Electrical connection structure and electronic device

Abstract

The application provides an electric connection structure and an electronic device. The electric connection structure comprises a heat sink, a circuit board, an electronic component group and a heat equalizing piece. The circuit board is arranged at a distance from the heat sink. The electronic component group comprises a first electronic component and a second electronic component stacked between the heat sink and the circuit board. The first electronic component is in contact with the heat sink, and the second electronic component is in contact with the circuit board. The heat equalizing piece is located between the first electronic component and the second electronic component, and is used for absorbing heat generated by the first electronic component and the second electronic component. The heat equalizing piece can absorb the heat generated by the first electronic component and the second electronic component, the second electronic component can dissipate heat without passing through the first electronic component, the accumulation of heat in the first electronic component and the second electronic component can be reduced, the temperature of the first electronic component and the second electronic component can be reduced, the heat transfer efficiency can be improved, and the heat dissipation performance of the electronic device can be improved.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to an electrical connection structure and an electronic device. Background Technology

[0002] Electronic devices are widely used in various aspects of life and work. With increasing internal integration and power of functional modules, heat dissipation has become a key factor restricting performance improvement. To save circuit board space, double-data-rate synchronous dynamic random access memory (SDRAM, DDR) and system-on-chip (SoC) are typically stacked on the surface of the circuit board, with the side of the DDR facing away from the SoC in contact with the heatsink. Heat generated by the SoC usually needs to pass through the DDR to reach the heatsink. However, the plastic encapsulation structure of DDR has high thermal resistance, affecting the speed of heat transfer. This makes it difficult for the heat generated by the SoC to be dissipated in time, easily causing the temperature of the electronic device to rise. This design is detrimental to improving the heat dissipation performance of electronic devices. Utility Model Content

[0003] This application provides an electrical connection structure and electronic device that improves heat transfer efficiency and helps to improve the heat dissipation performance of the electronic device.

[0004] In a first aspect, an electrical connection structure is provided, comprising:

[0005] heat sink;

[0006] A circuit board, wherein the circuit board is spaced apart from the heat sink;

[0007] An electronic component assembly, comprising a first electronic component and a second electronic component stacked between the heat sink and the circuit board, wherein the first electronic component is in contact with the heat sink and the second electronic component is in contact with the circuit board;

[0008] A heat spreader is located between the first electronic component and the second electronic component, and the heat spreader is used to absorb the heat generated by the first electronic component and the second electronic component.

[0009] The electrical connection structure provided in this application embodiment includes a heat spreader between a first electronic component and a second electronic component. The heat spreader absorbs heat generated by both components, and heat generated by the second component can be directly transferred to it. This absorption of heat from the second component reduces heat buildup within both components, helps lower their temperatures, improves heat transfer efficiency, and enhances the heat dissipation performance of the electronic device. Furthermore, when local temperatures of the first and second electronic components are excessively high, the heat spreader absorbs heat from these areas to balance the overall temperature of both components, allowing them to operate within a suitable temperature range and thus improving the performance of the electronic device.

[0010] In one possible implementation, a first heat-conducting element is further provided on the side of the heat spreader facing the heat sink. The first heat-conducting element is connected to both the heat sink and the heat spreader, and is used to transfer the heat absorbed by the heat spreader to the heat sink.

[0011] The heat spreader is connected to the heat sink using a first heat-conducting element. The heat absorbed by the heat spreader from the first and second electronic components can be transferred to the heat sink. For example, the heat generated by the second electronic component can be directly transferred to the heat sink through the heat spreader and the first heat-conducting element. The heat generated by the second electronic component does not need to be transferred through the first electronic component. In addition, the heat generated by the second electronic component can be dissipated into the air through the heat spreader. The heat generated by the first electronic component can be directly transferred to the heat sink or transferred to the heat sink through the heat spreader. In this way, the heat dissipation paths of the first and second electronic components are diversified, which can improve the heat transfer efficiency and help improve the heat dissipation performance of electronic devices.

[0012] In one possible implementation, multiple first heat-conducting elements are provided, and the multiple first heat-conducting elements are arranged around the central axis of the first electronic element;

[0013] Alternatively, the cross-section of the first heat-conducting element is annular, and the first electronic component is disposed within the annular region of the first heat-conducting element.

[0014] Normally, the temperature of the central region of an electronic component is higher than that of its peripheral regions. Therefore, the central region of the heat spreader absorbs more heat, which then radiates outwards to its surrounding edges. By arranging multiple first heat-conducting elements around the central axis of the first electronic component, the heat radiating outwards to the peripheral regions of the heat spreader can be transferred to the heat sink through these elements. This improves heat transfer efficiency and enhances the heat dissipation performance of the electronic device.

[0015] In one possible implementation, a first thermally conductive adhesive layer is disposed between the first thermally conductive component and the heat sink, the first thermally conductive adhesive layer being filled with a material with high thermal conductivity; and a second thermally conductive adhesive layer is disposed between the first thermally conductive component and the heat spreader, the second thermally conductive adhesive layer being filled with a material with high thermal conductivity; or,

[0016] A first thermally conductive adhesive layer is disposed between the first thermally conductive component and the heat sink, and the first thermally conductive component is welded to the heat spreader; or,

[0017] The first thermally conductive component is welded to the heat sink, and a second thermally conductive adhesive layer is disposed between the first thermally conductive component and the heat spreader; or,

[0018] The two ends of the first heat-conducting component are welded to the heat sink and the heat-spreading component, respectively.

[0019] By placing a first thermally conductive adhesive layer between the first thermally conductive component and the heat sink, that is, by filling the space between the first thermally conductive component and the heat sink with a first thermally conductive adhesive layer, heat can be quickly transferred from the first thermally conductive component to the heat sink, thereby improving the heat transfer efficiency and enhancing the heat dissipation performance of electronic devices.

[0020] Welding the first heat-conducting component to the heat-spreading component can improve the connection stability between the first heat-conducting component and the heat-spreading component. In addition, after the first heat-conducting component and the heat-spreading component are welded, the first heat-conducting component and the heat-spreading component are fixed together, which makes it convenient to fill the first thermally conductive adhesive layer between the first heat-conducting component and the heat sink.

[0021] Welding the first heat-conducting component to the heat sink can improve the connection stability between the first heat-conducting component and the heat sink. In addition, after the first heat-conducting component is welded to the heat sink, the first heat-conducting component and the heat sink are fixed together, which makes it convenient to fill the second heat-conducting adhesive layer between the first heat-conducting component and the heat-spreading component.

[0022] Welding the first heat-conducting component to the heat sink and the heat spreader can improve the connection stability of the three components. When the electronic device vibrates, the three components are less likely to shift, thus ensuring the stability of the heat dissipation path and enabling the heat generated by the first and second electronic components to be stably transferred to the heat sink.

[0023] In one possible implementation, the electrical connection structure further includes a third thermally conductive adhesive layer filled with a material with a high thermal conductivity. The third thermally conductive adhesive layer is filled between the first thermally conductive element and the first electronic element to transfer the heat generated by the first electronic element to the first thermally conductive element.

[0024] By placing a third thermally conductive adhesive layer between the first thermally conductive component and the first electronic component, heat can be quickly transferred from the first electronic component to the first thermally conductive component, allowing the heat generated by the first electronic component to be directly transferred to the first thermally conductive component. This improves the heat transfer efficiency and helps to enhance the heat dissipation performance of electronic devices.

[0025] In one possible implementation, the heat sink includes a first body spaced apart from the heat spreader, the first body having a first protrusion on its side facing the heat spreader, the end face of the first protrusion being connected to the heat spreader so that heat from the heat spreader can be transferred to the first body through the first protrusion; and / or,

[0026] The heat spreader includes a second body disposed between the first electronic component and the second electronic component. The second body has a second protrusion on the side facing the heat sink. The end face of the second protrusion is connected to the heat sink so that the heat absorbed by the first body can be transferred to the heat sink through the second protrusion.

[0027] A first protrusion is provided on the side of the first body of the heat sink facing the heat spreader. The first protrusion can be used to transfer heat so that the heat from the heat spreader can be transferred to the first body, thereby achieving heat dissipation for the first and second electronic components. Integrating the first protrusion into the first body of the heat sink can reduce assembly steps and help shorten the assembly time of electronic devices.

[0028] In some embodiments, multiple first protrusions may be provided, and the multiple first protrusions are arranged at intervals around the central axis of the first electronic component. In other embodiments, the first protrusions may be annular, and the first electronic component may be disposed within the annular region of the first protrusion. In general, the shape of the first protrusion may be the same as that of the first heat-conducting element in any of the above embodiments.

[0029] In some embodiments, the electrical connection structure may have a first protrusion or a first heat-conducting element provided separately. In other embodiments, the electrical connection structure may have both a first protrusion and a first heat-conducting element provided simultaneously. For example, when there are multiple first protrusions, the first heat-conducting element may be provided between the empty areas of two adjacent first protrusions. When the first protrusion is annular, the first heat-conducting element may be provided outside the annular area of ​​the first protrusion or within the annular area of ​​the first protrusion.

[0030] In some embodiments, a third thermally conductive adhesive layer may also be filled between the first protrusion and the first electronic component.

[0031] A second protrusion is provided on the side of the second body of the heat spreader facing the heat sink. The second protrusion can be used to transfer heat, so that the heat of the second body of the heat spreader can be transferred to the heat sink, thereby achieving heat dissipation for the first and second electronic components. Integrating the second protrusion into the second body of the heat spreader can reduce assembly steps and help shorten the assembly time of electronic devices.

[0032] In some embodiments, the electrical connection structure may be provided with a second protrusion or a first heat-conducting element separately. In other embodiments, the electrical connection structure may be provided with both a second protrusion and a first heat-conducting element. For example, when there are multiple second protrusions, the first heat-conducting element may be provided between the empty areas of two adjacent second protrusions. When the second protrusion is annular, the first heat-conducting element may be provided outside the annular area of ​​the second protrusion or within the annular area of ​​the second protrusion.

[0033] In some embodiments, a third thermally conductive adhesive layer may also be filled between the second protrusion and the first electronic component.

[0034] In some embodiments, the electrical connection structure can simultaneously provide a first protrusion and a second protrusion, and the orthographic projections of the first protrusion and the second protrusion on the surface of the heat exchanger can overlap. In this case, the end faces of the first protrusion and the second protrusion can be connected. In other embodiments, the orthographic projections of the first protrusion and the second protrusion on the surface of the heat exchanger can not overlap, that is, the first protrusion and the second protrusion are staggered. The end face of the first protrusion can be connected to the second body of the heat exchanger, and the end face of the second protrusion can be connected to the first body of the radiator.

[0035] In some embodiments, the electrical connection structure may simultaneously include a first protrusion, a second protrusion, and a first heat-conducting element.

[0036] In one possible implementation, a second heat-conducting element is provided on the side of the heat spreader facing the second electronic component. The second heat-conducting element is connected to both the circuit board and the heat spreader to transfer the heat absorbed by the heat spreader to the circuit board.

[0037] In this embodiment, the heat absorbed by the heat spreader can be transferred to the air or to the circuit board through the second heat conductor. This reduces the heat buildup in local areas of the electrical connection structure, helps to balance the temperature of each area of ​​the electrical connection structure, and reduces the possibility of excessively high local temperatures in the electrical connection structure.

[0038] In some embodiments, the electrical connection structure may be provided with both a first heat-conducting element and a second heat-conducting element. In this case, the heat absorbed by the heat-spreading element can be transferred to the air, the heat sink and the circuit board respectively, thereby diversifying the heat dissipation path and helping to improve the heat dissipation effect.

[0039] In some embodiments, the electrical connection structure may simultaneously provide a first protrusion and a second heat-conducting element, or simultaneously provide a second protrusion and a second heat-conducting element, or simultaneously provide a first protrusion, a second protrusion, and a second heat-conducting element, or simultaneously provide a first protrusion, a second protrusion, a first heat-conducting element, and a second heat-conducting element.

[0040] In some embodiments, the first protrusion, the second protrusion, and / or the first heat-conducting element of the electrical connection structure can coincide with the orthographic projection of the second heat-conducting element on the heat spreader. In this way, the first protrusion, the second protrusion, and / or the first heat-conducting element and the second heat-conducting element can form a symmetrical structure on both sides of the heat spreader, which can enhance the mechanical strength of the heat spreader and reduce the possibility of bending of the heat spreader.

[0041] Furthermore, the structure of the second heat-conducting element can be the same as or different from that of the first heat-conducting element.

[0042] In some embodiments, a fifth thermally conductive adhesive layer is filled between the second heat-conducting element and the heat spreader. This fifth thermally conductive adhesive layer is filled with a material with high thermal conductivity to transfer heat from the heat spreader to the second heat-conducting element. A sixth thermally conductive adhesive layer is filled between the second heat-conducting element and the circuit board. This sixth thermally conductive adhesive layer is filled with a material with high thermal conductivity to transfer heat from the second heat-conducting element to the circuit board. In other embodiments, the second heat-conducting element can be soldered to the heat spreader, with a sixth thermally conductive adhesive layer filled between the second heat-conducting element and the circuit board; or the second heat-conducting element can be soldered to the circuit board, with a fifth thermally conductive adhesive layer filled between the second heat-conducting element and the heat spreader; or the second heat-conducting element can be soldered to both the circuit board and the heat spreader.

[0043] In one possible implementation, the electrical connection structure further includes a fourth thermally conductive adhesive layer filled with a material with a high thermal conductivity. The fourth thermally conductive adhesive layer is filled between the second thermally conductive element and the second electronic element to transfer the heat generated by the second electronic element to the second thermally conductive element.

[0044] By placing a fourth thermally conductive adhesive layer between the second thermally conductive component and the second electronic component, heat can be quickly transferred from the second electronic component to the second thermally conductive component, allowing the heat generated by the second electronic component to be directly transferred to the second thermally conductive component. This improves the heat transfer efficiency and helps to enhance the heat dissipation performance of electronic devices.

[0045] In one possible implementation, the orthographic projection of the first electronic component onto the surface of the heat spreader coincides with the heat spreader; and / or, the orthographic projection of the second electronic component onto the surface of the heat spreader coincides with the heat spreader.

[0046] By aligning the orthographic projection of the first electronic component onto the surface of the heat spreader with the heat spreader, the contact area between the first electronic component and the heat spreader can be increased, which is equivalent to widening the heat transfer path and reducing heat accumulation in the first electronic component.

[0047] By aligning the orthographic projection of the second electronic component onto the surface of the heat spreader with the heat spreader, the contact area between the second electronic component and the heat spreader can be increased, which is equivalent to widening the heat transfer path, so that the heat generated by the second electronic component can be quickly transferred to the heat spreader.

[0048] In some embodiments, the orthographic projections of the first electronic component and the second electronic component on the surface of the heat spreader may both coincide with the heat spreader, or the orthographic projection of one of the first electronic component and the second electronic component on the surface of the heat spreader may coincide with the heat spreader, while the orthographic projection of the other of the first electronic component and the second electronic component on the surface of the heat spreader may not completely coincide with the heat spreader.

[0049] In one possible implementation, the heat spreader includes a substrate and signal lines disposed on the substrate, the signal lines being electrically connected to the first electronic component and the second electronic component, respectively.

[0050] The heat spreader is equipped with signal lines that are electrically connected to the first electronic component and the second electronic component respectively. The first electronic component and the second electronic component can be connected by signal through the heat spreader. It is not necessary to set up additional leads to connect the first electronic component and the second electronic component. The heat spreader can be used for heat dissipation and signal transmission at the same time, which helps to reduce the wiring difficulty of the electrical connection structure.

[0051] By placing the first electronic component within the device connection area and the first heat dissipation layer outside the device connection area, the obstruction of the first heat dissipation layer by the first electronic component can be reduced, allowing the heat dissipation component to dissipate heat better.

[0052] In some embodiments, the first heat spreader may be connected to the signal line so that heat within the signal line can be dissipated through the first heat spreader.

[0053] In one possible implementation, a device connection area is provided on the surface of the substrate, the signal line is provided in the device connection area, and the first electronic component is disposed in the device connection area;

[0054] The heat spreader further includes a first heat spreader layer, which is disposed on the surface of the substrate and located outside the device connection area.

[0055] In one possible implementation, the first heat dissipation layer completely covers the non-device connection area on the surface of the substrate, and the non-device connection area is disposed on the surface of the substrate at a distance from the device connection area.

[0056] By having the first heat-spreading layer completely cover the non-device connection area on the surface of the substrate, the area of ​​the heat-spreading component used for heat dissipation can be increased, thereby improving the heat dissipation effect of the electrical connection structure.

[0057] In one possible implementation, the heat spreader further includes a second heat spreader layer disposed within the substrate, the second heat spreader layer being connected to the first heat spreader layer.

[0058] A second heat-spreading layer is provided inside the heat-spreading component and connected to the first heat-spreading layer. Heat inside the heat-spreading component can be transferred to the first heat-spreading layer through the second heat-spreading layer. This reduces heat accumulation inside the heat-spreading component and helps improve the heat dissipation effect of the electrical connection structure.

[0059] In some embodiments, the first heat spreader can be made of a metallic material, for example, the first heat spreader can be a copper layer, a silver layer, a gold layer, etc.; in other embodiments, the first heat spreader can be made of a non-metallic material, for example, the first heat spreader includes carbon nanotubes, graphene, graphite, etc.

[0060] In some embodiments, the second heat spreader can be made of a metallic material, for example, the second heat spreader can be a copper layer, a silver layer, a gold layer, etc.; in other embodiments, the second heat spreader can be made of a non-metallic material, for example, the second heat spreader includes carbon nanotubes, graphene, graphite, etc.

[0061] In some embodiments, a device connection area and a first heat dissipation layer are provided on both sides of the substrate. One device connection area is connected to a first electronic component, and the other device connection area is connected to a second electronic component. The first heat dissipation layer located on the same side as the electronic component is connected to a first heat-conducting component, and the first heat dissipation layer located on the same side as the second electronic component is connected to a second heat-conducting component.

[0062] In addition, in other embodiments, when the electrical connection structure further includes a third electronic component and is stacked between the first and second electronic components, a heat spreader can be provided between the first and third electronic components, and a heat spreader can be provided between the third and fourth electronic components. That is, when the number of stacked electronic components increases, the number of heat spreaders can be increased accordingly. When the electrical connection structure has multiple stacked electronic components, multiple heat spreaders are provided accordingly. A heat spreader can be provided between two adjacent electronic components.

[0063] In any of the above embodiments, a seventh thermally conductive adhesive layer may be filled between the second electronic component and the circuit board. The seventh thermally conductive adhesive layer is filled with a highly thermally conductive material so that the heat generated by the second electronic component can be transferred to the circuit board through the seventh thermally conductive adhesive layer.

[0064] The seventh thermally conductive adhesive layer can have adhesive properties, meaning that the seventh thermally conductive adhesive layer can bond the circuit board and the second electronic component together. In this case, the seventh thermally conductive adhesive layer can be an underfill. In other embodiments, the seventh thermally conductive adhesive layer does not have adhesive properties, meaning that the seventh thermally conductive adhesive layer only serves as a thermally conductive structure and does not serve as a connection and fixing structure. In this case, the seventh thermally conductive adhesive layer can be silicone grease, thermally conductive gel, etc.

[0065] In some embodiments, the second electronic component is soldered to the circuit board via a plurality of first solder balls, and a seventh thermally conductive adhesive layer may be disposed between the gaps of the plurality of first solder balls.

[0066] In any of the above embodiments, an eighth thermally conductive adhesive layer may be filled between the second electronic component and the heat spreader. The eighth thermally conductive adhesive layer is filled with a highly thermally conductive material so that the heat generated by the second electronic component can be transferred to the heat spreader through the eighth thermally conductive adhesive layer.

[0067] The eighth thermally conductive adhesive layer may have adhesive properties, that is, the eighth thermally conductive adhesive layer can bond the heat spreader and the second electronic component together. In this case, the eighth thermally conductive adhesive layer may be an underfill. In other embodiments, the eighth thermally conductive adhesive layer may not have adhesive properties, that is, the eighth thermally conductive adhesive layer may only serve as a thermally conductive structure and not as a connection and fixing structure. In this case, the eighth thermally conductive adhesive layer may be silicone grease, thermally conductive gel, etc.

[0068] In some embodiments, the second electronic component is soldered to the heat spreader via a plurality of second solder balls, and the eighth thermally conductive adhesive layer may be disposed between the gaps of the plurality of second solder balls.

[0069] In some embodiments, the second solder ball may be connected to the signal lines of the heat spreader.

[0070] In any of the above embodiments, a ninth thermally conductive adhesive layer may be filled between the first electronic component and the heat spreader. The ninth thermally conductive adhesive layer is filled with a highly thermally conductive material so that the heat generated by the first electronic component can be transferred to the heat spreader through the ninth thermally conductive adhesive layer.

[0071] The ninth thermally conductive adhesive layer may have adhesive properties, meaning that the ninth thermally conductive adhesive layer can bond the heat spreader and the first electronic component together. In this case, the ninth thermally conductive adhesive layer may be an underfill. In other embodiments, the ninth thermally conductive adhesive layer may not have adhesive properties, meaning that the ninth thermally conductive adhesive layer only serves as a thermally conductive structure and does not serve as a connection and fixing structure. In this case, the ninth thermally conductive adhesive layer may be silicone grease, thermally conductive gel, etc.

[0072] In some embodiments, the first electronic component is soldered to the heat spreader via a plurality of third solder balls, and the ninth thermally conductive adhesive layer may be disposed between the gaps of the plurality of third solder balls.

[0073] In some embodiments, the third solder ball may be connected to the signal lines of the heat spreader.

[0074] In any of the above embodiments, a tenth thermally conductive adhesive layer may be filled between the first electronic component and the heat sink. The tenth thermally conductive adhesive layer is filled with a highly thermally conductive material so that the heat generated by the first electronic component can be transferred to the heat sink through the tenth thermally conductive adhesive layer.

[0075] The tenth thermally conductive adhesive layer can have adhesive properties, meaning that the tenth thermally conductive adhesive layer can bond the heat sink and the first electronic component together. In this case, the tenth thermally conductive adhesive layer can be an underfill. In other embodiments, the tenth thermally conductive adhesive layer does not have adhesive properties, meaning that the tenth thermally conductive adhesive layer only serves as a thermally conductive structure and does not serve as a connection and fixing structure. In this case, the tenth thermally conductive adhesive layer can be silicone grease, thermally conductive gel, etc.

[0076] Secondly, an electronic device is provided, including a housing, wherein the aforementioned electrical connection structure is disposed within the housing.

[0077] A heat spreader is placed between the first and second electronic components in the electrical connection structure of the electronic device. The heat spreader absorbs the heat generated by both components, allowing heat from the second component to be directly transferred to it without passing through the first component for heat dissipation. This reduces heat buildup within the first and second components, helps lower their temperatures, improves heat transfer efficiency, and enhances the electronic device's heat dissipation performance. Furthermore, when localized temperatures of the first and second electronic components are excessively high, the heat spreader absorbs heat from these areas to balance the overall temperature of both components, enabling them to operate within a suitable temperature range and thus improving the overall performance of the electronic device. Attached Figure Description

[0078] Figure 1 This is a schematic diagram of the electrical connection structure of the related technology.

[0079] Figure 2 This is a schematic diagram of an electrical connection structure provided in an embodiment of this application.

[0080] Figure 3 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0081] Figure 4 This is a schematic diagram of the structure of the first heat-conducting element, the heat-spreading element, and the first electronic component provided in an embodiment of this application.

[0082] Figure 5This is a schematic diagram of the structure of the first heat-conducting element, the heat-spreading element, and the first electronic component provided in another embodiment of this application.

[0083] Figure 6 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0084] Figure 7 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0085] Figure 8 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0086] Figure 9 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0087] Figure 10 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0088] Figure 11 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0089] Figure 12 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0090] Figure 13 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0091] Figure 14 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0092] Figure 15 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0093] Figure 16 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0094] Figure 17 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0095] Figure 18 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0096] Figure 19 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0097] Figure 20 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0098] Figure 21 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0099] Figure 22 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0100] Figure 23 This is a cross-sectional schematic diagram of the heat exchanger provided in an embodiment of this application.

[0101] Figure 24 This is a schematic diagram of the structure of the heat spreader and the first electronic component provided in the embodiments of this application.

[0102] 1' DDR; 2' SOC; 3' Circuit board; 4' Heatsink;

[0103] Figures 2 to 24 middle:

[0104] 1. First electronic component;

[0105] 2. Second electronic component;

[0106] 3. Circuit board;

[0107] 4. Radiator; 41. First main body; 42. First protrusion;

[0108] 5. Heat dissipation element; 51. Second body; 52. Second protrusion; 53. First heat dissipation layer; 54. Second heat dissipation layer; 55. Device connection area; 56. Non-device connection area; 57. Substrate; 58. Signal line;

[0109] 61. First solder ball; 62. Second solder ball; 63. Third solder ball;

[0110] 701, First thermally conductive adhesive layer; 702, Second thermally conductive adhesive layer; 703, Third thermally conductive adhesive layer; 704, Fourth thermally conductive adhesive layer; 705, Fifth thermally conductive adhesive layer; 706, Sixth thermally conductive adhesive layer; 707, Seventh thermally conductive adhesive layer; 708, Eighth thermally conductive adhesive layer; 709, Ninth thermally conductive adhesive layer; 710, Tenth thermally conductive adhesive layer;

[0111] 8. First heat-conducting component;

[0112] 9. Second heat-conducting component. Detailed Implementation

[0113] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0114] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between the components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0115] In the description of this application, it should be understood that the terms "upper", "lower", "side", "front", "rear", etc., indicate the orientation or positional relationship based on the installation orientation or positional relationship, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0116] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0117] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0118] In today's era of rapid technological advancement, electronic devices are widely used in all aspects of people's lives and work. From everyday smartphones and tablets to professional servers and high-performance computers, these electronic devices are becoming increasingly powerful and their performance is constantly improving. However, with the increasing integration of electronic devices and the gradual increase in the operating power of functional modules, heat dissipation has become one of the key factors restricting further improvements in the performance of electronic devices.

[0119] Figure 1 This is a schematic diagram of the electrical connection structure in related technologies. (Refer to...) Figure 1The electrical connection structure of the electronic device includes a circuit board 3', an electronic component group disposed on and connected to the circuit board 3', and a heat sink 4' located above and in contact with the electronic component group. The electronic component group includes multiple stacked electronic components, such as a system-on-chip (SOC) 2', double-data-rate synchronous dynamic random access memory (SDRAM, DDR), etc. In a package-on-package (POP) architecture, DDR1' is typically stacked on the surface of the SOC to save layout area on the circuit board 3'. However, the heat generated by the SOC 2' usually needs to be transferred to the heat sink via DDR1'. The plastic encapsulation structure of DDR1' has high thermal resistance, affecting the heat transfer speed. The heat generated by the SOC 2' is difficult to dissipate in time, easily causing the temperature of the electronic device to rise. This design is detrimental to improving the heat dissipation performance of the electronic device.

[0120] Based on this, embodiments of this application provide an electrical connection structure and an electronic device that improves heat transfer efficiency and helps to improve the heat dissipation performance of the electronic device.

[0121] This application first provides an electronic device, which may be, for example, a mobile phone, tablet computer, laptop computer, television, in-vehicle equipment, wearable device, personal digital assistant (PDA), point of sale (POS), video surveillance equipment, etc. The mobile phone may be, for example, a conventional candybar phone or a foldable phone, such as a small vertical folding phone, a left-right inward folding phone, or a left-right outward folding phone. Wearable devices may be, for example, smart bracelets, smartwatches, wireless headphones, augmented reality (AR) glasses, AR headsets, virtual reality (VR) glasses, or VR headsets, etc.

[0122] Figure 2 This is a schematic diagram of an electrical connection structure provided in an embodiment of this application. (Refer to...) Figure 2The electronic device includes an electrical connection structure, which includes a heat sink 4, a circuit board 3, an electronic component group, and a heat spreader 5. The circuit board 3 and the heat sink 4 are spaced apart. The electronic component group includes a first electronic component 1 and a second electronic component 2 stacked between the heat sink 4 and the circuit board 3. The first electronic component 1 is in contact with the heat sink 4, and the second electronic component 2 is in contact with the circuit board 3. The heat spreader 5 is located between the first electronic component 1 and the second electronic component 2 and is used to absorb the heat generated by the first electronic component 1 and the second electronic component 2.

[0123] As an example, the heat spreader 5 is in contact with the first electronic component 1 and the second electronic component 2, or it can be considered that the first electronic component 1 and the second electronic component 2 are respectively disposed on different surfaces of the heat spreader 5.

[0124] It should be noted that circuit board 3 can be the motherboard of an electronic device, and circuit board 3 can be a printed circuit board (PCB) or a flexible printed circuit (FPC). In some embodiments, all pins of the second electronic component 2 can be connected to the leads of the same circuit board 3, that is, in this embodiment, the signals of the second electronic component 2 all originate from the same circuit board 3; see reference. Figure 2 In other embodiments, multiple pins of the second electronic component 2 can be connected to the leads of two circuit boards 3 respectively. In this embodiment, the second electronic component 2 can be driven by two circuit boards 3. In other embodiments, multiple pins of the second electronic component 2 can be connected to the leads of three or four circuit boards 3 respectively. The connection method between the second electronic component 2 and the circuit board 3 can be selected according to actual needs. This application embodiment does not limit this.

[0125] It should be noted that in some embodiments, the heat spreader 5 may contain a metallic material, and signals can be transmitted between the first electronic component 1 and the second electronic component 2 through the heat spreader 5; in other embodiments, through holes may be formed in the heat spreader 5, and the connecting lines of the first electronic component 1 and the second electronic component 2 may pass through the through holes of the heat spreader 5 to realize signal transmission between the first electronic component 1 and the second electronic component 2. In the embodiments of this application, the first electronic component 1 and the second electronic component 2 transmit signals through the heat spreader 5, the second electronic component 2 and the circuit board 3 are soldered together by the first solder ball 61, the second electronic component 2 and the heat spreader 5 are soldered together by the second solder ball 62, and the heat spreader 5 and the first electronic component 1 are soldered together by the third solder ball 63.

[0126] It should be noted that the first electronic component 1 can be a DDR, and the second electronic component 2 can be a SOC. The DDR can be stacked on the surface of the SOC to save the layout area of ​​the circuit board 3. The electrical connection structure of this embodiment can be applied to a package-on-package (POP) architecture.

[0127] It should be noted that the contact between the first electronic component 1 and the heat sink 4 can be either that the surface of the first electronic component 1 abuts against the surface of the heat sink 4, and the two are in direct contact, or that thermally conductive material is filled between the first electronic component 1 and the heat sink 4, so that the first electronic component 1 and the heat sink 4 are in indirect contact.

[0128] It should be noted that the heat spreader 5 can be plate-shaped, that is, the thickness of the heat spreader 5 is basically the same everywhere. In other embodiments, the thickness of the heat spreader 5 can be unequal everywhere. In this case, the heat spreader 5 can have an irregular shape. The shape of the heat spreader 5 can be designed according to actual needs. This application does not limit it here.

[0129] It should be noted that in some embodiments, the area of ​​the heat spreader 5 may be smaller than that of the first electronic component 1 or the second electronic component 2; in other embodiments, the area of ​​the heat spreader 5 may be equal to that of the first electronic component 1 or the second electronic component 2; and in still other embodiments, the area of ​​the heat spreader 5 may be larger than that of the first electronic component 1 and the second electronic component 2. Furthermore, the orthographic projection of the first electronic component 1 onto the surface of the heat spreader 5 may partially or completely coincide with that of the heat spreader 5, and the orthographic projection of the second electronic component 2 onto the surface of the heat spreader 5 may partially or completely coincide with that of the heat spreader 5. Orthographic projection refers to parallel projection lines perpendicular to the projection surface. In this embodiment, when the heat spreader 5 is plate-shaped, the orthographic projection of the first electronic component 1 (second electronic component 2) on the surface of the heat spreader 5 can be understood as the shadow cast on the surface of the heat spreader 5 after a projection line perpendicular to the surface of the heat spreader 5 is projected onto the first electronic component 1 (second electronic component 2); when the heat spreader 5 has an irregular shape, the orthographic projection of the first electronic component 1 (second electronic component 2) on the surface of the heat spreader 5 can be understood as the shadow cast on the surface of the heat spreader 5 after a projection line perpendicular to the surface of the circuit board 3 is projected onto the first electronic component 1 (second electronic component 2).

[0130] It should be noted that in some embodiments, a material with a high specific heat capacity can be used to manufacture the heat spreader 5, so that the temperature of the heat spreader 5 can always remain within a suitable range after absorbing heat. In other embodiments, the volume of the heat spreader 5 can be increased, for example, the area of ​​the heat spreader 5 can be larger than that of the first electronic component 1 and the second electronic component 2. In this case, the heat absorbed by the heat spreader 5 from the first electronic component 1 and the second electronic component 2 can be dissipated into the air. In still some embodiments, the heat spreader 5 can be connected to the heat sink 4 and / or the circuit board 3, so that the heat absorbed by the heat spreader 5 from the first electronic component 1 and the second electronic component 2 can be transferred to the heat sink 4 and / or the circuit board 3.

[0131] It should be noted that common types of radiators include air-cooled radiators, liquid-cooled radiators, heat pipe radiators, vapor chamber radiators, liquid-cooled plate radiators, and natural heat sinks. Air-cooled radiators typically consist of a cooling fan, cooling fins, and a heatsink base. The fan generates airflow, which passes over the cooling fins and carries away heat. Liquid-cooled radiators generally include a water block, water pump, reservoir, radiator, and cooling fan. The water block contacts the heat-generating components, transferring heat to the circulating coolant. Driven by the pump, the coolant flows through the radiator, where the cooling fan dissipates heat, allowing the coolant to cool down before returning to the water block, thus completing the cycle. A heat pipe radiator consists of heat pipes, cooling fins, and a heatsink base. The working fluid inside the heat pipe absorbs heat in the evaporation section and evaporates into a gaseous state. Under the pressure difference within the heat pipe, the gaseous working fluid flows to the condensation section, releases heat, and re-condenses into a liquid state. The liquid working fluid then flows back to the evaporation section through structures such as a wick, thus achieving efficient heat transfer. Finally, the cooling fins dissipate the heat into the air. A vapor chamber radiator mainly consists of a vapor chamber. In some embodiments, the vapor chamber may be used in conjunction with a cooling fan or cooling fins. The vapor chamber contains a vacuum chamber with a special thermally conductive medium and capillary structures. When one side of the vapor chamber is heated, the thermally conductive medium evaporates to form vapor. The vapor rapidly diffuses into a cooler area within the vacuum chamber and condenses into a liquid. The liquid flows back to the heated area through the capillary structures, continuing to evaporate and dissipate heat, thereby achieving rapid and uniform heat dissipation. A liquid-cooled plate radiator includes a liquid-cooled plate and a coolant circulation system. The coolant flows within the liquid-cooled plate, absorbing heat, and then the heat is carried to an external heat dissipation device through the circulation system. Natural heat sinks primarily rely on the equipment's own casing or heat sink structure. They utilize heat conduction to transfer heat from inside the equipment to the casing or heat sink, and then dissipate the heat to the surrounding environment through natural convection and thermal radiation. The appropriate type of radiator can be selected based on the type of the first electronic component 1 and the second electronic component 2 to ensure effective heat dissipation for both components, allowing them to operate at a suitable temperature.

[0132] The electrical connection structure provided in this application embodiment includes a heat spreader 5 disposed between the first electronic component 1 and the second electronic component 2. The heat spreader 5 can absorb the heat generated by the first electronic component 1 and the second electronic component 2, and the heat generated by the second electronic component 2 can be directly transferred to the heat spreader 5. This allows the heat generated by the second electronic component 2 to be absorbed by the heat spreader 5, reducing heat accumulation within the first electronic component 1 and the second electronic component 2, helping to lower the temperature of the first electronic component 1 and the second electronic component 2, improving heat transfer efficiency, and enhancing the heat dissipation performance of the electronic device. Furthermore, when the local temperature of the first electronic component 1 and the second electronic component 2 is too high, the heat spreader 5 can also absorb the heat from these areas to balance the overall temperature of the first electronic component 1 and the second electronic component 2, enabling the first electronic component 1 and the second electronic component 2 to operate within a suitable temperature range, thereby improving the performance of the electronic device.

[0133] Figure 3 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application. (Refer to...) Figure 3 A first heat-conducting element 8 is also provided on the side of the heat-spreading element 5 facing the heat sink 4. The first heat-conducting element 8 is connected to the heat sink 4 and the heat-spreading element 5 respectively. The first heat-conducting element 8 is used to transfer the heat absorbed by the heat-spreading element 5 to the heat sink 4.

[0134] The heat spreader 5 is connected to the heat sink 4 using the first heat-conducting element 8, and the heat absorbed by the heat spreader 5 from the first electronic component 1 and the second electronic component 2 can be transferred to the heat sink 4.

[0135] For example, the heat generated by the second electronic component 2 can be transferred to the heat sink 4 through the heat spreader 5 and the first heat conductor 8. The heat generated by the second electronic component 2 does not need to be transferred through the first electronic component 1. In addition, the heat generated by the second electronic component 2 can be dissipated into the air through the heat spreader 5. The heat generated by the first electronic component 1 can be directly transferred to the heat sink 4, or it can be transferred to the heat sink 4 through the heat spreader 5. In this way, the heat dissipation paths of the first electronic component 1 and the second electronic component 2 are diversified, which can improve the heat transfer efficiency and help improve the heat dissipation performance of electronic devices.

[0136] Figure 4 This is a schematic diagram of the structure of the first heat-conducting element 8, the heat-spreading element 5, and the first electronic component 1 provided in an embodiment of this application. (Refer to...) Figure 3 In some embodiments, multiple first heat-conducting elements 8 are provided, and the multiple first heat-conducting elements 8 are arranged around the central axis of the first electronic component 1.

[0137] As an example, the first heat-conducting element 8 can be columnar, and the cross-section of the first heat-conducting element 8 can be circular, elliptical, annular, rectangular, triangular, pentagonal, polygonal, or other regular / irregular shapes.

[0138] It should be noted that there can be two, three, four or even more first heat-conducting components 8.

[0139] It should be noted that the height of the multiple first heat-conducting components 8 can be designed according to their installation positions. If the distance between the heat-spreading component 5 and the heat sink 4 is equal at all points, then the height of all the first heat-conducting components 8 can be equal. If the distance between the heat-spreading component 5 and the heat sink 4 is not equal at all points, the actual distance between the heat-conducting component and the heat sink 4 at all points can be measured, so as to select the appropriate height of the first heat-conducting component 8 and arrange it in the corresponding position.

[0140] Under normal circumstances, the temperature of the central region of an electronic component is higher than that of its peripheral regions. Therefore, the central region of the heat spreader 5 absorbs more heat, which then radiates outwards to its surrounding edges. By arranging multiple first heat-conducting elements 8 around the central axis of the first electronic component 1, the heat dissipated towards the peripheral regions of the heat spreader 5 can be transferred to the heat sink 4 through these elements. This improves heat transfer efficiency and enhances the heat dissipation performance of the electronic device.

[0141] Figure 5 A schematic diagram of the structure of the first heat-conducting element 8, the heat-spreading element 5, and the first electronic component 1 provided in another embodiment of this application. (Refer to...) Figure 5 In other embodiments, the cross-section of the first heat-conducting element 8 is annular, and the first electronic component 1 is disposed within the annular region of the first heat-conducting element 8.

[0142] It is understandable that the temperature in the central region of an electronic component is higher than that in its peripheral regions. Therefore, the central region of the heat spreader 5 absorbs more heat, which then radiates outwards to its surrounding edges. By placing the first electronic component 1 within the annular region of the first heat-conducting element 8, the heat dissipated towards the peripheral regions of the heat spreader 5 can be transferred to the heat sink 4 through various points on the first heat-conducting element 8. This improves heat transfer efficiency and helps enhance the heat dissipation performance of the electronic device.

[0143] Figure 6 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application. (Refer to...) Figure 6 In some embodiments, a first thermally conductive adhesive layer 701 is provided between the first thermally conductive element 8 and the heat sink 4, and the first thermally conductive adhesive layer 701 is filled with a material with high thermal conductivity. A second thermally conductive adhesive layer 702 is provided between the first thermally conductive element 8 and the heat spreader 5, and the second thermally conductive adhesive layer 702 is filled with a material with high thermal conductivity.

[0144] It should be noted that high thermal conductivity materials refer to a class of materials with relatively high thermal conductivity. Thermal conductivity is a physical quantity that measures the heat conduction ability of a material; it represents the amount of heat passing through a unit area per unit time under a unit temperature gradient. Generally speaking, materials with a thermal conductivity greater than a certain value [e.g., 200 W / (m*K)] can be considered high thermal conductivity materials. High thermal conductivity materials can be metals and their oxides, carbon-based materials, nitrides, etc. Metals and their oxides can be aluminum, copper, silver, alumina, etc.; carbon-based materials can be graphite, carbon fiber, carbon nanotubes, graphene, etc.; and nitrides can be boron nitride, aluminum nitride, etc. The high thermal conductivity material in the first thermally conductive adhesive layer 701 can be the same as or different from the high thermal conductivity material in the second thermally conductive adhesive layer 702. Furthermore, the content of the high thermal conductivity material in the first thermally conductive adhesive layer 701 and the second thermally conductive adhesive layer 702 can be the same or different.

[0145] It should be noted that in some embodiments, the first thermally conductive adhesive layer 701 may have adhesive properties, that is, the first thermally conductive adhesive layer 701 can bond the first thermally conductive component 8 and the heat sink 4 together. In this case, the first thermally conductive adhesive layer 701 may be an underfill. In other embodiments, the first thermally conductive adhesive layer 701 may not have adhesive properties, that is, the first thermally conductive adhesive layer 701 may only serve as a thermally conductive structure and not as a connecting and fixing structure. In this case, the first thermally conductive adhesive layer 701 may be silicone grease, thermally conductive gel, etc.

[0146] It should be noted that in some embodiments, the second thermally conductive adhesive layer 702 may have adhesive properties, that is, the second thermally conductive adhesive layer 702 can bond the first thermally conductive component 8 and the heat sink 4 together. In this case, the second thermally conductive adhesive layer 702 may be an underfill. In other embodiments, the second thermally conductive adhesive layer 702 may not have adhesive properties, that is, the second thermally conductive adhesive layer 702 may only serve as a thermally conductive structure and not as a connecting and fixing structure. In this case, the second thermally conductive adhesive layer 702 may be silicone grease, thermally conductive gel, etc.

[0147] The first thermally conductive adhesive layer 701 is provided between the first thermally conductive element 8 and the heat sink 4, which can help to quickly transfer heat from the first thermally conductive element 8 to the heat sink 4, improve the heat transfer efficiency, and help improve the heat dissipation performance of electronic devices.

[0148] Figure 7 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application. (Refer to...) Figure 7 In other embodiments, a first thermally conductive adhesive layer 701 is provided between the first thermally conductive element 8 and the heat sink 4, and the first thermally conductive element 8 is welded to the heat spreader 5.

[0149] Welding the first heat-conducting component 8 to the heat-spreading component 5 can improve the connection stability between the first heat-conducting component 8 and the heat-spreading component 5. In addition, after the first heat-conducting component 8 and the heat-spreading component 5 are welded, the first heat-conducting component 8 and the heat-spreading component 5 are fixed together, which makes it convenient to fill the first thermally conductive adhesive layer 701 between the first heat-conducting component 8 and the heat sink 4.

[0150] Figure 8 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application. (Refer to...) Figure 8 In other embodiments, the first heat-conducting element 8 is welded to the heat sink 4, and a second heat-conducting adhesive layer 702 is provided between the first heat-conducting element 8 and the heat-spreading element 5.

[0151] Welding the first heat-conducting component 8 to the heat sink 4 can improve the connection stability between the first heat-conducting component 8 and the heat sink 4. In addition, after the first heat-conducting component 8 is welded to the heat sink 4, the first heat-conducting component 8 and the heat sink 4 are fixed together, which makes it convenient to fill the second thermally conductive adhesive layer 702 between the first heat-conducting component 8 and the heat-spreading component 5.

[0152] In some embodiments, the two ends of the first heat-conducting element 8 can be welded to the heat sink 4 and the heat spreader 5 respectively. That is, both ends of the first heat-conducting element 8 are welded and fixed to the heat sink 4 and the heat spreader 5, and the first heat-conducting element 8 is not detachable from the heat sink 4 and the heat spreader 5.

[0153] Welding the first heat-conducting component 8 to the heat sink 4 and the heat-spreading component 5 can improve the connection stability of the three components. When the electronic device vibrates, the three components are less likely to shift, thus ensuring the stability of the heat dissipation path and enabling the heat generated by the first electronic component 1 and the second electronic component 2 to be stably transferred to the heat sink 4.

[0154] Figure 9 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application. (Refer to...) Figure 9 The electrical connection structure also includes a third thermally conductive adhesive layer 703, which is filled with a material with a high thermal conductivity. The third thermally conductive adhesive layer 703 is filled between the first thermally conductive element 8 and the first electronic component 1 to transfer the heat generated by the first electronic component 1 to the first thermally conductive element 8.

[0155] It should be noted that, regardless of whether the first thermal conductive element 8 is welded to the heat sink 4 or filled with the first thermal conductive adhesive layer 701, and regardless of whether the first thermal conductive element 8 is welded to the heat spreader 5 or filled with the second thermal conductive adhesive layer 702, the first thermal conductive element 8 and the first electronic component 1 can be filled with the third thermal conductive adhesive layer 703.

[0156] It should be noted that in some embodiments, the third thermally conductive adhesive layer 703 may have adhesive properties, meaning that the third thermally conductive adhesive layer 703 can bond the first thermally conductive component 8 and the first electronic component 1 together. In this case, the third thermally conductive adhesive layer 703 can be an underfill. In other embodiments, the third thermally conductive adhesive layer 703 does not have adhesive properties, meaning that the third thermally conductive adhesive layer 703 only serves as a thermally conductive structure and not as a connecting and fixing structure. In this case, the third thermally conductive adhesive layer 703 can be silicone grease, thermally conductive gel, etc. The high thermal conductivity material in the third thermally conductive adhesive layer 703, the high thermal conductivity material in the first thermally conductive adhesive layer 701, and the high thermal conductivity material in the second thermally conductive adhesive layer 702 can be the same, different, or two of them can be the same, and the remaining one can be different. In addition, the content of the high thermal conductivity material in the third thermally conductive adhesive layer 703, the high thermal conductivity material in the first thermally conductive adhesive layer 701, and the high thermal conductivity material in the second thermally conductive adhesive layer 702 can be the same, different, or two of them can be the same, and the remaining one can be different.

[0157] The provision of a third thermally conductive adhesive layer 703 between the first thermally conductive component 8 and the first electronic component 1 can help to quickly transfer heat from the first electronic component 1 to the first thermally conductive component 8, so that the heat generated by the first electronic component 1 can be directly transferred to the first thermally conductive component 8. This can improve the heat transfer efficiency and help improve the heat dissipation performance of electronic devices.

[0158] Figure 10 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application; Figure 11 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0159] Reference Figure 10 and Figure 11 In some embodiments, the heat sink 4 includes a first body 41 spaced apart from the heat spreader 5. The first body 41 has a first protrusion 42 on the side facing the heat spreader 5. The end face of the first protrusion 42 is connected to the heat spreader 5 so that the heat of the heat spreader 5 can be transferred to the first body 41 through the first protrusion 42.

[0160] It should be noted that in this embodiment, the first heat-conducting element 8 in any of the above embodiments is integrated on the first body 41 of the heat sink 4, so that the first heat-conducting element 8 and the first body 41 of the heat sink 4 are integrally formed, and the two do not need to be fixed together by welding, riveting or other methods.

[0161] It should be noted that, referring to Figure 11 A second thermally conductive adhesive layer 702 can be filled between the end face of the first protrusion 42 and the heat spreader 5, or the end of the first protrusion 42 can be welded to the heat spreader 5.

[0162] A first protrusion 42 is provided on the side of the first body 41 of the heat sink 4 facing the heat spreader 5. The first protrusion 42 can be used to transfer heat so that the heat of the heat spreader 5 can be transferred to the first body 41, thereby achieving heat dissipation for the first electronic component 1 and the second electronic component 2. Integrating the first protrusion 42 into the first body 41 of the heat sink 4 can reduce assembly steps and help shorten the assembly time of electronic devices.

[0163] In some embodiments, multiple first protrusions 42 may be provided, and the multiple first protrusions 42 are arranged at intervals around the central axis of the first electronic component 1. In other embodiments, the first protrusions 42 may be annular, and the first electronic component 1 may be disposed within the annular region of the first protrusions 42. In general, the shape of the first protrusions 42 may be the same as that of the first heat-conducting element 8 in any of the above embodiments.

[0164] In some embodiments, the electrical connection structure may have a single first protrusion 42 or a single first heat-conducting element 8. In other embodiments, the electrical connection structure may have both a first protrusion 42 and a first heat-conducting element 8. For example, when there are multiple first protrusions 42, the first heat-conducting element 8 may be disposed between the empty areas of two adjacent first protrusions 42. When the first protrusion 42 is annular, the first heat-conducting element 8 may be disposed outside the annular area of ​​the first protrusion 42 or within the annular area of ​​the first protrusion 42.

[0165] In some embodiments, a third thermally conductive adhesive layer 703 may also be filled between the first protrusion 42 and the first electronic component 1.

[0166] Figure 12 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application. (Refer to...) Figure 12 In some embodiments, the heat spreader 5 includes a second body 51 disposed between the first electronic component 1 and the second electronic component 2. The second body 51 has a second protrusion 52 on the side facing the heat sink 4. The end face of the second protrusion 52 is connected to the heat sink 4 so that the heat absorbed by the first body 41 can be transferred to the heat sink 4 through the second protrusion 52.

[0167] It should be noted that in this embodiment, the first heat-conducting element 8 in any of the above embodiments is integrated on the second body 51 of the heat-spreading element 5, so that the first heat-conducting element 8 and the second body 51 of the heat-spreading element 5 are integrally formed, and the two do not need to be fixed together by welding, riveting or other methods.

[0168] It should be noted that, referring to Figure 12 The end face of the second protrusion 52 and the heat sink 4 can be filled with a first thermally conductive adhesive layer 701, or the end of the second protrusion 52 can be welded to the heat sink 4.

[0169] A second protrusion 52 is provided on the side of the second body 51 of the heat spreader 5 facing the heat sink 4. The second protrusion 52 can be used to transfer heat so that the heat of the second body 51 of the heat spreader 5 can be transferred to the heat sink 4, thereby achieving heat dissipation for the first electronic component 1 and the second electronic component 2. Integrating the second protrusion 52 into the second body 51 of the heat spreader 5 can reduce assembly steps and help shorten the assembly time of electronic devices.

[0170] In some embodiments, the electrical connection structure may be provided with a second protrusion 52 alone or with a first heat-conducting element 8 alone. In other embodiments, the electrical connection structure may be provided with both the second protrusion 52 and the first heat-conducting element 8. For example, when there are multiple second protrusions 52, the first heat-conducting element 8 may be provided between the empty areas of two adjacent second protrusions 52. When the second protrusion 52 is annular, the first heat-conducting element 8 may be provided outside the annular area of ​​the second protrusion 52 or within the annular area of ​​the second protrusion 52.

[0171] In some embodiments, a third thermally conductive adhesive layer 703 may also be filled between the second protrusion 52 and the first electronic component 1.

[0172] In some embodiments, the electrical connection structure can simultaneously provide a first protrusion 42 and a second protrusion 52, and the orthographic projections of the first protrusion 42 and the second protrusion 52 on the surface of the heat exchanger 5 can overlap. In this case, the end faces of the first protrusion 42 and the second protrusion 52 can be connected. In other embodiments, the orthographic projections of the first protrusion 42 and the second protrusion 52 on the surface of the heat exchanger 5 can not overlap, that is, the first protrusion 42 and the second protrusion 52 are staggered. The end face of the first protrusion 42 can be connected to the second body 51 of the heat exchanger 5, and the end face of the second protrusion 52 can be connected to the first body 41 of the radiator 4.

[0173] In some embodiments, the electrical connection structure may include a first protrusion 42, a second protrusion 52, and a first heat-conducting element 8.

[0174] Figure 13 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application. (Refer to...) Figure 13 A second heat-conducting element 9 is provided on the side of the heat-spreading element 5 facing the second electronic component 2. The second heat-conducting element 9 is connected to the circuit board 3 and the heat-spreading element 5 respectively, so as to transfer the heat absorbed by the heat-spreading element 5 to the circuit board 3.

[0175] In this embodiment, the heat absorbed by the heat spreader 5 can be transferred to the air or to the circuit board 3 through the second heat conductor 9. This reduces the heat accumulation in local areas of the electrical connection structure, helps to balance the temperature of each area of ​​the electrical connection structure, and reduces the possibility of excessively high local temperatures in the electrical connection structure.

[0176] Figure 14This is a schematic diagram of an electrical connection structure provided in another embodiment of this application. (Refer to...) Figure 14 In some embodiments, the electrical connection structure may be provided with a first heat-conducting element 8 and a second heat-conducting element 9. In this case, the heat absorbed by the heat-spreading element 5 can be transferred to the air, the heat sink 4 and the circuit board 3 respectively, thereby diversifying the heat dissipation path and helping to improve the heat dissipation effect.

[0177] In some embodiments, the electrical connection structure may simultaneously provide a first protrusion 42 and a second heat-conducting element 9, or simultaneously provide a second protrusion 52 and a second heat-conducting element 9, or simultaneously provide a first protrusion 42, a second protrusion 52 and a second heat-conducting element 9, or simultaneously provide a first protrusion 42, a second protrusion 52, a first heat-conducting element 8 and a second heat-conducting element 9.

[0178] In some embodiments, the first protrusion 42, the second protrusion 52 and / or the first heat-conducting element 8 of the electrical connection structure can coincide with the orthographic projection of the second heat-conducting element 9 on the heat spreader 5. In this way, the first protrusion 42, the second protrusion 52 and / or the first heat-conducting element 8 and the second heat-conducting element 9 can form a symmetrical structure on both sides of the heat spreader 5, which can enhance the mechanical strength of the heat spreader 5 and reduce the possibility of bending of the heat spreader 5.

[0179] Furthermore, the structure of the second heat-conducting element 9 can be the same as or different from the structure of the first heat-conducting element 8.

[0180] Figure 15 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application; Figure 16 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application; Figure 17 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application; Figure 18 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application; Figure 19 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application.

[0181] Reference Figures 14 to 19In some embodiments, a fifth thermally conductive adhesive layer 705 is filled between the second heat-conducting element 9 and the heat-spreading element 5. The fifth thermally conductive adhesive layer 705 is filled with a material with high thermal conductivity to transfer the heat from the heat-spreading element 5 to the second heat-conducting element 9 through the fifth thermally conductive adhesive layer 705. A sixth thermally conductive adhesive layer 706 is filled between the second heat-conducting element 9 and the circuit board 3. The sixth thermally conductive adhesive layer 706 is filled with a material with high thermal conductivity to transfer the heat from the second heat-conducting element 9 to the circuit board 3. In other embodiments, the second heat-conducting element 9 can be soldered to the heat-spreading element 5, with the sixth thermally conductive adhesive layer 706 filled between the second heat-conducting element 9 and the circuit board 3; or the second heat-conducting element 9 can be soldered to the circuit board 3, with the fifth thermally conductive adhesive layer 705 filled between the second heat-conducting element 9 and the heat-spreading element 5; or the second heat-conducting element 9 can be soldered to both the circuit board 3 and the heat-spreading element 5.

[0182] It should be noted that the fifth thermally conductive adhesive layer 705 may have adhesive properties, that is, the fifth thermally conductive adhesive layer 705 can bond the second thermally conductive element 9 and the heat-spreading element 5 together. In this case, the fifth thermally conductive adhesive layer 705 may be an underfill. In other embodiments, the fifth thermally conductive adhesive layer 705 may not have adhesive properties, that is, the fifth thermally conductive adhesive layer 705 may only serve as a thermally conductive structure and not as a connecting and fixing structure. In this case, the fifth thermally conductive adhesive layer 705 may be silicone grease, thermally conductive gel, etc.

[0183] It should be noted that the sixth thermally conductive adhesive layer 706 may have adhesive properties, that is, the sixth thermally conductive adhesive layer 706 can bond the second thermally conductive component 9 and the circuit board 3 together. In this case, the sixth thermally conductive adhesive layer 706 may be an underfill. In other embodiments, the sixth thermally conductive adhesive layer does not have adhesive properties, that is, the sixth thermally conductive adhesive layer 706 only serves as a thermally conductive structure and does not serve as a connection and fixing structure. In this case, the sixth thermally conductive adhesive layer 706 may be silicone grease, thermally conductive gel, etc.

[0184] It should be noted that the connection methods (soldering or setting adhesive layer) of the corresponding connection positions of the first heat-conducting component 8, the second heat-conducting component 9, the heat-spreading component 5 and the circuit board 3 can be the same or different.

[0185] Figure 20 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application. (Refer to...) Figure 20 The electrical connection structure also includes a fourth thermally conductive adhesive layer 704, which is filled with a material with a high thermal conductivity. The fourth thermally conductive adhesive layer 704 is filled between the second thermally conductive element 9 and the second electronic component 2 to transfer the heat generated by the second electronic component 2 to the second thermally conductive element 9.

[0186] It should be noted that in some embodiments, the fourth thermally conductive adhesive layer 704 may have adhesive properties, that is, the fourth thermally conductive adhesive layer 704 can bond the second thermally conductive element 9 and the second electronic component 2 together. In this case, the fourth thermally conductive adhesive layer 704 may be an underfill. In other embodiments, the fourth thermally conductive adhesive layer 704 may not have adhesive properties, that is, the fourth thermally conductive adhesive layer 704 may only serve as a thermally conductive structure and not as a connection and fixing structure. In this case, the third thermally conductive adhesive layer 703 may be silicone grease, thermally conductive gel, etc.

[0187] The fourth thermally conductive adhesive layer 704 is provided between the second thermally conductive component 9 and the second electronic component 2, which can help to quickly transfer heat from the second electronic component 2 to the second thermally conductive component 9, so that the heat generated by the second electronic component 2 can be directly transferred to the second thermally conductive component 9. This can improve the heat transfer efficiency and help improve the heat dissipation performance of electronic devices.

[0188] Figure 21 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application. Figure 22 This is a schematic diagram of an electrical connection structure provided in another embodiment of this application. (Refer to...) Figures 20 to 22 In some embodiments, for the third thermally conductive adhesive layer 703 and the fourth thermally conductive adhesive layer 704, the electrical connection structure may only provide the third thermally conductive adhesive layer 703, or only provide the fourth thermally conductive adhesive layer 704, or provide both the third thermally conductive adhesive layer 703 and the fourth thermally conductive adhesive layer 704.

[0189] In some embodiments, the orthographic projection of the first electronic component 1 onto the surface of the heat spreader 5 coincides with that of the heat spreader 5.

[0190] By aligning the orthographic projection of the first electronic component 1 onto the surface of the heat spreader 5 with that of the heat spreader 5, the contact area between the first electronic component 1 and the heat spreader 5 can be increased, which is equivalent to widening the heat transfer path and reducing the heat accumulation inside the first electronic component 1.

[0191] In other embodiments, the orthographic projection of the second electronic component 2 onto the surface of the heat spreader 5 coincides with that of the heat spreader 5.

[0192] By aligning the orthographic projection of the second electronic component 2 onto the surface of the heat spreader 5 with that of the heat spreader 5, the contact area between the second electronic component 2 and the heat spreader 5 can be increased, which is equivalent to widening the heat transfer path so that the heat generated by the second electronic component 2 can be quickly transferred to the heat spreader 5.

[0193] In some embodiments, the orthographic projections of the first electronic component 1 and the second electronic component 2 on the surface of the heat spreader 5 may both coincide with the heat spreader 5, or the orthographic projection of one of the first electronic component 1 and the second electronic component 2 on the surface of the heat spreader 5 may coincide with the heat spreader 5, while the orthographic projection of the other of the first electronic component 1 and the second electronic component 2 on the surface of the heat spreader 5 may not completely coincide with the heat spreader 5.

[0194] Figure 23 This is a cross-sectional schematic diagram of the heat spreader 5 provided in an embodiment of this application. (Refer to...) Figure 23 The heat spreader 5 includes a substrate 57 and a signal line 58 disposed on the substrate 57. The signal line 58 is electrically connected to the first electronic component 1 and the second electronic component 2, respectively.

[0195] The heat spreader 5 is provided with signal lines 58 that are electrically connected to the first electronic component 1 and the second electronic component 2 respectively. The first electronic component 1 and the second electronic component 2 can be connected by signal through the heat spreader 5. It is not necessary to set up additional leads to connect the first electronic component 1 and the second electronic component 2. The heat spreader 5 can be used for heat dissipation and signal transmission at the same time, which helps to reduce the wiring difficulty of the electrical connection structure.

[0196] Figure 24 This is a schematic diagram of the structure of the heat spreader 5 and the first electronic component 1 provided in an embodiment of this application. (Refer to...) Figure 23 , Figure 24 (a) and Figure 24 In (b), a device connection area 55 is provided on the surface of the substrate 57, a signal line 58 is provided in the device connection area 55, and a first electronic component 1 is provided in the device connection area 55; the heat dissipation component 5 also includes a first heat dissipation layer 53, which is provided on the surface of the substrate 57 and located outside the device connection area 55.

[0197] It should be noted that the first heat-spreading layer 53 can be connected to the first heat-conducting element 8, the first protrusion 42 and / or the second protrusion 52 in any of the above embodiments.

[0198] By placing the first electronic component 1 inside the device connection area 55 and placing the first heat dissipation layer 53 outside the device connection area 55, the obstruction of the first heat dissipation layer 53 by the first electronic component 1 can be reduced, allowing the heat dissipation component 5 to dissipate heat better.

[0199] In some embodiments, the first heat spreader 53 may be connected to the signal line 58 so that heat in the signal line 58 can be dissipated through the first heat spreader 53.

[0200] Non-device connection region 56 and device connection region 55 are disposed at intervals on the outer surface of substrate 57. (Refer to...) Figure 24In embodiment (a), the first heat dissipation layer 53 may cover a portion of the non-device connection area 56 on the surface of the substrate 57, that is, the area of ​​the first heat dissipation layer 53 is smaller than that of the non-device connection area 56, see reference. Figure 24 In (b) of the embodiments, in other embodiments, the first heat spreader 53 can completely cover the non-device connection area 56 on the surface of the substrate 57, that is, the area of ​​the first heat spreader 53 is equal to that of the non-device connection area 56.

[0201] The first heat dissipation layer 53 can completely cover the non-device connection area 56 on the surface of the substrate 57, which can increase the area of ​​the heat dissipation component 5 used for heat dissipation, thereby improving the heat dissipation effect of the electrical connection structure.

[0202] In some embodiments, the heat spreader 5 further includes a second heat spreader layer 54 disposed within the substrate 57, the second heat spreader layer 54 being connected to the first heat spreader layer 53.

[0203] It should be noted that the second heat dissipation layer 54 may or may not be connected to the signal line 58.

[0204] A second heat-spreading layer 54 is provided inside the heat-spreading component 5, and the second heat-spreading layer 54 is connected to the first heat-spreading layer 53. The heat inside the heat-spreading component 5 can be transferred to the first heat-spreading layer 53 through the second heat-spreading layer 54. In this way, the heat accumulation inside the heat-spreading component 5 can be reduced, which helps to improve the heat dissipation effect of the electrical connection structure.

[0205] In some embodiments, the first heat spreader 53 may be made of a metallic material, for example, the first heat spreader 53 may be a copper layer, a silver layer, a gold layer, etc.; in other embodiments, the first heat spreader 53 may be made of a non-metallic material, for example, the first heat spreader 53 may include carbon nanotubes, graphene, graphite, etc.

[0206] In some embodiments, the second heat spreader 54 may be made of a metallic material, for example, the second heat spreader 54 may be a copper layer, a silver layer, a gold layer, etc.; in other embodiments, the second heat spreader 54 may be made of a non-metallic material, for example, the second heat spreader 54 may include carbon nanotubes, graphene, graphite, etc.

[0207] In some embodiments, a device connection area 55 and a first heat dissipation layer 53 are provided on both sides of the substrate 57. One device connection area 55 is connected to the first electronic component 1, and the other device connection area 55 is connected to the second electronic component 2. The first heat dissipation layer 53 located on the same side as the electronic component is connected to the first heat conduction element 8, and the first heat dissipation layer 53 located on the same side as the second electronic component 2 is connected to the second heat conduction element 9.

[0208] In addition, in other embodiments, when the electrical connection structure further includes a third electronic component and is stacked between the first electronic component 1 and the second electronic component 2, a heat spreader 5 can be provided between the first electronic component 1 and the third electronic component, and between the third electronic component and the fourth electronic component. That is, when the number of stacked electronic components increases, the number of heat spreaders 5 can be increased accordingly. When the electrical connection structure has multiple stacked electronic components, multiple heat spreaders 5 are provided accordingly. A heat spreader 5 can be provided between two adjacent electronic components.

[0209] In any of the above embodiments, a seventh thermally conductive adhesive layer 707 may be filled between the second electronic component 2 and the circuit board 3. The seventh thermally conductive adhesive layer 707 is filled with a highly thermally conductive material so that the heat generated by the second electronic component 2 can be transferred to the circuit board 3 through the seventh thermally conductive adhesive layer 707.

[0210] The seventh thermally conductive adhesive layer 707 can have adhesive properties, that is, the seventh thermally conductive adhesive layer 707 can bond the circuit board 3 and the second electronic component 2 together. In this case, the seventh thermally conductive adhesive layer 707 can be an underfill. In other embodiments, the seventh thermally conductive adhesive layer 707 does not have adhesive properties, that is, the seventh thermally conductive adhesive layer 707 only serves as a thermally conductive structure and does not serve as a connection and fixing structure. In this case, the seventh thermally conductive adhesive layer 707 can be silicone grease, thermally conductive gel, etc.

[0211] In some embodiments, the second electronic component 2 is soldered to the circuit board 3 by a plurality of first solder balls 61, and the seventh thermally conductive adhesive layer 707 may be disposed between the gaps of the plurality of first solder balls 61.

[0212] In any of the above embodiments, an eighth thermally conductive adhesive layer 708 may be filled between the second electronic component 2 and the heat spreader 5. The eighth thermally conductive adhesive layer 708 is filled with a highly thermally conductive material so that the heat generated by the second electronic component 2 can be transferred to the heat spreader 5 through the eighth thermally conductive adhesive layer 708.

[0213] The eighth thermally conductive adhesive layer 708 may have adhesive properties, that is, the eighth thermally conductive adhesive layer 708 can bond the heat spreader 5 and the second electronic component 2 together. In this case, the eighth thermally conductive adhesive layer 708 may be an underfill. In other embodiments, the eighth thermally conductive adhesive layer 708 may not have adhesive properties, that is, the eighth thermally conductive adhesive layer 708 may only serve as a thermally conductive structure and not as a connection and fixing structure. In this case, the eighth thermally conductive adhesive layer 708 may be silicone grease, thermally conductive gel, etc.

[0214] In some embodiments, the second electronic component 2 is soldered to the heat spreader 5 by a plurality of second solder balls 62, and the eighth thermally conductive adhesive layer 708 may be disposed between the gaps of the plurality of second solder balls 62.

[0215] In some embodiments, the second solder ball 62 may be connected to the signal line 58 of the heat spreader 5.

[0216] In any of the above embodiments, a ninth thermally conductive adhesive layer 709 may be filled between the first electronic component 1 and the heat spreader 5. The ninth thermally conductive adhesive layer 709 is filled with a highly thermally conductive material so that the heat generated by the first electronic component 1 can be transferred to the heat spreader 5 through the ninth thermally conductive adhesive layer 709.

[0217] The ninth thermally conductive adhesive layer 709 may have adhesive properties, that is, the ninth thermally conductive adhesive layer 709 can bond the heat spreader 5 and the first electronic component 1 together. In this case, the ninth thermally conductive adhesive layer 709 may be an underfill. In other embodiments, the ninth thermally conductive adhesive layer 709 may not have adhesive properties, that is, the ninth thermally conductive adhesive layer 709 may only serve as a thermally conductive structure and not as a connection and fixing structure. In this case, the ninth thermally conductive adhesive layer 709 may be silicone grease, thermally conductive gel, etc.

[0218] In some embodiments, the first electronic component 1 is soldered to the heat spreader 5 by a plurality of third solder balls 63, and the ninth thermally conductive adhesive layer 709 may be disposed between the gaps of the plurality of third solder balls 63.

[0219] In some embodiments, the third solder ball 63 may be connected to the signal line 58 of the heat spreader 5.

[0220] In any of the above embodiments, a tenth thermally conductive adhesive layer 710 may be filled between the first electronic component 1 and the heat sink 4. The tenth thermally conductive adhesive layer 710 is filled with a highly thermally conductive material so that the heat generated by the first electronic component 1 can be transferred to the heat sink 4 through the tenth thermally conductive adhesive layer 710.

[0221] The tenth thermally conductive adhesive layer 710 can have adhesive properties, that is, the tenth thermally conductive adhesive layer 710 can bond the heat sink 4 and the first electronic component 1 together. In this case, the tenth thermally conductive adhesive layer 710 can be an underfill. In other embodiments, the tenth thermally conductive adhesive layer 710 does not have adhesive properties, that is, the tenth thermally conductive adhesive layer 710 only serves as a thermally conductive structure and does not serve as a connection and fixing structure. In this case, the tenth thermally conductive adhesive layer 710 can be silicone grease, thermally conductive gel, etc.

[0222] The electronic device provided in this application includes a housing, and the housing is provided with an electrical connection structure as described in any of the above embodiments.

[0223] A heat spreader 5 is provided between the first electronic component 1 and the second electronic component 2 in the electrical connection structure of the electronic device. The heat spreader 5 can absorb the heat generated by the first electronic component 1 and the second electronic component 2. The heat generated by the second electronic component 2 can be directly transferred to the heat spreader 5, and the heat generated by the second electronic component 2 can be absorbed by the heat spreader 5. This reduces heat accumulation within the first electronic component 1 and the second electronic component 2, helps to lower the temperature of the first electronic component 1 and the second electronic component 2, improves heat transfer efficiency, and helps to improve the heat dissipation performance of the electronic device. In addition, when the local temperature of the first electronic component 1 and the second electronic component 2 is too high, the heat spreader 5 can also absorb the heat in these areas to balance the overall temperature of the first electronic component 1 and the second electronic component 2, so that the first electronic component 1 and the second electronic component 2 can operate within a suitable temperature range, thereby improving the performance of the electronic device.

[0224] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electrical connection structure, characterized in that, include: Radiator (4); Circuit board (3), wherein the circuit board (3) and the heat sink (4) are spaced apart; An electronic component assembly comprising a first electronic component (1) and a second electronic component (2) stacked between the heat sink (4) and the circuit board (3), wherein the first electronic component (1) is in contact with the heat sink (4) and the second electronic component (2) is in contact with the circuit board (3); A heat spreader (5) is located between the first electronic component (1) and the second electronic component (2), and the heat spreader (5) is used to absorb the heat generated by the first electronic component (1) and the second electronic component (2).

2. The electrical connection structure according to claim 1, characterized in that, The heat spreader (5) has a first heat conduction element (8) on the side facing the heat sink (4). The first heat conduction element (8) is connected to the heat sink (4) and the heat spreader (5) respectively. The first heat conduction element (8) is used to transfer the heat absorbed by the heat spreader (5) to the heat sink (4).

3. The electrical connection structure according to claim 2, characterized in that, Multiple first heat-conducting elements (8) are provided, and multiple first heat-conducting elements (8) are arranged around the central axis of the first electronic component (1); Alternatively, the cross-section of the first heat-conducting element (8) is annular, and the first electronic component (1) is disposed within the annular region of the first heat-conducting element (8).

4. The electrical connection structure according to claim 2 or 3, characterized in that, A first thermally conductive adhesive layer (701) is provided between the first thermally conductive component (8) and the heat sink (4), and / or, a second thermally conductive adhesive layer (702) is provided between the first thermally conductive component (8) and the heat-spreading component (5); wherein, the first thermally conductive adhesive layer (701) is filled with a material with high thermal conductivity, and the second thermally conductive adhesive layer (702) is filled with a material with high thermal conductivity; or, A first thermally conductive adhesive layer (701) is disposed between the first thermally conductive component (8) and the heat sink (4), and the first thermally conductive component (8) is welded to the heat spreader (5); or, The first heat-conducting component (8) is welded to the heat sink (4), and a second thermally conductive adhesive layer (702) is disposed between the first heat-conducting component (8) and the heat-spreading component (5); or, The two ends of the first heat-conducting component (8) are welded to the heat sink (4) and the heat-spreading component (5), respectively.

5. The electrical connection structure according to any one of claims 2-4, characterized in that, The electrical connection structure further includes a third thermally conductive adhesive layer (703), which is filled with a material with high thermal conductivity and is filled between the first thermally conductive element (8) and the first electronic component (1).

6. The electrical connection structure according to any one of claims 1-5, characterized in that, The radiator (4) includes a first body (41) spaced apart from the heat spreader (5). The first body (41) has a first protrusion (42) on its side facing the heat spreader (5), and the end face of the first protrusion (42) is connected to the heat spreader (5); and / or, The heat spreader (5) includes a second body (51) disposed between the first electronic component (1) and the second electronic component (2). The second body (51) has a second protrusion (52) on the side facing the heat sink (4). The end face of the second protrusion (52) is connected to the heat sink (4).

7. The electrical connection structure according to any one of claims 1-6, characterized in that, The heat spreader (5) has a second heat conduction element (9) on the side facing the second electronic component (2). The second heat conduction element (9) is connected to the circuit board (3) and the heat spreader (5) respectively. The second heat conduction element (9) is used to transfer the heat absorbed by the heat spreader (5) to the circuit board (3).

8. The electrical connection structure according to claim 7, characterized in that, The electrical connection structure further includes a fourth thermally conductive adhesive layer (704), which is filled with a material with a high thermal conductivity and is filled between the second thermally conductive element (9) and the second electronic component (2).

9. The electrical connection structure according to any one of claims 1-8, characterized in that, The orthographic projection of the first electronic component (1) onto the surface of the heat spreader (5) coincides with the heat spreader (5); and / or, the orthographic projection of the second electronic component (2) onto the surface of the heat spreader (5) coincides with the heat spreader (5).

10. The electrical connection structure according to claim 9, characterized in that, The heat spreader (5) includes a substrate (57) and a signal line (58) disposed on the substrate (57), and the signal line (58) is electrically connected to the first electronic component (1) and the second electronic component (2) respectively.

11. The electrical connection structure according to claim 10, characterized in that, The substrate (57) has a device connection area (55) on its surface, and the signal line (58) is disposed in the device connection area (55). The first electronic component (1) is disposed in the device connection area (55). The heat spreader (5) further includes a first heat spreader layer (53), which is disposed on the surface of the substrate (57) and located outside the device connection area (55).

12. The electrical connection structure according to claim 11, characterized in that, The first heat dissipation layer (53) completely covers the non-device connection area (56) on the surface of the substrate (57), and the non-device connection area (56) and the device connection area (55) are disposed at intervals on the surface of the substrate (57).

13. The electrical connection structure according to claim 11 or 12, characterized in that, The heat spreader (5) further includes a second heat spreader layer (54) disposed in the substrate (57), and the second heat spreader layer (54) is connected to the first heat spreader layer (53).

14. An electronic device, comprising a housing, characterized in that, The housing is provided with an electrical connection structure as described in any one of claims 1-13.

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