, and will not be repeated here.

[0218] like Figures 22 to 24 As shown, the terminal device 600 also includes a printed circuit board 650, wherein the heating device 620 is disposed on the printed circuit board 650, or in other words, the heating device 620 is a device on the printed circuit board 650.

[0219] Understandably, many other components can be placed on the printed circuit board 650, but for the sake of simplicity in the diagram... Figure 19 and Figure 20 Only a portion of the components are shown.

[0220] For example, Figures 22 to 24 The diagram illustrates a non-heat-generating device 651. The non-heat-generating device 651 can be a low-power or low-heat-generating device or chip. For example, the non-heat-generating device 651 can be a signal interface, audio device, etc. This application does not limit or elaborate on this.

[0221] For example, such as Figures 22 to 24As shown, the printed circuit board 650 is also provided with a first interface 652, a second interface 653 and a third interface 654. The first interface 652 and the second interface 653 can be used for radio frequency communication, and the third interface 654 can be used for communication between the terminal device and the gateway or OBD (On-Board Diagnostics). Of course, other interfaces can also be connected to the printed circuit board 650, which are not limited or described in this application.

[0222] For example, in Figures 22 to 24 In the illustrated embodiment, the heat dissipation component 630 corresponds to the heat-generating device 620, and the heat dissipation component 630 is schematically represented as a rectangular block. It is understood that the heat dissipation component 630 may include at least one of a thermal pad, thermal gel, metal component, thermoelectric cooler, and fan. A detailed description of the heat dissipation component 630 can be found in the preceding description of the heat dissipation component 230, and will not be repeated here.

[0223] To facilitate understanding, the following explanation is provided in conjunction with the accompanying diagram. Figures 22 to 24 The casing of the terminal device shown is illustrated by way of example.

[0224] like Figures 22 to 24 As shown, in this embodiment, housing 610 includes upper housing 613 and lower housing 614. Figures 22 to 24 The three-dimensional structure of the upper housing 613 in the terminal device shown can be referred to Figure 12 And related descriptions, which will not be elaborated here.

[0225] For example, the upper housing 613 and the lower housing 614 can be detachably connected, which makes it convenient for users to disassemble and assemble the terminal device.

[0226] For example, such as Figure 23 As shown, the first inner wall 611 is the inner wall of the upper shell 613, and the second graphene film structure 660 is attached to the first inner wall 611. For example, the second graphene film structure 660 can be attached to the first inner wall 611 by an adhesive, or the second graphene film structure 660 can be attached to the first inner wall 611 by other means. This application embodiment does not limit or elaborate on this.

[0227] It should be understood that any existing and applicable adhesive can be used, and the specific types of adhesives described in this application are not limited or elaborated.

[0228] Understandably, the upper housing 613 also includes four support members 615. Figure 23(Only two are shown in the diagram). Support members 615 are located at the four corners of the upper housing 613. The four support members 615 are used to support the printed circuit board 650, or in other words, the printed circuit board 650 is disposed on the four support members 615. For example, the printed circuit board 650 can be snapped onto the four support members 615, or the printed circuit board 650 can be fixedly connected to the four support members 615, or it can be detachably connected to the four support members 615; of course, the printed circuit board 650 can also be fixed inside the housing 610 in other ways, which are not limited or described in this application.

[0229] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A heat dissipation structure, characterized in that, The heat dissipation structure includes: A heat dissipation assembly, located in a first direction between at least one heat-generating device and a first inner wall of a housing, the inner surface of the housing including the first inner wall, the heat dissipation assembly being used to conduct heat dissipated by the at least one heat-generating device to the housing; and A first graphene film structure is disposed on the first inner wall. The first graphene film structure has a vacant area. The vacant area is disposed through the first graphene film structure along the first direction. The heat dissipation component is at least partially disposed in the vacant area. The first direction is the thickness direction of the first graphene film structure. The first graphene film structure is used to receive the heat emitted by the shell and disperse the received heat.

2. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation component includes at least one of the following: a thermal pad, a thermal gel, a metal component, a semiconductor cooler, and a fan.

3. The heat dissipation structure according to claim 1 or 2, characterized in that, All of the heat dissipation components are located in the empty area.

4. The heat dissipation structure according to any one of claims 1 to 3, characterized in that, The heat dissipation component is connected to the first inner wall.

5. The heat dissipation structure according to any one of claims 1 to 3, characterized in that, The heat dissipation component is integrally formed with the housing.

6. The heat dissipation structure according to claim 5, characterized in that, The heat dissipation structure further includes a pad, which is disposed between the at least one heat-generating device and the heat dissipation component.

7. The heat dissipation structure according to any one of claims 1 to 6, characterized in that, The at least one heating device includes a first heating device, and the vacant area includes a first sub-vacant area, which corresponds to the first heating device. The first sub-vacant area includes a through hole or a through notch.

8. The heat dissipation structure according to any one of claims 1 to 7, characterized in that, The at least one heating device includes a second heating device, the vacant area includes a second sub-vacant area, the second sub-vacant area corresponds to the second heating device, and the second sub-vacant area includes a plurality of through holes.

9. The heat dissipation structure according to any one of claims 1 to 8, characterized in that, The heat dissipation structure further includes a second graphene film structure, which is disposed on the first outer wall of the housing. The outer surface of the housing includes the first outer wall, and the first outer wall corresponds to the first inner wall.

10. The heat dissipation structure according to any one of claims 1 to 9, characterized in that, The first graphene film structure is a single-piece film, or the first graphene film structure is formed by splicing multiple graphene films to form the vacant area.

11. A terminal device, characterized in that, The terminal device includes a heat dissipation structure according to any one of claims 1 to 10, and the terminal device further includes the at least one heat-generating device and the housing, wherein the heat dissipation structure and the at least one heat-generating device are located within the housing.

12. The terminal device according to claim 11, characterized in that, The terminal device is a vehicle-mounted terminal device.

13. The terminal device according to claim 11 or 12, characterized in that, The terminal device also includes a printed circuit board, and the at least one heating device is fixed on the printed circuit board, which is located inside the housing.

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