Chip shifting assembly and chip testing device

Abstract

This utility model relates to the field of chip testing technology, and discloses a chip shifting component and a chip testing device. The chip shifting component includes a movable base and a sealing ring disposed on the movable base. A gas channel is provided within the movable base, one end of which connects to the space surrounded by the sealing ring. A vacuum generator connected to the other end of the gas channel can create a negative pressure area within this space, allowing the chip under test to be adsorbed by surrounding the outer periphery of several probe contacts of the chip under test with the sealing ring. The chip shifting component provided by this utility model uses a sealing ring on the movable base to create a negative pressure area capable of accommodating the probe contacts. When picking up the chip under test, it is only necessary to surround and cover the outer periphery of the probe contacts, facilitating positioning and providing sufficient opening area for stable and effective picking up of the main chip for testing, increasing testing efficiency and yield.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, specifically to a chip shifting component and a chip testing device. Background Technology

[0002] The main chip of a mobile phone is generally in a POP (Package-on-Package) structure (layered package structure). This means a DDR chip (memory chip) is attached to the top surface of the main chip. During measurement, the main chip requires a transfer device with a vacuum generator. The vacuum chuck of the transfer device adheres to the top surface of the main chip, moving it to the target location for testing. The vacuum level and the opening area of ​​the chuck determine the adhesion quality. Due to the limitations of the I / O area (probe contact area) on the top surface of the main chip, traditional horn-shaped vacuum chucks are often affected by this area, requiring multiple chucks to adhere to locations on the main chip without I / O areas. Furthermore, they cannot stably and effectively lift the main chip for testing, affecting testing efficiency and yield. Utility Model Content

[0003] In order to solve the above-mentioned technical problems, or at least partially solve the above-mentioned technical problems, the present invention provides a chip shifting component and a chip testing device.

[0004] This utility model provides a chip shifting assembly, including a movable base and a sealing ring disposed on the movable base. The movable base is provided with a gas channel, one end of which is connected to the space surrounded by the sealing ring. A negative pressure area can be formed in the space by a vacuum generator connected to the other end of the gas channel, so that the chip under test can be adsorbed by the sealing ring surrounding the outer periphery of several probe contacts of the chip under test.

[0005] Optionally, the interior of the movable base is provided with a memory chip and a plurality of probes for electrically connecting the memory chip to the chip under test, wherein the probes correspond one-to-one with the probe contacts;

[0006] The sealing ring is made of an elastic material so that it is compressed when the chip under test is adsorbed, and the probe makes contact with the probe contact point.

[0007] Optionally, the movable base includes an upper base and a lower base that are interlocked and sealed to each other, the memory chip is located in the upper base, the sealing ring is disposed on the side of the lower base opposite to the upper base, and the plurality of probes pass through the lower base and extend to the negative pressure area.

[0008] Optionally, the lower body has probe holes at positions corresponding to the negative pressure area, allowing the probes to pass through, and a gas inlet is formed at the center position corresponding to the negative pressure area, connecting the gas channel to the negative pressure area.

[0009] Optionally, the movable seat body is provided with an annular groove for installing the sealing ring, the depth of which is less than the thickness of the sealing ring.

[0010] Optionally, one end of the gas channel for connection with the vacuum generator is located on the side of the movable base away from the negative pressure area.

[0011] Optionally, the sealing ring has a rectangular or circular cross-section.

[0012] This utility model also provides a chip testing device, including a test base and the aforementioned chip shifting component, wherein the moving base of the chip shifting component can drive the chip under test to move into the test base, and the chip under test is tested through the test base.

[0013] Optionally, the test housing is provided with a test circuit board, and the chip under test moved into the test housing can be electrically connected to the test circuit board.

[0014] Optionally, the test base is provided with multiple slots, and the movable base is provided with multiple plugs that match the slots, with each slot corresponding to one of the multiple plugs.

[0015] The technical solution provided by this utility model has the following advantages compared with the prior art:

[0016] The chip shifting assembly provided by this utility model has a sealing ring on the moving base to form a negative pressure area that can accommodate the probe contacts. When picking up the chip to be tested, the sealing ring only needs to be placed around the outer periphery of the probe contacts, which is convenient for positioning and has a sufficient opening area to stably and effectively pick up the main chip for testing, thereby increasing testing efficiency and yield. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a cross-sectional view of the chip shifting assembly described in an embodiment of the present invention;

[0020] Figure 2 This is a bottom view of the chip shifting assembly described in this embodiment of the present invention;

[0021] Figure 3 This is an exploded view of the chip testing device according to an embodiment of the present invention.

[0022] Explanation of reference numerals in the attached figures

[0023] 1. Movable base; 11. Gas channel; 111. Gas inlet; 112. Gas outlet; 12. Memory chip; 121. Probe; 13. Upper base; 14. Lower base; 15. Annular groove; 16. Insert block; 2. Sealing ring; 3. Negative pressure area; 4. Chip under test; 41. Probe contact; 5. Test base; 51. Slot. Detailed Implementation

[0024] To better understand the above-mentioned objectives, features, and advantages of this utility model, the solution of this utility model will be further described below. It should be noted that, unless otherwise specified, the embodiments and features of this utility model can be combined with each other.

[0025] The following description sets forth many specific details to provide a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein; obviously, the embodiments described in the specification are only some embodiments of the present invention, and not all embodiments.

[0026] Combination Figure 1 and Figure 2 As shown, the chip shifting assembly provided in this embodiment of the present invention includes a movable base 1 and a sealing ring 2 disposed on the movable base 1, wherein the sealing ring 2 is disposed on the side of the movable base 1 facing the test base 5. A gas channel 11 is provided inside the movable base 1. When a memory chip 12 is disposed inside the movable base 1, the gas channel 11 should bypass the memory chip 12. The extension method of the gas channel 11 is not limited and can be designed according to actual needs. One end of the gas channel 11 is connected to the space surrounded by the sealing ring 2, and a negative pressure region 3 can be formed in this space by a vacuum generator connected to the other end of the gas channel 11, so that the chip under test 4 is adsorbed by the sealing ring 2 surrounding the outer periphery of several probe contacts 41 of the chip under test 4.

[0027] Specifically, the space is formed between the sealing ring 2 and the end of the movable base 1, and a negative pressure region 3 is formed in the control by the negative pressure provided by the vacuum generator. During operation, when the sealing ring 2 comes into contact with the chip under test 4, the negative pressure region 3 generates a negative pressure under the action of the vacuum generator, so that the chip under test 4 can be adsorbed onto the end of the sealing ring 2, and can be moved by the movable base 1. One end of the gas channel 11 is connected to the negative pressure region 3, and the other end is connected to the vacuum generator. Specifically, the gas channel 11 has a gas inlet and a gas outlet 112. The gas inlet is connected to the negative pressure region 3, and the gas outlet 112 is connected to the vacuum generator. The vacuum generator can generate suction to form a negative pressure in the negative pressure region 3. The sealing ring 2 can surround the outer periphery of several probe contacts 41 of the chip under test 4, and the depth of the negative pressure area 3 should be greater than the height of the probe contacts 41 of the chip under test 4, so that the negative pressure area 3 can accommodate the probe contacts 41 of the chip under test 4, and avoid the probe contacts 41 of the chip under test 4 from affecting the adsorption connection between the sealing ring 2 and the chip under test 4.

[0028] The chip shifting assembly provided by this utility model features a sealing ring 2 on the moving base 1 to form a negative pressure area 3 capable of accommodating the probe contact 41. When picking up the chip under test 4, the sealing ring 2 only needs to be placed around the outer periphery of the probe contact 41, facilitating positioning and providing sufficient opening area for stable and effective picking up of the main chip for testing, thus increasing testing efficiency and yield. Furthermore, it eliminates the need for multiple horn-shaped vacuum chucks, effectively reducing costs.

[0029] In some embodiments, the movable base 1 contains a memory chip 12 and a plurality of probes 121 for electrically connecting the memory chip 12 to the chip under test 4. Specifically, the memory chip 12 has a plurality of probes 121 positioned on the side of the memory chip 12 facing the chip under test 4, with each probe 121 corresponding to a probe contact 41. The sealing ring 2 is made of an elastic material, allowing it to be compressed when the chip under test 4 is adsorbed, thus bringing the probes 121 into contact with the probe contacts 41. The elastic sealing ring 2 allows for axial compression, enabling the ends of the probes 121 to contact the probe contacts 41 during compression and allowing it to reset after the external force is removed. The sealing ring 2 maintains a reasonable compression ratio and elasticity, ensuring stable operation within a certain number of cycle tests and increasing its service life. It is understandable that after the sealing ring 2 adsorbs the chip under test 4, it can be compressed under the negative pressure of the negative pressure area 3, so that the probe 121 is electrically connected to the probe contact 41; or, the end of the sealing ring 2 away from the memory chip 12 is subjected to external force, so that the sealing ring 2 is compressed. These are not limiting factors.

[0030] In the non-test state, the sealing ring 2 is in its normal (uncompressed) state. The tip of the probe 121 of the memory chip 12 extends into the negative pressure area 3, and the tip of the probe 121 does not protrude from the tip of the sealing ring 2 to avoid affecting the adhesion of the sealing ring 2 to the side of the chip under test 4. During testing, the sealing ring 2 adheres to the chip under test 4, and the sealing ring 2 is compressed. The chip under test 4 and the memory chip 12 are electrically connected through the probe 121. The moving base 1 moves the chip under test 4 into the test base 5 through the sealing ring 2. The chip under test 4 is electrically connected to the test circuit board. As the pressure applied by the moving base 1 increases, the sealing ring 2 can begin to compress along its axial direction, increasing the tightness of the connection between the test circuit board, the chip under test 4, and the memory chip 12 for testing. After the test is completed, the sealing ring 2 picks up the chip under test 4, and the moving base 1 moves the chip under test 4 to the next position.

[0031] This design ensures that the adsorption force between the sealing ring 2 and the chip under test 4 is large enough to ensure the accuracy of the movement and positioning of the chip under test 4. Moreover, the design of the sealing ring 2 will not affect the electrical connection between the test circuit board, the chip under test 4 and the memory chip 12, thus increasing the test efficiency.

[0032] In some implementations, such as Figure 1 As shown, the movable base 1 includes an upper base 13 and a lower base 14 that are interlocked and sealed to each other. The memory chip 12 is located inside the upper base 13. The sealing ring 2 is disposed on the side of the lower base 14 away from the upper base 13. Several probes 121 pass through the lower base 14 and extend to the negative pressure area 3.

[0033] In this design, the modular design of the mobile base 1 facilitates the installation and removal of the memory chip 12, increases the convenience of replacement, and makes the maintenance of the mobile base 1 easier.

[0034] In some embodiments, the lower body 14 has probe holes at positions corresponding to the negative pressure region 3, allowing the probe 121 to pass through, to facilitate the installation and removal of the probe 121. A gas inlet 111 is formed at the center position corresponding to the negative pressure region 3, connecting the gas passage 11 to the negative pressure region 3.

[0035] In this design, a gas inlet 111 is formed at the center of the lower body 14, which helps to increase the stability of adsorption.

[0036] In some implementations, reference continues. Figure 1The movable base 1 has an annular groove 15 for mounting the sealing ring 2, the depth of which is less than the thickness of the sealing ring 2. Specifically, the movable base 1 has an annular groove 15 on the side facing the test base 5. The shape of the annular groove 15 matches the shape of the sealing ring 2, so that one end of the sealing ring 2 can extend into the annular groove 15 and the other end of the sealing ring 2 can extend out of the annular groove 15. The sealing ring 2 and this side of the movable base 1 form a negative pressure area 3. The way the sealing ring 2 is connected to the annular groove 15 is not limited. For example, the end of the sealing ring 2 that extends into the annular groove 15 can be bonded to the annular groove 15; or the end of the sealing ring 2 that extends into the annular groove 15 can be snapped into the annular groove 15. These are not limiting and can be designed according to actual needs.

[0037] In this design, an annular groove 15 for installing the sealing ring 2 is formed on the movable base 1 to increase the convenience and firmness of the installation of the sealing ring 2.

[0038] In some embodiments, the end of the gas channel 11 that connects to the vacuum generator is located on the side of the movable base 1 away from the negative pressure region 3. Specifically, the gas inlet 111 and the gas outlet 112 of the gas channel 11 are arranged opposite each other on both sides of the movable base 1, making the structure more compact and avoiding any impact from the vacuum generator and its piping on the movement of the movable base 1.

[0039] In some embodiments, the cross-section of the sealing ring 2 is rectangular or circular; preferably, it is combined with... Figure 2 and Figure 3 As shown, the cross-section of the sealing ring 2 is rectangular to increase the suction port area, thereby ensuring the adsorption effect.

[0040] like Figure 3 As shown, this utility model also provides a chip testing device, including a test base 5 and the aforementioned chip shifting assembly. The chip shifting assembly here includes all the technical features of the aforementioned chip shifting assembly. The movable base 1 of the chip shifting assembly can move the chip under test 4 into the test base 5, and the chip under test 4 is tested through the test base 5. That is, a driving assembly is connected to the movable base 1, which can drive the movable base 1 to move in a direction closer to or away from the test base 5. The driving assembly can be a linear module, an electric push rod, a hydraulic rod, or a cylinder, or it can be a robotic arm to drive in multiple directions; these are not limiting factors.

[0041] In some embodiments, a test circuit board is provided inside the test housing 5, and the chip under test 4, which is moved into the test housing 5, can be electrically connected to the test circuit board. Specifically, the test circuit board has test terminals on its top and a test terminal on its bottom, with each test terminal corresponding to a test terminal. When the moving housing 1 moves the chip under test 4 into the interior of the test housing 5, the test terminals and their corresponding test terminals are connected one by one to achieve electrical connection between the chip under test 4 and the test circuit board. As the pressure applied to the sealing ring 2 increases, the pressure applied by the sealing ring 2 to the chip under test 4 gradually increases, thereby increasing the connection strength between the chip under test 4 and the test circuit board and ensuring the test effect. The connection process of the test circuit board, the chip under test 4, and the memory chip 12 has been described above and will not be repeated here.

[0042] In some embodiments, the test base 5 is provided with multiple slots 51, and the movable base 1 is provided with multiple inserts 16 that match the slots 51, with each slot 51 corresponding to one insert 16. Specifically, there are multiple inserts 16 arranged sequentially along the outer periphery of the sealing ring 2. The number of slots 51 is the same as the number of inserts 16. When the movable base 1 moves the sealing ring 2 into the interior of the test base 5, the inserts 16 are inserted into the corresponding slots 51 to ensure alignment.

[0043] The chip testing device provided by this utility model generates a negative pressure of -100 kPa during testing. After 30,000 cycles, the negative pressure remains at -91.5 kPa, indicating that the chip testing device has good stability.

[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0045] The above description is merely a specific embodiment of this utility model, enabling those skilled in the art to understand or implement it. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this utility model. Therefore, this utility model is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features of the utility model described herein.

Claims

1. A chip shifting component, characterized in that, Includes a movable base (1) and a sealing ring (2) disposed on the movable base (1). The movable base (1) is provided with a gas channel (11). One end of the gas channel (11) is connected to the space surrounded by the sealing ring (2), and a negative pressure area (3) can be formed in the space by a vacuum generator connected to the other end of the gas channel (11), so as to adsorb the chip under test (4) by having the sealing ring (2) surround the outer periphery of a plurality of probe contacts (41) of the chip under test (4).

2. The chip shifting assembly according to claim 1, characterized in that, The movable base (1) is provided with a memory chip (12) and a number of probes (121) for electrically connecting the memory chip (12) to the chip under test (4). The probes (121) correspond one-to-one with the probe contacts (41). The sealing ring (2) is made of elastic material so that when the chip under test (4) is adsorbed, the sealing ring (2) is compressed and the probe (121) contacts the probe contact (41).

3. The chip shifting assembly according to claim 2, characterized in that, The movable base (1) includes an upper base (13) and a lower base (14) that are interlocked and sealed to each other. The memory chip (12) is located inside the upper base (13). The sealing ring (2) is disposed on the side of the lower base (14) away from the upper base (13). The plurality of probes (121) pass through the lower base (14) and extend to the negative pressure area (3).

4. The chip shifting assembly according to claim 3, characterized in that, The lower body (14) has probe holes at positions corresponding to the negative pressure region (3) that allow the probe (121) to pass through, and a gas inlet (111) is formed at the center position corresponding to the negative pressure region (3) to connect the gas channel (11) to the negative pressure region (3).

5. The chip shifting assembly according to claim 1, characterized in that, The movable seat (1) is provided with an annular groove (15) for installing the sealing ring (2), the depth of which is less than the thickness of the sealing ring (2).

6. The chip shifting assembly according to claim 1, characterized in that, One end of the gas channel (11) for connection with the vacuum generator is located on the side of the movable seat (1) away from the negative pressure area (3).

7. The chip shifting assembly according to claim 1, characterized in that, The cross-section of the sealing ring (2) is rectangular or circular.

8. A chip testing device, characterized in that, The device includes a test base (5) and a chip shifting assembly as described in any one of claims 1 to 7, wherein the moving base (1) of the chip shifting assembly is capable of moving the chip under test (4) into the test base (5) and testing the chip under test (4) through the test base (5).

9. The chip testing apparatus according to claim 8, characterized in that, The test base (5) is equipped with a test circuit board, and the chip under test (4) that moves into the test base (5) can be electrically connected to the test circuit board.

10. The chip testing apparatus according to claim 8, characterized in that, The test base (5) is provided with multiple slots (51), and the movable base (1) is provided with multiple plugs (16) that match the slots (51). The multiple slots (51) correspond one-to-one with the multiple plugs (16).

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