Middle frame assembly and electronic device

Abstract

The present disclosure relates to a middle frame assembly and an electronic device, wherein the middle frame assembly comprises a frame and a pressure sensor assembly, the frame comprises a side frame, and an outer surface of the side frame comprises a key area; the pressure sensor assembly is arranged on an inner surface of the side frame corresponding to the position of the key area, and the pressure sensor assembly is configured to generate a pressure signal according to the pressure received by the key area. In this way, instead of setting the physical key, not only the use of key components can be reduced, thereby facilitating the assembly of the middle frame assembly and improving the assembly efficiency of the middle frame assembly, but also the waterproof reliability of the middle frame assembly can be further improved. In addition, the key area is arranged on the side frame, which is more in line with the user's usage habits and is convenient for the user to operate, thereby effectively improving the user's experience.

Description

Technical Field

[0001] This disclosure relates to the field of electronic devices, and more particularly to a mid-frame assembly and an electronic device. Background Technology

[0002] With the continuous development of technology, virtual buttons are gradually being used to replace physical buttons on electronic devices in order to improve assembly efficiency. Utility Model Content

[0003] To overcome the problems existing in the related technologies, this disclosure provides a mid-frame component and an electronic device.

[0004] According to a first aspect of this disclosure, a mid-frame assembly is provided, comprising: a frame including a side frame, the outer surface of which includes a button area; and a pressure sensor assembly disposed on the inner surface of the side frame corresponding to the button area, the pressure sensor assembly being configured to generate a pressure signal based on the pressure applied to the button area. This approach, replacing physical buttons, not only reduces the use of button components, thus facilitating the assembly of the mid-frame assembly and improving its assembly efficiency, but also further enhances the waterproof reliability of the mid-frame assembly. Furthermore, placing the button area on the side frame is more in line with user habits, facilitating user operation and effectively improving the user experience.

[0005] In some possible implementations, the pressure sensor assembly includes: a circuit board disposed on the inner surface of the side frame and opposite to the side frame; and a pressure sensor disposed on the surface of the circuit board opposite to the side frame. This simplifies the structure of the pressure sensor assembly, facilitating production and processing, and reduces its footprint within the electronic device's internal space. Furthermore, by positioning the circuit board opposite the side frame, the footprint is further reduced, facilitating miniaturization of the electronic device. Simultaneously, the shorter distance between the pressure sensor and the side frame improves the accuracy of pressure detection, thereby enhancing the reliability of the button function.

[0006] In some possible implementations, the circuit board includes a flexible circuit board comprising a body and an extension connected to the body, the body being opposite to the side frame, and the extension for connecting to the motherboard of the electronic device. This not only improves the convenience of connecting the circuit board to the motherboard but also further reduces the space occupied within the electronic device. The pressure sensor is disposed on the surface of the body facing away from the side frame; a reinforcing plate is disposed on the surface of the body facing the side frame, thus improving the structural strength of the body and facilitating the placement of the pressure sensor. Simultaneously, the reinforcing plate, with its surface facing away from the body connected to the side frame, secures the body, preventing displacement under external forces and further improving the reliability of the mid-frame assembly.

[0007] In some possible implementations, the mid-frame assembly further includes a support portion, with the frame surrounding the support portion, and an extension connected to the side edge of the body facing the support portion, the extension being opposite to the support portion. This further reduces the space occupied by the circuit board, thereby facilitating the miniaturization design of electronic devices.

[0008] In some possible implementations, the pressure sensor assembly further includes an adhesive layer disposed between the reinforcing plate and the side frame. This further improves the stability of the circuit board body fixed to the side frame, thereby enhancing the reliability of the mid-frame assembly.

[0009] In some possible implementations, the pressure sensor assembly further includes a retainer disposed on the side of the body opposite to the side frame to secure the circuit board to the side frame. This further improves the stability of the circuit board body fixed to the side frame.

[0010] In some possible implementations, the fastener includes a sheet-like structure opposite to the side frame. Along the extending direction of the side frame, the sheet-like structure includes a recess, abutment portions on both sides of the recess, and a fixing portion on the side of the abutment portion facing away from the recess. The recess and the circuit board enclose a receiving space, within which the pressure sensor is located. The abutment portions abut against the circuit board, and the fixing portion is fixed to the side frame. By placing the pressure sensor within the receiving space formed by the recess and the circuit board, the pressure sensor is protected, thereby further improving the reliability of the mid-frame assembly. Furthermore, the abutment portions abut against the circuit board body, ensuring the integrity of the body and preventing damage to the internal circuit layers, helps reduce the circuit board area and facilitates miniaturization of electronic devices. In addition, the above-described configuration simplifies the fastener's structure, making it easy to manufacture and process.

[0011] In some possible implementations, the inner surface of the side frame has a recessed structure corresponding to the button area, and the pressure sensor assembly is disposed within the recessed structure. This further shortens the distance between the button area and the pressure sensor, thereby improving the accuracy of pressure detection by the pressure sensor. Furthermore, placing the pressure sensor within the recessed structure on the side frame further reduces the space occupied by the pressure sensor assembly within the electronic device.

[0012] In some possible implementations, the groove structure includes a first groove disposed on the inner surface of the side frame and a second groove disposed at the bottom of the first groove. The two fixing parts are respectively fixed to the bottom of the first groove on both sides of the second groove. The pressure sensor and part of the circuit board are located within the second groove. This allows the shape of the groove structure to match the overall structural shape of the pressure sensor assembly, except for the other extension portion, enabling the fixing parts to be completely placed within the groove structure. This further reduces the space occupied by the pressure sensor assembly within the electronic device, facilitating miniaturization of the electronic device.

[0013] In some possible implementations, the mid-frame component further includes an identification structure disposed in the button area. By providing an identification structure in the button area, users can easily locate the button area, thereby improving the ease of use of the button functions in that area and further enhancing the user experience.

[0014] According to a second aspect of this disclosure, an electronic device is provided, comprising a mid-frame assembly as described in the first aspect. This approach, replacing physical buttons, not only reduces the number of button components, thus facilitating assembly of the mid-frame assembly and improving assembly efficiency, but also further enhances the waterproof reliability of the mid-frame assembly. Furthermore, placing the button area on the side frame is more in line with user habits, facilitating operation and effectively improving the user experience.

[0015] In some possible implementations, the electronic device further includes a motherboard, to which pressure signals generated by the pressure sensor assembly of the mid-frame assembly are transmitted. This ensures the reliability of the button functions in the button area, thereby improving the control of the electronic device.

[0016] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0017] The mid-frame assembly disclosed herein features a button area on the outer surface of its side frame. A pressure sensor assembly is positioned on the inner surface of the side frame, corresponding to the button area. The pressure sensor assembly generates a pressure signal based on the pressure applied to the button area, thereby enabling the button area to function as a button. This method, replacing physical buttons, not only reduces the number of button components, facilitating assembly of the mid-frame assembly and improving assembly efficiency, but also further enhances the waterproof reliability of the mid-frame assembly. Furthermore, placing the button area on the side frame better aligns with user habits, facilitating operation and effectively improving the user experience.

[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0020] Figure 1 This is a schematic diagram of the structure of a mid-frame component according to an exemplary embodiment;

[0021] Figure 2 This is a structural schematic diagram of a mid-frame component according to another exemplary embodiment;

[0022] Figure 3 This is a structural schematic diagram of the mid-frame component according to yet another exemplary embodiment;

[0023] Figure 4 yes Figure 3Sectional view along the middle AA direction;

[0024] Figure 5 This is an exploded view of a mid-frame assembly according to an exemplary embodiment.

[0025] In the picture:

[0026] 10-Middle frame assembly; 11-Middle frame; 111-Side frame; 1111-Button area; 112-Support part; 12-Pressure sensor assembly; 121-Pressure sensor; 122-Flexible circuit board; 1221-Body; 1222-Extension; 1223-Reinforcing plate; 123-Adhesive layer; 124-Factor; 1241-Recess; 1242-Abutting part; 1243-Fixing part; 125-Screw; 13-Groove structure; 131-First groove; 132-Second groove. Detailed Implementation

[0027] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0028] With the continuous development of technology, virtual buttons are gradually replacing physical buttons on electronic devices, thereby improving assembly efficiency. For example, an exemplary embodiment of this disclosure provides an electronic device with a button area on the front or back of the device. A pressure sensor is installed inside the device at the location corresponding to the button area. The pressure sensor detects the pressure value applied to the button area, enabling the button area to perform button functions. This arrangement eliminates the need for separate physical buttons on the electronic device. However, this arrangement is inconvenient for user operation, resulting in a poor user experience.

[0029] To address the aforementioned technical issues, another exemplary embodiment of this disclosure provides a mid-frame assembly. The outer surface of the side frame has a button area, and a pressure sensor assembly is positioned on the inner surface of the side frame corresponding to the button area. The pressure sensor assembly generates a pressure signal based on the pressure applied to the button area, thereby enabling the button area to function as a button. This method, replacing physical buttons, not only reduces the number of button components, facilitating assembly of the mid-frame assembly and improving assembly efficiency, but also further enhances the waterproof reliability of the mid-frame assembly. Furthermore, placing the button area on the side frame better aligns with user habits, facilitating operation and effectively improving the user experience.

[0030] An exemplary embodiment of this disclosure provides a mid-frame component, such as Figure 1 and Figure 2 As shown, the mid-frame assembly 10 includes a frame and a pressure sensor assembly 12. The frame includes a side frame 111, and the outer surface of the side frame 111 includes a button area 1111. The pressure sensor assembly 12 is positioned on the inner surface of the side frame 111, corresponding to the button area 1111. The pressure sensor assembly 12 is configured to generate a pressure signal based on the pressure received by the button area 1111, allowing the user to activate the button function by pressing the button area 1111. This arrangement replaces the use of physical buttons, thereby reducing the number of button components, facilitating the assembly of the mid-frame assembly 10, improving assembly efficiency, reducing production costs, and avoiding issues such as poor tactile feedback caused by uneven pressing. Furthermore, it improves the integrity of the side frame 111, further enhancing the waterproof reliability of the mid-frame assembly 10 without requiring additional waterproof components, further reducing production costs.

[0031] In addition, by setting a button area 1111 on the side frame 111 to realize button functions, the setting position of the button area 1111 is more in line with the user's usage habits, making it easier for the user to operate, thereby effectively improving the user experience.

[0032] like Figure 3 , Figure 4 and Figure 5 As shown, in one embodiment, the pressure sensor assembly 12 includes a circuit board and a pressure sensor 121. The circuit board is disposed on the inner surface of the side frame 111 and faces the side frame 111. The pressure sensor 121 is disposed on the surface of the circuit board facing away from the side frame 111. When a user presses the button area 1111, the pressure is transmitted through the side frame 111 to the pressure sensor 121. The pressure sensor 121 generates a pressure signal from the pressure received by the button area 1111 and transmits it to the circuit board. The circuit board then transmits the pressure signal to the motherboard of the electronic device, thereby enabling the button area 1111 to perform the button function. This design, on the one hand, simplifies the structure of the pressure sensor assembly 12, facilitates production and processing, and reduces the space occupied inside the electronic device. On the other hand, by making the circuit board face the side frame 111, the space occupied inside the electronic device is further reduced, which is beneficial to the miniaturization design of the electronic device. At the same time, the distance between the pressure sensor 121 and the side frame 111 is shortened, which can improve the accuracy of the pressure sensor 121 in detecting pressure, thereby improving the reliability of the button function.

[0033] like Figure 4As shown, in one embodiment, the circuit board includes a flexible circuit board 122 and a reinforcing plate 1223. The flexible circuit board 122 includes a body 1221 and an extension 1222 connected to the body 1221. The body 1221 is opposite to the side frame 111, and the extension 1222 is used to connect to the motherboard of the electronic device. This not only improves the convenience of connecting the circuit board to the motherboard, but also further reduces the space occupied inside the electronic device. The pressure sensor 121 is disposed on the surface of the body 1221 facing away from the side frame 111, and the reinforcing plate 1223 is disposed on the surface of the body 1221 facing the side frame 111. Thus, the reinforcing plate 1223 improves the structural strength of the body 1221, facilitating the placement of the pressure sensor 121. At the same time, the surface of the reinforcing plate 1223 facing away from the body 1221 is connected to the side frame 111 to fix the body 1221, preventing the body 1221 from shifting under external forces, thereby further improving the reliability of the middle frame assembly 10.

[0034] like Figure 2 As shown, in one embodiment, the mid-frame assembly 10 further includes a support portion 112, with a frame surrounding the support portion 112. The support portion 112 and the frame together constitute the mid-frame 11 of the mid-frame assembly 10. An extension portion 1222 is connected to the side edge of the body 1221 facing the support portion 112, and the extension portion 1222 is opposite to the support portion 112. This arrangement can further reduce the space occupied by the circuit board, thereby facilitating the miniaturization design of electronic devices.

[0035] like Figure 4 As shown, in one embodiment, the pressure sensor assembly 12 further includes an adhesive layer 123 disposed between the reinforcing plate 1223 and the side frame 111. The adhesive layer 123 can be, for example, double-sided adhesive or adhesive backing. By fixing the reinforcing plate 1223 to the inner surface of the side frame 111 through the adhesive layer 123, the stability of the circuit board body 1221 fixed to the side frame 111 is further improved, thereby further enhancing the reliability of the mid-frame assembly 10.

[0036] like Figure 2 and Figure 5 As shown, in one embodiment, the pressure sensor assembly 12 further includes a fixing member 124, which is disposed on the side of the body 1221 opposite to the side frame 111, to fix the body 1221 of the circuit board to the side frame 111. Exemplarily, the fixing member 124 may be a screw structure, a bracket structure, etc., for fastening the body 1221 to the side frame 111, and is not specifically limited thereto. This arrangement further improves the stability of the circuit board body 1221 fixed to the side frame 111.

[0037] like Figure 5As shown, in one embodiment, the fastener 124 includes a sheet-like structure opposite to the side frame 111, thereby reducing the space occupied inside the electronic device.

[0038] Along the extending direction of the side frame 111, the sheet-like structure includes a recess 1241, abutment portions 1242 located on both sides of the recess 1241, and a fixing portion 1243 located on the side of the abutment portion 1242 opposite to the recess 1241. The recess 1241 and the circuit board enclose a receiving space, within which the pressure sensor 121 is located, and the abutment portion 1242 abuts against the body 1221 of the circuit board. The fixing portion 1243 extends away from the recess 1241 along the extending direction of the side frame 111 to be fixed to the side frame 111. The fixing portion 1243 can be fixed to the side frame 111 by means of adhesive, screws 125, etc.

[0039] In this embodiment, when the fixing part 1243 is fixed to the side frame 111, the pressure sensor 121 is protected by placing it within the accommodating space formed by the recess 1241 and the circuit board, thereby further improving the reliability of the middle frame assembly 10. Furthermore, the abutting part 1242 abuts against the body 1221 of the circuit board, thus fixing the body 1221 and ensuring its integrity. This prevents damage to the circuit layers inside the circuit board, reducing the circuit board area and facilitating miniaturization of electronic devices. In addition, the above-described configuration simplifies the structure of the fixing member 124, making it easier to manufacture and process.

[0040] like Figure 2 and Figure 5 As shown, in one embodiment, a groove structure 13 is provided on the inner surface of the side frame 111 corresponding to the button area 1111, and the pressure sensor assembly 12 is disposed within the groove structure 13. This design, on the one hand, further shortens the distance between the button area 1111 and the pressure sensor 121, thereby further improving the accuracy of pressure detection by the pressure sensor 121. On the other hand, placing the pressure sensor 121 within the groove structure 13 on the side frame 111 further reduces the space occupied by the pressure sensor assembly 12 within the electronic device.

[0041] Continue to refer to Figure 2 and Figure 5In one embodiment, the groove structure 13 includes a first groove 131 disposed on the inner surface of the side frame 111 and a second groove 132 disposed at the bottom of the first groove 131. Two fixing parts 1243 are respectively fixed to the bottom of the first groove 131 corresponding to the two sides of the second groove 132. The pressure sensor 121 and part of the circuit board are located in the second groove 132, that is, the body 1221 of the circuit board and the part of the extension 1222 connected to the body 1221 are located in the second groove 132, while another part of the extension 1222 extends out from the groove structure 13 to connect with the motherboard of the electronic device.

[0042] This arrangement allows the shape of the groove structure 13 to match the overall shape of the pressure sensor assembly 12, except for the other extension 1222. This allows the fixing member 124 to be completely placed inside the groove structure 13, further reducing the space occupied by the pressure sensor assembly 12 inside the electronic device and facilitating the miniaturization design of the electronic device.

[0043] In one embodiment, the mid-frame component 10 further includes an identification structure disposed on the button area 1111. Exemplarily, the identification structure may be a pattern laser-engraved on the button area 1111, a raised structure formed on the button area 1111, or a decorative piece pasted on the button area 1111, etc., without specific limitations. By providing an identification structure in the button area 1111, users can easily locate the button area 1111, thereby improving the ease of use of the button functions of the button area 1111 and further enhancing the user experience.

[0044] An exemplary embodiment of this disclosure provides an electronic device, which may be a mobile device with communication functions such as a mobile phone, tablet computer, laptop computer, handheld computer, in-vehicle electronic device, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), or a non-mobile device with communication functions such as a personal computer (PC) or television (TV).

[0045] like Figure 1 and Figure 2As shown, the electronic device includes the mid-frame assembly 10 as described above. The mid-frame assembly 10 includes a frame and a pressure sensor assembly 12. The frame includes a side frame 111, and the outer surface of the side frame 111 includes a button area 1111. The pressure sensor assembly 12 is disposed on the inner surface of the side frame 111, corresponding to the position of the button area 1111. The pressure sensor assembly 12 is configured to generate a pressure signal based on the pressure received by the button area 1111, so that the user can activate the button function by touching the button area 1111. This arrangement replaces the method of setting physical buttons, thereby reducing the use of button components, facilitating the assembly of the mid-frame assembly 10, improving the assembly efficiency of the mid-frame assembly 10, reducing production costs, and avoiding problems such as poor feel caused by uneven pressing. On the other hand, it also improves the integrity of the side frame 111, further improving the waterproof reliability of the mid-frame assembly 10 without the need for additional waterproof parts, further reducing production costs.

[0046] In addition, by setting a button area 1111 on the side frame 111 to realize button functions, the setting position of the button area 1111 is more in line with the user's usage habits, making it easier for the user to operate, thereby effectively improving the user experience.

[0047] In one embodiment, the electronic device further includes a motherboard. The pressure signal generated by the pressure sensor assembly 12 of the mid-frame assembly 10 is transmitted to the motherboard, thereby enabling the button area 1111 to perform button functions. These button functions can, for example, enable the electronic device's camera or snapshot function, or adjust volume, screen brightness, power on, or unlock functions, etc., without specific limitations. This ensures the reliability of the button functions in the button area 1111, thereby improving the control effect of the electronic device.

[0048] In one embodiment, the motherboard of the electronic device is further configured to control the vibration of the motor of the electronic device when a pressure signal is received. Through the vibration feedback of the motor, it is not only easier for the user to grasp the status of the buttons, but also to provide the user with the tactile effect of the buttons, thereby further improving the user experience.

[0049] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0050] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A mid-frame component, characterized in that, The mid-frame component includes: The frame includes a side frame, and the outer surface of the side frame includes a button area; A pressure sensor assembly is disposed on the inner surface of the side frame corresponding to the position of the button area, and the pressure sensor assembly is configured to generate a pressure signal based on the pressure applied to the button area.

2. The mid-frame assembly according to claim 1, characterized in that, The pressure sensor assembly includes: A circuit board is disposed on the inner surface of the side frame and is opposite to the side frame; A pressure sensor is disposed on the surface of the circuit board opposite to the side frame.

3. The mid-frame assembly according to claim 2, characterized in that, The circuit board includes: A flexible circuit board, the flexible circuit board including a body and an extension connected to the body, the body being opposite to the side frame, and the pressure sensor being disposed on the surface of the body opposite to the side frame; A reinforcing plate is disposed on the surface of the body facing the side frame, and the surface of the reinforcing plate facing away from the body is connected to the side frame.

4. The mid-frame assembly according to claim 3, characterized in that, The mid-frame assembly also includes a support portion, the frame is disposed around the support portion, the extension portion is connected to the side edge of the body facing the support portion, and the extension portion is opposite to the support portion.

5. The mid-frame assembly according to claim 3, characterized in that, The pressure sensor assembly also includes: An adhesive layer is disposed between the reinforcing plate and the side frame.

6. The mid-frame assembly according to any one of claims 3 to 5, characterized in that, The pressure sensor assembly also includes: A fastener is provided on the side of the body away from the side frame to fix the circuit board to the side frame.

7. The mid-frame assembly according to claim 6, characterized in that, The fastener includes a sheet-like structure opposite to the side frame. Along the extending direction of the side frame, the sheet-like structure includes a recess, abutting portions on both sides of the recess, and a fixing portion on the side of the abutting portion away from the recess. The recess and the circuit board enclose a receiving space, the pressure sensor is located within the receiving space, the abutting portions abut against the circuit board, and the fixing portion is fixed to the side frame.

8. The mid-frame assembly according to claim 7, characterized in that, The inner surface of the side frame is provided with a groove structure corresponding to the button area, and the pressure sensor assembly is disposed in the groove structure.

9. The mid-frame assembly according to claim 8, characterized in that, The groove structure includes a first groove disposed on the inner surface of the side frame and a second groove disposed at the bottom of the first groove. The two fixed parts are respectively fixed to the bottom of the first groove on both sides of the second groove. The pressure sensor and part of the circuit board are located in the second groove.

10. The mid-frame assembly according to any one of claims 1 to 5, characterized in that, The mid-frame component also includes: An identifier structure is provided in the button area.

11. An electronic device, characterized in that, The electronic device includes a mid-frame assembly as described in any one of claims 1 to 10.

12. The electronic device according to claim 11, characterized in that, The electronic device also includes a motherboard, and the pressure signal generated by the pressure sensor assembly of the mid-frame assembly is transmitted to the motherboard.

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