An integrated main unit that combines an optical endoscope and an ultrasonic endoscope

Abstract

The utility model discloses a kind of integrated mainframes of fusion optical endoscope and ultrasonic endoscope, comprising: optical endoscope module, for realizing endoscope examination;Ultrasonic endoscope module, for realizing ultrasonic examination;The optical endoscope module and the ultrasonic endoscope module are integrally arranged on the same mainframe equipment, and constitute integrated mainframe. Through the above integrated mainframe, the existing optical electronic endoscope mainframe and ultrasonic endoscope mainframe can be effectively solved when being designed separately, endoscope mainframe and ultrasonic mainframe need to be equipped respectively to realize endoscope and ultrasonic examination respectively, resulting in the problem that equipment overall is huge, transfer is inconvenient and the problem of high product cost.

Description

Technical Field

[0001] This utility model relates to the field of medical device technology, specifically to an integrated host that combines an optical endoscope and an ultrasonic endoscope. Background Technology

[0002] An optical endoscope is a medical device that uses optical principles to transmit images and light. It captures images of a target area through an objective lens, which are then transmitted point-by-point via fiber optic bundles, transmitting the images as light signals to the eyepiece. The operator then directly observes the target image through the eyepiece. An endoscope with ultrasound (EUS) inserts an ultrasound probe through the instrument channels of an endoscope into a body cavity, using ultrasound to perform real-time scanning and obtain ultrasound images.

[0003] In existing technologies, the main units of the aforementioned optical electronic endoscopes and ultrasonic endoscopes are designed separately. This means that when performing endoscopic and ultrasonic examinations, three separate machines are required: the endoscope main unit, the endoscope light source machine, and the ultrasonic main unit. Furthermore, if separate large and small ultrasonic examinations are also needed, an additional ultrasonic main unit is required to perform multiple examinations, resulting in a large overall equipment size and inconvenient transportation. In contrast to the separate optical electronic endoscope and ultrasonic endoscope main units, an integrated main unit can effectively allow the optical endoscope module and the ultrasonic endoscope module to share some equipment, thereby reducing the number of components, significantly lowering product costs, and making high-end medical devices more affordable for more clinical hospitals. Utility Model Content

[0004] Therefore, the technical problem to be solved by this utility model is to overcome the lack of an integrated main unit that integrates optical endoscope and ultrasonic endoscope in the prior art, thereby providing an integrated main unit that integrates optical endoscope and ultrasonic endoscope, comprising:

[0005] Optical endoscope module, used to perform endoscopic examinations;

[0006] An ultrasonic endoscope module is used to perform ultrasonic examinations; the optical endoscope module and the ultrasonic endoscope module are integrated into the same host device to form an integrated host.

[0007] The optical endoscope module and the ultrasonic endoscope module share a power supply module; and the optical endoscope module and the ultrasonic endoscope module share a system motherboard and / or hard disk and / or memory.

[0008] Optionally, the optical endoscope module includes an endoscope host module and an endoscope light source module; the ultrasonic endoscope module includes a large ultrasonic host module and a small ultrasonic host module; the light source module and the system motherboard are arranged side by side in the width direction of the integrated host; the system motherboard includes a first motherboard and a second motherboard, the first motherboard is located above the second motherboard, the first motherboard is communicatively connected to the second motherboard, and the endoscope host module, the large ultrasonic host module and the small ultrasonic host module are located on the first motherboard and the second motherboard.

[0009] Optionally, the optical endoscope module further includes an endoscope interface located on the integrated host, the endoscope interface being connected to the endoscope body for connecting endoscope signals and connecting a light source.

[0010] Optionally, the ultrasound endoscope module further includes a small ultrasound module interface and a large ultrasound module interface located on the integrated host. The small ultrasound module interface is connected to the small ultrasound probe for connecting the small ultrasound probe, and the large ultrasound module interface is connected to the large ultrasound probe for connecting the large ultrasound probe.

[0011] Optionally, the endoscope module and the ultrasound endoscope module share a signal line, which is connected to an external workstation for communication.

[0012] Optionally, the integrated unit combining optical endoscope and ultrasonic endoscope also includes:

[0013] The cooling system includes an air inlet on the bottom shell of the integrated host for allowing cool air to enter, and air outlets on the rear and top covers of the integrated host; an exhaust component is located at the air outlet to guide hot air out of the integrated host; and / or,

[0014] An air intake component is provided at the air inlet position to guide cold air into the integrated main unit.

[0015] Optionally, the side of the ultrasonic endoscope module away from the air outlet is further provided with a blowing component for guiding cold air into the ultrasonic endoscope module, and the blowing component is arranged opposite to the air outlet.

[0016] The endoscope light source module is provided with a heat dissipation component, which includes a heat sink and a cooling fan; the heat dissipation component is located along the length of the integrated host, at the end and / or middle of the endoscope light source module.

[0017] Optionally, the ultrasound endoscope module further includes: an air pump module for supplying air to the endoscope; the air pump module and the endoscope light source module are arranged side by side along the length of the integrated main unit, and a shock absorption module is provided below the air pump module.

[0018] Optionally, the air pump module includes: an air pump mounting cover and an air pump; the shock absorption module includes: an EVA shock absorption pad and a shock absorption base;

[0019] The EVA shock-absorbing pad is disposed at the bottom of the air pump and extends to the air inlet and outlet channels of the air pump.

[0020] The air pump is mounted on the shock-absorbing base via the EVA shock-absorbing pad.

[0021] Optionally, the shock-absorbing base includes: an upper air pump mounting base, a lower air pump mounting base, and an elastic shock-absorbing pad disposed between the upper air pump mounting base and the lower air pump mounting base;

[0022] The lower air pump mounting base, the upper air pump mounting base, and the elastic shock-absorbing pad are fixed together by fasteners that penetrate all three of them.

[0023] The technical solution of this utility model has the following advantages:

[0024] 1. The integrated host unit that integrates optical endoscope and ultrasonic endoscope provided by this utility model includes: an optical endoscope module for performing endoscopic examination; an ultrasonic endoscope module for performing ultrasonic examination; the optical endoscope module and the ultrasonic endoscope module are integrated and set on the same host unit to form an integrated host unit.

[0025] In this invention, integrating the optical endoscope main unit and the ultrasonic endoscope main unit into a single integrated unit effectively allows the optical endoscope module and the ultrasonic endoscope module to share some equipment. The optical endoscope module and the ultrasonic endoscope module in this invention share a single power supply; that is, the endoscope main unit module, the endoscope light source module, the small ultrasonic main unit module, and the large ultrasonic main unit module all share a single power supply module. Furthermore, the optical endoscope module and the ultrasonic endoscope module share the same system motherboard, hard drive, memory, and interfaces as the endoscope main unit module, the small ultrasonic main unit module, and the large ultrasonic main unit module. This structural design effectively reduces the number of equipment components, significantly lowering product costs and making high-end medical devices more affordable for more clinical hospitals. Simultaneously, this integrated unit also solves the problem of bulky equipment and inconvenient transportation caused by separately equipping the endoscope main unit, the light source machine, and one or more ultrasonic main units.

[0026] 2. The integrated host unit that combines optical endoscope and ultrasonic endoscope provided by this utility model communicates with an external workstation via a single signal line. This means the signal line simultaneously transmits signals from both the endoscope and the ultrasound, solving the problems of existing separate designs that result in numerous host units, bulky equipment structures, and a large number of complex connecting cables. It effectively reduces the number of signal connection cables, improves equipment reliability, and optimizes the overall structure of the integrated host unit.

[0027] 3. The integrated host unit that integrates optical endoscope and ultrasonic endoscope provided by this utility model also includes: a heat dissipation system, an air inlet for cold air to enter the bottom shell of the integrated host unit, and air outlets for the rear cover and top cover of the integrated host unit.

[0028] In this invention, cold air from the outside enters the integrated main unit through the air inlet at the bottom of the main unit, and then exits through the rear and top covers. This arrangement allows a fixed airflow channel to be formed inside the integrated main unit, thereby cooling the integrated main unit that combines an optical endoscope and an ultrasonic endoscope.

[0029] 4. The integrated host unit that integrates optical endoscope and ultrasonic endoscope provided by this utility model, wherein the optical endoscope module further includes: an endoscope host unit module and a light source module; the light source module and the ultrasonic endoscope module are respectively arranged at intervals in the width direction of the integrated host unit; the ultrasonic endoscope module includes: a large ultrasonic host unit module and a small ultrasonic host unit module;

[0030] The ultrasonic endoscope module is also provided with a blowing component for guiding cold air into the ultrasonic endoscope module at a side position away from the air outlet. The blowing component is arranged opposite to the air outlet.

[0031] The light source module is equipped with a heat dissipation component, which includes a heat sink and a cooling fan. The heat dissipation component is located along the length of the integrated host, at the end and / or middle of the light source module.

[0032] In this invention, the light source module and the ultrasonic endoscope module, which serve as the main heat sources, are spaced apart on both sides of the integrated main unit along its width. This effectively allows cold air entering the main unit from the bottom shell to flow from the center towards both sides of the main unit, passing through the light source module and the ultrasonic endoscope module respectively, and then exiting from the air outlets on both sides of the top cover. This structural arrangement ensures that cold air flows separately through the light source module and the ultrasonic endoscope module, guaranteeing effective heat dissipation. Furthermore, this invention also includes a heat dissipation component to further improve the heat dissipation efficiency of the light source module.

[0033] 5. The integrated main unit of this utility model, which combines an optical endoscope and an ultrasonic endoscope, has an air pump module mounted on a shock-absorbing module. The shock-absorbing module includes an EVA shock-absorbing pad and a shock-absorbing base. The EVA shock-absorbing pad is located at the bottom of the air pump and extends to the air inlet and outlet channels of the air pump. Furthermore, the air pump is mounted on the shock-absorbing base via the EVA shock-absorbing pad.

[0034] In this invention, an EVA shock-absorbing pad is used to wrap around the bottom of the air pump and extends to the air inlet and outlet channels. This structure effectively reduces vibrations generated during air pump operation, thus reducing equipment vibration and noise. Furthermore, the shock-absorbing base works in conjunction with the EVA shock-absorbing pad to further dampen the air pump. The EVA shock-absorbing pad is an ethylene-vinyl acetate copolymer, which exhibits good elasticity and flexibility at room temperature, effectively achieving the shock-absorbing effect. Attached Figure Description

[0035] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0036] Figure 1 This is a top view of the internal structure of the integrated host in an embodiment of the present utility model;

[0037] Figure 2 This is a front view schematic diagram of the internal structure of the integrated host in an embodiment of this utility model;

[0038] Figure 3 This is a schematic diagram of the connection structure between the air pump module and the shock absorption module in an embodiment of this utility model;

[0039] Figure 4 This is a schematic diagram showing the arrangement of the internal heat dissipation components of the integrated host in an embodiment of this utility model.

[0040] Figure 5 This is an exploded view of the internal structure of the integrated host in an embodiment of this utility model;

[0041] Figure 6 This is a three-dimensional schematic diagram of the internal structure assembly of the integrated host in an embodiment of the present utility model;

[0042] Figure 7 This is a top view of the internal structure of the integrated host in an embodiment of this utility model.

[0043] Explanation of reference numerals in the attached diagram: 1. Integrated main unit; 2. Bottom shell; 3. Air inlet; 4. Rear cover; 5. Top cover; 6. Air outlet; 7. Endoscope light source module; 8. Large-scale main unit module; 9. Front shell; 10. Exhaust component; 11. Blower component; 12. Heat dissipation component; 13. Air pump module; 14. Air pump mounting cover; 15. Air pump; 16. EVA shock-absorbing pad; 17. Shock-absorbing base; 18. Upper air pump mounting base; 19. Lower air pump mounting base; 20. Elastic shock-absorbing pad; 21. Fastener; 22. Air tank; 23. Power module; 24. Small-scale main unit module; 25. Endoscope main unit module; 26. Main control board. Detailed Implementation

[0044] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0045] In existing technologies, the main units of optical electronic endoscopes and ultrasonic endoscopes are designed separately. When performing endoscopic and ultrasonic examinations, separate endoscope main units and ultrasonic main units, along with other related machines, are required to perform the examinations. This setup results in bulky equipment and inconvenient transportation. Furthermore, multiple main units require independent power modules, system motherboards, hard drives, and other components, leading to high product costs and hindering widespread adoption.

[0046] To solve the above technical problems, please refer to Figure 5 The diagram shown is an exploded view of the internal structure of the integrated host unit. Figure 6 The diagram shows a 3D view of the internal structure of the integrated main unit. And, Figure 7 The image shows a top view of the internal structure of the integrated main unit.

[0047] This embodiment provides an integrated main unit that combines an optical endoscope and an ultrasonic endoscope, including:

[0048] An optical endoscope module is used to perform endoscopic examinations, wherein the optical endoscope module integrates an electronic endoscope host module 25 and an electronic endoscope light source module 7.

[0049] An ultrasound endoscopy module is used to perform ultrasound examinations; the optical endoscopy module and the ultrasound endoscopy module are integrated into the same host device to form an integrated host 1;

[0050] The optical endoscope module and the ultrasonic endoscope module share a power supply module 23, that is, the endoscope host module 25, the endoscope light source module 7, the small ultrasonic host module, and the large ultrasonic host module share the same power supply module; and the optical endoscope module and the ultrasonic endoscope module share a system motherboard, hard disk, memory and interface.

[0051] In one optional embodiment, the components shared by the optical endoscope module and the ultrasonic endoscope module are not specifically limited. In other embodiments, the optical endoscope module and the ultrasonic endoscope module share a set of power supply modules 23 for the light source, small ultrasound, and large ultrasound. Of course, the shared power supply module 23 can also be selected as needed.

[0052] In a preferred embodiment, see Figure 1 The diagram shown is a top view of the internal structure of the integrated main unit. And, Figure 2 The diagram shows a front view of the internal structure of the integrated main unit. The integrated main unit, which combines an optical endoscope and an ultrasonic endoscope, also includes:

[0053] The cooling system includes an air inlet 3 on the bottom shell 2 of the integrated main unit 1 for allowing cool outside air to enter, and air outlets 6 on the rear cover 4 and top cover 5 of the integrated main unit. The front shell 9 of the integrated main unit 1 does not have the aforementioned air inlets 3 and outlets 6. This configuration allows for the formation of a fixed airflow channel within the integrated main unit, thereby cooling the integrated main unit 1 that combines an optical endoscope and an ultrasonic endoscope.

[0054] In one specific embodiment, an exhaust component 10 is provided at the air outlet 6 to guide hot air out of the integrated main unit 1; an air intake component is provided at the air inlet 3 to guide cold air into the integrated main unit 1.

[0055] In this embodiment, as Figure 4 As shown, the optical endoscope module further includes: an endoscope host module 25 and an endoscope light source module 7; the endoscope light source module 7 and the ultrasonic endoscope module are respectively arranged at intervals in the width direction of the integrated host; in this embodiment, the ultrasonic endoscope module includes: a large ultrasonic host module 8 and a small ultrasonic host module 24;

[0056] In another embodiment, the ultrasound endoscope module may also include only one of the large ultrasound host module 8 and the small ultrasound host module 24.

[0057] Specifically, the endoscope light source module 7 and the ultrasonic endoscope module are respectively arranged at intervals along the width of the integrated host; a blowing component 11 for guiding cold air into the ultrasonic endoscope module is also provided on the side away from the air outlet 6, and the blowing component 11 is arranged opposite to the air outlet 6. In addition, a heat dissipation component 12 is provided on the endoscope light source module 7, which includes a heat sink and a cooling fan; the heat dissipation component 12 is located along the length of the integrated host, at the end and middle of the endoscope light source module 7. The above structural arrangement allows cold air to flow through the endoscope light source module 7 and the ultrasonic endoscope module respectively, ensuring the heat dissipation effect of the device. In addition, the heat dissipation component 12 is also provided in this utility model to improve the heat dissipation efficiency of the endoscope light source module 7.

[0058] In an optional embodiment, the heat dissipation component 12 is only disposed at the end of the endoscope light source module 7. Alternatively, the aforementioned air intake component may not be necessary at the air inlet 3. Furthermore, the heat dissipation component 12 may consist of either a heat sink or a cooling fan.

[0059] In a preferred embodiment, such as Figure 5 As shown, the endoscope host module 25 and the mini-ultrasound host module 24 are located on the same main control board 26, thereby optimizing the structural layout of the integrated host. The specific arrangement of the first and second motherboards is as follows: the first motherboard is positioned above the second motherboard, the endoscope host module 25 and the mini-ultrasound host module 24 are located on the first motherboard, and the large-scale ultrasound host module 8 is located on the second motherboard, with the first and second motherboards communicatively connected. In other embodiments, the endoscope host module 25 and the large-scale ultrasound host module 8 can also be positioned on the first motherboard, and the mini-ultrasound host module 24 on the second motherboard, etc., according to other layout requirements, which will not be listed here.

[0060] Specifically, such as Figure 4 and Figure 5 As shown, the endoscope light source module 7 and the air pump module 13 are located on the same side of the integrated main unit; the endoscope light source module 7 is cooled by the aforementioned heat dissipation component 12 located on this side. The air pump module 13 is damped by a shock-absorbing module located on this side. Furthermore, the two-layered first and second motherboards are located on the other side of the integrated main unit, opposite to the endoscope light source module 7 and the air pump module 13. This arrangement greatly optimizes the utilization of the internal space of the main unit and effectively reduces the size of the integrated main unit.

[0061] Specifically, the integrated host 1 is also equipped with a small ultrasound module interface and a large ultrasound module interface. The small ultrasound module interface is connected to the small ultrasound probe for connection, and the large ultrasound module interface is connected to the large ultrasound probe for connection. Endoscopic signals, small ultrasound signals, and large ultrasound signals share a single signal line for communication with an external workstation. The external workstation is typically located on an external computer for storing patient information, etc. The aforementioned integrated host 1 communicates with the external workstation via only one signal line, while existing devices require each host to connect to the external workstation via a signal line, meaning existing split-type hosts require two to three signal lines. The integrated host of this application, through internal integration, achieves universal signal lines for the optical endoscope module and ultrasound module, effectively reducing the number of signal lines, improving equipment reliability, and optimizing the overall structure of the integrated host.

[0062] In a preferred embodiment, see Figure 3 The diagram shows the connection structure between the air pump module and the shock absorption module. The ultrasound endoscope module also includes an air pump module 13 for supplying air to the endoscope; the air pump module 13 is mounted on the shock absorption module. The air pump module 13 is connected to the endoscope body via an air tank 22. The air pump module 13 includes an air pump mounting cover 14 and an air pump 15; the shock absorption module includes an EVA shock-absorbing pad 16 and a shock-absorbing base 17.

[0063] EVA damping pad 16 is disposed at the bottom of air pump 15 and extends to the air inlet and outlet channels of air pump 15; air pump 15 is mounted on damping base 17 via EVA damping pad 16. Figure 3 The shock-absorbing base 17 shown includes: an upper air pump mounting base 18, a lower air pump mounting base 19, and an elastic shock-absorbing pad 20 disposed between the upper air pump mounting base 18 and the lower air pump mounting base 19; the lower air pump mounting base 19, the upper air pump mounting base 18, and the elastic shock-absorbing pad 20 are fixed together by fasteners 21 that pass through them.

[0064] In an alternative embodiment, the shock-absorbing base 17 may also be other shock-absorbing structures such as shock-absorbing pads.

[0065] In summary, the integrated host unit that combines optical endoscope and ultrasonic endoscope provided by this utility model can effectively optimize the size of the equipment, reduce the cost of the equipment, and optimize the heat dissipation and shock absorption structure of the integrated host unit.

[0066] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. An integrated main unit combining an optical endoscope and an ultrasonic endoscope, characterized in that, include: Optical endoscope module, used to perform endoscopic examinations; An ultrasonic endoscope module is used to perform ultrasonic examinations; the optical endoscope module and the ultrasonic endoscope module are integrated on the same host device to form an integrated host (1); The optical endoscope module and the ultrasonic endoscope module share a power supply module (23); and the optical endoscope module and the ultrasonic endoscope module share a system motherboard and / or hard disk and / or memory.

2. The integrated main unit combining optical endoscope and ultrasonic endoscope according to claim 1, characterized in that, The optical endoscope module includes an endoscope host module (25) and an endoscope light source module (7); the ultrasound endoscope module includes a large ultrasound host module (8) and a small ultrasound host module (24); the light source module and the system motherboard are arranged side by side in the width direction of the integrated host; the system motherboard includes a first motherboard and a second motherboard, the first motherboard is located above the second motherboard, the first motherboard is communicatively connected to the second motherboard, and the endoscope host module (25), the large ultrasound host module (8) and the small ultrasound host module (24) are located on the first motherboard and the second motherboard.

3. The integrated main unit combining optical endoscope and ultrasonic endoscope according to claim 1, characterized in that, The optical endoscope module also includes an endoscope interface located on the integrated host (1). The endoscope interface is connected to the endoscope body and is used to connect the endoscope body signal and the light source.

4. The integrated main unit combining optical endoscope and ultrasonic endoscope according to claim 1, characterized in that, The ultrasound endoscope module also includes a small ultrasound module interface and a large ultrasound module interface on the integrated host (1). The small ultrasound module interface is connected to the small ultrasound probe and is used to connect the small ultrasound probe. The large ultrasound module interface is connected to the large ultrasound probe and is used to connect the large ultrasound probe.

5. The integrated main unit for fusing optical endoscope and ultrasonic endoscope according to any one of claims 1-4, characterized in that, The optical endoscope module and the ultrasonic endoscope module share a signal line, which is connected to an external workstation for communication.

6. The integrated main unit combining optical endoscope and ultrasonic endoscope according to claim 5, characterized in that, Also includes: The heat dissipation system includes an air inlet (3) on the bottom shell (2) of the integrated host (1) for allowing outside cold air to enter, and air outlets (6) on the rear cover (4) and top cover (5) of the integrated host; an exhaust component (10) is provided at the air outlet (6) to guide hot air out of the integrated host (1); and / or, An air intake component is provided at the air inlet (3) to guide cold air into the integrated host (1).

7. The integrated main unit combining optical endoscope and ultrasonic endoscope according to claim 6, characterized in that, The side of the ultrasonic endoscope module away from the air outlet (6) is also provided with a blowing component (11) for guiding cold air into the ultrasonic endoscope module. The blowing component (11) is arranged opposite to the air outlet (6). The optical endoscope module includes: an endoscope light source module (7); the endoscope light source module (7) is provided with a heat dissipation component (12), the heat dissipation component (12) includes: a heat sink and a cooling fan; the heat dissipation component (12) is located in the length direction of the integrated host, at the end position and / or the middle position of the endoscope light source module (7).

8. The integrated main unit combining optical endoscope and ultrasonic endoscope according to claim 2, characterized in that, The ultrasonic endoscope module also includes an air pump module (13) for supplying air to the endoscope; the air pump module (13) and the endoscope light source module (7) are arranged side by side in the length direction of the integrated host, and a shock absorption module is provided below the air pump module (13).

9. The integrated main unit combining optical endoscope and ultrasonic endoscope according to claim 8, characterized in that, The air pump module (13) includes: an air pump mounting cover (14) and an air pump (15); the shock absorption module includes: an EVA shock absorption pad (16) and a shock absorption base (17); The EVA shock-absorbing pad (16) is disposed at the bottom of the air pump (15) and extends to the air inlet and outlet passage of the air pump (15); The air pump (15) is mounted on the shock-absorbing base (17) via the EVA shock-absorbing pad (16).

10. The integrated main unit combining optical endoscope and ultrasonic endoscope according to claim 9, characterized in that, The shock-absorbing base (17) includes: an upper air pump mounting base (18), a lower air pump mounting base (19), and an elastic shock-absorbing pad (20) disposed between the upper air pump mounting base (18) and the lower air pump mounting base (19). The lower air pump mounting base (19), the upper air pump mounting base (18), and the elastic shock-absorbing pad (20) are fixed together by fasteners (21) that pass through them.

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