Workpiece clamping mechanism of wafer sawing machine

Abstract

The utility model relates to wafer dicing processing technical field discloses a workpiece clamping mechanism of wafer dicing machine, including mounting frame board, suction nozzle mounting plate and vacuum suction nozzle, is provided with the installation groove for adjusting suction nozzle mounting plate installation position on mounting frame board, is provided with the connecting groove for adjusting vacuum suction nozzle installation position on suction nozzle mounting plate, realizes the adaptability clamping of vacuum suction nozzle to multiple size wafer workpiece through the cooperation adjustment of installation groove and connecting groove, the middle part of every suction nozzle mounting plate is provided with rotatable anti -drop baffle, and the anti -drop baffle fixed -angle rotation coordinates vacuum suction nozzle to complete wafer workpiece clamping fixed. The utility model can prevent the damage of workpiece caused by the wafer workpiece of unstable clamping, greatly strengthens the security of clamping transport workpiece, adjusts the installation position of vacuum suction nozzle according to the need simultaneously, can take the steel ring of different size wafer workpiece, helps to improve the versatility of equipment, strengthens the flexibility of production.

Description

Technical Field

[0001] This utility model relates to the field of wafer dicing processing technology, specifically to a workpiece clamping mechanism for a wafer dicing machine. Background Technology

[0002] With the rapid development of the semiconductor industry and the ever-expanding scale of chip manufacturing, extremely high demands are placed on the production efficiency and precision of wafer dicing machines. Traditional grinding wheel dicing machines typically use wafer clamping mechanisms to hold wafer workpieces for semi-automatic or automatic feeding. While this improves efficiency to some extent, it lacks flexibility and can only adapt to wafers of specific specifications. When faced with wafers of different sizes and shapes, as well as diverse dicing processes, frequent adjustments or replacements of the device are required, which is not only cumbersome but also prone to precision loss. At the same time, existing wafer workpiece clamping mechanisms offer only one method of clamping and fixing wafer workpieces, and there is a risk of workpieces falling during clamping and movement. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a workpiece clamping mechanism for a wafer dicing machine, which solves the problems of the risk of wafer workpieces falling during the transportation process of existing wafer dicing machines, and the difficulty in adapting to the clamping requirements of wafer workpieces of different sizes and shapes.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A workpiece clamping mechanism for a wafer dicing machine includes a mounting frame plate, a nozzle mounting plate, and a vacuum nozzle. The mounting frame plate is provided with a mounting groove for adjusting the mounting position of the nozzle mounting plate, and the nozzle mounting plate is provided with a connecting groove for adjusting the mounting position of the vacuum nozzle. The vacuum nozzle can adaptably clamp wafer workpieces of various sizes by adjusting the mounting groove and the connecting groove. Each nozzle mounting plate is provided with a rotatable anti-drop baffle in the middle. The anti-drop baffle rotates at a fixed angle to cooperate with the vacuum nozzle to complete the clamping and fixing of the wafer workpiece.

[0006] Preferably, the anti-fall baffle is an L-shaped plate.

[0007] Preferably, a rotary cylinder is fixedly installed in the middle of the nozzle mounting plate, and the anti-drop baffle is fixedly connected to the piston end of the rotary cylinder through a transmission rod.

[0008] Preferably, a connecting seat is fixedly provided in the middle of the end face of the mounting plate. The inner cavity of the connecting seat is arranged with an air passage matching the number of vacuum nozzles. Multiple air inlets and air outlets are respectively installed on the connecting seat. The air inlets serve as the inlet end of the air passage, and the air outlets serve as the outlet end of the air passage.

[0009] Preferably, the connector is L-shaped, with multiple connection holes arranged on one side for connecting to the external moving module.

[0010] Preferably, the mounting plate is driven to be mounted on the piston end of the drive cylinder, a rotatable gripper assembly is provided on one side of the drive cylinder, and air knife assemblies are arranged on both sides of the gripper assembly.

[0011] Preferably, a limit slide rail assembly is arranged between the mounting plate and the drive cylinder, which slides in a specific direction as the mounting plate moves.

[0012] Preferably, the gripper assembly is driven to rotate by a rotary cylinder. An extension frame is detachably mounted on one side of the driving cylinder. The extension frame is detachably connected to the air knife assembly and the rotary cylinder via an extension base. The extension base is provided with a hydraulic damper and a proximity switch that cooperate with the rotation and retraction of the gripper assembly.

[0013] This utility model has the following beneficial effects:

[0014] The workpiece clamping mechanism of this wafer dicing machine, through its connecting and mounting slots, allows for flexible adjustment of the vacuum nozzle's mounting position. It can clamp steel rings for wafer workpieces of different sizes, such as 6-inch, 8-inch, and 12-inch, improving equipment versatility, enhancing production flexibility, reducing human error, and optimizing the production process, thereby achieving cost reduction and efficiency improvement. Simultaneously, the rotatable anti-drop baffle rotates at a certain angle after the vacuum nozzle has gripped and fixed the steel ring of the wafer workpiece, further clamping the steel ring and preventing it from falling and damaging the workpiece due to unstable vacuum pressure, significantly improving material safety. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the layout structure of the anti-fall baffle and vacuum nozzle of this utility model;

[0016] Figure 2 This is a schematic diagram of the layout structure of the connector of this utility model;

[0017] Figure 3 This is a schematic diagram of the layout structure of the air knife assembly and gripper assembly of this utility model;

[0018] Figure 4 This is a schematic diagram of the layout structure of the drive cylinder and limit slide rail assembly of this utility model;

[0019] Figure 5 This is a schematic diagram of the actual application state structure of Embodiment 1 of this utility model;

[0020] Figure 6 This is a schematic diagram of the actual application state of Embodiment 2 of this utility model.

[0021] In the diagram: 1. Connecting seat; 2. Mounting plate; 21. Mounting slot; 3. Nozzle mounting plate; 31. Connecting slot; 4. Vacuum nozzle; 5. Anti-drop baffle; 6. Rotary cylinder; 7. Air inlet; 8. Air outlet; 9. Drive cylinder; 10. Limiting slide rail assembly; 11. Extension base; 12. Air knife assembly; 13. Gripper assembly; 14. Extension frame. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example 1

[0024] A workpiece clamping mechanism for a wafer dicing machine includes a mounting plate 2, a nozzle mounting plate 3, and a vacuum nozzle 4. The mounting plate 2 is provided with a mounting groove 21 for adjusting the mounting position of the nozzle mounting plate 3, and the nozzle mounting plate 3 is provided with a connecting groove 31 for adjusting the mounting position of the vacuum nozzle 4. The vacuum nozzle 4 can adaptably clamp wafer workpieces of various sizes by adjusting the mounting groove 21 and the connecting groove 31. Each nozzle mounting plate 3 is provided with a rotatable anti-drop baffle 5 in the middle. The anti-drop baffle 5 rotates at a certain angle to cooperate with the vacuum nozzle 4 to complete the clamping and fixing of the wafer workpiece.

[0025] like Figure 1 and 2 As shown, in this technical solution, the connection groove 31 and the mounting groove 21 allow for flexible adjustment of the installation position of the vacuum nozzle 4, enabling the clamping of steel rings for wafer workpieces of different sizes, such as 6 inches, 8 inches, and 12 inches. This improves the equipment's versatility, enhances production flexibility, reduces human error, and optimizes the production process, thereby achieving cost reduction and efficiency improvement. In actual processing, the wafer workpiece is fixedly positioned in the middle of the steel ring, which is used for clamping. The term "wafer workpiece steel ring clamping" can be understood as the clamping of the wafer workpiece. Simultaneously, the rotatably arranged anti-drop baffle 5 can rotate at a certain angle after the vacuum nozzle 4 has adsorbed and fixed the steel ring of the wafer workpiece, further tightening the steel ring and preventing it from falling and damaging the workpiece due to unstable vacuum pressure, significantly improving material safety.

[0026] like Figure 1 and Figure 2As shown, in this technical solution, the anti-drop baffle 5 is an L-shaped plate. By using an L-shaped anti-drop baffle 5, the L-shaped plate can be rotated by the rotation drive assembly, which can then work with the vacuum nozzle 4 to clamp and fix the steel ring of the wafer workpiece. The entire anti-drop function has simple components, high transmission efficiency, and effectively saves application and energy costs.

[0027] In this technical solution, a rotary cylinder 6 is fixedly installed in the middle of the nozzle mounting plate 3, and the anti-drop baffle 5 is fixedly connected to the piston end of the rotary cylinder 6 via a transmission rod. In practical applications, a servo motor with programmable function can also be used to drive the anti-drop baffle 5 to rotate and clamp the wafer workpiece.

[0028] A connecting seat 1 is fixedly installed in the middle of the end face of the mounting plate 2. The inner cavity of the connecting seat 1 is arranged with air passages matching the number of vacuum nozzles 4. Multiple air inlets 7 and air outlets 8 are installed on the connecting seat 1. The air inlets 7 serve as the inlet end of the air passages, and the air outlets 8 serve as the outlet ends of the air passages.

[0029] like Figure 2 As shown, in this technical solution, multiple air paths are designed according to the number of vacuum nozzles 4 to supply air to different vacuum nozzles 4. Through the cooperation of independent air paths and vacuum generator, it is ensured that the negative pressure value of each vacuum nozzle 4 can stably adsorb the steel ring of the wafer workpiece, which improves the efficiency of loading and unloading to a certain extent.

[0030] Connector 1 is L-shaped, with multiple connection holes on one side for connecting to external moving modules, as shown in the details. Figure 2 and Figure 5 As shown.

[0031] In this technical solution, by adopting an L-shaped connecting seat 1, it is easy to connect to an external moving module to realize multi-axial movement of the entire clamping mechanism. At the same time, it is also convenient to arrange the air circuit and facilitate subsequent maintenance of the air circuit.

[0032] Example 2

[0033] like Figure 3 and Figure 4 As shown, in this embodiment, the mounting plate 2 is driven to be mounted on the piston end of the drive cylinder 9, and a rotatable gripper assembly 13 is provided on one side of the drive cylinder 9. Air knife assemblies 12 are arranged on both sides of the gripper assembly 13.

[0034] Driven by the cylinder 9, the entire clamping mechanism can be directionally fed along the direction of the cylinder piston. At the same time, the gripper assembly 13 can accurately grasp the workpiece and rotate it to a preset position, thereby avoiding interference with the movement of other modules. The air knife assembly 12 can automatically blow away residual water droplets on the surface before and after gripping the steel ring of the wafer workpiece, or clean the surface of the equipment located below the air knife assembly 12, which helps to keep the device clean and safe.

[0035] A limit slide rail assembly 10 is arranged between the mounting plate 2 and the drive cylinder 9, which slides in a specific direction as the mounting plate 2 moves, as follows: Figure 4 As shown, the slider seat arranged on the drive cylinder 9 cooperates with the slide rail assembly fixedly mounted on the mounting plate 2 to ensure the stability of the mounting plate 2 during movement.

[0036] like Figure 2 and Figure 3 As shown, the gripper assembly 13 is driven to rotate by the rotary cylinder 6. An extension frame 14 is detachably installed on one side of the drive cylinder 9. The extension frame 14 is detachably connected to the air knife assembly 12 and the rotary cylinder 6 via an extension base 11. The extension base 11 is provided with a hydraulic buffer and a proximity switch that cooperate with the rotation and retraction of the gripper assembly 13.

[0037] In the above-described technical solution, after the gripper assembly 13 accurately grasps the steel ring of the wafer workpiece and moves it to the designated position, the rotary cylinder 6 drives the gripper assembly 13 to rotate upwards in a clockwise direction. This action effectively prevents the gripper assembly 13 from colliding with other modules during loading and unloading, eliminating safety risks during equipment operation. Simultaneously, by changing the spatial placement of the gripper assembly 13, the movement distance in the X-axis direction is significantly reduced, minimizing unnecessary movement trajectories. This significantly improves the efficiency of transporting wafer workpieces after removal from the wafer cassette, optimizes the overall production process, and ensures the smoothness and stability of the semiconductor wafer dicing machine's loading and unloading operations.

[0038] Meanwhile, the extension frame 14 can be used in conjunction with the installation of a linear module to enable multi-axial movement of the entire clamping structure, so as to carry out automatic loading and unloading operations.

[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A workpiece clamping mechanism for a wafer dicing machine, characterized in that, It includes a mounting frame, a nozzle mounting plate, and a vacuum nozzle. The mounting frame has a mounting groove for adjusting the mounting position of the nozzle mounting plate, and the nozzle mounting plate has a connecting groove for adjusting the mounting position of the vacuum nozzle. By coordinating the mounting groove and the connecting groove, the vacuum nozzle can adaptively clamp wafer workpieces of various sizes. Each nozzle mounting plate has a rotatable anti-drop baffle in the middle. The anti-drop baffle rotates at a fixed angle to cooperate with the vacuum nozzle to clamp and fix the wafer workpiece.

2. The workpiece clamping mechanism of the wafer dicing machine according to claim 1, characterized in that: The anti-fall baffle is an L-shaped plate.

3. The workpiece clamping mechanism of the wafer dicing machine according to claim 2, characterized in that: A rotary cylinder is fixedly installed in the middle of the nozzle mounting plate, and the anti-drop baffle is fixedly connected to the piston end of the rotary cylinder through a transmission rod.

4. The workpiece clamping mechanism of the wafer dicing machine according to claim 2 or 3, characterized in that: A connecting seat is fixedly installed in the middle of the end face of the mounting plate. The inner cavity of the connecting seat is arranged with an air passage matching the number of vacuum nozzles. Multiple air inlets and air outlets are installed on the connecting seat. The air inlets serve as the inlet end of the air passage, and the air outlets serve as the outlet end of the air passage.

5. The workpiece clamping mechanism of the wafer dicing machine according to claim 4, characterized in that: The connector is L-shaped, with multiple connection holes on one side for connecting to the external moving module.

6. The workpiece clamping mechanism of the wafer dicing machine according to claim 1, characterized in that: The mounting plate is driven to be mounted on the piston end of the drive cylinder. A rotatable gripper assembly is provided on one side of the drive cylinder, and air knife assemblies are arranged on both sides of the gripper assembly.

7. The workpiece clamping mechanism of the wafer dicing machine according to claim 6, characterized in that: A limit slide rail assembly is arranged between the mounting plate and the drive cylinder, which slides in a specific direction as the mounting plate moves.

8. The workpiece clamping mechanism of the wafer dicing machine according to claim 7, characterized in that: The gripper assembly is driven to rotate by a rotary cylinder. An extension frame is detachably mounted on one side of the drive cylinder. The extension frame is detachably connected to the air knife assembly and the rotary cylinder via an extension base. The extension base is equipped with a hydraulic buffer and a proximity switch that cooperate with the rotation and retraction of the gripper assembly.

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