Apparatus system for detecting curing rate of thermosetting glue for photovoltaic module

Abstract

The utility model provides a kind of for photovoltaic module hot glue curing rate detection equipment system, including sample preparation tool, conveying device, heating device and weighing device.Sample preparation tool is equipped with sample preparation cavity.Conveying device is used to convey sample preparation tool along conveying path.Heating device is located on the conveying path of conveying device.Weighing device is used to weigh sample block before and after xylene extraction treatment to sample block.In the application, the process of hot solidification of string welding machine in production line is simulated by heating device, and the sample block after curing treatment is obtained, and then the sample block is weighed, xylene extraction treatment and calculation are carried out, the curing rate of hot glue based on the actual string welding condition of production line is obtained, the curing rate detection of hot glue based on the actual string welding condition of production line can be realized, the problem of unqualified glue point tension caused by the lack of hot glue curing rate detection in the hot solidification string welding link of photovoltaic module is solved, and the reliability and quality of photovoltaic module are improved.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic technology, and in particular to a device system for detecting the curing rate of thermosetting adhesives for photovoltaic modules. Background Technology

[0002] Zero Busbar (OBB) is an emerging technology in photovoltaic (PV) module stringing. In the OBB thermosetting module process, the thermosetting adhesive dots printed on the cell surface and the solder ribbon are heated to create tension between the adhesive dots and the solder ribbon, replacing the tension of the silver paste pads and solder ribbons used in the original Super Multi Busbar (SMBB) technology. The tension of the thermosetting adhesive dots is strongly correlated with their curing rate; that is, increasing the curing rate effectively improves the tension. However, current technology lacks equipment for detecting the curing rate of thermosetting adhesives in the PV module stringing process. Utility Model Content

[0003] Therefore, it is necessary to address the lack of a device for detecting the curing rate of thermosetting adhesives in the thermosetting stringing process of photovoltaic modules in the existing technology, and to provide a device system for detecting the curing rate of thermosetting adhesives in photovoltaic modules.

[0004] The technical solution is as follows:

[0005] On the one hand, a device system for testing the curing rate of thermosetting adhesives for photovoltaic modules is provided, comprising:

[0006] The sample preparation fixture is equipped with a sample preparation cavity for containing thermosetting adhesive;

[0007] A conveying device is used to convey the sample preparation tooling along a conveying path;

[0008] A heating device is provided on the conveying path of the conveying device and is used to heat the thermosetting adhesive in the sample preparation chamber to solidify the thermosetting adhesive and form a sample block.

[0009] A weighing device is used to weigh the sample block before and after xylene extraction.

[0010] The equipment system for detecting the curing rate of thermosetting adhesives for photovoltaic modules described in the above embodiments is used as follows: First, thermosetting adhesive is dripped into the sample preparation chamber. Next, the sample preparation fixture containing the thermosetting adhesive is placed on a conveying device, which uses a simulated automatic welding motion mode to deliver the fixture into a heating device. Then, the heating device simulates the thermal field temperature and conditions of thermosetting adhesive curing during normal welding and heats the thermosetting adhesive in the sample preparation chamber, causing it to solidify and form a sample block. Next, the sample block is weighed to obtain the weight W1 of the sample block before extraction, and then subjected to xylene extraction. After the xylene extraction is completed, the sample block is weighed again to obtain the mass W2 of the extracted sample block. Finally, the curing rate P of the thermosetting adhesive is calculated based on the weight of the sample block before extraction and the mass of the sample block after extraction, i.e., P = W2 / W1 * 100%. The equipment system for detecting the curing rate of thermosetting adhesives for photovoltaic modules in this application simulates the thermosetting process of the string welding machine on the production line using a heating device to obtain a cured sample block. The sample block is then weighed, extracted with xylene, and calculated to obtain the curing rate of the thermosetting adhesive under actual string welding conditions on the production line. This system can detect the curing rate of thermosetting adhesives under actual string welding conditions on the production line, solving the problem of unqualified adhesive dot pull caused by the lack of thermosetting adhesive curing rate detection in the thermosetting string welding process of photovoltaic modules, thereby improving the reliability and quality of photovoltaic modules.

[0011] The technical solution will be further explained below:

[0012] In one embodiment, the sample preparation fixture includes a base plate, a carrier plate, and a cover plate. The carrier plate is placed on one side of the base plate and has a sample preparation hole. The cover plate covers the side of the carrier plate away from the base plate and forms the sample preparation cavity with the base plate and the inner wall of the sample preparation hole.

[0013] In one embodiment, the sample preparation fixture further includes a first isolation layer and a second isolation layer. The first isolation layer is located between the base plate and the carrier plate to isolate the base plate from the thermosetting adhesive in the sample preparation cavity, and the second isolation layer is located between the cover plate and the carrier plate to isolate the cover plate from the thermosetting adhesive in the sample preparation cavity.

[0014] In one embodiment, the cover plate is provided with a clearance hole, which is configured to correspond to the sample preparation hole when the cover plate is disposed on the side of the carrier plate away from the base plate.

[0015] In one embodiment, the inner diameter of the clearance hole is equal to the inner diameter of the sample preparation hole.

[0016] In one embodiment, the outer contour shape of the base plate, the outer contour shape of the carrier plate, and the outer contour shape of the cover plate are adapted to each other.

[0017] In one embodiment, the thickness of the base plate is 2.0 mm to 3.2 mm;

[0018] And / or, the thickness of the carrier plate is 0.3 mm to 0.5 mm;

[0019] And / or, the thickness of the cover plate is 0.5 mm to 1.0 mm.

[0020] In one embodiment, the sample preparation fixture further includes a fixing member for fixing the base plate, the carrier plate and the cover plate together.

[0021] In one embodiment, the heating device is configured as a string welding machine light box.

[0022] In one embodiment, the equipment system for detecting the curing rate of thermosetting adhesives for photovoltaic modules further includes a cutting device for cutting the sample block. Attached Figure Description

[0023] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a device system according to one embodiment.

[0026] Figure 2 This is a schematic diagram of the sample preparation tooling in one embodiment.

[0027] Explanation of reference numerals in the attached figures:

[0028] 10. Equipment system; 100. Sample preparation fixture; 110. Base plate; 120. Carrier plate; 121. Sample preparation hole; 130. Cover plate; 131. Clearance hole; 140. First isolation layer; 150. Second isolation layer; 200. Conveying device; 300. Heating device; 20. Thermosetting adhesive. Detailed Implementation

[0029] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0030] like Figure 1 and Figure 2 As shown, in one embodiment, an equipment system 10 for detecting the curing rate of thermosetting adhesives for photovoltaic modules is provided, including a sample preparation fixture 100, a conveying device 200, a heating device 300, and a weighing device (not shown). The sample preparation fixture 100 has a sample preparation cavity for containing thermosetting adhesive 20. The conveying device 200 is used to convey the sample preparation fixture 100 along a conveying path. The heating device 300 is disposed on the conveying path of the conveying device 200 and is used to heat the thermosetting adhesive 20 in the sample preparation cavity to cure the thermosetting adhesive 20 into a sample block. The weighing device is used to weigh the sample block before and after xylene extraction treatment.

[0031] In the above embodiment, the equipment system 10 for detecting the curing rate of thermosetting adhesive for photovoltaic modules is used as follows: First, thermosetting adhesive 20 is dripped into the sample preparation chamber. Next, the sample preparation fixture 100 carrying the thermosetting adhesive 20 is placed on the conveying device 200, which uses a simulated automatic welding motion mode to deliver the sample preparation fixture 100 into the heating device 300. Then, the heating device 300 simulates the thermal field temperature and conditions of the thermosetting adhesive 20 curing during normal welding and heats the thermosetting adhesive 20 in the sample preparation chamber, causing the thermosetting adhesive 20 to cure and form a sample block. Next, the sample block is weighed to obtain the weight W1 of the sample block before extraction, and then the sample block is subjected to xylene extraction. After the xylene extraction is completed, the sample block is weighed again to obtain the mass W2 of the extracted sample block. Finally, the curing rate P of the thermosetting adhesive 20 is calculated based on the weight of the sample block before extraction and the mass of the sample block after extraction, i.e., P = W2 / W1 * 100%. The equipment system 10 for detecting the curing rate of thermosetting adhesive in photovoltaic modules uses a heating device 300 to simulate the thermosetting process of the string welding machine on the production line, obtaining a sample block after curing treatment. The sample block is then weighed, subjected to xylene extraction treatment, and calculated to obtain the curing rate of thermosetting adhesive 20 under actual string welding conditions on the production line. This system can detect the curing rate of thermosetting adhesive 20 under actual string welding conditions on the production line, solving the problem of unqualified adhesive dot pull caused by the lack of detection of the curing rate of thermosetting adhesive 20 in the thermosetting string welding process of photovoltaic modules, thereby improving the reliability and quality of photovoltaic modules.

[0032] The heating device 300 can be any existing heating structure capable of heating and curing the thermosetting adhesive 20. Specifically, in this embodiment, the heating device 300 can be a string welding machine light box.

[0033] The weighing device can be any existing weighing structure capable of weighing the sample block. Specifically, in this embodiment, the weighing device is located on one side of the heating device 300.

[0034] Specifically, in this embodiment, the equipment system 10 for detecting the curing rate of thermosetting adhesives for photovoltaic modules also includes any of the prior art extraction devices (not shown) capable of extracting xylene from the sample block. The extraction device is located on one side of the heating device 300.

[0035] Optionally, the equipment system 10 for detecting the curing rate of thermosetting adhesives for photovoltaic modules also includes a cutting device (not shown) for cutting the sample block. The cutting device is located between the heating device 300 and the weighing device. In this way, the cutting device can cut the sample block to a preset size to facilitate xylene extraction treatment of the sample block, thereby improving the practicality of the equipment system 10.

[0036] The preset size can be flexibly adjusted according to actual needs. Specifically, in this embodiment, the size of the cut sample block can be set to 3mm*3mm. It should be noted that the weighing device weighs the cut sample block before xylene extraction.

[0037] like Figure 2 As shown, in one embodiment, the sample preparation fixture 100 includes a base plate 110, a carrier plate 120, and a cover plate 130. The carrier plate 120 is placed on one side of the base plate 110 and has a sample preparation hole 121. The cover plate 130 covers the side of the carrier plate 120 away from the base plate 110 and forms a sample preparation cavity with the inner wall of the base plate 110 and the sample preparation hole 121. Thus, the sample preparation fixture 100 is configured as a stacked structure, which facilitates the dripping of thermosetting adhesive 20 into the sample preparation cavity and the assembly and disassembly of the sample preparation fixture 100.

[0038] In this specific embodiment, the conveying device 200 includes a conveyor belt. When the sample preparation fixture 100 is placed on the conveyor belt, the base plate 110 faces the conveyor belt.

[0039] like Figure 2As shown, the sample preparation fixture 100 further includes a first isolation layer 140 and a second isolation layer 150. The first isolation layer 140 is located between the base plate 110 and the carrier plate 120 to isolate the base plate 110 from the thermosetting adhesive 20 in the sample preparation chamber. The second isolation layer 150 is located between the cover plate 130 and the carrier plate 120 to isolate the cover plate 130 from the thermosetting adhesive 20 in the sample preparation chamber. In this way, the first isolation layer 140 and the second isolation layer 150 can protect the thermosetting adhesive 20 in the sample preparation chamber from contamination, while also facilitating the subsequent peeling of the sample block, thus improving the practicality of the equipment system 10.

[0040] Specifically, in this embodiment, the sample preparation cavity is formed by the inner wall of the first isolation layer 140, the second isolation layer 150, and the sample preparation hole 121. The sample preparation hole 121 is located in the middle of the carrier plate 120.

[0041] Both the first isolation layer 140 and the second isolation layer 150 can be made of high-temperature resistant materials. Both the first isolation layer 140 and the second isolation layer 150 can be configured as isolation plates, isolation sheets, isolation films, or other isolation structures. Specifically, in this embodiment, both the first isolation layer 140 and the second isolation layer 150 are configured as high-temperature resistant release films.

[0042] like Figure 2 As shown, optionally, the cover plate 130 is provided with a clearance hole 131, which is configured to correspond to the sample preparation hole 121 when the cover plate 130 is located on the side of the carrier plate 120 away from the base plate 110. In this way, the clearance hole 131 can avoid the heating light, so that the subsequent heating light can directly irradiate the thermosetting adhesive 20 to heat and cure it.

[0043] The inner diameter of the sample preparation hole 121 and the inner diameter of the clearance hole 131 can be flexibly adjusted according to the actual needs of use.

[0044] Optionally, the inner diameter of the clearance hole 131 is equal to the inner diameter of the sample preparation hole 121. Specifically, in this embodiment, both the clearance hole 131 and the sample preparation hole 121 are circular holes, and the radius of both the clearance hole 131 and the sample preparation hole 121 is set to 50 mm.

[0045] In one embodiment, the outer contour shapes of the base plate 110, the carrier plate 120, and the cover plate 130 are adapted to each other. In this way, the outer sidewalls of the base plate 110, the carrier plate 120, and the cover plate 130 can play a positioning role, which facilitates the stacking and positioning of the base plate 110, the carrier plate 120, and the cover plate 130.

[0046] Specifically, in this embodiment, the outer contour shapes of the base plate 110, the carrier plate 120, the cover plate 130, the first isolation layer 140, and the second isolation layer 150 are adapted to each other.

[0047] The dimensions of the base plate 110, carrier plate 120, cover plate 130, first isolation layer 140 and second isolation layer 150 can be flexibly adjusted according to actual usage needs.

[0048] Optionally, the base plate 110 is made of semi-tempered glass. The length and width dimensions of the base plate 110 are set to 210mm * 210mm. The thickness of the base plate 110 is set to 2.0mm to 3.2mm. The base plate 110 serves as the substrate of the sample preparation fixture 100, providing support. Specifically, in this embodiment, the thickness of the base plate 110 is set to 3.2mm.

[0049] Optionally, the carrier plate 120 is made of stainless steel. The length and width dimensions of the carrier plate 120 are set to 210mm * 210mm. The thickness of the carrier plate 120 is set to 0.3mm to 0.5mm.

[0050] Optionally, the cover plate 130 is made of stainless steel. The length and width dimensions of the cover plate 130 are set to 210mm*210mm. The thickness of the cover plate 130 is set to 0.5mm to 1.0mm. The cover plate 130 cooperates with the base plate 110 to fix and clamp the sample block.

[0051] In one embodiment, the sample preparation fixture 100 further includes a fastener (not shown) for securing the base plate 110, carrier plate 120, and cover plate 130 together. This fastener ensures that the base plate 110, carrier plate 120, and cover plate 130 do not move relative to each other during transport and heat curing, thus improving the reliability of the equipment system 10.

[0052] The fastener can be a fastener, a fastening adhesive, or other high-temperature resistant fastening structure.

[0053] Specifically, in this embodiment, the fastener can be a high-temperature resistant tape. When the base plate 110, the first isolation layer 140, the carrier plate 120, the second isolation layer 150, and the cover plate 130 are stacked together to form a stacked structure, the high-temperature resistant tape is used to firmly fix the stacked structure around its perimeter to prevent it from shaking and improve the reliability of the equipment system 10.

[0054] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0055] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0056] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0057] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0058] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0059] It should also be understood that, in interpreting the connection or positional relationships of components, although not explicitly described, connection and positional relationships are interpreted to include a range of error, which should be within the acceptable deviation range of a specific value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0060] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0061] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A device system for detecting the curing rate of thermosetting adhesives for photovoltaic modules, characterized in that, include: The sample preparation fixture (100) is provided with a sample preparation cavity for containing thermosetting adhesive (20); A conveying device (200) is used to convey the sample preparation tooling (100) along a conveying path. A heating device (300) is provided on the conveying path of the conveying device (200) and is used to heat the thermosetting adhesive (20) in the sample preparation chamber so that the thermosetting adhesive (20) is cured to form a sample block. A weighing device is used to weigh the sample block before and after xylene extraction.

2. The equipment system for detecting the curing rate of thermosetting adhesives for photovoltaic modules according to claim 1, characterized in that, The sample preparation fixture (100) includes a base plate (110), a carrier plate (120), and a cover plate (130). The carrier plate (120) is placed on one side of the base plate (110) and has a sample preparation hole (121). The cover plate (130) covers the side of the carrier plate (120) away from the base plate (110) and forms the sample preparation cavity with the inner wall of the base plate (110) and the sample preparation hole (121).

3. The equipment system for detecting the curing rate of thermosetting adhesives for photovoltaic modules according to claim 2, characterized in that, The sample preparation fixture (100) further includes a first isolation layer (140) and a second isolation layer (150). The first isolation layer (140) is located between the base plate (110) and the carrier plate (120) to isolate the base plate (110) from the thermosetting adhesive (20) in the sample preparation cavity. The second isolation layer (150) is located between the cover plate (130) and the carrier plate (120) to isolate the cover plate (130) from the thermosetting adhesive (20) in the sample preparation cavity.

4. The equipment system for detecting the curing rate of thermosetting adhesives for photovoltaic modules according to claim 3, characterized in that, The cover plate (130) is provided with a clearance hole (131), which is configured to correspond to the sample preparation hole (121) when the cover plate (130) is located on the side of the carrier plate (120) away from the bottom plate (110).

5. The equipment system for detecting the curing rate of thermosetting adhesives for photovoltaic modules according to claim 4, characterized in that, The inner diameter of the clearance hole (131) is equal to the inner diameter of the sample preparation hole (121).

6. The equipment system for detecting the curing rate of thermosetting adhesives for photovoltaic modules according to claim 2, characterized in that, The outer contour shape of the base plate (110), the outer contour shape of the carrier plate (120), and the outer contour shape of the cover plate (130) are adapted to each other.

7. The equipment system for detecting the curing rate of thermosetting adhesives for photovoltaic modules according to claim 2, characterized in that, The thickness of the base plate (110) is 2.0 mm to 3.2 mm; And / or, the thickness of the carrier plate (120) is 0.3 mm to 0.5 mm; And / or, the thickness of the cover plate (130) is 0.5 mm to 1.0 mm.

8. The equipment system for detecting the curing rate of thermosetting adhesives for photovoltaic modules according to claim 2, characterized in that, The sample preparation fixture (100) also includes a fixing component, which is used to fix the base plate (110), the carrier plate (120) and the cover plate (130) into one piece.

9. The equipment system for detecting the curing rate of thermosetting adhesives for photovoltaic modules according to any one of claims 1 to 8, characterized in that, The heating device (300) is configured as a string welding machine light box.

10. The equipment system for detecting the curing rate of thermosetting adhesives for photovoltaic modules according to any one of claims 1 to 8, characterized in that, The equipment system (10) for detecting the curing rate of thermosetting adhesives for photovoltaic modules further includes a cutting device for cutting the sample block.

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